CN108692599A - Conductive structure with liquid gas separation mechanism - Google Patents
Conductive structure with liquid gas separation mechanism Download PDFInfo
- Publication number
- CN108692599A CN108692599A CN201710234248.8A CN201710234248A CN108692599A CN 108692599 A CN108692599 A CN 108692599A CN 201710234248 A CN201710234248 A CN 201710234248A CN 108692599 A CN108692599 A CN 108692599A
- Authority
- CN
- China
- Prior art keywords
- capillary structure
- mentioned
- separation mechanism
- gas separation
- liquid gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/22—Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/22—Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates
- F28F2009/222—Particular guide plates, baffles or deflectors, e.g. having particular orientation relative to an elongated casing or conduit
- F28F2009/226—Transversal partitions
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2210/00—Heat exchange conduits
- F28F2210/10—Particular layout, e.g. for uniform temperature distribution
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
The present invention relates to a kind of conductive structures with liquid gas separation mechanism, including temperature-uniforming plate, heat pipe, partition board and working fluid, temperature-uniforming plate includes shell and vessel, and shell has bottom plate and riser, it is equipped with the first capillary structure in the inner surface of bottom plate, perforation is offered in riser;Heat pipe includes tube body and the second capillary structure, and tube body has open end, and tube body corresponds to wear with open end connects sealing;Partition board is laid on open end and is covered in the first capillary structure and the second capillary structure, to be respectively formed with gas flow and flow channel for liquids in two sides of partition board;Working fluid is filled in vessel.Thereby, the gaseous working fluid of reflux can not be flowed the back-flow velocity for being influenced, and then promoting gaseous working fluid by gaseous working fluid.
Description
Technical field
The present invention relates to a kind of heat conduction technology, espespecially a kind of conductive structure with liquid gas separation mechanism.
Background technology
It is constantly promoted with the arithmetic speed of electronic building brick, generated heat is also higher and higher, in order to effectively solve
Certainly the problem of this golf calorific value, industry is by heat pipe (Heat Pipe) and temperature-uniforming plate (Vapor with good heat conductive characteristic
Chamber the use of popularity) is carried out, although wherein heat pipe has and makes the flow direction property of internal gaseous working fluid consistent,
Because the inflexible limit of volume causes the heat that it can conduct fairly limited, though there is another temperature-uniforming plate spacious heating surface area to provide
Directly attach conduction to pyrotoxin, but its gaseous working fluid flows to comparable disorder, so will all limit it and leads heat dissipation effect
Energy.
Heat pipe and temperature-uniforming plate are subject to group and connect and form a heat conduction knot by industry in order to solve the problems of aforementioned point
Structure, wherein heat pipe be wear a side for being connected on temperature-uniforming plate, and allow heat pipe inner space and temperature-uniforming plate inner space it is mutual
Connection.
However, known temperature-uniforming plate and heat pipe combination structure, although with heat dissipation is led, there are following problems
Point, since gaseous working fluid is when flowing through heat pipe, because sectional area becomes smaller so that flow velocity increase, these streams being increased
Speed will generate restraining function to the gaseous working fluid of reflux, and by the gaseous working fluid of reflux band product heat cal rod far from temperature-uniforming plate
One end, and then temperature-uniforming plate is allowed to generate empty a problem that burning.The capillary structure of another inside heat pipe fail with inside temperature-uniforming plate
Capillary structure mutually amplexiforms, thus gaseous working fluid is caused to be interrupted or discontinuous situation to generate during flowing back, all
It will be greatly reduced and leads heat dissipation.
Invention content
The purpose of the present invention is to provide a kind of conductive structure with liquid gas separation mechanism, outlet is separated with partition board
Body runner and flow channel for liquids can not be influenced, Jin Erti conducive to the gaseous working fluid of reflux by gaseous working fluid flowing
Rise the back-flow velocity of gaseous working fluid.
In order to reach above-mentioned purpose, the present invention provides a kind of conductive structure with liquid gas separation mechanism, including one
Warm plate, a heat pipe, a partition board and a working fluid, the temperature-uniforming plate include a shell and are formed in a vessel of the enclosure interior,
The riser that the shell has a bottom plate and extends from the bottom plate, one first capillary group is laid in the inner surface of the bottom plate
It knits, the perforation for being connected to the vessel is offered in the riser;The heat pipe include a tube body and be laid in the tube body one second
Capillary structure, the tube body have an open end, which, which with the open end corresponds to the perforation, wears and connect sealing;The partition board is laid on this
Open end and it is covered in first capillary structure and second capillary structure, to be respectively formed with one in two sides of the partition board
Gas flow and a flow channel for liquids;The working fluid is filled in the vessel.
Preferably, aforementioned barriers are an airtight sheet body.
Preferably, aforementioned barriers are a copper foil or an aluminium foil.
Preferably, aforementioned barriers include a shielding plate and connect an arc sheet body of the shielding plate, which is covered in
The inner surface of above-mentioned first capillary structure, the arc sheet body are then to be covered in above-mentioned second capillary structure.
Preferably, the radius of curvature of above-mentioned arc sheet body is equal with the above-mentioned radius of curvature of second capillary structure inner surface.
Preferably, above-mentioned heat pipe and partition board are all plural number, and each heat pipe is worn respectively connects above-mentioned temperature-uniforming plate, and each partition board is laid with respectively
In above-mentioned each open end.
Preferably, above-mentioned heat pipe is plural number, and each heat pipe is worn respectively connects above-mentioned temperature-uniforming plate, and aforementioned barriers hide including a strip
It covers piece and connects the plural arc sheet body of the strip shielding plate, which is covered in above-mentioned first capillary structure
Inner surface, each arc sheet body are respectively overlay in the second capillary structure of each heat pipe.
Preferably, the end face of above-mentioned second capillary structure mutually attaches with above-mentioned first capillary structure and contacts.
Preferably, above-mentioned first capillary structure is metal net, fibre bundle or metal powder sintered object.
Preferably, above-mentioned second capillary structure is metal net, fibre bundle or metal powder sintered object.
The present invention also has effects that following, utilizes the first capillary structure and the second capillary structure to attach and contacts and then promote liquid
The back-flow velocity of state working fluid.It is connected with each arc sheet body by strip shielding plate, the liquid to flow back from each heat pipe can be made
Working fluid can be exchanged with each other or the demand of supply.
Description of the drawings
Fig. 1 is the stereogram exploded view of the present invention.
Fig. 2 is the assembled sectional view of the present invention.
Fig. 3 is the assembled sectional view of the other direction of the present invention.
Fig. 4 is the assembled sectional view that the present invention is applied to pyrotoxin.
Fig. 5 is another embodiment assembled sectional view of the present invention.
[Critical piece symbol description]
10 ... temperature-uniforming plates
11 ... lower housings
111 ... bottom plates
112 ... risers
113 ... perforation
12 ... upper shells
13 ... first capillary structures
A ... vessels
20 ... heat pipes
21 ... tube bodies
22 ... second capillary structures
30,30a ... partition boards
31 ... shielding plates
31a ... strip shielding plates
32 ... arc sheet bodies
C1 ... gas flows
C2 ... flow channel for liquids
40 ... working fluids
8 ... pyrotoxins
Specific implementation mode
The detailed description of the related present invention and technology contents, cooperation description of the drawings is as follows, however appended attached drawing only provides ginseng
It examines and illustrates to use, be not intended to limit the present invention.
Please refer to Fig.1 and Fig. 3 shown in, the present invention provides a kind of conductive structure with liquid gas separation mechanism, mainly wraps
Include a temperature-uniforming plate 10, a heat pipe 20, a partition board 30 and a working fluid 40.
The temperature-uniforming plate 10 of the present embodiment includes mainly a lower housing 11 and a upper shell 12, and upper shell 12 and lower housing 11 are all
Made by the good material of the thermal conductivity such as copper, aluminium or its alloy, lower housing 11 has a rectangular base plate 111 and from rectangular base plate
111 are folded upward at the riser 112 extended, and upper shell 12 corresponds to lower housing 11 and does contiguity sealing, in upper shell
It is formed with a vessel A between 12 and lower housing 11, a perforation 113 of connection aforesaid housing compartment A is offered on riser 112.The bottom of at
The inner surface of plate 111 is laid with one first capillary structure 13, can be metal net, fibre bundle or metal powder sintered object etc.
Made by material.Similarly also it can lay aforementioned first capillary structure 13 in the inner surface of riser 112 and the inner surface of upper shell 12.
Heat pipe 20 includes a tube body 21 and one second capillary structure 22, and tube body 21 can be the thermal conductivity such as copper, aluminium or its alloy
Made by good material, it can be metal net, fibre bundle to have a blind end and an open end, the second capillary structure 22
Or made by the materials such as metal powder sintered object, it is provided in 21 inner wall of tube body and extends to the open end end face of tube body 21
Position, heat pipe 20 are to correspond to aforementioned perforation 113 with its open end to wear the end face for connecing sealing, and enabling the second capillary structure 22
It does mutually to attach with the first capillary structure 13 and contact.
Partition board 30 is an airtight sheet body, can be made by the materials such as copper foil, aluminium foil or its alloy, the present embodiment every
Plate 30 has a shielding plate 31 and connects an arc sheet body 32 of shielding plate 31, and shielding plate 31 is substantially in one rectangular-shaped, is to cover
Cover the inner surface in the first capillary structure 13, the song of the radius of curvature of arc sheet body 32 substantially with 32 inner surface of the second capillary structure
Rate radius is equal, and using keeps arc sheet body 32 closely connected and be covered in 22 top of the second capillary structure, in partition board 30
Upside is formed with a gas flow C1 and is formed with a flow channel for liquids C2 in the downside of partition board 30.
Working fluid 40 can be water, and permeable one enters liquid gas removing pipe (not shown) is interconnected with aforesaid housing compartment A, by work
Make fluid 40 and insert upper shell 12 and lower housing 11 to be formed by vessel A, and with enter liquid gas removing pipe carry out degasification processing and
Sealing operation is imposed to entering liquid gas removing pipe, and then completes the conductive structure with liquid gas separation mechanism of the present invention.
Please refer to shown in Fig. 4, when use be by the bottom plate 111 of temperature-uniforming plate 10 corresponding to a pyrotoxin 8 do it is closely sealed amplexiform,
After the running of pyrotoxin 8 generates high heat, these high heat military orders store the gaseous working fluid 40 in the first capillary structure 13
It generates and evaporates and be formed as gaseous working fluid 40, this gaseous working fluid 40 is with a large amount of warm from vessel A via gas stream
Road C1 reaches the one end of heat pipe 20 far from temperature-uniforming plate 10, outside heat pipe 20 towards 21 internal flow of tube body of heat pipe 20
Under the action of the heat-sink units such as the radiating fin installed (not shown), military order gaseous working fluid 40 above-mentioned generates condensation
Act on and be formed as gaseous working fluid 40, these gaseous working fluids 40 with the second capillary structure 22 capillary absorption power,
And through amplexiforming for the second capillary structure 22 and the first capillary structure 13, the first capillary structure will be flowed back to from flow channel for liquids C2
13, so continuously cycle running is dissipated with the diversion for carrying out heat.
The present invention carries out shunting processing by partition board 30 to gaseous working fluid 40 and gaseous working fluid 40, uses and enables gas
State working fluid 40 is when flowing through open end, because sectional area becomes smaller so that flow velocity increase, these flow velocitys being increased will
It is not to generate restraining function to the gaseous working fluid 40 of reflux, and then the back-flow velocity of gaseous working fluid can be promoted.
It please refers to shown in Fig. 5, the difference of the present embodiment and above-described embodiment is:Partition board 30a is covered including a strip
The plural arc sheet body 32 of piece 31a and connection strip shielding plate 31a, each arc sheet body 32 are worn corresponding to each heat pipe 20 and are connect simultaneously
It is covered on each second capillary structure 22, the open end that strip shielding plate 31a is then across each heat pipe 20 is covered in first mao
On thin tissue 13, the gaseous working fluid 40 to flow back from each heat pipe 20 can so be enable to be exchanged with each other or the demand of supply.
In conclusion the conductive structure with liquid gas separation mechanism of the present invention, really can reach the purpose that uses of expection, and
Known missing is solved, and because of great novelty and creativeness, complies fully with application for a patent for invention requirement, Shen is proposed according to Patent Law
Please, detailed survey and accurate patent of the present invention please be grant, to ensure the right of inventor.
Claims (10)
1. a kind of conductive structure with liquid gas separation mechanism, it is characterised in that including:One temperature-uniforming plate, including a shell and formation
In the riser that a vessel of the enclosure interior, the shell have a bottom plate and extend from the bottom plate, in the interior table of the bottom plate
Face is laid with one first capillary structure, and the perforation for being connected to the vessel is offered in the riser;One heat pipe, including a tube body and cloth
There is an open end, the tube body to correspond to the perforation with the open end and wear for one second capillary structure being located in the tube body, the tube body
Connect sealing;One partition board is laid on the open end and is covered in first capillary structure and second capillary structure, at this
Two sides of partition board are respectively formed with a gas flow and a flow channel for liquids;And a working fluid, it fills in the vessel.
2. the conductive structure with liquid gas separation mechanism as described in claim 1, it is characterised in that aforementioned barriers are one impermeable
Gas sheet body.
3. the conductive structure with liquid gas separation mechanism as claimed in claim 2, it is characterised in that aforementioned barriers are a copper foil
An or aluminium foil.
4. the conductive structure with liquid gas separation mechanism as described in claim 1, it is characterised in that aforementioned barriers include a screening
It covers piece and connects an arc sheet body of the shielding plate, which is covered in the inner surface of above-mentioned first capillary structure, the arc
Sheet body is then to be covered in above-mentioned second capillary structure.
5. the conductive structure with liquid gas separation mechanism as claimed in claim 4, it is characterised in that the song of above-mentioned arc sheet body
Rate radius is equal with the above-mentioned radius of curvature of second capillary structure inner surface.
6. the conductive structure with liquid gas separation mechanism as described in claim 1, it is characterised in that above-mentioned heat pipe and partition board are all
For plural number, each heat pipe is worn respectively connects above-mentioned temperature-uniforming plate, and each partition board is laid on above-mentioned each open end respectively.
7. the conductive structure with liquid gas separation mechanism as described in claim 1, it is characterised in that above-mentioned heat pipe is plural number, respectively
Heat pipe is worn respectively connects above-mentioned temperature-uniforming plate, and aforementioned barriers include a strip shielding plate and connect the plural arc of the strip shielding plate
Shape sheet body, the strip shielding plate are covered in the inner surface of above-mentioned first capillary structure, and each arc sheet body is respectively overlay in each heat
Second capillary structure of pipe.
8. the conductive structure with liquid gas separation mechanism as described in claim 1, it is characterised in that above-mentioned second capillary structure
End face mutually attach and contact with above-mentioned first capillary structure.
9. the conductive structure with liquid gas separation mechanism as described in claim 1, it is characterised in that above-mentioned first capillary structure
For metal net, fibre bundle or metal powder sintered object.
10. the conductive structure with liquid gas separation mechanism as described in claim 1, it is characterised in that above-mentioned second capillary structure
For metal net, fibre bundle or metal powder sintered object.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710234248.8A CN108692599A (en) | 2017-04-11 | 2017-04-11 | Conductive structure with liquid gas separation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710234248.8A CN108692599A (en) | 2017-04-11 | 2017-04-11 | Conductive structure with liquid gas separation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108692599A true CN108692599A (en) | 2018-10-23 |
Family
ID=63842399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710234248.8A Pending CN108692599A (en) | 2017-04-11 | 2017-04-11 | Conductive structure with liquid gas separation mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108692599A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113710050A (en) * | 2020-05-21 | 2021-11-26 | 上海巽科节能科技有限公司 | Heat radiator |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5216580A (en) * | 1992-01-14 | 1993-06-01 | Sun Microsystems, Inc. | Optimized integral heat pipe and electronic circuit module arrangement |
| CN101050928A (en) * | 2006-04-07 | 2007-10-10 | 富准精密工业(深圳)有限公司 | Heat tube |
| CN201429350Y (en) * | 2009-05-11 | 2010-03-24 | 索士亚科技股份有限公司 | temperature equalizing plate with separation plate |
| CN201819597U (en) * | 2010-08-20 | 2011-05-04 | 深圳市特安安防设备有限公司 | Pressure-driven loop type thermosyphon device |
| CN203934263U (en) * | 2014-07-04 | 2014-11-05 | 讯凯国际股份有限公司 | There is the heat abstractor of capillary member |
| CN205980889U (en) * | 2016-07-29 | 2017-02-22 | 迈萪科技股份有限公司 | Temperature -uniforming plate and heat pipe integrated configuration |
| CN206847445U (en) * | 2017-04-11 | 2018-01-05 | 迈萪科技股份有限公司 | Conductive structure with liquid gas separation mechanism |
-
2017
- 2017-04-11 CN CN201710234248.8A patent/CN108692599A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5216580A (en) * | 1992-01-14 | 1993-06-01 | Sun Microsystems, Inc. | Optimized integral heat pipe and electronic circuit module arrangement |
| CN101050928A (en) * | 2006-04-07 | 2007-10-10 | 富准精密工业(深圳)有限公司 | Heat tube |
| CN201429350Y (en) * | 2009-05-11 | 2010-03-24 | 索士亚科技股份有限公司 | temperature equalizing plate with separation plate |
| CN201819597U (en) * | 2010-08-20 | 2011-05-04 | 深圳市特安安防设备有限公司 | Pressure-driven loop type thermosyphon device |
| CN203934263U (en) * | 2014-07-04 | 2014-11-05 | 讯凯国际股份有限公司 | There is the heat abstractor of capillary member |
| CN205980889U (en) * | 2016-07-29 | 2017-02-22 | 迈萪科技股份有限公司 | Temperature -uniforming plate and heat pipe integrated configuration |
| CN206847445U (en) * | 2017-04-11 | 2018-01-05 | 迈萪科技股份有限公司 | Conductive structure with liquid gas separation mechanism |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113710050A (en) * | 2020-05-21 | 2021-11-26 | 上海巽科节能科技有限公司 | Heat radiator |
| CN113710050B (en) * | 2020-05-21 | 2024-01-30 | 苏州圣荣元电子科技有限公司 | Heat dissipation device |
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| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20181023 |
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| WD01 | Invention patent application deemed withdrawn after publication |