TWI747437B - Thin vapor chamber device with directional liquid phase flow and non-directional vapor phase flow - Google Patents

Abstract

A thin vapor chamber device includes a first metal sheet, a wick structures, and a second metal sheet. A groove structure of the first metal sheet is divided into two secondary grooved structures by a supporting wall structure configured in the groove structure. The wick structure is respectively formed in a secondary groove to form directional liquid flow channels. The second metal sheet has a plurality of supporting column structures corresponding to the position of the supporting wall structures. The second metal sheet is sealed with the first metal sheet to form a non-directional gas flow channel. By means of both directional liquid flow channels and non-directional gas flow channel, the present invention enhances the flow speed of liquid phase flow of working fluid in wick structure and the efficiency of gas phase flow, thus reducing the thermal resistance of the element and improving the function uniformity of the device.

Description

Ultra-thin uniform temperature plate element with both directional liquid phase flow and non-directional gas phase flow

The present invention relates to a capillary structure of a uniform temperature plate, in particular to a high-efficiency ultra-thin uniform temperature plate element with different liquid and gas flow modes.

Generally, a certain temperature difference is formed between the heating zone (Evaporator) and the condensation zone (Condensor) of the uniform temperature plate element due to the existence of the internal thermal resistance of the uniform temperature plate element. The smaller the temperature difference, the better the temperature equalization performance of the temperature equalization plate element, and the better the heat conduction function. The factors that affect the internal thermal resistance of the uniform temperature plate element depend on the liquid flow velocity of the working fluid in the capillary structure, from the condensation zone to the heat absorption zone, and the resistance of the gas flow in the vacuum duct. At present, the application of general temperature equalizing plate components usually requires that the temperature difference between the temperature of the test point in the heating zone and the test point in the remote condensing zone is less than 5°C.

Please refer to Fig. 1. Fig. 1 shows a schematic diagram of a thin-type uniform temperature plate in the prior art. As shown in FIG. 1, the capillary structure of the thin-type uniform temperature plate 8 of the prior art uses a common copper mesh 80 (Copper Mesh) as the capillary structure, and the entire copper mesh is attached to the groove structure of a metal copper sheet. The columnar support structure 81 of the prior art is formed in a groove structure of another metal copper sheet, and the support structure column is directly pressed on the whole piece of copper mesh 80 when the components are sealed. Since the copper mesh is laid entirely in the groove structure of the metal copper sheet, when the liquid phase working fluid at the cooling end returns to the heat absorption zone, its flat hair The efficiency of transporting the liquid phase of the working fluid back to the endothermic zone in the fine structure is limited. When the thickness of the uniform temperature plate element and the thickness of the capillary structure of the copper mesh are thinner, the efficiency of the liquid phase reflux is limited more obviously.

Therefore, how to improve the circulation efficiency of the working fluid in the uniform temperature plate to achieve the rapid heat dissipation of the uniform temperature plate and reduce the temperature difference is a problem that needs to be solved in the field of manufacturing an ultra-thin uniform temperature plate.

In view of this, an ultra-thin uniform temperature plate element with both directional liquid phase flow and non-directional gas phase flow of the present invention is composed of two substrates containing two corresponding support structures, which solves the capillary in the uniform temperature plate. The capillary force of the structure is insufficient, the liquid-phase working fluid's return rate is insufficient, and the liquid-phase and gas-phase circulation efficiency of the working fluid in an ultra-thin and narrow space is insufficient.

The ultra-thin uniform temperature plate element with both directional liquid phase flow and non-directional gas phase flow of the present invention has a heat absorption area (Evaporator) and a condensation area (Condensor), and the thickness is not greater than 0.6mm, ultra-thin uniform temperature plate The element further includes a first metal sheet, a plurality of first capillary structures, and a second metal sheet. The first metal sheet has a first surface, the first surface has a first groove structure, and at least one elongated supporting wall structure is arranged in the first groove structure, which extends from the heat absorption area toward the condensation area, and is elongated The supporting wall structure divides the first groove structure into at least two elongated secondary first groove structures. A plurality of first capillary structures are respectively formed in the elongated secondary first groove structure to form a plurality of elongated directional capillary liquid flow channels. The second metal sheet has a second surface. A plurality of supporting column structures are arranged on the second surface. The position of the supporting column structure corresponds to the position of the supporting wall structure. The second metal sheet is connected to the periphery of the first groove structure The first metal sheet is hermetically sealed to form a cavity containing the elongated support wall structure, the elongated directional capillary liquid flow channel, and the support column structure. The cavity area is in a vacuum negative pressure state. The planar non-directional gas phase flow channel is formed between the first capillary structure and the second metal sheet in the cavity, and makes the elongated directional hair The areas of the corresponding cavities of the fine liquid flow channels are connected to each other. The working fluid is contained in the cavity, and the liquid-gas phase is rapidly circulated through the long directional capillary liquid-phase flow channel and the planar non-directional gas-phase flow channel.

Wherein, the second surface of the second metal sheet further has a second groove structure, and the supporting column structure is disposed in the second groove structure.

Among them, the top of the supporting column structure abuts the top of the supporting wall structure, and the length of the farthest ends of the single supporting wall structure is greater than the length of the farthest ends of the single supporting column structure.

Wherein, the ultra-thin temperature equalizing plate element further includes at least two second capillary structures formed in the condensation area and the heat absorption area in the first groove structure, respectively, wherein the first capillary structure is in the condensation area and the heat absorption area through the second capillary structure. The heat-absorbing area is connected in a liquid state.

Wherein, the width of each elongated secondary first groove structure is not greater than 2.5 mm.

Among them, the length of the elongated secondary first trench structure exceeds 10 times the width.

Among them, the height of the plane non-directional gas phase flow channel is not more than 0.3mm.

Wherein, the capillary structure is formed by printing a paste placed on the first metal sheet through heating, pyrolysis and sintering processes to form a three-dimensional porous capillary structure. The paste contains a metal powder, a polymer and a Solvent.

The paste has rheological properties, and it is easy to lay the paste containing copper powder in the groove structure of the first metal sheet by graphic printing. The capillary structure of the sintered copper powder is confined to the elongated groove, which further strengthens the capillary force of the capillary structure to transport the liquid phase working fluid.

Among them, the elongated supporting wall structure can be composed of a plurality of elongated secondary supporting wall structures connected in sections, so that the liquid phase working fluid can also be transported between adjacent elongated secondary first groove structures.

In summary, the present invention provides an ultra-thin uniform temperature plate element with both directional liquid phase flow and non-directional gas phase flow. The wall-like support structure is conducive to the transportation of the working fluid in the liquid phase, and the columnar support structure is conducive to Plane diffusion and transportation of working fluid in gas phase. With the two corresponding support structures of the two substrates, the capillary structure in the uniform temperature plate will not be deformed and collapsed due to the difference in internal and external air pressure. In addition, the efficiency of the liquid-gas two-phase heat conduction and heat convection of the working fluid in the two substrates is improved to effectively achieve the functions of heat conduction and temperature uniformity.

1: The first metal sheet

d: The width of the secondary first trench structure

12: The first surface

3: Thin-type uniform temperature plate

122: first trench structure

31: Heat absorption area

1222: Secondary second trench structure

32: Condensation area

1224: Long support wall structure

4: The first capillary structure

1226: Perimeter of the first groove structure

5: Long strip directional capillary liquid flow channel

2: The second metal sheet

6: Plane non-directional gas flow channel

22: second surface

7: The second capillary structure

222: Second groove structure

8: Known average temperature board

2224: Support column structure

80: Copper mesh

2: The second metal sheet

81: Supporting structure

a: The length of the farthest ends of the supporting wall structure

b: The length of the farthest ends of the support column structure

c: The length of the secondary first groove structure

Figure 1 is a schematic diagram showing the thin-type uniform temperature plate of the prior art.

2A is a schematic diagram of a first metal sheet and a second metal sheet according to a specific embodiment of the present invention.

2B is a perspective view showing the combination of the first metal sheet and the second metal sheet of the specific embodiment of FIG. 2A according to the present invention.

2C is a perspective view showing the combination of the first metal sheet and the second metal sheet of the specific embodiment of FIG. 2A according to the present invention.

Fig. 3A is a schematic diagram showing the cross-sectional line AA' of the embodiment shown in Fig. 2B.

Fig. 3B is a schematic diagram showing the section line BB' of the embodiment shown in Fig. 2B.

Fig. 3C is a schematic diagram showing the CC' section line of the embodiment shown in Fig. 2B.

4A is a schematic diagram of a first metal sheet and a second metal sheet according to another embodiment of the present invention.

4B is a perspective view showing the combination of the first metal sheet and the second metal sheet of the specific embodiment of FIG. 4A according to the present invention.

Fig. 4C is a schematic diagram showing the DD' section line of the embodiment of Fig. 4B according to the present invention.

FIG. 5A is a schematic diagram of a first metal sheet and a second metal sheet according to another embodiment of the present invention.

5B is a perspective view showing the combination of the first metal sheet and the second metal sheet of the specific embodiment of FIG. 5A according to the present invention.

In order to make the advantages, spirit and features of the present invention easier and clearer to understand, the following will be detailed and discussed with specific embodiments and with reference to the accompanying drawings. It should be noted that these specific embodiments are only representative specific embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. In addition, each device in the figure is only used to express its relative position and is not drawn according to its actual scale, which is explained first.

In the drawings of this creation, the devices are only used to express their relative positions and are not drawn according to their actual scale. The terms "vertical, horizontal, up, down, front, back, left, right, top, bottom, inside, outside The orientation or positional relationship indicated by "" is based on the orientation or positional relationship shown in the drawings, and is only used to facilitate the description of this creation and simplify the description, and does not indicate that the device or element must have a specific orientation or a specific orientation. Construction and operation.

The term "directivity" mentioned in this specification means that under the macroscopic view, the special structure of the element makes it easy for fluid to flow in the set direction, but it does not mean that the fluid must flow in the set direction under all conditions. The term "non-directional" mentioned in this specification means that the special structure of the element does not restrict the flow direction of the fluid, which makes the fluid easy to disperse, but it does not mean that the fluid will not be subjected to other external forces and follow a single direction under the macroscopic view. flow.

Please refer to FIG. 2A, FIG. 2B and FIG. 2C, FIG. 2A is a specific diagram according to the present invention The schematic diagram of the first metal sheet and the second metal sheet of the embodiment. 2B is a perspective view showing the combination of the first metal sheet and the second metal sheet of the specific embodiment of FIG. 2A according to the present invention. 2C is a perspective view showing the combination of the first metal sheet and the second metal sheet of the specific embodiment of FIG. 2A according to the present invention. As shown in FIGS. 2A, 2B and 2C, the ultra-thin uniform temperature plate element of the present invention has a heat absorption area and a condensation area, and the ultra-thin uniform temperature plate element of the present invention includes a first metal sheet 1, a plurality of A first capillary structure 4, and a second metal sheet 2. The first metal sheet 1 has a first surface 12, and the first surface 12 has a first groove structure 122. At least one elongated supporting wall structure 1224 is provided in the first groove structure 122 and extends from the heat absorption area 31 toward the condensation area 32. The elongated supporting wall structure 1224 divides the first groove structure 122 into at least two elongated secondary first groove structures 1222. Wherein, a plurality of first capillary structures 4 are respectively formed in the elongated secondary first groove structures 1222 to form a plurality of elongated directional capillary liquid-phase flow channels 5.

A plurality of elongated directional capillary liquid-phase flow channels 5 are beneficial to make the working fluid in the liquid-phase flow rapidly toward the heat-absorbing area 31 following the direction indicated by the arrow in FIG. 2B. In the conventional technology, due to the laying of the whole piece of copper mesh, it is difficult to design a long strip supporting wall structure, and it is even more difficult to form a three-dimensional porous capillary structure like a copper powder sintered capillary structure. In an ultra-thin uniform temperature structure Can not effectively increase the capillary flow rate of the working fluid in the liquid phase. In contrast, the elongated supporting wall structure 1224 of the present invention is arranged in the first capillary structure 4 to form a plurality of directional capillary liquid flow channels, which effectively enhances the working fluid from the condensation zone to the heating The flow efficiency of the area.

Next, the second metal sheet 2 has a second surface 22, and a plurality of supporting column structures 2224 are provided on the second surface 22. The position of the supporting column structure 2224 corresponds to the position of the elongated supporting wall structure 1224, and the second metal sheet The material 2 is hermetically sealed with the first metal sheet 1 along the peripheral edge 1226 of the first groove structure 122 to form an elongated supporting wall structure 1224 and an elongated directional capillary liquid phase. Runner 5, the cavity of the support column structure 2224. However, the planar non-directional gas-phase flow channel 6 is formed between the first capillary structure 4 and the second metal sheet 2 in the cavity, and the elongated directional capillary liquid-phase flow channel 5 corresponds to the empty space. The areas of the cavity are connected to each other. Among them, the planar non-directional gas phase flow channel 6 and the volume occupied by all the supporting column structures 2224 on the second surface 22 of the second metal sheet 2 are relatively small relative to the entire planar air chamber space. In a specific embodiment, the total volume of the support column structure 2224 is less than ten percent (10%), which facilitates the uniform flow and spread of the working fluid in the gas phase in the plane. However, under the pressure of the gas-phase working fluid being continuously converted into the heat-absorbing region 31, the gas-phase working fluid still flows towards the condensation region 32 in a macroscopic view, as shown by the arrow in FIG. 2C, for example. The working fluid in the gas phase has a large amount of heat and air pressure, and can quickly and non-directionally diffuse in the planar non-directional gas flow channel 6. The elongated directional capillary liquid-phase flow channel 5 and the planar non-directional gas-phase flow channel 6 of the present invention are beneficial to enhance the circulation of the liquid phase-gas phase of the working fluid. After the first metal sheet 1 and the second metal sheet 2 are sealed, a thin uniform temperature plate 3 is formed.

If the first metal sheet 1 and the second metal sheet 2 in the thin-type temperature equalizing plate 3 are both elongated wall structures, the diffusion and uniform velocity of the gas-phase working fluid will be restricted. If the first metal sheet 1 and the second metal sheet 2 in the thin-type uniform temperature plate 3 are both columnar structures, the flow rate of the liquid phase working fluid is significantly slower. Therefore, in the present invention, a long strip wall structure is arranged on the first metal sheet 1 with a capillary structure, and a columnar structure is arranged on the second metal sheet 2 on the side of the gas channel, and the two positions correspond to each other. In addition, the three-dimensional porous capillary structure is formed in the elongated supporting wall structure 1224 in the groove structure of the first metal sheet 1 by using the paste printing and laying and copper powder sintering processes. Therefore, the flow velocity of the liquid phase working fluid and the diffusion and uniform velocity of the gas phase working fluid are enhanced at the same time.

Ultra-thin uniform temperature plate with both directional liquid phase flow and non-directional gas phase flow of the present invention The thickness of the component is not greater than 0.6mm, which can be applied to the current thinner electronic devices. Among them, the working fluid is contained in the cavity, and the liquid-gas circulation is performed by the long directional capillary liquid-phase flow channel 5 and the planar non-directional gas-phase flow channel 6 to effectively achieve the functions of heat conduction and temperature uniformity . Among them, the height of the planar non-directional gas-phase flow channel 6 is not more than 0.3mm.

The top of the support column structure 2224 abuts the top of the support wall structure 1224, and the length a of the farthest ends of the single support wall structure 1224 is greater than the length b of the farthest ends of the single support column structure 2224, a>b. The length b of the supporting column structure 2224 is as shown in the enlarged view of L of the supporting column structure 2224. The length b of the supporting column structure 2224 is less than the length a of the supporting wall structure 1224. Therefore, the gaps between the supporting column structures 2224 can maintain more lateral passages to facilitate the gas phase operation on both sides of the supporting wall structure 1224. The fluid flows laterally.

Wherein, the length of each elongated secondary first trench structure 1222 is c and the width is d. The width d of each elongated secondary first trench structure 1222 is not greater than 2.5 mm and the length c of each elongated secondary first trench structure 1222 exceeds 10 times the width d. The larger the ratio of the length c to the width d, the more favorable the capillary force and flow velocity of the liquid phase working fluid in the sintered copper powder sintered porous capillary structure.

The arrangement and position of the supporting structure of different shapes will facilitate the liquid-gas circulation of the working fluid. The support column structure 2224, unlike the support wall, has a larger area, so more gaps can be left in the cavity of the uniform temperature plate, which is conducive to the non-directional transportation of the working fluid in the gas phase to achieve uniform temperature Purpose. The elongated supporting wall structure 1224 facilitates the condensed liquid phase working fluid to be transported to the heat absorption area 31 via the capillary force of the first capillary structure 4. Therefore, the two supporting structures of different shapes can improve the circulation efficiency of the working fluid in the liquid phase and the gas phase in the uniform temperature plate, thereby accelerating the heat transfer rate of the uniform temperature plate to achieve the effect of uniform temperature. According to this, effectively increase the temperature equalizing plate The efficiency of heat conduction.

Please refer to Figure 3A, Figure 3B and Figure 3C. Fig. 3A is a cross-sectional view taken along the line AA' of Fig. 2B. Fig. 3B is a cross-sectional view taken along the line BB' of Fig. 2B. Fig. 3C is a cross-sectional view of the CC' section line of Fig. 2B. As shown in FIGS. 3A and 3C, the elongated supporting wall structure 1224 and the supporting column structure 2224 are in conflict with each other. Wherein, the elongated supporting wall structure 1224 on the first surface 12 of the first metal sheet 1 and the supporting column structure 2224 on the second surface 22 of the second metal sheet 2 correspond to each other and are air-tightly sealed. To form a thin uniform temperature plate element 3 with a cavity inside. The thin-type uniform temperature plate element 3 includes a heat absorption area 31 and a condensation area 32. As shown in FIG. 3B, the place where there is no supporting column structure 2224 on the second metal sheet 2 and the elongated supporting wall structure 1224 of the first metal sheet 1 do not touch each other, forming a gap. The voids formed are favorable for the diffusion and distribution of the gas phase working fluid. The first capillary structure 4 of the first metal sheet 1 of the thin-type uniform temperature plate 3 is beneficial to the liquid phase working fluid transportation, and the gap between the second metal sheet 2 and the first metal sheet 1 is beneficial to air The working fluid of the phases diffuses to increase the circulation efficiency of the two-phase liquid or gaseous state in the uniform temperature plate.

Please refer to Figures 4A, 4B and 4C. 4A is a schematic diagram of a first metal sheet and a second metal sheet according to another embodiment of the present invention. 4B is a perspective view showing the combination of the first metal sheet and the second metal sheet of the specific embodiment of FIG. 4A according to the present invention. Fig. 4C is a cross-sectional view showing a specific embodiment of the DD' section line of Fig. 2B. As shown in FIGS. 4A, 4B and 4C, the second surface 22 of the second metal sheet 2 of the ultra-thin temperature equalizing plate element of the present invention further has a second groove structure 222, and the supporting column structure 2224 is disposed in the second groove Structure 222. Among them, the purpose of the second trench structure 222 is to facilitate the formation of the supporting column structure 2224. In addition, as shown in FIG. 4C, it can be clearly seen that the second metal sheet 2 has a second groove structure 222, and a plurality of support column structures 2224 are provided on the second groove structure 222. Among them, the elongated supporting wall structure 1224 of the first metal sheet 1 and the second metal The supporting column structures 2224 of the sheet 2 correspond to each other.

In addition, the ultra-thin uniform temperature plate element 3 of the present invention with both directional liquid phase flow and non-directional gas phase flow, in addition to the general rectangular structure, can also be designed into a corresponding shape according to the hardware layout of the electronic device, such as: curved Shape, square. But in principle, the ultra-thin uniform temperature plate element 3 is composed of a first metal sheet 1 and a second metal sheet 2 with two corresponding shapes.

Among them, the ultra-thin temperature equalizing plate element of the present invention with both directional liquid phase flow and non-directional gas phase flow further includes at least two second capillary structures 7 respectively formed in the first groove structure 122 to absorb heat Zone 31 and condensation zone 32. The first capillary structure 4 and the second capillary structure 7 are continuously distributed, which facilitates the uniform distribution of the liquid-phase working fluid in the second capillary structure 7. The first capillary structure 4 uses the second capillary structure 7 to connect the working fluid in the liquid state in the heat absorption area 31 and the condensation area 32. The ultra-thin uniform temperature plate element contacts a heat source, and the area where it contacts the heat source extends to the surroundings and is called a heat absorption area 31. The heat absorption area 31 extends outward from the place where it contacts the heat source, and occupies about 5-30% of the area of the first surface 12 (or second surface). 5-30% of the area of the surface 12 (or second surface). The area between the heat absorption area 31 and the condensation area 32 is called an adiabatic area (not labeled in the figure). The insulation area occupies at least 40% of the area of the first surface 12 (or the second surface). The position of the first capillary structure 4 and the position of the second capillary structure 7 are continuous without being separated, so that the first capillary structure 7 and the second capillary structure 4 are connected in a liquid state.

In another specific embodiment, the ultra-thin uniform temperature plate element has only one second burr structure 7 formed in the heat absorption area 31 in the first groove structure 122. The heat absorption area 31 extends outward from the point where it is in contact with the heat source, and occupies about 5-30% of the area of the first surface 12 (or the second surface). The remaining parts are laid with the first burr structure 4.

The pores of the second capillary structure 7 are larger than the pores of the first capillary structure 4. Second capillary The pore size of the structure 7 is larger than the pore size of the first capillary structure 4. The second capillary structure 7 is arranged in the heat absorption area 31 where the gas-liquid exchange is the most frequent, and can also be arranged in the condensation area 32 where the gas-liquid exchange is the second most frequent. Smaller pores are conducive to the flow rate of the liquid phase working fluid, so the first capillary structure 4 is mainly arranged in the middle section of the thin uniform temperature plate element 3. In addition, the condensing area 32 can also be laid with the first capillary structure 4, and the order in which the first capillary structure 4 and the second capillary structure 7 are laid with the heat absorption area 31 and the condensing area 32 is not limited to this.

The capillary structure is formed by the three heating processes of drying, cracking and sintering a slurry. The slurry contains a metal powder, a polymer and a solvent. Among them, the organic solvent may be an alcohol solvent, and the polymer may be a plastic polymer material, acrylic, synthetic fiber, nylon, natural resin (Natural Resin), synthetic resin (Synthetic Resin), or a combination of the above. The metal powder may include copper powder, copper oxide powder, cuprous oxide powder, tetracopper oxide powder, or a combination of the above. Powder sintering is carried out in a hydrogen-containing atmosphere. On the one hand, it prevents the oxidation of the copper powder, and on the other hand, it can also reduce the copper oxide powder to copper. Compared with the capillary structure of copper mesh, the capillary structure laid with slurry has a three-dimensional and porous structure with better capillary force. In addition, it is confined in a narrow and long groove, and the capillary force is relatively increased. In addition, the capillary structure formed by the slurry can be laid in an automated printing manner, which saves manpower and production costs, and at the same time improves the efficiency of making uniform temperature plates.

For another specific embodiment, please refer to FIGS. 5A and 5B. FIG. 5A is a schematic diagram of a first metal sheet and a second metal sheet according to another embodiment of the present invention. 5B is a perspective view showing the combination of the first metal sheet and the second metal sheet of the specific embodiment of FIG. 5A according to the present invention. The difference between this embodiment and the previous embodiment is that the elongated supporting wall structure 1224 of the first metal sheet 1 can also be formed by successively connecting in sections. As shown in Figures 5A and 5B, the first metal sheet 1 After being sealed with the second metal sheet 2, the first metal sheet 1 and the second metal sheet 2 are compared with the uniform temperature plate formed by the continuous elongated supporting wall structure 1224 of the previous embodiment In this embodiment, the continuous long strip supporting wall structure 1224 of this embodiment has more gaps in the cavity in the uniform temperature plate, which is beneficial to gas transportation. The elongated supporting wall structure 1224 of the thin uniform temperature plate with both directional liquid phase flow and non-directional gas phase flow of the present invention is not limited to a continuous elongated shape, and can also be composed of successive segments.

Compared with the support structure of the prior art, it is easy to damage and crush the capillary structure, which makes the capillary structure easy to collapse and deform, which affects the transmission efficiency of the working fluid in the capillary structure, and causes the heat conduction and heat equalization function of the uniform temperature plate to be limited, and The capillary structure made of copper mesh is not conducive to the installation of supporting structural members, and its production process consumes a lot of manpower and cost. For ultra-thin temperature equalizing plate components, especially those with a thickness of less than 0.3mm, the limit of the thickness of the capillary structure will limit the effectiveness of the equalizing plate. In the thin-shaped temperature equalizing plate member of the present invention, the wall-shaped support structure is beneficial to the conveying and returning of the working fluid in the liquid phase, and the columnar support structure is beneficial to the planar diffusion of the working fluid in the gas phase. Two supporting structure members with different shapes in the vacuum chamber can effectively improve the efficiency of the liquid and gas phase circulation of the working fluid in the thin uniform temperature plate member, thereby improving the heat conduction and temperature uniformity efficiency of the uniform temperature plate.

Based on the above detailed description of the preferred embodiments, it is hoped that the characteristics and spirit of the present invention can be described more clearly, and the scope of the present invention is not limited by the preferred embodiments disclosed above. On the contrary, its purpose is to cover various changes and equivalent arrangements within the scope of the patent for which the present invention is intended. Therefore, the scope of the patent application for the present invention should be interpreted in the broadest way based on the above description, so that it covers all possible changes and equivalent arrangements.

1: The first metal sheet

12: The first surface

122: first trench structure

1222: Secondary second trench structure

1224: Long support wall structure

1226: Perimeter of the first groove

2: The second metal sheet

22: second surface

2224: Support column structure

3: Thin-type uniform temperature plate

a: The length of the farthest ends of the supporting wall structure

b: The length of the farthest ends of the support column structure

c: The length of the secondary first groove structure

d: The width of the secondary first trench structure

L: An enlarged view of the length of the farthest ends of the support column structure

Claims (10)

An ultra-thin uniform temperature plate element with both directional liquid phase flow and non-directional gas phase flow. It has a heat absorption area and a condensation area, and the thickness is not greater than 0.6mm. The ultra-thin uniform temperature plate element further includes: A first metal sheet having a first surface, the first surface having a first groove structure, and at least one elongated supporting wall structure is arranged in the first groove structure from the heat absorption area toward the condensation area Extending, the elongated supporting wall structure divides the first groove structure into at least two elongated secondary first groove structures; a plurality of first powder sintered capillary structures are respectively formed on the elongated secondary In the first groove structure and attached to the bottom of the elongated secondary first groove structures, a plurality of elongated directional capillary liquid flow channels are formed; a second metal sheet has a second Surface, the second surface is provided with a plurality of support column structures, the positions of the support column structures correspond to the positions of the support wall structures, and the second metal sheet is along the periphery of the first groove structure and the first groove structure. A metal sheet is hermetically sealed to form a cavity containing the elongated support wall structure, the elongated directional capillary liquid flow passages, and one of the support column structures. The area of the cavity is in a vacuum negative pressure state ; A planar non-directional gas phase flow channel formed between the first capillary structure and the second metal sheet in the cavity, and the elongated directional capillary liquid phase flow channels are corresponding to each other The areas of the cavity communicate with each other; and a working fluid is contained in the cavity, and the liquid-gas flow is carried out by the elongated directional capillary liquid-phase flow channels and the planar non-directional gas-phase flow channel. Phase cycle. The ultra-thin temperature equalizing plate element described in claim 1, wherein the second surface of the second metal sheet further has a second groove structure, and the supporting column structures are arranged in the second groove Structure. The ultra-thin temperature equalizing plate element described in item 1 of the scope of patent application, wherein the top of the supporting column structure abuts the top of the supporting wall structure, and the length of the farthest ends of the single supporting wall structure is greater than that of a single supporting wall structure The length of the farthest ends of the support column structure. The ultra-thin uniform temperature plate element described in claim 1 further includes a second capillary structure formed in the heat absorption area in the first groove structure, wherein the position of the first capillary structure is the same as that of the second capillary structure. The positions of the capillary structures are continuous without partitions, so that the first capillary structures and the second capillary structures are connected in a liquid state, and the pores of the second capillary structure are larger than the pores of the first capillary structure. The ultra-thin temperature equalizing plate element described in claim 1, wherein the heat absorption area extends outward from the point where the ultra-thin temperature equalizing plate element contacts a heat source, and the heat absorption area on the first surface occupies the first surface. 5~30% of surface area. In the ultra-thin temperature equalizing plate element described in item 1 of the scope of patent application, the width of each of the elongated secondary first groove structures is not greater than 2.5 mm. In the ultra-thin uniform temperature plate element described in item 1 of the scope of patent application, the length of the elongated secondary first groove structure exceeds 10 times the width. As for the ultra-thin temperature equalizing plate element described in item 1 of the scope of patent application, the height of the planar non-directional gas phase flow channel is not greater than 0.3mm. The ultra-thin temperature equalizing plate element described in item 1 of the scope of patent application, wherein the capillary structure is formed by printing and laying a slurry on the first metal sheet through a heating process to form a three-dimensional With a porous capillary structure, the slurry contains a metal powder, a polymer and a solvent. In the ultra-thin temperature equalizing plate element described in item 1 of the scope of patent application, the elongated supporting wall structure is composed of a plurality of elongated secondary supporting wall structures connected in sections.

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