TWM532046U - Vapor chamber with liquid-vapor separating structure - Google Patents

Description

Temperature equalization plate with liquid-vapor separation structure

This creation is related to heat dissipation technology, especially a temperature equalization plate with a liquid-vapor separation structure.

According to the growth trend of the global electronics industry, many electronic products (such as LED lighting modules, computers and mobile phones, etc.) have become an indispensable part of people's habits and life. However, with the rapid development of these electronic products, In order to achieve product performance improvement, the product component unit is often easy to generate a large amount of heat energy during operation. When these components accumulate a certain degree of heat energy, the work efficiency is reduced or the product life is shortened. Therefore, many electronic products will be equipped with a heat pipe or a vapor chamber in the heating unit, and then combined with a fin or a fan to form a heat dissipation system to further achieve the heat dissipation effect.

Among them, the heat conduction of the heat pipe is performed in a one-dimensional and linear structure, and the temperature equalization plate is performed in a two-dimensional and surface structure. Due to the different contact areas of the two, the temperature equalizing plate has the ability to disperse the heat energy quickly and evenly, and accelerates the efficiency of the heat dissipation cycle. Therefore, the temperature equalizing plate has a better heat dissipation effect than the heat pipe. As disclosed in Japanese Patent No. I476361, a "mean temperature plate capillary forming method and structure thereof" is disclosed, which comprises a bottom plate, a cover plate, a plurality of supporting protrusions, a capillary structure and a working fluid, wherein the cover plate is sealed on the bottom plate. In the above, a cavity is formed between the two, and the supporting convex system is directly formed on the bottom plate and the cover plate or the inner wall surface of either one, and the capillary structure is coated on the surface of the supporting convex body, the inner wall surface of the bottom plate and the inner surface of the cover plate. On the wall surface, the working fluid is filled in the cavity to improve the heat transfer efficiency and speed of the temperature equalization plate.

However, although the above-mentioned uniform temperature plate uses the supporting protrusion to increase the supporting strength of the temperature equalizing plate, the capillary structure originally covered on the bottom plate or the cover plate is in an undulating state, and the working fluid must pass through the heat dissipation cycle. The aperture formed between the supporting protrusions, this structure will affect the recirculation speed of the working fluid during the heat dissipation process. Moreover, the working fluid is coexisted in the liquid and vapor in the cavity, and the flow of the working fluid in the vapor and liquid forms will also be different. The mass flux during the cycle is reduced, which further affects the heat dissipation effect.

Furthermore, if the temperature equalizing plate is disposed in a space that requires a load or is susceptible to being squeezed, since the supporting convex structure is composed of two solid spheres having unequal radii, and is arranged at intervals, The force point will be concentrated on the top of the semi-circular sphere, so when it is squeezed, especially when the pressure is uneven, the structure of the uniformity plate is still damaged, so the uniform temperature plate structure Support is still to be improved.

The main purpose of the present invention is to provide a temperature equalizing plate having a liquid-vapor separation structure, the structure having the plurality of vaporous channels and the at least one liquid channel, which can restrict the flow direction of the vapor and liquid activating liquid, and increase the steam during the heat-dissipating cycle. The liquid flux of the liquid type actuates to achieve better heat dissipation.

Another object of the present invention is to provide a temperature equalizing plate having a liquid-vapor separation structure, the structure having a strip-shaped plurality of partitioning members, the at least one first plate and the second abutting the temperature equalizing plate A strong support structure is formed between the plates to further achieve better support.

According to the present invention, a temperature equalizing plate having a liquid-vapor separation structure according to the present invention includes: at least one first plate; a second plate, the at least one first plate is coupled to the second plate, and the at least Forming a sealed at least one accommodating space between the first plate and the second plate; a plurality of partitioning members, the plurality of partitioning members abutting between the at least one first plate and the second plate and located at the at least one In the accommodating space, the partitioning members are arranged at intervals and form a plurality of vapor passages and at least one liquid passage, and the plurality of partitions divide the at least one accommodating space into a heated zone and a condensing zone, and the heated zone Between the condensation zones, only the plurality of vapor passages and the at least one liquid passage are connected; at least one first capillary material, a portion of the at least one first capillary material is disposed on the at least one liquid passage, and the at least one first capillary The remaining portion of the material is disposed in the heated zone and the condensation zone; and an actuating liquid is filled in the at least one accommodating space.

Thereby, the plurality of vapor channels and the at least one liquid channel provided by the temperature equalizing plate of the present invention can overcome the coexistence of liquid and vapor in the working cavity in the prior art, and the mass flux when the working fluid circulates. The disadvantage of reducing, and thus having better circulation efficiency of the operating fluid, thereby improving the heat dissipation effect.

The plurality of partitions abut the first plate and the second plate in a strip shape, so that the two solid spheres of the unequal radius of the prior art are semi-spherical balls to form a supporting convex structure. Disadvantages, in turn, have a better support effect.

In order to explain in detail the technical features of the present invention, the following preferred embodiments are described below with reference to the following:

As shown in FIG. 1 to FIG. 4, a temperature equalizing plate 10 having a liquid-vapor separation structure according to a first preferred embodiment of the present invention is mainly composed of at least a first plate 11 and a second plate 12, a plurality of partition members 13, at least one first capillary material 14 and an actuating liquid (not shown), wherein:

The at least one first board 11 is coupled to the second board 12. In the first preferred embodiment, the at least one first board 11 is substantially one, and the first board 11 and the second board 12 are In the first preferred embodiment, the at least one accommodating space 121 is substantially one in number; the junction of the first board 11 and the second board 12 is formed. In the first preferred embodiment, the at least one deaeration tube 19 is substantially one in number; the deaeration tube 19 is connected to the accommodating space 121 at one end, and the other end is exposed at the same. The warm plate 10 is outside and closed.

The plurality of partition members 13 are abutted between the first plate 11 and the second plate 12 and located in the accommodating space 121, and the partitioning members 13 are arranged at intervals and form a plurality of vapor passages 141 and at least one liquid passage. 142, in the first preferred embodiment, the at least one liquid channel 142 is substantially two in number; and the plurality of partitions 13 divide the accommodating space 121 into a heated zone H and a condensing zone C, the heated zone H and the condensation zone C are only connected by the plurality of vapor passages 141 and the two liquid passages 142; a heat insulation zone A is formed between the heat receiving zone H and the condensation zone C, and the plurality of partitions 13 are Located in the adiabatic zone A. In the first preferred embodiment, the plurality of partitions 13 are elongated, and the plurality of vapor passages 141 and the two liquid passages 142 are elongated (see Figures 1, 2 and 4). Figure shows).

A portion of the at least one first capillary material 14 is disposed in the two liquid channels 142. In the first preferred embodiment, the at least one first capillary material 14 is substantially two in size, and the two first capillary materials 14 are The other part is located in the heated zone H and the condensing zone C. In the first preferred embodiment, the two first capillary materials 14 are elongated, and the two first capillary materials 14 are arranged to fill the liquid channel 142; the two first capillary materials 14 are fiber bundles. A copper powder or a copper mesh (not shown) is a fiber bundle in the present embodiment as a composition of the two first capillary materials 14 (see FIGS. 1 and 2).

The actuating liquid is filled in the accommodating space 121. Since the illuminating liquid is well known to those skilled in the art and is difficult to display in the drawings, it will not be described here.

The structure of the first preferred embodiment of the present invention has been described above, and the state of use of the first preferred embodiment of the present invention will be described next.

Referring to FIG. 1 to FIG. 4, when the temperature equalizing plate 10 having the liquid-vapor separation structure of the present invention is in an operating state, the heat receiving zone H conducts heat energy to the accommodating space 121, so as to be originally contained in the The actuating liquid of the first first capillary material 14 evaporates into a vapor phase, and the actuating liquid diffuses in the vapor phase form through the plurality of vapor passages 141 formed by the plurality of partition members 13 toward the condensation region C, reaching the In the condensation zone C, the actin liquid is reduced to a liquid phase and adheres to the condensation zone C, and the second capillary material 14 composed of a fiber bundle connected between the condensation zone C and the heat receiving zone H passes through the The two liquid passages 142 are recirculated to the heating zone H; the plurality of vapor passages 141 and the two liquid passages 142 restrict the flow of the actuating liquid in the vapor and the liquid in different passages, thereby improving the quality of the actin liquid in the circulation mechanism. Flux; and the plurality of partition members 13 abut against the first plate 11 of the temperature equalizing plate 10 and the second plate 12 to form a strong supporting structure to achieve a better supporting effect; the temperature equalizing plate 10 has The strips of the two first capillary materials 14 can effectively accelerate the liquid state in the temperature equalizing plate 10 The actuating liquid circulation is substantially the same as the conventional material such as copper powder sintering or copper mesh when the material of the two first capillary materials 14 is a fiber bundle.

Accordingly, it can be seen from the above preferred embodiment that the temperature-inciding plate 10 having the liquid-vapor separation structure of the present invention provides the plurality of vapor passages 141 and the two liquid passages 142, which can overcome the working fluids described in the prior art. The coexistence of liquid and vapor in the cavity causes the disadvantage of the reduction of the mass flux during the circulation of the working fluid, and further has the circulation efficiency of the preferred actuating liquid, thereby improving the heat dissipation effect.

The plurality of partition members 13 are in a strip-like manner abutting between the first plate 11 and the second plate 12, so that the support convex bodies are formed by semi-spherical balls compared with the two solid unequal radii of the prior art. The shortcomings of the structure, in turn, have a better supporting effect.

Please refer to FIG. 5 again. The temperature equalizing plate 20 provided in the second preferred embodiment of the present invention is mainly similar to the first preferred embodiment. The difference is as follows:

The second plate 22 is further sintered with a second capillary material 28, and the second capillary material 28 is located in the heated zone H2 of the second plate 22, the condensation zone C2 or both 26, 27, which is preferred in the second. In the embodiment, the second capillary material 24 is in contact with the second capillary material 28 as an example.

The second capillary material 28 is a copper powder or a copper mesh; the second preferred embodiment is exemplified by a copper mesh.

According to the temperature equalizing plate 20 disclosed in the second preferred embodiment, the heated area H2 of the second plate 22 and the condensing area C2 are each sintered with a certain area of the second capillary material 28 to cause the heating. The zone H2 can maintain a higher capacity of the actuating liquid culvert, and the second capillary material 28 effectively accommodates the actuating liquid on average, thereby improving the evapotranspiration efficiency of the actuating liquid; and the condensing zone C2 disposed in the second plate 22 The second capillary material 28 also increases the operating fluid culvert capacity of the condensing zone C2, which improves the recirculation efficiency of the actuating liquid during circulation, and the remaining structures and the achievable functions are similar to those disclosed above. A preferred embodiment will not be described again.

Please refer to FIG. 6 to FIG. 8 again. The temperature equalizing plate 30 provided in the third preferred embodiment of the present invention is mainly the same as the first preferred embodiment. The difference is:

The second plate 32 further includes at least one recess 322 and is disposed in the condensing zone C3. In the third preferred embodiment, the at least one recess 322 is substantially two, and the second plate 32 is sintered with a third. The capillary material 38 is disposed on the bottom side of the two concave portions 322, and the third capillary material 38 is connected to the first capillary material 34. The height of the two concave portions 322 is greater than the at least one first plate 31 to the second plate. The height 32 (see FIG. 8), in the third preferred embodiment, the at least one first plate 31 is substantially two in number. The two first plates 31 are coupled to the second plate 32, and a second sealed receiving space 321 is formed between each of the first plates 31 and the second plate 32. The plurality of partitions 33, the heat receiving zone H3, the condensation zone C3, the plurality of vapor passages 341, the two liquid passages 342, the two first capillary materials 38, and the actuating liquid (not shown).

The third capillary material 38 is a copper powder or a copper mesh; the third preferred embodiment is exemplified by a copper mesh.

According to the temperature equalizing plate 30 having the liquid-vapor separation structure disclosed in the third preferred embodiment, the structure of the two recesses 322 increases the storage space of the condensing zone C3 for the actin liquid, which is beneficial to the second A capillary material 34 is guided back to the heated zone H3 by the condensing zone C3. In addition, the change in the number of constituent units of the above-mentioned temperature equalizing plate 30 can also accelerate the cooling efficiency, and the remaining structure and the achievable The function is similar to that of the first preferred embodiment, and will not be described again.

Please refer to FIG. 9 again. The temperature equalizing plate 40 provided in the fourth preferred embodiment of the present invention is mainly the same as the first preferred embodiment. The difference is as follows:

The second plate 42 corresponds to the heat receiving zone H4, the condensation zone C4 or both 46, 47, and is further provided with a plurality of support blocks 49. In the fourth preferred embodiment, the plurality of support blocks 49 are arranged to The second plate 42 is exemplified by the heat receiving zone H4, and the shape of the plurality of supporting blocks 49 is cylindrical, and the at least one first capillary material 44 has a substantial number of four; the plurality of supporting blocks 49 are offset from the first a plate 41, and the plurality of support blocks 49 are respectively located on opposite sides of the body of the plurality of first capillary materials 44 of the heat receiving zone H4, and provide a limiting effect on the body of the plurality of first capillary materials 44; each of the supports The blocks 49 are aligned or staggered with each other. In the fourth preferred embodiment, the support blocks 49 are aligned with each other, and the plurality of support blocks 49 are arranged in the same direction with each of the partition members 43 to form a plurality of support groups. 45, and each of the support groups 45 has the same distance between them. In addition, in addition to the above-described type, the plurality of support blocks 49 can also be disposed on the second plate 42 corresponding to the heat receiving zone H4 and the condensation zone C4 (see FIG. 10), and the plurality of support blocks 49 The type can also be set to a long column (see Figures 11, 12).

According to the temperature equalizing plate 40 having the liquid-vapor separation structure disclosed in the fourth preferred embodiment, the plurality of supporting blocks 49 are disposed to correspond to the second plate 42 corresponding to the heat receiving zone H4, the condensation zone C4 or both. The support of the structure of the temperature equalizing plate 40 can be effectively improved, and the rest of the structure and the achievable functions are similar to those of the first preferred embodiment, and will not be further described.

Referring to FIG. 13 again, the temperature equalizing plate 50 provided in the fifth preferred embodiment of the present invention is mainly similar to the first preferred embodiment. The difference is that:

The second board 52 is disposed correspondingly to the heat receiving area H5, the condensing area C5 or both 56, 57, and further provided with a plurality of supporting blocks 59. In the fifth preferred embodiment, the plurality of supporting blocks 59 are The second plate 52 is disposed as an example of a side of the heat receiving zone H5, and the shape of the plurality of supporting blocks 59 is cylindrical, and the at least one capillary material 54 has a substantial number of four; the plurality of supporting blocks 59 are abutted against The first plate 51, and the plurality of support blocks 59 are respectively located on both sides of the body of the plurality of first capillary materials 54 of the heat receiving zone H5, and provide a limiting effect on the body of the plurality of first capillary materials 54; The support blocks 59 are aligned or staggered with each other (not shown). In the fifth preferred embodiment, the support blocks 59 are aligned with each other, and the plurality of support blocks 59 and the spacers 53 are respectively arranged. The plurality of support groups 55 are arranged in the same direction, and the distance between the support groups 55 is the same. In addition to the above-described type, the plurality of support blocks 59 can also be disposed on the second plate 52 corresponding to the heat receiving zone H5 and the condensation zone C5, and the shape of the plurality of support blocks 59 can also be set to a long column shape ( Not shown in the figure).

In addition, in the fifth preferred embodiment of the present invention, the second capillary material 58 is disposed on the second plate 52 and corresponds to the heat receiving zone H5, the condensation zone C5 or both 56, 57, and the at least one first The capillary material 54 is in contact with the second capillary material 58. In the fifth preferred embodiment, the second capillary material 58 is exemplified by the condensation zone C5 of the second plate 52. The at least one first capillary material 54 is exemplified. The substantial number is four; in addition to the above type, the second capillary 58 may be disposed only in the condensation zone C5 of the second plate 52 (see FIG. 14), or on the second plate. The heated zone H5 of 52 and the condensing zone C5 (see Figure 15). The above structure can effectively increase the culvert capacity of the actuating liquid in the heated zone H5 and the condensing zone C5, and at the same time take into consideration the structural support of the heated zone H5 of the temperature equalizing plate 50 and the condensing zone C5, and the remaining structure and The efficacies that can be achieved are the same as those of the first preferred embodiment, and will not be described again.

The above description is only used to explain the preferred embodiment of the present invention, and is not intended to impose any limitation on the present invention, so that any modifications or changes to the creation made in the same creative spirit are made. All should still be included in the scope of this creative intent.

10‧‧‧Wall plate
11‧‧‧ first board
12‧‧‧ second board
121‧‧‧ accommodating space
13‧‧‧Parts
14‧‧‧First capillary
141‧‧‧Vapor channel
142‧‧‧ liquid channel
19‧‧‧Degassing tube
H‧‧·heated area
C‧‧‧Condensation zone
A‧‧‧Insulation zone
20‧‧‧Homothermal board
22‧‧‧ second board
24‧‧‧First capillary
28‧‧‧Second capillary
H2‧‧‧heated area
C2‧‧‧ Condensation zone
30‧‧‧Wall plate
31‧‧‧ first board
32‧‧‧ second board
321‧‧‧ accommodating space
322‧‧‧ recess
33‧‧‧Parts
34‧‧‧First capillary
341‧‧‧Vapor channel
342‧‧‧ liquid channel
38‧‧‧ Third capillary
H3‧‧‧heated area
C3‧‧‧ Condensation zone
40‧‧‧Homothermal board
41‧‧‧ first board
42‧‧‧ second board
43‧‧‧Parts
44‧‧‧First capillary
45‧‧‧Support group
49‧‧‧Support block
H4‧‧‧heated area
C4‧‧‧ Condensation zone
50‧‧‧Wall plate
51‧‧‧ first board
52‧‧‧ second board
53‧‧‧Parts
54‧‧‧First capillary
55‧‧‧Support group
58‧‧‧Second capillary
59‧‧‧Support block
H5‧‧‧heated area
C5‧‧‧ Condensation zone

1 is a partially exploded perspective view of the first preferred embodiment of the present invention; FIG. 2 is a front elevational view of the first preferred embodiment of the present invention, showing the internal structure thereof; 3 is a longitudinal cross-sectional view of the first preferred embodiment; FIG. 4 is a front cross-sectional view of the second preferred embodiment of the present invention; FIG. 5 is a front view of the second preferred embodiment of the present invention, showing the internal structure thereof; The front view of the third preferred embodiment shows the internal structure thereof; the seventh drawing is a partially exploded perspective view of the third preferred embodiment of the present invention; and the eighth drawing is a side view of the third preferred embodiment of the present invention; 9 is a partially exploded perspective view of the fourth preferred embodiment of the present invention; FIG. 10 is another schematic view of the fourth preferred embodiment of the present invention, showing that the plurality of support blocks in a cylindrical shape are located in the heated area and The condensing zone; FIG. 11 is another schematic view of the fourth preferred embodiment of the present invention, showing that the plurality of supporting blocks having a long column shape are located in the heated area; FIG. 12 is a fourth preferred embodiment of the present creation A further schematic diagram showing an elongated column The plurality of support blocks are located in the heated area and the condensing area; FIG. 13 is a partially exploded perspective view of the fifth preferred embodiment of the present invention; and FIG. 14 is another schematic view of the fifth preferred embodiment of the present invention. The second capillary is disposed on the second plate and corresponds to the heated area; and FIG. 15 is a schematic view of the fifth preferred embodiment of the present invention, showing that the second capillary is disposed on the second plate And corresponding to the heated zone and the condensation zone;

10‧‧‧Wall plate

11‧‧‧ first board

12‧‧‧ second board

121‧‧‧ accommodating space

13‧‧‧Parts

14‧‧‧First capillary

141‧‧‧Vapor channel

19‧‧‧Degassing tube

H‧‧·heated area

C‧‧‧Condensation zone

A‧‧‧Insulation zone

Claims (11)

A temperature equalizing plate having a liquid-vapor separation structure, comprising: at least one first plate; a second plate, the at least one first plate being coupled to the second plate, and the at least one first plate and the second plate Forming a sealed at least one accommodating space; a plurality of partitioning members, the plurality of partitioning members abutting between the at least one first plate and the second plate and located in the at least one accommodating space, and the separating members Arranging a plurality of vapor channels and at least one liquid channel at intervals, and the plurality of partitions divide the at least one accommodating space into a heat receiving zone and a condensing zone, and the heating zone and the condensing zone are only separated by the plurality of steam And communicating with the at least one liquid passage; at least one first capillary material, a portion of the at least one first capillary material is disposed in the at least one liquid passage, and the remaining portion of the at least one first capillary material is located in the heated region and The condensing zone; and an actuating liquid, the activating liquid is filled in the at least one accommodating space. A temperature equalizing plate having a liquid vapor separation structure according to claim 1, wherein a heat insulating zone is formed between the heat receiving zone and the condensation zone, and the plurality of partitions are located in the heat insulating zone. A temperature equalizing plate having a liquid vapor separation structure according to claim 1, wherein the plurality of partition members are elongated. The temperature equalizing plate having a liquid-vapor separation structure according to claim 1, wherein the plurality of vapor channels are elongated with the at least one liquid channel. A temperature equalizing plate having a liquid vapor separation structure according to claim 1, wherein: the at least one first capillary material is elongated, and the at least one first capillary material is configured to fill the liquid passage. A temperature equalizing plate having a liquid-vapor separation structure according to claim 1, wherein at least one degassing pipe is disposed at a junction of the at least one first plate and the second plate, and the at least one degassing pipe is connected at one end. The at least one receiving space and the other end are exposed outside the temperature equalizing plate and are in a closed state. The temperature equalizing plate having a liquid-vapor separation structure according to claim 1, wherein the second plate corresponds to a heat receiving zone, the condensation zone or both, and further comprises a plurality of supporting blocks, the plurality of supporting blocks The top portion is opposite to the at least one first plate, and the plurality of support blocks are respectively located on two sides of the body of the at least one first capillary material, and provide a limiting effect on the body of the at least one first capillary material. The temperature equalizing plate having a liquid-vapor separation structure according to claim 7, wherein each of the supporting blocks is aligned or staggered with each other, and the plurality of supporting blocks are arranged in the same direction as each of the partitioning members to form a plurality of Support group. A temperature equalizing plate having a liquid-vapor separation structure according to claim 7, wherein the second plate is further sintered with a second capillary material, the second capillary material being located in the heated zone, the condensation zone or two And the at least one first capillary material contacts the second capillary material. A temperature equalizing plate having a liquid-vapor separation structure according to claim 1, wherein the second plate further comprises at least one recess and is disposed in the condensation zone, and the second plate is sintered with a third capillary material. The third capillary material is connected to the first capillary material, and the height of the at least one concave portion is greater than the height of the at least one first plate to the second plate. A temperature equalizing plate having a liquid vapor separation structure according to claim 1, wherein the at least one first capillary material is composed of a fiber bundle, a copper powder or a mesh.