CN102469744A - Flat plate type heat pipe - Google Patents
Flat plate type heat pipe Download PDFInfo
- Publication number
- CN102469744A CN102469744A CN2010105381463A CN201010538146A CN102469744A CN 102469744 A CN102469744 A CN 102469744A CN 2010105381463 A CN2010105381463 A CN 2010105381463A CN 201010538146 A CN201010538146 A CN 201010538146A CN 102469744 A CN102469744 A CN 102469744A
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- CN
- China
- Prior art keywords
- flat plate
- plate heat
- heat tube
- capillary structure
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a flat plate type heat pipe. The flat plate type heat pipe comprises a sealed shell, wherein a certain amount of working fluid is filled in the shell; a plurality of lengthwise capillary structures are parallelly arranged in the shell at intervals; the flat plate type heat pipe is provided with an evaporation end and a condensation end in a lengthwise direction; two ends of each of the capillary structures are positioned at the evaporation end and the condensation end of the flat plate type heat pipe respectively; the upper and lower surfaces of each of the capillary structures are correspondingly supported on the upper and lower internal surfaces of the shell respectively; and a plurality of steam flow channels which extend along the lengthwise direction of the shell are formed among the capillary structures. The capillary structures arranged in the flat plate type heat pipe not only can provide capillary force for the working fluid in the flat plate type heat pipe so as to guarantee normal proceeding of phase change circulation, but also can provide powerful support for the shell on the upper and lower sides of the capillary structures so as to prevent the flat plate type heat pipe from being deformed under the action of internal force and external force and guarantee the flatness of the flat plate type heat pipe.
Description
Technical field
The present invention relates to a kind of heat transfer unit (HTU), particularly a kind of flat plate heat tube.
Background technology
Electronic component produces great amount of heat usually in running, normally move for guaranteeing electronic component, and these caloric requirements in time distribute, and installs a radiator on this electronic component usually additional and is its heat radiation.This radiator generally includes an absorber plate and is arranged at the radiating fin on this absorber plate.This absorber plate is processed by heat conductivity good metal materials such as copper, aluminium; But metallic plate is limited by the limited heat conductivity of material itself; If to the electronic component of golf calorific value, tangible thermal resistance can be produced and good heat radiating can't be reached, influence the operation stability of electronic component.
For promoting the efficient of radiator, industry also is employed in a cavity is set in the absorber plate, is sealed with working fluids such as water, ethanol in this cavity, utilizes the phase change of working fluid to improve heat transfer rate.During work, the heat release zone of working fluid endothermic gasification arrival absorber plate, cooling liquid then in the heat absorption district of absorber plate.For making workflow physical efficiency after the liquefaction be back to the heat absorption district of absorber plate sooner, this absorber plate is provided with a kind of capillary structure in the cavity periphery.Working fluid after the liquefaction is back to the heat absorption district and participates in the phase change circulation in capillary structure.Yet in the process of using, the absorber plate of this radiator the product distortion occurs with the pressure inside effect easily receiving from outside, even causes the interior capillary structure of absorber plate to come off, and has had a strong impact on the radiating efficiency and the stability of radiator.
Summary of the invention
In view of this, be necessary in fact the flat plate heat tube that provides a kind of structure firm.
A kind of flat plate heat tube; It comprises the housing of a sealing; Be filled with a certain amount of working fluid in this housing; The capillary structure of some lengthwises walks abreast, is arranged in the housing at intervals, and said flat plate heat tube longitudinally has an evaporation ends and a condensation end, and the two ends of each capillary structure lay respectively at the evaporation ends and the condensation end of flat plate heat tube; The corresponding respectively upper and lower inner surface that is supported in housing in the upper and lower surface of each capillary structure forms some steam flow channel along the housing longitudinal extension between each capillary structure.
Compared with prior art; The capillary structure that is provided with in the flat plate heat tube of the present invention both can be the interior working fluid of flat plate heat tube capillary force was provided; Guarantee normally carrying out of phase change circulation; Can strong support be provided to the housing of both sides about it again, prevent that flat plate heat tube from deforming under the effect of inside and outside power, to guarantee the flatness of flat plate heat tube.
With reference to accompanying drawing, the present invention is further described below in conjunction with embodiment.
Description of drawings
Fig. 1 is the sketch map that a flat plate heat tube of first embodiment of the invention is used.
Fig. 2 is that flat plate heat tube among Fig. 1 is along the cutaway view of II-II line.
Fig. 3 to Fig. 7 is the sketch map of a plurality of different shapes of the capillary structure in Fig. 2 middle plateform formula heat pipe.
Fig. 8 is the sketch map of a flat plate heat tube of second embodiment of the invention.
Fig. 9 is the sketch map of a flat plate heat tube of third embodiment of the invention.
The main element symbol description
Fins group 10
Flat plate heat tube 20,20a, 20b
Evaporation ends 21,21a, 21b
Condensation end 23,23a, 23b
Steam flow channel 282,282a
Embodiment
Fig. 1 shows the sketch map of flat plate heat tube 20 application of first embodiment of the invention, and this flat plate heat tube 20 has an evaporation ends 21 that contacts with thermal source 30 heat conduction and a condensation end 23 that contacts with fins group 10 heat conduction.
Please be simultaneously with reference to Fig. 2 and Fig. 3, this flat plate heat tube 20 comprises the housing 25 of a sealing and is attached to the capillary structure 26 of some lengthwises of housing 25 inner surfaces.Housing 25 is longitudinal and is flat, comprises that the base plate 24 and of a level is covered with the cover plate 22 of this base plate 24.The sealing of the periphery of this cover plate 22 posts on the periphery of this base plate 24, thus between base plate 24 and cover plate 22 the airtight cavity 28 of formation one.Be filled with a certain amount of working fluid (not label) in this cavity 28, liquid working fluid can be back to evaporation ends 21 from condensation end 23 through capillary structure 26.As shown in Figure 2; Above-mentioned some capillary structures 26 walk abreast, are arranged in the cavity 28 at intervals; Each capillary structure 26 extends to evaporation ends 21 from the condensation end 23 of this flat plate heat tube 20; The upper and lower surface of each capillary structure 26 is resisted against the inner surface of cover plate 22 and base plate 24 respectively, thereby this cavity 28 is separated into some steam flow channel 280 along housing 25 longitudinal extensions.These some capillary structures 26 are formed by metal or ceramic powders sintering; It has certain intensity; Base plate 24 with to its both sides provides strong support with cover plate 22, prevents that flat plate heat tube 20 is out of shape under the effect of inside and outside power, to guarantee the flatness of flat plate heat tube 20.
During use; The evaporation ends 21 of this flat plate heat tube 20 is close to thermal source 30 heat absorptions; To be steam from its evaporation ends 21 endothermic gasifications flow to condensation end 23 along the steam flow channel 280 of 26 of each capillary structures to working fluid in the housing 25; The working fluid of gaseous state is met at condensation end 23 and is coldly emitted heat and be cooled to liquid state, and this heat and then be passed to fins group 10 distributes through fin 14.The capillary force of liquid working fluid through capillary structure 26 flows back into evaporation ends 21 by condensation end 23 and carries out the phase change circulation.
Fig. 4 shows the another kind of form of capillary structure of the present invention; Different with capillary structure among Fig. 3 26 is: the part that each capillary structure 26a is positioned at the condensation end of flat plate heat tube 20 connects through the metal or the pottery of sintering each other, makes liquid working fluid flow to another capillary structure 26a from one of them capillary structure 26a along the metal or the pottery of sintering.
Fig. 5 shows the another kind of form of capillary structure of the present invention, and different with capillary structure 26a among Fig. 4 is: each capillary structure 26b two ends all connects through the metal or the pottery of sintering each other.
Fig. 6 shows the another kind of form of capillary structure of the present invention; Different with capillary structure 26a among Fig. 4 is: each capillary structure 26c is positioned at the part of condensation end of flat plate heat tube 20 except metal through sintering or pottery connect each other; Also two steam flow channels 282 have been offered with steam flow channel 280 vertical directions in the edge in addition; Thereby not only make liquid working fluid flow to another capillary structure 26c from one of them capillary structure 26c along the metal or the pottery of sintering; Also make the working fluid of gaseous state flow to another steam flow channel 280 from one of them steam flow channel 280, make heat distribution more even along steam flow channel 282.
Fig. 7 shows the another kind of form of capillary structure of the present invention; Different with capillary structure 26b among Fig. 5 is: each capillary structure 26d two ends is except all metal through sintering or pottery connect each other, and its two ends have also been offered two steam flow channel 282a respectively with steam flow channel 280 vertical directions in the edge in addition.
Fig. 8 shows a flat plate heat tube 20a of corresponding second embodiment of the invention, and different with flat plate heat tube among first embodiment 20 is: through bending, make evaporation ends 21a and condensation end 23a lay respectively at Different Plane in the middle of this flat plate heat tube 20a.
Fig. 9 shows a flat plate heat tube 20b of corresponding third embodiment of the invention, and different with flat plate heat tube among first embodiment 20 is: through bending, make evaporation ends 21b and condensation end 23b perpendicular in same plane in the middle of this flat plate heat tube 20b.
Compared with prior art; The capillary structure that is provided with in flat plate heat tube of the present invention 20,20a, the 20b both can be that working fluid provides capillary force in flat plate heat tube 20,20a, the 20b; Guarantee normally carrying out of phase change circulation; Can strong support be provided to the housing 25 of both sides about it again, prevent that flat plate heat tube 20,20a, 20b from deforming under the effect of inside and outside power, to guarantee the flatness of flat plate heat tube 20,20a, 20b.
Claims (8)
1. flat plate heat tube; It comprises the housing of a sealing; Be filled with a certain amount of working fluid in this housing; It is characterized in that: the capillary structure of some lengthwises walks abreast, is arranged in the housing at intervals, and said flat plate heat tube longitudinally has an evaporation ends and a condensation end, and the two ends of each capillary structure lay respectively at the evaporation ends and the condensation end of flat plate heat tube; The corresponding respectively upper and lower inner surface that is supported in housing in the upper and lower surface of each capillary structure forms some steam flow channel along the housing longitudinal extension between each capillary structure.
2. flat plate heat tube as claimed in claim 1 is characterized in that: said some capillary structures are formed by metal or ceramic powders sintering.
3. flat plate heat tube as claimed in claim 2 is characterized in that: the part that each capillary structure is positioned at condensation end connects through the metal of sintering each other.
4. flat plate heat tube as claimed in claim 3 is characterized in that: the part that each capillary structure is positioned at condensation end laterally offers steam flow channel along capillary structure, and through said steam flow channel two adjacent steam flow channel is communicated with.
5. flat plate heat tube as claimed in claim 2 is characterized in that: the two ends that each capillary structure is positioned at evaporation ends and condensation end all connect through the metal of sintering each other.
6. flat plate heat tube as claimed in claim 5 is characterized in that: the two ends that each capillary structure is positioned at evaporation ends and condensation end laterally offer steam flow channel respectively along capillary structure, and through said steam flow channel two adjacent steam flow channel are communicated with.
7. flat plate heat tube as claimed in claim 1 is characterized in that: through bending, evaporation ends and condensation end lay respectively at Different Plane in the middle of this flat plate heat tube.
8. flat plate heat tube as claimed in claim 1 is characterized in that: through bending, evaporation ends and condensation end are perpendicular in same plane in the middle of this flat plate heat tube.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105381463A CN102469744A (en) | 2010-11-09 | 2010-11-09 | Flat plate type heat pipe |
| US12/977,088 US20120111541A1 (en) | 2010-11-09 | 2010-12-23 | Plate type heat pipe and heat sink using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105381463A CN102469744A (en) | 2010-11-09 | 2010-11-09 | Flat plate type heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102469744A true CN102469744A (en) | 2012-05-23 |
Family
ID=46018506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105381463A Pending CN102469744A (en) | 2010-11-09 | 2010-11-09 | Flat plate type heat pipe |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20120111541A1 (en) |
| CN (1) | CN102469744A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103846366A (en) * | 2012-11-30 | 2014-06-11 | 象水国际股份有限公司 | Uniform-temperature plate and method for manufacturing same |
| CN107979962A (en) * | 2018-01-09 | 2018-05-01 | 无锡巨日电子科技有限公司 | Water-cooled circuit plate heat dissipating device |
| CN114894016A (en) * | 2022-04-29 | 2022-08-12 | 广州大学 | Metal wire array liquid absorption core one-way heat pipe and manufacturing method thereof |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120175084A1 (en) * | 2011-01-09 | 2012-07-12 | Chin-Hsing Horng | Heat pipe with a radial flow shunt design |
| US20120312507A1 (en) * | 2011-06-07 | 2012-12-13 | Hsiu-Wei Yang | Thin heat pipe structure and manufacturing method thereof |
| US10598442B2 (en) * | 2012-03-12 | 2020-03-24 | Cooler Master Development Corporation | Flat heat pipe structure |
| US11454454B2 (en) | 2012-03-12 | 2022-09-27 | Cooler Master Co., Ltd. | Flat heat pipe structure |
| JP6011499B2 (en) * | 2013-09-13 | 2016-10-19 | 株式会社デンソー | Adsorber |
| CN105592664A (en) * | 2014-10-23 | 2016-05-18 | 奇鋐科技股份有限公司 | Heat tube structure |
| US10082340B2 (en) * | 2014-11-12 | 2018-09-25 | Asia Vital Components Co., Ltd. | Heat pipe structure |
| US20160223267A1 (en) * | 2015-02-02 | 2016-08-04 | Asia Vital Components Co., Ltd. | Flat-plate heat pipe structure |
| TWM532046U (en) * | 2016-06-02 | 2016-11-11 | Tai Sol Electronics Co Ltd | Vapor chamber with liquid-vapor separating structure |
| US10739082B2 (en) * | 2018-01-03 | 2020-08-11 | Asia Vital Components Co., Ltd. | Anti-pressure structure of heat dissipation device |
| TW201948015A (en) * | 2018-05-04 | 2019-12-16 | 泰碩電子股份有限公司 | Joint vapor chamber assembly with vapor chambers connected by extension wick layer |
| US11131511B2 (en) | 2018-05-29 | 2021-09-28 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
| JP7434735B2 (en) * | 2018-06-29 | 2024-02-21 | 大日本印刷株式会社 | vapor chamber, electronic equipment |
| US11913725B2 (en) | 2018-12-21 | 2024-02-27 | Cooler Master Co., Ltd. | Heat dissipation device having irregular shape |
| CN109982550B (en) * | 2019-04-01 | 2021-03-26 | Oppo广东移动通信有限公司 | Heat dissipation plate, heat dissipation assembly, electronic device and manufacturing method of heat dissipation plate |
| CN110234212A (en) * | 2019-04-01 | 2019-09-13 | Oppo广东移动通信有限公司 | The preparation method of heat sink, radiating subassembly, electronic device and heat sink |
| CN110012643B (en) * | 2019-04-04 | 2021-03-02 | Oppo广东移动通信有限公司 | Heat dissipation assembly, preparation method thereof and electronic equipment |
| JP7222448B2 (en) * | 2020-11-19 | 2023-02-15 | 株式会社村田製作所 | heat spreading device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7100680B2 (en) * | 1999-05-12 | 2006-09-05 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
| US7278469B2 (en) * | 2002-05-08 | 2007-10-09 | The Furukawa Electric Co., Ltd. | Thin sheet type heat pipe |
| CN101074853A (en) * | 2006-05-19 | 2007-11-21 | 富准精密工业(深圳)有限公司 | Composite hot pipe and its production |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5427174A (en) * | 1993-04-30 | 1995-06-27 | Heat Transfer Devices, Inc. | Method and apparatus for a self contained heat exchanger |
| KR100581115B1 (en) * | 2003-12-16 | 2006-05-16 | 엘에스전선 주식회사 | Flat plate heat transferring apparatus and Method for manufacturing the same |
-
2010
- 2010-11-09 CN CN2010105381463A patent/CN102469744A/en active Pending
- 2010-12-23 US US12/977,088 patent/US20120111541A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7100680B2 (en) * | 1999-05-12 | 2006-09-05 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
| US7278469B2 (en) * | 2002-05-08 | 2007-10-09 | The Furukawa Electric Co., Ltd. | Thin sheet type heat pipe |
| CN101074853A (en) * | 2006-05-19 | 2007-11-21 | 富准精密工业(深圳)有限公司 | Composite hot pipe and its production |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103846366A (en) * | 2012-11-30 | 2014-06-11 | 象水国际股份有限公司 | Uniform-temperature plate and method for manufacturing same |
| CN107979962A (en) * | 2018-01-09 | 2018-05-01 | 无锡巨日电子科技有限公司 | Water-cooled circuit plate heat dissipating device |
| CN107979962B (en) * | 2018-01-09 | 2024-02-20 | 无锡巨日电子科技有限公司 | Water-cooled circuit board heat abstractor |
| CN114894016A (en) * | 2022-04-29 | 2022-08-12 | 广州大学 | Metal wire array liquid absorption core one-way heat pipe and manufacturing method thereof |
| CN114894016B (en) * | 2022-04-29 | 2023-09-15 | 广州大学 | Metal wire array wick unidirectional heat pipe and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120111541A1 (en) | 2012-05-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120523 |