TW201102604A - Plate-type heat pipe and method for manufacturing the same - Google Patents

Plate-type heat pipe and method for manufacturing the same Download PDF

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Publication number
TW201102604A
TW201102604A TW98123354A TW98123354A TW201102604A TW 201102604 A TW201102604 A TW 201102604A TW 98123354 A TW98123354 A TW 98123354A TW 98123354 A TW98123354 A TW 98123354A TW 201102604 A TW201102604 A TW 201102604A
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Taiwan
Prior art keywords
heat pipe
casing
carrier plate
flat
plate
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TW98123354A
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Chinese (zh)
Inventor
sheng-chao Zhang
Zhi-Yong Zhou
Qiao-Li Ding
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Foxconn Tech Co Ltd
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Priority to TW98123354A priority Critical patent/TW201102604A/en
Publication of TW201102604A publication Critical patent/TW201102604A/en

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Abstract

A plate-type heat pipe includes a flatten sealed casing, a capillary wick structure arranged in an inner sidewall of the casing, a working liquid contained in the casing and a supporting assembly received in the casing. The supporting assembly includes a supporting plate horizontally received in the casing and a plurality of supporting posts extending through the supporting plate. The supporting posts each have top and bottom ends which are respectively located at two opposite sides of the supporting plate and contact the inner sidewall of the casing.

Description

201102604 六、發明說明: 【發明所屬之技術領域】 本發明涉及一種平板式熱管及其製造方法,特_ 指一種性能穩定之平板式熱管及其製造方法。 【先前技術】 隨著電子技術之進步,電子元件集成程度日益增心 工作時産生之熱量亦越來越多1而電子元件表面積大小 却趨向變小’熱流密度日益增大,這對電子元件散熱十分 不利。 、 業界通常米用均溫板(vapGI> ehamber)對這種電子元 件散熱。這種均溫板具有—與電子元件貼設之底蓋及盘底 盍配合之-頂蓋。所述底蓋及頂蓋通過烊接料同形成二 密閉之腔室,複數工作液體及毛細結構收容於該密閉之腔 室‘然而,這種均溫板在使科,其底蓋及頂蓋極㈣ 受壓而變形,從而影響其熱傳導性能。 【發明内容】201102604 VI. Description of the Invention: [Technical Field] The present invention relates to a flat heat pipe and a method of manufacturing the same, and to a flat heat pipe having stable performance and a method of manufacturing the same. [Prior Art] With the advancement of electronic technology, the degree of integration of electronic components is increasing, and the amount of heat generated during work is increasing. 1 The surface area of electronic components tends to become smaller. 'The heat flux density is increasing, which dissipates heat from electronic components. Very unfavorable. In the industry, the average temperature plate (vapGI> ehamber) is used to dissipate heat from such electronic components. The temperature equalizing plate has a top cover that is coupled to the bottom cover and the bottom plate of the electronic component. The bottom cover and the top cover are formed into a two-closed chamber by means of a splicing material, and a plurality of working liquids and capillary structures are accommodated in the sealed chamber. However, the temperature equalizing plate is in the utility, the bottom cover and the top cover. The pole (4) is deformed by pressure, which affects its heat conduction performance. [Summary of the Invention]

有鑒於此,有必要提供一其製造方法。 性能穩定之平板式熱管及 一種平板式熱管之製造方法,包括以τ步驟: 提供-扇平之殼體,其至少一端具有開口;⑻在: 殼體内表面形成一層毛細結構;(c)提供—承 承載板上開設有複數之穿孔;(D)提供 將/ 該複數域㈣設在承餘上之 構,(E)將所述支撑結構塞人所述殼體内,且使支撑柱° 201102604 • 之上下端面分別抵接在所述殼體上下側壁;(F )填充工 • 作流體後將殼體之開口進行封口。 ' 一種平板式熱管,包括一扁平板狀之密封殼體、形 成於殼體内壁之毛細結構、容置於殼體内之工作流體和 容置在殼體内之支撑結構,所述支撑結構包括承載板和 複數支撑柱,所述承載板上開設複數穿孔,所述支撑柱 插置在承載板之穿孔内,且支撑柱之上下端面與殼體上 下側壁抵接。 ^ 與習知技術相比,上述平板式熱管之支撑結構位於 平板式熱管内,支撑平板式熱管之上下侧壁,從而使平 板式熱管抗壓、不易變形,進而不易在運輸、使用等過 程中損壞而具有穩定之性能。 【實施方式】 圖1至圖5所示爲本發明第一個實施例中之平板式 熱官之製造方法,在本實施例中,該平板式熱管之具體 φ 製造步驟及其過程如下所示: (1) 提供一定長度之之金屬管體10,該金屬管體 1〇通常爲一導熱性能良好之銅管。 (2) 將金屬管體10壓扁,使其成爲具有一定寬度 之内空之長方形板狀殼體11,該殼體11兩端各形成 —長條形開口。 士 ( 3 )提供一板形芯模,該芯模之長度及寬度均小 於Λ又體11之長度及寬度,將該芯模塞入殼體11中,再 在心楔與殼體11之間填充金屬粉末,對殼體丨i進行高 201102604 - 溫燒結’使金屬粉末燒結於殼體11内壁而形成燒纟士气 , 毛細結構13,其中該芯模可以係實體芯模,在燒結後抽 出,亦可以係金屬纖維芯模,與金屬粉末一起燒結與殼 體11内壁。可以理解地,上述毛細結構13可以係其他 形式之毛細結構,如絲網、溝槽等。 (4) 提供一矩形承載板20,該承載板2〇之長度及 寬度均略小於殼體11之長度及寬度,該承載板20 I均 勻開設有複數呈矩陣式排列之圓形穿孔22,且該等穿孔 鲁22排列成複數等距間隔之縱列及橫列。 (5) 將複數支撑柱30穿設在承載板2〇之部分穿 孔22内固定而形成熱管之支撑結構,較佳地該等支 撑柱30呈圓錐台狀,其兩端大小不等,且外徑較大之 一端逐漸向較小之一端逐漸縮小,該支撑柱3〇從承载 板20 —側壓入穿孔22内,使支撑柱3〇之中間位置與 穿孔22過盈配合而固定於穿孔22内。該承載板2〇之 參另一部分穿孔22沒有穿置支撑柱30而形成供汽化之工 作液體通過之氣流通道。該等插置在承載板2()内之支 撑柱30呈複數相互間隔之縱列或者橫列排列,或者係 無規則地均勻插置在承載板20上。 較佳地,该等支撑柱3 〇分成兩組,幷分別從承載 ^ 2〇之不同側插入,既係該等支撑柱30外徑較大之一 端幷不位於承載板20之同一側,可以係不同列之支撑 ,3〇外徑較大之一端交錯位於承載板20之不同側,亦 可以係一支撑柱30外徑較大之一端位於承載板2〇 一侧 201102604 而與其相鄰之支撑柱3〇 -之另-側,以達到均勻二之用:位於承裁板 柱30之上下端面分別位於同—平 ,所有支撐 行。可以理解地,上述多 I、承載板20平 其他諸如圓柱狀或多棱雖^3〇幷不局限於圓錐台狀, -可以係兩端大=且台由狀構亦適用;該她 ^ ^ i 由兩螭向中間逐漸縮小之形 狀,撑柱亦可以係中間大兩端小之形狀。也 將熱官支撑結構塞入殼體u内,使 之上下麵施加墨力使支撑柱30上下 : 之上下内壁之毛細結構13上。 双體u ⑺填充相變化工作流體,將殼體u腔體抽 二,再通過聽將殼體u兩端開口麼合在一起來實現 對殼體11之封口,而完成平板式熱管之製作。 圖6所不爲本發明第二實施例中之平板式熱管用支 撑結構’其與第-實施例中之支撑結構之區別主要在 於:第二實施例中之支撑結構之承載板4〇上均勻開設 有複數呈料式排狀穿孔42且還開設有複數蒸汽通 道44,該等蒸汽通道44之尺寸遠大於第一實施例中之 支撑結構之穿孔22之尺寸。該等蒸汽通道44可以呈圓 形 '二角形等各種形狀,在本實施例中該等蒸汽通道44 爲矩升y數里爲四且關於承載板40之縱向及橫向中綫 兩兩對稱分布。該等支撑柱30插置於穿孔42内,且呈 與承載板40相對兩邊緣平行且相互間隔之縱列排布, 其中數列位於蒸汽通道44之間且至少一列分別位於蒸 201102604 汽通道44之兩側幷靠近承載板4〇之相對兩側邊緣。 如圖7所示,本發明第三實施與第一、二實施例之 區別在於支撐結構不同,第三實施例中支撑結構包括複 數相互平行間隔之長矩形承載板5〇及插置於承載板5〇 上之支撑柱30,該承載板50上開設有相互等距間隔且 沿其縱長方向排列之複數穿孔3〇。該等支撑柱等距 間隔地插置在穿孔30内固定。 上述第二實施例中之支撑結構在承載板40上開設 有複數蒸汽通道44以及第三實施例中之支撑結構之承 載板50相互間隔設置,均係爲减少支撑結構在殼體i j 内占據之空間,以便於氣化之工作液體流通,而提高該 平板式熱管之熱傳導效率。 上述平板式熱管之支撑結構位於平板式熱管内,支 撐平板式熱管之上下内壁,從而使平板式熱管抗壓、不 易變形,進而不易在運輸、使用等過程中損壞而具有穩 定之性能。 上述平板式熱管之支撑結構通過在一板體上沖孔 形成承載板20/40/50 ’再將預先鑄造好之支撑柱3〇壓 置在承載板20/40/50之穿孔22/42/52内,即可製造完 成’可見該支撑結構之結構簡單且製造過程簡單,便於 生産製造。 综上所述,本發明符合發明專利要件,爰依法提出 專利申請。惟,以上所述者僅為本發明之較佳實施例, 舉凡熟悉本案技藝之人士’在爰依本發明精神所作之等 201102604 效修飾或變化,皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係用於製造本發明第一實施例中平板式熱管殼 體之金屬管體之立體示意圖。 圖2係圖1中金屬管體被壓扁幷在内壁形成燒結式 毛細結構時之結構示意圖。 圖3係本發明第一實施例中平板式熱管之支撑結構 之不意圖。 圖4係圖3中支撑結構塞入圖2中金屬管體内之局 部剖視圖。 圖5係本發明第一實施例中平板式熱管之立體示意 圖。 圖6係本發明第二實施例中平板式熱管之支撑結構 之立體示意圖。In view of this, it is necessary to provide a manufacturing method thereof. A method for manufacturing a stable flat heat pipe and a flat heat pipe, comprising the steps of: τ: providing a fan-flat housing having an opening at least at one end thereof; (8) forming a capillary structure on the inner surface of the housing; (c) providing - a plurality of perforations are provided on the bearing plate; (D) a structure in which the / (multiple) domain is provided on the bearing, (E) the supporting structure is inserted into the casing, and the supporting column is 201102604 • The upper lower end faces abut the upper and lower side walls of the housing respectively; (F) fills the fluid and seals the opening of the housing. A flat heat pipe comprising a flat plate-shaped sealed casing, a capillary structure formed on an inner wall of the casing, a working fluid accommodated in the casing, and a support structure housed in the casing, the support structure including The carrier plate and the plurality of support columns are provided with a plurality of through holes, the support columns are inserted into the through holes of the carrier plate, and the upper end surface of the support column abuts the upper and lower sidewalls of the housing. ^ Compared with the conventional technology, the support structure of the flat heat pipe is located in the flat heat pipe, and supports the upper and lower sidewalls of the flat heat pipe, so that the flat heat pipe is resistant to pressure and deformation, and is not easy to be transported or used. Damaged and stable performance. [Embodiment] Figs. 1 to 5 show a manufacturing method of a flat type heat official in a first embodiment of the present invention. In the present embodiment, a specific φ manufacturing step and a process of the flat type heat pipe are as follows. (1) A metal pipe body 10 of a certain length is provided, and the metal pipe body 1 is usually a copper pipe having good thermal conductivity. (2) The metal pipe body 10 is flattened to have a rectangular plate-like casing 11 having an inner space of a certain width, and the ends of the casing 11 are each formed into an elongated opening. The mantle (3) provides a plate-shaped core mold having a length and a width smaller than the length and width of the body 11 and the core mold is inserted into the casing 11 and filled between the core wedge and the casing 11. The metal powder is subjected to high 201102604 - temperature sintering of the casing 丨i to sinter the metal powder on the inner wall of the casing 11 to form a burnt gas, and the capillary structure 13, wherein the core mold can be a solid core mold and is extracted after sintering. It may be a metal fiber core mold which is sintered together with the metal powder and the inner wall of the casing 11. It will be appreciated that the capillary structure 13 described above may be in the form of other forms of capillary structures such as screens, grooves, and the like. (4) providing a rectangular carrying plate 20, the length and width of the carrying plate 2 are slightly smaller than the length and width of the casing 11, and the carrying plate 20I is uniformly provided with a plurality of circular perforations 22 arranged in a matrix, and The perforations 22 are arranged in a plurality of columns and courses at equal intervals. (5) The plurality of support columns 30 are bored in a portion of the through holes 22 of the carrier plate 2 to form a support structure for the heat pipes. Preferably, the support columns 30 have a truncated cone shape, and the ends thereof are different in size and external. One of the larger diameters gradually tapers toward the smaller one end, and the support post 3〇 is pressed into the perforation 22 from the side of the carrier plate 20, so that the intermediate position of the support post 3〇 is interference-fitted with the perforation 22 and fixed to the perforation 22 Inside. The other portion of the perforations 22 of the carrier plate 2 does not pass through the support column 30 to form an air flow path through which the vaporized working fluid passes. The support posts 30 interposed in the carrier plate 2 () are arranged in a plurality of columns or columns spaced apart from each other, or are uniformly and uniformly interposed on the carrier plate 20. Preferably, the support columns 3 are divided into two groups, and the rafts are respectively inserted from different sides of the load bearing, and the one end of the support column 30 is not located on the same side of the carrier plate 20, Supported by different columns, one of the larger outer diameters of 3〇 is staggered on different sides of the carrier plate 20, or one of the outer diameters of one of the support columns 30 may be located on the side of the carrier plate 2〇201102604 and adjacent thereto. The other side of the column 3〇-to achieve uniformity: the lower end faces of the upper and lower plates 30 are located in the same plane, all supporting rows. It can be understood that the above-mentioned multi-I, the carrier plate 20 is flat, such as a cylindrical shape or a multi-edge, although it is not limited to a truncated cone shape, and the two ends may be large and the structure of the table is also applicable; i The shape is gradually reduced from the middle to the middle, and the struts can also be in the shape of small ends at the middle. The thermal official support structure is also inserted into the casing u such that the ink is applied to the upper and lower sides to support the column 30 up and down: the capillary structure 13 of the upper and lower inner walls. The double body u (7) fills the phase change working fluid, draws the shell u cavity, and then seals the shell 11 by listening to the opening of the shell u, and completes the manufacture of the flat heat pipe. Figure 6 is not a support structure for a flat-plate heat pipe according to a second embodiment of the present invention. The difference from the support structure in the first embodiment is mainly that the support plate 4 of the support structure in the second embodiment is evenly distributed. A plurality of rows of rows of perforations 42 are opened and a plurality of vapor passages 44 are also provided. The dimensions of the steam passages 44 are much larger than the size of the perforations 22 of the support structure of the first embodiment. The steam passages 44 may have various shapes such as a circular 'diagonal shape. In the present embodiment, the steam passages 44 are four in the y number of the moments and are symmetrically distributed about the longitudinal and transverse center lines of the carrier plate 40. The support posts 30 are inserted into the through holes 42 and are arranged in a row parallel to the opposite edges of the carrier plate 40 and spaced apart from each other, wherein the rows are located between the steam passages 44 and at least one column is located at the steam passages of the steam 102102604. The sides are close to the opposite side edges of the carrier plate 4〇. As shown in FIG. 7 , the third embodiment of the present invention differs from the first and second embodiments in that the supporting structure is different. In the third embodiment, the supporting structure includes a plurality of long rectangular carrying plates 5 相互 spaced apart from each other and inserted into the carrying board. The supporting column 30 on the upper side of the support plate 50 is provided with a plurality of perforations 3〇 which are equally spaced from each other and arranged along the longitudinal direction thereof. The support columns are interposed at equal intervals and are fixed in the perforations 30. The support structure in the second embodiment is provided with a plurality of steam passages 44 on the carrier plate 40 and the support plates 50 of the support structure in the third embodiment are spaced apart from each other, both of which are designed to reduce the support structure occupying the housing ij. The space is used to facilitate the circulation of the vaporized working fluid, and the heat transfer efficiency of the flat heat pipe is improved. The support structure of the flat heat pipe is located in the flat heat pipe, and supports the upper inner wall of the flat heat pipe, so that the flat heat pipe is resistant to pressure and deformation, and is not easy to be damaged during transportation and use, and has stable performance. The support structure of the flat heat pipe is formed by punching a plate body to form a carrier plate 20/40/50' and then pressing the pre-cast support column 3 to the perforation 22/42/ of the carrier plate 20/40/50. Within 52, it can be manufactured. 'The structure of the support structure is simple and the manufacturing process is simple, and it is easy to manufacture. In summary, the present invention complies with the requirements of the invention patent, and proposes a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and those who are familiar with the art of the present invention are modified or changed in accordance with the spirit of the present invention, and are intended to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a metal pipe body for manufacturing a flat heat pipe casing in the first embodiment of the present invention. Fig. 2 is a structural schematic view showing the state in which the metal pipe body of Fig. 1 is crushed and the sintered capillary structure is formed on the inner wall. Fig. 3 is a schematic view showing the support structure of the flat heat pipe in the first embodiment of the present invention. Figure 4 is a partial cross-sectional view showing the support structure of Figure 3 inserted into the metal body of Figure 2; Fig. 5 is a perspective view showing a flat type heat pipe in the first embodiment of the present invention. Fig. 6 is a perspective view showing the support structure of the flat heat pipe in the second embodiment of the present invention.

圖7係本發明第三實施例中平板式熱管之支撑結構 之立體示意圖。 殼體 承載板 52 支撑柱 11 20、40、50 30 【主要元件符號說明】 金屬管體 1() 燒結式毛細結構j 3 穿孔 蒸汽通道 22、42 44Fig. 7 is a perspective view showing the support structure of the flat type heat pipe in the third embodiment of the present invention. Housing Carrier plate 52 Support column 11 20, 40, 50 30 [Key component symbol description] Metal pipe body 1 () Sintered capillary structure j 3 Perforated Steam channel 22, 42 44

Claims (1)

201102604 : 七、申請專利範圍: 1.種平板式熱管之製造方法,包括以下步驟: (A) 提供一扁平之殼體,其至少一端具有開口 ; (B) 在所述殼體内壁表面形成一層毛細結構; (C) 提供一承載板,該承載板上開設有複數之穿孔; (D) 提供複數支撑柱,將該複數支撑柱插設在承載板 上之穿孔内而形成支撑結構; (E) 將所述支撑結構塞入所述殼體内,且使支撑柱之 上下端面分別抵接在所述殼體上下側壁; (F) 填充工作流體後將殼體之開口進行封口。 2.如申凊專利範圍帛〗帛所述之平板式熱管之製造方 法,其中該承載板上形成有複數氣流通道。 •士申叫專利範圍第1或2項所述之平板式熱管之製造 方法其中該·#支撑柱之兩端外徑大小不等,幷於支 撑柱兩端之間之位置過盈配合於所述承載板。 • 4·如申請專利範圍帛3項所述之平板式熱管之製造方 法,其中該等支撑柱呈圓錐台或棱錐台狀。 5.如申請專利範㈣3項所述之平板式熱管之製造方 法,其中該支撑柱分別從承載板之兩相對側插入所述 承載板之穿孔内,以使所述支撑柱外徑較大之一端分 別位於承載板之兩相對側。 6·一種平板式熱管’包括—扁平板狀之密封殼體、形成 =殼體内壁之毛細結構、容置於殼體内之工作流體和 谷置在殼體内之支撑結構,其改良在於:該支撑結構 201102604 包括承载板和複數支撑柱,所料餘上開設複數穿 孔,所述支撑柱插置在承載板之穿孔内,且支撑柱之 上下端面與殼體上下侧壁抵接。 7.如申請專利㈣第6項所叙平板式熱管,其中該等 支撑柱之兩端外徑大小不等,幷於支撑柱兩端之間之 位置過盈配合於所述承載板上。 8·如申請㈣第7項所述之平板式熱管,其中該等 支撑柱呈圓錐台或棱錐台狀。 9.如申請專利範圍第7項所述之平板式熱管,其中 支撑柱中有一部分外徑較大之一端位於承载板之一 而另一部分外徑較大之一端位於承載板之另一 ίαΐ請專利範圍第6項所述之平板式熱管,其中 載板呈矩形,所述承載板上開設有複數相互間隔 寸遠大於穿孔之蒸汽通道。201102604 : VII. Patent application scope: 1. A method for manufacturing a flat type heat pipe, comprising the following steps: (A) providing a flat casing having an opening at least at one end thereof; (B) forming a layer on the inner wall surface of the casing a capillary structure; (C) providing a carrier plate having a plurality of perforations; (D) providing a plurality of support columns, the plurality of support columns being inserted into the perforations of the carrier plate to form a support structure; Inserting the support structure into the casing, and abutting the upper and lower end faces of the support column respectively against the upper and lower sidewalls of the casing; (F) sealing the opening of the casing after filling the working fluid. 2. The method of manufacturing a flat heat pipe according to the scope of the invention, wherein a plurality of air flow passages are formed on the carrier plate. The method for manufacturing a flat-plate heat pipe according to the first or second aspect of the patent, wherein the outer diameter of the two ends of the support column is not equal, and the position between the two ends of the support column is excessively matched with the Said carrier board. 4. The method of manufacturing a flat heat pipe as described in claim 3, wherein the support columns are in the shape of a truncated cone or a truncated cone. 5. The method for manufacturing a flat-plate heat pipe according to claim 4, wherein the support columns are respectively inserted into the perforations of the carrier plate from opposite sides of the carrier plate, so that the outer diameter of the support column is larger. One end is located on opposite sides of the carrier plate. 6. A flat heat pipe 'includes a flat plate-shaped sealed casing, a capillary structure forming an inner wall of the casing, a working fluid housed in the casing, and a support structure in which the valley is placed in the casing, the improvement being: The support structure 201102604 includes a carrier plate and a plurality of support columns, and a plurality of perforations are formed on the remaining material. The support columns are inserted into the through holes of the carrier plate, and the upper end surface of the support column abuts the upper and lower sidewalls of the housing. 7. The flat heat pipe according to item 6 of claim 4, wherein the outer diameters of the two ends of the support columns are different, and the position between the two ends of the support column is interference fit on the carrier plate. 8. The flat heat pipe according to item (4), wherein the support columns are in the shape of a truncated cone or a truncated cone. 9. The flat-plate heat pipe according to claim 7, wherein one of the support columns has a larger outer diameter, one of the outer ends is located at one of the carrier plates and the other of the outer diameters of the other portion is located at the other of the carrier plates. The flat heat pipe of the sixth aspect of the invention, wherein the carrier plate has a rectangular shape, and the carrier plate is provided with a plurality of steam passages which are spaced apart from each other by a distance far larger than the perforations.
TW98123354A 2009-07-10 2009-07-10 Plate-type heat pipe and method for manufacturing the same TW201102604A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407071B (en) * 2011-01-18 2013-09-01 Asia Vital Components Co Ltd Thin heat pipe structure and manufacturing method thereof
TWI499016B (en) * 2013-03-01 2015-09-01 Cooler Master Co Ltd Plate type heat pipe and method of manufacturing therefor
US11765861B2 (en) 2011-10-17 2023-09-19 Asia Vital Components Co., Ltd. Vapor chamber structure
US11879690B2 (en) 2020-05-06 2024-01-23 Asia Vital Components (China) Co., Ltd. Flexible wick structure and deformable heat-dissipating unit using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407071B (en) * 2011-01-18 2013-09-01 Asia Vital Components Co Ltd Thin heat pipe structure and manufacturing method thereof
US11765861B2 (en) 2011-10-17 2023-09-19 Asia Vital Components Co., Ltd. Vapor chamber structure
TWI499016B (en) * 2013-03-01 2015-09-01 Cooler Master Co Ltd Plate type heat pipe and method of manufacturing therefor
US11879690B2 (en) 2020-05-06 2024-01-23 Asia Vital Components (China) Co., Ltd. Flexible wick structure and deformable heat-dissipating unit using the same

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