CN205546384U - Temperature equalizing plate and upper shell component thereof - Google Patents
Temperature equalizing plate and upper shell component thereof Download PDFInfo
- Publication number
- CN205546384U CN205546384U CN201620175426.5U CN201620175426U CN205546384U CN 205546384 U CN205546384 U CN 205546384U CN 201620175426 U CN201620175426 U CN 201620175426U CN 205546384 U CN205546384 U CN 205546384U
- Authority
- CN
- China
- Prior art keywords
- temperature
- upper case
- case member
- uniforming
- uniforming plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012530 fluid Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims description 13
- 230000003746 surface roughness Effects 0.000 claims description 8
- 238000003754 machining Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000003486 chemical etching Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000004049 embossing Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000005488 sandblasting Methods 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 abstract 2
- 238000005452 bending Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007872 degassing Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a temperature-uniforming plate and its upper shell component, temperature-uniforming plate includes lower casing, upper shell component and working fluid, the upper shell component corresponds the lower casing involution, enclose between upper shell component and lower casing and be equipped with the cavity, the upper shell component contains base plate and a plurality of heat radiation fins, the base plate has the surface and forms at the internal face of surface dorsal part, each heat radiation fin extends and integrated into one piece from the surface, the internal face is equipped with the fluid stagnation structure; the working fluid is filled in the chamber. Thus, the condensed water molecules can be uniformly dropped on the heat receiving unit of the lower case.
Description
Technical field
This utility model relates to a kind of temperature-uniforming plate, a kind of temperature-uniforming plate for electronic heating element and upper casing structure thereof
Part.
Background technology
Along with the arithmetic speed of electronic component constantly promotes, heat produced by it is more and more higher, in order to effectively solve
The certainly problem of this golf calorific value, the temperature-uniforming plate (Vapor Chamber) with good heat conductive characteristic is carried out popularity by industry
Use, but such temperature-uniforming plate whether heat conduction efficiency, cost of manufacture still make easness etc. and all there is a need to be changed
Kind space.
Known temperature-uniforming plate, mainly includes a upper shell and a lower house, and in upper shell and the inner space of lower house
It is respectively equipped with capillary structure, the most again by corresponding with lower house for upper shell seam, then working fluid is inserted upper shell and lower casing
Internal portion, finally carries out the operations such as deairing and sealing and completes.
It is well known, however, that temperature-uniforming plate, although there is heat conduction efficiency, but there is problem below in actual use,
Owing to temperature-uniforming plate is in addition to the processor being used in host computer or notebook computer is used as heat conduction, being answered the most progressively
Being used on the electronic product such as Portable tablet personal computer, intelligent mobile phone, such portable type electronic product when operation is not
Being used by horizontal, most situation is to operate with its angled manner, also has and is operated with standing manner,
Therefore it is easily caused the working fluid within temperature-uniforming plate cannot be dropped on the heated parts of lower house uniformly, and then significantly
Reduce its heat conduction efficiency, it would be highly desirable to improved.
Utility model content
A purpose of the present utility model, is to provide a kind of temperature-uniforming plate and upper case member thereof, and it utilizes each fluid stagnation to tie
Structure is arranged, and each hydrone being condensed can be enable to be dropped in uniformly on the heated parts of lower house.
In order to reach above-mentioned purpose, this utility model provides a kind of temperature-uniforming plate, including a lower house, a upper case member and
Detection device, this upper case member to should lower house sealing, and enclose between this upper case member and this lower house and be provided with a chamber,
This upper case member comprises a substrate and multiple radiating fin, and this substrate has an outer surface and is formed at the one of this outer surface dorsal part
Internal face, each radiating fin extends and one-body molded from this outer surface, and this internal face is provided with a fluid stagnation structure；This workflow
Body is filled in this chamber.
In order to reach above-mentioned purpose, this utility model provides the upper case member of a kind of temperature-uniforming plate, including a substrate and multiple
Radiating fin, this substrate has an outer surface and is formed at an internal face of this outer surface dorsal part, and each radiating fin is from this appearance
Face extends and one-body molded, and this internal face is provided with a fluid stagnation structure.
This utility model also has the effect that, owing to fluid stagnation structure can destroy the cohesiveness of hydrone, therefore
Condensation and attached work do not produce aggregative flow at each hydrone of fluid stagnation structure, thus can make each water molecule energy comprehensively
Drip on the heated parts of lower house.
Accompanying drawing explanation
Fig. 1 is upper case member stereo appearance figure of the present utility model.
Fig. 2 is upper case member sectional view of the present utility model.
Fig. 3 is temperature-uniforming plate three-dimensional exploded view of the present utility model.
Fig. 4 is that temperature-uniforming plate of the present utility model combines schematic diagram.
Fig. 5 is temperature-uniforming plate assembled sectional view of the present utility model.
Fig. 6 is that temperature-uniforming plate of the present utility model uses state enlarged partial sectional view.
List of reference characters
10 lower houses
11 base plates
12 times coaming plates
13 engage plate
20 upper case member
21 substrates
211 outer surfaces
212 internal faces
213 fluid stagnation structures
22 radiating fins
Coaming plate on 23
24 boards
30 working fluids
40 capillary structures
A chamber
Detailed description of the invention
Relevant detailed description of the present utility model and technology contents, coordinate accompanying drawing to be described as follows, but accompanying drawing only provide reference
With explanation, it is not limiting as scope of the present utility model.
Referring to shown in Fig. 1 to Fig. 5, this utility model provides a kind of temperature-uniforming plate and upper case member, wherein temperature-uniforming plate
(Vapor Chamber) mainly includes lower house 10, upper case member 20 and a working fluid 30 (as shown in Figure 5).
Seeing shown in Fig. 1 and Fig. 2, upper case member 20 can be made by copper, aluminum or its alloy, and it mainly includes a rectangle base
Plate 21 and multiple radiating fin 22, substrate 21 has an outer surface 211 and is formed at an internal face 212 of outer surface 211 dorsal part,
Each radiating fin 22 extends and one-body molded from outer surface 211, and each radiating fin 22 can extrude or the processing mode such as backing-off cutting comes
Interval molding.
Internal face 212 can come the comprehensive fluid stagnation structure 213 that is shaped as, machinery therein in modes such as machinings
Processing can be sandblasting or embossing, and fluid stagnation structure 213 is the matsurface being made up of multiple sags and crests, its surface roughness
Value is between Ra0.01～10 (mm), and wherein surface roughness value is preferably Ra0.05～3 (mm), and this surface roughness value is less than
During Ra0.01, can not effectively prevent working fluid 30 flowing after condensation and the convergence of inside, work as surface roughness in addition
When value is more than more than Ra10, it is not particularly suited for the use demand of electronic component because overall height is the highest.It addition, internal face
The processing of 212 can also be that the modes such as chemical etching complete.Additionally, upper case member 20 also include from substrate 21 periphery towards under
Side's bending extend one on coaming plate 23 and from upper coaming plate 23 periphery towards the board 24 that laterally bending extends.
Seeing shown in Fig. 3 to Fig. 5, lower house 10 can also be made by copper, aluminum or its alloy, and it has a rectangular base plate
11, and extend towards laterally bending towards the coaming plate once 12 of extension bent over from lower coaming plate 12 periphery from base plate 11 periphery
One engages plate 13.It is by corresponding for upper case member 20 lower house 10 cover cap during combination, is layered on top of each other with board 24 and joint plate 13
And sealed with welding manner, thus will enclose to set between upper case member 20 and lower house 10 and be formed with a chamber A；So
After, by transfusion gas removing pipe (not shown), working fluid 30 is inserted in chamber A, and carry out the step such as degasification, sealing, and
Complete the making of a temperature-uniforming plate.
Additionally, temperature-uniforming plate of the present utility model also includes a capillary structure 40, it can be a metal net or porous
Metal powder sintered thing, this capillary structure 40 is arranged on above the base plate 11 of lower house 10.
Shown in Figure 6, be using the base plate 11 of lower house 10 as heated parts during use, base plate 11 is directly thermally contacted in
One electronic heating source (not shown), it will produce heat when computing, and this heat will be passed to base plate 11 and liquid working stream
Body 30, evaporation is generated gaseous working fluid 30 after being heated by gaseous working fluid 30, and this gaseous working fluid 30 is then towards substrate
The internal face 212 direction flowing of 21, and be attached in fluid stagnation structure 213, substrate 21 is then by each radiating fin 22
Dissipation of heat, and make aforementioned gaseous working fluid 30 be condensed into multiple water respectively after touching each fluid stagnation structure 213
Molecule, owing to fluid stagnation structure 213 can destroy the cohesiveness of hydrone, therefore order is attached to fluid stagnation structure 213
Each hydrone does not produce aggregative flow, and each water molecule energy so can be made comprehensively and uniformly to drip the heated parts in lower house
On (i.e. base plate 11).
In sum, the temperature-uniforming plate of this utility model offer and upper case member thereof, intended application target can be reached, solve
Prior art problem, and great novelty is with creative.
Claims (16)
1. a temperature-uniforming plate, including:
One lower house；
One upper case member, corresponding described lower house seals, and encloses between described upper case member and described lower house and be provided with a chamber
Room, described upper case member comprises a substrate and multiple radiating fin, and described substrate has an outer surface and is formed at described appearance
One internal face of face dorsal part, each radiating fin extends and one-body molded from described outer surface, and described internal face is provided with a fluid
Stagnate structure；And
One working fluid, fills in described chamber.
2. temperature-uniforming plate as claimed in claim 1, wherein said fluid stagnation structure is that be made up of multiple sags and crests is coarse
Face.
3. temperature-uniforming plate as claimed in claim 2, the surface roughness value of wherein said matsurface is between Ra0.01～10 (mm).
4. temperature-uniforming plate as claimed in claim 3, wherein said surface roughness value is between Ra0.05～3 (mm).
5. temperature-uniforming plate as claimed in claim 2, wherein said fluid stagnation structure is with machining or chemical etching mode
Shape.
6. temperature-uniforming plate as claimed in claim 5, wherein said machining is sandblasting or embossing.
7. temperature-uniforming plate as claimed in claim 1, wherein each radiating fin is to extrude or backing-off cutting mode is to be spaced molding.
8. temperature-uniforming plate as claimed in claim 1, it also includes that a capillary structure, described capillary structure are arranged at described lower house
Internal.
9. temperature-uniforming plate as claimed in claim 8, wherein said capillary structure is a metal net or porous metal powder
Sinter.
10. a upper case member for temperature-uniforming plate, including a substrate and multiple radiating fin, described substrate has an outer surface and shape
Becoming the internal face at this outer surface dorsal part, each radiating fin extends and one-body molded from described outer surface, described internal face
It is provided with a fluid stagnation structure.
The upper case member of 11. temperature-uniforming plates as claimed in claim 10, wherein said fluid stagnation structure is by multiple sags and crests
The matsurface constituted.
The upper case member of 12. temperature-uniforming plates as claimed in claim 11, the surface roughness value of wherein said matsurface is at Ra0.01
～between 10 (mm).
The upper case member of 13. temperature-uniforming plates as claimed in claim 12, wherein said surface roughness value Ra0.05～3 (mm) it
Between.
The upper case member of 14. temperature-uniforming plates as claimed in claim 11, wherein said fluid stagnation structure be with machining or
Chemical etching mode shapes.
The upper case member of 15. temperature-uniforming plates as claimed in claim 14, wherein said machining is sandblasting or embossing.
The upper case member of 16. temperature-uniforming plates as claimed in claim 10, wherein each radiating fin is to extrude or backing-off cutting mode
Interval molding.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104215321 | 2015-09-23 | ||
| TW104215321U TWM517812U (en) | 2015-09-23 | 2015-09-23 | Vapor chamber and upper shell member thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205546384U true CN205546384U (en) | 2016-08-31 |
Family
ID=55811909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620175426.5U Expired - Fee Related CN205546384U (en) | 2015-09-23 | 2016-03-09 | Temperature equalizing plate and upper shell component thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205546384U (en) |
| TW (1) | TWM517812U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110191626A (en) * | 2019-06-28 | 2019-08-30 | Oppo广东移动通信有限公司 | Housing unit, preparation method and electronic equipment |
| CN110678036A (en) * | 2018-07-02 | 2020-01-10 | 德尔福技术有限责任公司 | Circuit assembly with heat sink |
| US11121058B2 (en) | 2019-07-24 | 2021-09-14 | Aptiv Technologies Limited | Liquid cooled module with device heat spreader |
| US11382205B2 (en) | 2020-09-16 | 2022-07-05 | Aptiv Technologies Limited | Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI800245B (en) * | 2022-01-28 | 2023-04-21 | 奇鋐科技股份有限公司 | Heat dissipation device |
-
2015
- 2015-09-23 TW TW104215321U patent/TWM517812U/en not_active IP Right Cessation
-
2016
- 2016-03-09 CN CN201620175426.5U patent/CN205546384U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110678036A (en) * | 2018-07-02 | 2020-01-10 | 德尔福技术有限责任公司 | Circuit assembly with heat sink |
| US10849217B2 (en) | 2018-07-02 | 2020-11-24 | Aptiv Technologies Limited | Electrical-circuit assembly with heat-sink |
| CN110191626A (en) * | 2019-06-28 | 2019-08-30 | Oppo广东移动通信有限公司 | Housing unit, preparation method and electronic equipment |
| WO2020259323A1 (en) * | 2019-06-28 | 2020-12-30 | Oppo广东移动通信有限公司 | Shell assembly and preparation method therefor, and electronic device |
| US11121058B2 (en) | 2019-07-24 | 2021-09-14 | Aptiv Technologies Limited | Liquid cooled module with device heat spreader |
| US11626345B2 (en) | 2019-07-24 | 2023-04-11 | Aptiv Technologies Limited | Liquid cooled module with device heat spreader |
| US11382205B2 (en) | 2020-09-16 | 2022-07-05 | Aptiv Technologies Limited | Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly |
| US11737203B2 (en) | 2020-09-16 | 2023-08-22 | Aptiv Technologies Limited | Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM517812U (en) | 2016-02-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205546384U (en) | Temperature equalizing plate and upper shell component thereof | |
| CN105814389B (en) | Ring type heat pipe and its manufacturing method and electronic equipment | |
| CN106996710B (en) | Thin type equalizing plate structure | |
| TWI400032B (en) | Heat dissipation module and supporting element thereof | |
| CN203327471U (en) | Heat radiation structure and hand-held electronic device with heat radiation structure | |
| TW201248110A (en) | Electronic device | |
| TWI601933B (en) | Heat-conducting structure | |
| CN104112724A (en) | Radiating element | |
| CN202014433U (en) | Isothermal vapor chamber with seal | |
| US20170122671A1 (en) | Vapor chamber and upper housing thereof | |
| JP3197757U (en) | A heat dissipation module combined with a mobile device and having an undulating surface | |
| CN205980889U (en) | Temperature -uniforming plate and heat pipe integrated configuration | |
| CN105188302A (en) | Hand-held electronic device heat radiation structure | |
| CN203704740U (en) | Extremely thin heat conduction device | |
| CN201706933U (en) | Vapor chamber with combined-type supporting structure | |
| CN205488104U (en) | Ultra -thin heat conduction component and ultra -thin heat conduction component of buckling | |
| CN104215106B (en) | There is temperature-uniforming plate and the manufacture method thereof of heat-conducting block | |
| CN205883805U (en) | Liquid cooling type heat abstractor and temperature -uniforming plate thereof | |
| US20200232712A1 (en) | Heat dissipation device | |
| CN208016229U (en) | Heat-sink unit combination reinforced structure | |
| CN207852661U (en) | Hand-hold communication device and its thin heat radiation structure | |
| CN105228413B (en) | A kind of electronic equipment | |
| CN101907416A (en) | Heat radiating plate and manufacture method thereof | |
| CN107072117A (en) | A kind of electronic equipment casing | |
| CN206192158U (en) | Temperature -uniforming plate structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160831 Termination date: 20200309 |