TW201948015A - Joint vapor chamber assembly with vapor chambers connected by extension wick layer - Google Patents

Abstract

A joint vapor chamber assembly with vapor chambers connected by an extension wick layer is provided. The vapor chambers each have therein a closed space being a vacuum and filled with a working liquid. The joint vapor chamber assembly includes: a base having a first recess, second recess, liquid flow channel and gaseous flow channel in communication with each other; an upper lid coupled to the base to jointly form the closed space, the closed space including the first and second recesses, liquid and gaseous flow channels; a wick structure disposed in the closed space and facing the first and second recesses; an extension wick layer filling the liquid flow channel partially to prevent any gas from entering the first and second recesses via the liquid flow channel. Two ends of the extension wick layer extend from the liquid flow channel to come into contact with the wick structure.

Description

Joint isothermal plate assembly with extended capillary layer contacting plural isothermal plates

The present invention relates to a heat-dissipating device, and in particular relates to a combined temperature-equalizing plate assembly that connects a plurality of temperature-equalizing plates with an extended capillary layer.

According to the conventional circuit type temperature equalizing plate, such as the US Patent No. 2016/01282341 "Cooling Device and Electronic Equipment" patent case, the case mainly discloses two temperature equalizing plates, one of which is a heating plate and the other is a heat radiation plate. The heating plate is connected to the two plates of the heat dissipation plate by a steam pipe and a liquid pipe to form a liquid-steam separation circuit soaking plate. The steam pipe and the liquid pipe connect the heating plate and the heat sink by welding. board.

However, the welding process is relatively difficult to control the quality, there will be a problem of product yield reduction, and the structure of the welding place is more fragile, which is easy to be damaged by collision or long-term use, resulting in shortened product life.

The main object of the present invention is to provide a combined temperature equalizing plate assembly that connects a plurality of temperature equalizing plates with an extended capillary layer, and has better heat dissipation effect.

In order to achieve the aforesaid objective, according to the present invention, a joint temperature equalizing plate assembly is provided in which an extended capillary layer is connected to a plurality of temperature equalizing plates. An enclosed space inside the temperature equalizing plate is in a vacuum state and filled with a working liquid, including: The base is formed with a first groove, a second groove, a liquid flow channel and a steam flow channel, and the first groove, the second groove, the liquid flow channel and the steam flow channel communicate with each other; an upper cover Combined with the base and forming the closed space, the closed space includes the first groove, the second groove, the liquid flow channel and the vapor flow channel; a capillary structure is located in the closed space and corresponds to the first A groove and the second groove; and an extended capillary layer formed in the liquid flow channel, and a part of the liquid flow channel is filled with the extended capillary layer so that the vapor cannot pass through the liquid flow channel to the first flow channel. A groove communicates with the second groove, and the two ends of the extended capillary layer contact the capillary structure beyond the liquid flow channel.

In this way, the combined temperature equalizing plate assembly of the present invention, in which an extended capillary layer is connected to a plurality of temperature equalizing plates, can rapidly guide the liquid working fluid to flow back to achieve a better heat dissipation effect.

In order to explain the technical features of the present invention in detail, the following preferred embodiments are described in conjunction with the drawings as follows, wherein:

As shown in FIG. 1 to FIG. 5, a joint isothermal plate assembly 10 extending a capillary layer to connect a plurality of isothermal plates is provided in a first preferred embodiment of the present invention, and an enclosed space 115 inside the isothermal plate It is in a vacuum state and filled with a working liquid. It is mainly composed of a base 11, an upper cover 12, an extended capillary layer 17, and a capillary structure. The capillary structure of this embodiment includes a first capillary layer 13, a second capillary layer 14, a third capillary layer 15, and a fourth capillary layer 16. However, in other embodiments, the capillary structure may have more or fewer layers. Structure, and the configuration in the enclosed space is not limited to that described in this embodiment. among them:

The base 11 is formed with a first groove 111, a second groove 112, a liquid flow channel 113 and a vapor flow channel 114. The first groove 111, the second groove 112, the liquid flow channel 113 and the The steam flow channel 114 is located on the same plane, and the first groove 111, the second groove 112, the liquid flow channel 113, and the steam flow channel 114 communicate with each other.

The first groove 111, the second groove 112, the liquid flow channel 113 and the vapor flow channel 114 are located on the same plane, but in other embodiments, the four grooves may be located on different horizontal planes, or part of them may be located on the same plane. The horizontal plane and parts are located at different horizontal planes. In other embodiments, the bottom surfaces of the first groove 111, the second groove 112, the liquid flow channel 113 and the vapor flow channel 114 may be different horizontal planes.

The upper cover 12 corresponds to the contours of the first groove 111, the second groove 112, the liquid flow channel 113, and the steam flow channel 114, and is combined with the base 11, and the first groove 111, the second groove The groove 112, the liquid flow channel 113 and the vapor flow channel 114 form a closed space 115.

In this embodiment, the base 11 and the upper cover 12 are respectively formed into an integrally formed structure by CNC or etching means. In other embodiments, the formation of the structure may also be performed by other processing means, or both may use different processing means.

The first capillary layer 13 may be a metal woven mesh or copper powder sintering. In this embodiment, copper powder sintering is formed on the upper cover 12 and faces the first groove 111.

The second capillary layer 14 may be a woven metal mesh or a copper powder sintered. In this embodiment, the copper powder sintered is formed on the upper cover 12 and faces the second groove 112.

The third capillary layer 15 may be a metal woven mesh or copper powder sintering. In this embodiment, copper powder sintering is formed on the base 11 and is located in the first groove 111.

The fourth capillary layer 16 may be a metal woven mesh or copper powder sintering. In this embodiment, copper powder sintering is formed on the base 11 and is located in the second groove 112.

The first capillary layer 13, the second capillary layer 14, the third capillary layer 15 and the fourth capillary layer 16 are each provided with a plurality of convex portions 131, 141, 151, 161, and the convex portions 131, 141, 151, 161 It may be a solid copper block or a sintered capillary layer of copper powder, and respectively abut against the first capillary layer 13 and the third capillary layer 15, and between the second capillary layer 14 and the fourth capillary layer 16 between.

The extended capillary layer 17 is sintered with copper powder, and is formed in the liquid flow channel 113. A part of the liquid flow channel 113 is filled by the extended capillary layer 17, so that the gas cannot pass through the liquid flow channel 113 to the first capillary layer. A groove 111 circulates in the second groove 112, and both ends of the extended capillary layer 17 are beyond a predetermined distance outside the liquid flow channel 113, and two extension sections 171 and 172 are provided. The two extension sections 171 , 172 extend into the first groove 111 and the second groove 112, respectively, and extend a predetermined length from the ends to the same side.

The working liquid in this embodiment uses pure water as an example (not shown in the figure), and is adsorbed on the first capillary layer 13, the second capillary layer 14, the third capillary layer 15, the fourth capillary layer 16 and The extended capillary layer 17 is filled in the closed space 115, and the vapor refers to a liquid working fluid that is converted into a vaporous working fluid after absorbing thermal energy.

In this embodiment, the two extension sections 171 and 172 extend in a direction close to the steam flow passage 114, but the two extension sections 171 and 172 are not connected with the first groove 111 and the second groove 112. The side walls of the groove are in contact and maintained at an appropriate distance. The two extensions 171, 172 may be in contact with at least one of the third capillary layer 15 or the fourth capillary layer 16, and the two extensions 171, 172 may be simultaneously. It is in contact with the third capillary layer 15 and the fourth capillary layer 16 (as shown in FIG. 4).

The structure of the first embodiment of the present invention has been described above, and a description of the use state is provided next.

With the above structure, in the actual operation process, the surface of the upper cover 12 corresponding to the first groove 111 serves as a heat receiving area, and the heat receiving area is used to contact a heat source and receive heat energy from the heat source. The heat source may be a microprocessor, an integrated circuit, a radio frequency component, or other components or modules that generate thermal energy. A module is an electronic circuit composed of one or more of the above components and other electronic components.

A surface of the upper cover 12 corresponding to the second groove 112 is used as a heat dissipation area for directly or indirectly contacting the heat dissipation module. Direct contact refers to that the heat dissipation module directly touches the heat dissipation area to cool the heat dissipation area. The direct contact is usually through a heat dissipation fin, or a combination of a heat dissipation fin and a fan. Indirect contact is that the heat dissipation module does not touch the heat dissipation area, but cools the heat dissipation area through a fluid, such as the airflow of a fan. In other embodiments, the heat dissipation module may use multiple heat dissipation fins, multiple fans, or other components, so the composition of the heat dissipation module is not limited to the above.

As shown in Figure 5, after the heat receiving zone receives the heat energy, it transfers heat from the upper cover 12 down to the first groove 111, so that the liquid working fluid evaporates into a vaporous working fluid due to heat absorption. The gaseous working fluid will Entering the second groove 112 corresponding to the heat dissipation area through the vapor flow channel 114 to cool down, and the vaporized working fluid after the temperature reduction will condense into a liquid working fluid and pass through the plurality of convex portions 141 of the second capillary layer 14 And the plurality of convex portions 161 of the fourth capillary layer 16 are in abutting contact, and coupled with the extended section 172 of the extended capillary layer 17 located in the second groove 112, the condensed liquid working fluid can be quickly moved. Via the extended capillary layer 17 in the liquid flow channel 113, proceed to the extended section 171 at the other end of the extended capillary layer 17, enter the first groove 111, and adsorb and dissolve in the third capillary layer 15, The aforementioned liquid working fluid will then contact the third capillary layer 15 and the first capillary layer 13 through the extended capillary layer 17 in the first groove 111, so that the liquid working fluid will return to the heated area, thus circulating. , You can continuously export the heat energy of the heat source to achieve a good Heating effect.

As can be seen from the above, the present invention contacts the fourth capillary layer 16 and the third capillary layer 15 through the extended capillary layer 17, and because the second capillary layer 14 and the fourth capillary layer 16 and the third capillary layer 16 A plurality of convex portions 141, 161, and 151, 131 are provided between the capillary layer 15 and the first capillary layer 13. In addition, the guiding and transmitting effects of the two extension sections 171 and 172 of the extended capillary layer 17 make the liquid act. The liquid can smoothly flow back into the first groove 111 corresponding to the heating source, which can accelerate the heat dissipation cycle and improve the heat dissipation effect.

Please refer to FIG. 6 to FIG. 7 again, which is a joint isothermal plate assembly 20 provided by a second preferred embodiment of the present invention to extend a capillary layer to connect a plurality of isothermal plates. The first preferred embodiment is different in that:

The base 21 has two steam flow channels 214 which are respectively disposed on both sides of the first groove 211 and the second groove 212. The liquid flow channel 213 is provided between the first groove 211 and the second groove 212. Of course, the upper cover 22 is set to have a contour corresponding to the base 21, the two ends of the extended capillary layer 27 are both beyond a predetermined distance outside the liquid flow channel 213, and are provided with two extension sections 271, 272, which The segments 271 and 272 extend into the first groove 211 and the second groove 212, respectively, and extend a predetermined length from their ends to different two sides.

The remaining steps of the second embodiment and the effects that can be achieved are the same as those of the first embodiment disclosed above, and will not be described again.

Please refer to FIG. 8 to FIG. 9 again, which is a joint isothermal plate assembly 30 extending a capillary layer to connect a plurality of isothermal plates provided by the third preferred embodiment of the present invention. The first preferred embodiment is different in that:

One end of the extended capillary layer 37 exceeds a predetermined distance outside the liquid flow channel 313. The other end of the extended capillary layer 37 has an extension 371 that extends into the first groove 311 but is not filled. In the space of the first groove 311, the extension section 371 has a main section section 3711 and a plurality of branch sections 3712. The main section section 3711 has a rectangular shape. The plurality of branch sections 3712 are formed by the main section section 3711. The sides are arranged at intervals and extend in a direction close to the steam flow passage 314.

The remaining steps of the third embodiment and the effects that can be achieved are the same as those of the first embodiment disclosed previously, and will not be described again.

Please refer to FIG. 10 to FIG. 11 again, which is a joint isothermal plate assembly 40 extending a capillary layer to connect a plurality of isothermal plates provided by the fourth preferred embodiment of the present invention. The first preferred embodiment is different in that:

The base 41 has two liquid flow channels 413 and two vapor flow channels 414. Two extended capillary layers 47 are respectively disposed on the two liquid flow channels 413 and extend beyond a distance. Two ends of the two extended capillary layers 47 exceed the liquid. After a predetermined distance outside the flow channel 413, the flow channel 413 extends into the first groove 411 and the second groove 412, respectively, and is connected to each other by an extension 471.

The first groove 411 and the second groove 412 communicate with each other through two connecting grooves 48. Each of the connecting grooves 48 is provided with a partition plate 481 to separate the two liquid flow channels 413 and the two Steam flow channel 414.

The remaining steps of the fourth embodiment and the effects that can be achieved are the same as those of the first embodiment disclosed above, and will not be described again.

Please refer to FIG. 12 for a fifth preferred embodiment of the present invention, which are basically the same as the first preferred embodiment disclosed above, and the difference lies in that the capillary structure is omitted from the first capillary layer 13 and the fourth layer of FIG. 4. Capillary layer 16. The fifth embodiment provides a joint soaking plate assembly 50 in which an extended capillary layer is connected to a plurality of soaking plates, and includes a base 51 having a first groove 511, a second groove 512, and a liquid flow channel 513 connected to each other. , The steam flow channel 514, the upper cover 52, the extended capillary layer 57 and the capillary structure, two ends of the extended capillary layer 57 have two extension sections 571 and 572 respectively project into the first groove 511 and the second groove 512, The capillary structure includes the second capillary layer 54 and the third capillary layer 55. The remaining steps and the effects that can be achieved are the same as those in the first embodiment disclosed above, and will not be described again.

The embodiment of FIG. 12 has a capillary structure with fewer layers than the embodiment of FIG. 4, but the capillary structure with fewer layers can also have other configurations, which is not limited to this. More layers of capillary structure can distinguish each layer of capillary structure into more layers.

It can be known from the above that the extended capillary layer 17 is in contact with at least the first capillary layer 13, the second capillary layer 14, the third capillary layer 15, and the fourth capillary layer 16 of the capillary structure, and the extension is added. The structural design of the extensions 171 and 172 provided in the capillary layer 17 provides guidance and transmission functions, so that the liquid working fluid can flow back into the first groove 111 corresponding to the heated area, which can continuously heat the heat source. Heat extraction, the invention can accelerate the heat dissipation cycle and has the function of achieving a good heat dissipation effect.

10‧‧‧Combined constant temperature plate assembly that connects the plurality of constant temperature plates with an extended capillary layer

11‧‧‧ base

111‧‧‧first groove

112‧‧‧Second groove

113‧‧‧fluid channel

114‧‧‧Steam flow channel

115‧‧‧ enclosed space

12‧‧‧ Upper cover

13‧‧‧ first capillary layer

131‧‧‧ convex

14‧‧‧ second capillary layer

141‧‧‧ convex

15‧‧‧ third capillary layer

151‧‧‧ convex

16‧‧‧ fourth capillary layer

161‧‧‧ convex

17‧‧‧ extended capillary layer

171, 172‧‧‧ extension

20‧‧‧Combined constant temperature plate assembly that connects the plurality of constant temperature plates with an extended capillary layer

21‧‧‧base

211‧‧‧first groove

212‧‧‧Second groove

213‧‧‧fluid channel

214‧‧‧Steam flow channel

22‧‧‧ Upper cover

27‧‧‧ extended capillary layer

271, 272‧‧‧ extension

30‧‧‧Combined constant temperature plate assembly that connects the plurality of constant temperature plates with an extended capillary layer

311‧‧‧first groove

313‧‧‧fluid channel

314‧‧‧Steam flow channel

37‧‧‧Extended Capillary Layer

371‧‧‧extended

3711‧‧‧Main Section

3712‧‧‧ Branch Section

40‧‧‧Combined constant temperature plate assembly that connects the plurality of constant temperature plates with an extended capillary layer

41‧‧‧base

411‧‧‧first groove

412‧‧‧Second groove

413‧‧‧fluid channel

414‧‧‧Steam flow channel

47‧‧‧ extended capillary layer

471‧‧‧ extension

48‧‧‧ connecting slot

481‧‧‧ partition

50‧‧‧Combined constant temperature plate assembly that connects multiple constant temperature plates with extended capillary layer

51‧‧‧base

511‧‧‧first groove

512‧‧‧Second groove

513‧‧‧fluid channel

514‧‧‧steam flow channel

52‧‧‧ Upper cover

54‧‧‧Second capillary layer

55‧‧‧ third capillary layer

57‧‧‧Extended capillary layer

571, 572‧‧‧ extension

FIG. 1 is a schematic perspective view of the first preferred embodiment of the present invention. Figure 2 is a schematic sectional view of Figure 1 along the direction of 2-2. Figure 3 is a schematic cross-sectional view of Figure 1 along the direction of 3-3. FIG. 4 is a three-dimensional exploded view of FIG. 1. Figure 5 is a schematic top view of Figure 4 after the top cover and the first capillary layer are removed. FIG. 6 is a three-dimensional exploded view of the second preferred embodiment of the present invention. Figure 7 is a schematic top view of Figure 6 after the top cover and the first capillary layer are removed. FIG. 8 is a three-dimensional exploded view of the third preferred embodiment of the present invention. Figure 9 is a schematic top view of Figure 8 after the top cover and the first capillary layer are removed. FIG. 10 is a three-dimensional exploded view of the fourth preferred embodiment of the present invention. Figure 11 is a schematic top view of Figure 10 after the top cover and the first capillary layer are removed. FIG. 12 is a three-dimensional exploded view of the fifth preferred embodiment of the present invention.

Claims (12)

A combined temperature equalizing plate assembly in which an extended capillary layer is connected to a plurality of temperature equalizing plates. A closed space inside the temperature equalizing plate is in a vacuum state and filled with a working liquid, and includes: a base formed with a first groove, a A second groove, a liquid flow channel and a vapor flow channel, the first groove, the second groove, the liquid flow channel and the vapor flow channel communicate with each other; an upper cover combined with the base and forming the closed space, The closed space includes the first groove, the second groove, the liquid flow channel and the vapor flow channel; a capillary structure is located in the closed space and corresponds to the first groove and the second groove; An extended capillary layer is formed in the liquid flow channel, and a part of the liquid flow channel is filled by the extended capillary layer, so that the vapor cannot pass through the liquid flow channel to the first groove and the second groove. Circulating inside, the two ends of the extended capillary layer contact the capillary structure beyond the liquid flow channel. According to item 1 of the scope of the patent application, the combined constant temperature plate assembly is connected with a plurality of constant temperature plates by an extended capillary layer, wherein: the extended capillary layer fills the inside of the liquid flow channel. According to item 1 of the scope of the patent application, a joint isothermal plate assembly is connected to a plurality of isothermal plates with an extended capillary layer, wherein: two ends of the extended capillary layer each have an extended section, and the two extended sections respectively extend into the first A groove and a predetermined length in the second groove are not in contact with the groove side walls of the first groove and the second groove, and a proper distance is maintained. According to item 3 of the scope of the patent application, a joint soaking plate assembly in which an extended capillary layer is connected to a plurality of soaking plates, wherein the two extended sections are formed by extending the two ends of the extended capillary layer to the same side. According to item 3 of the scope of the patent application, the combined constant temperature plate assembly in which an extended capillary layer is connected to a plurality of constant temperature plates, wherein the two extension sections are respectively formed by extending two ends of the extended capillary layer to different two sides. According to item 1 of the scope of the patent application, a joint soaking plate assembly that uses an extended capillary layer to contact a plurality of soaking plates, wherein: one end of the extended capillary layer has an extension section that extends into the first groove, However, the space of the first groove is not filled. The extension has a main section and a plurality of branch sections. The main section is rectangular and the plurality of branch sections are spaced from one side of the main section. It is arranged and extends in a direction close to the steam flow channel. According to item 1 of the scope of the patent application, a joint soaking plate assembly that connects an extended capillary layer with a plurality of soaking plates, wherein the base has two liquid flow channels and two steam flow channels, and two extended capillary layers are respectively formed on the base plate. Two liquid flow channels, and at least a part of each of the liquid flow channels is filled with each of the extended capillary layers and blocks the gaseous working fluid sent from the vapor flow channel from entering the two liquid flow channels, and the two extensions Both ends of the capillary layer are beyond a predetermined distance outside the two liquid flow channels, and respectively extend into the first groove and the second groove, and are connected to the two ends of the extended capillary layer by two extension sections. According to item 7 of the scope of the patent application, a joint soaking plate assembly for extending a capillary layer to contact a plurality of soaking plates, wherein: the first groove and the second groove of the base are connected by two connecting grooves, and The connection tank is separated into a liquid flow channel and a vapor flow channel by a partition plate. Two liquid flow channels are provided on the opposite sides of the two connection tank bodies, and two of the vapor flow channels are provided on the two connections. The opposite outside of the slot body. According to item 1 of the scope of the patent application, a joint soaking plate assembly that extends a capillary layer to connect a plurality of soaking plates, wherein: the first groove, the second groove, the liquid flow channel and the vapor flow channel are located in the same flat. According to item 1 of the scope of the patent application, a joint soaking plate assembly that extends a capillary layer to contact a plurality of soaking plates, wherein the capillary structure includes a first capillary layer, a second capillary layer, a third capillary layer, and a A fourth capillary layer, the first capillary layer is formed on the upper cover and faces the first groove, the second capillary layer is formed on the upper cover, and faces the second groove, and the third capillary layer is formed on The base is located in the first groove, and the fourth capillary layer is formed in the base and is located in the second groove. According to item 10 of the scope of the patent application, a joint soaking plate assembly for extending a capillary layer to contact a plurality of soaking plates, wherein: between the first capillary layer, the second capillary layer, the third capillary layer, and the fourth capillary layer A plurality of convex portions are provided, and each of the convex portions may be a solid copper block. According to item 10 of the scope of the patent application, a joint soaking plate assembly for extending a capillary layer to contact a plurality of soaking plates, wherein: between the first capillary layer, the second capillary layer, the third capillary layer, and the fourth capillary layer A plurality of convex portions are provided, and each of the convex portions may be a capillary layer sintered with copper powder.