CN110828404A - Micro-channel vapor chamber with recess structure - Google Patents
Micro-channel vapor chamber with recess structure Download PDFInfo
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- CN110828404A CN110828404A CN201911152716.2A CN201911152716A CN110828404A CN 110828404 A CN110828404 A CN 110828404A CN 201911152716 A CN201911152716 A CN 201911152716A CN 110828404 A CN110828404 A CN 110828404A
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- microchannel
- bottom plate
- heat spreader
- recess
- plate
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- 238000002791 soaking Methods 0.000 claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 19
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 6
- 238000003754 machining Methods 0.000 claims 1
- 239000006262 metallic foam Substances 0.000 claims 1
- 238000012546 transfer Methods 0.000 abstract description 15
- 238000009833 condensation Methods 0.000 abstract description 11
- 230000005494 condensation Effects 0.000 abstract description 11
- 238000010521 absorption reaction Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 238000010992 reflux Methods 0.000 abstract description 5
- 230000001965 increasing effect Effects 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 238000009827 uniform distribution Methods 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000012530 fluid Substances 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000011949 advanced processing technology Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a microchannel soaking plate with a recess structure, which comprises a bottom plate, a capillary core and a cover plate, wherein the upper surface of the bottom plate is provided with a recess, the capillary core is arranged in the recess, the upper surface of the cover plate is provided with the microchannel structure, the recess structure is arranged on two sides of the inner surface of the microchannel structure, the bottom plate and the cover plate form a closed cavity in a welding mode, and the microchannel soaking plate with the recess structure is formed by vacuumizing and injecting liquid. The micro-channel array with the recessed structure is adopted to replace a conventional condensation end liquid absorption core structure, so that on one hand, the transmission and the uniform distribution of working media are facilitated, the condensation area of the working media is increased, the condensation reflux path is shortened, and the lower flow resistance and the superior burn-dry resistance are realized; on the other hand, the cavity structure can increase the heat transfer area, generate the jet throttling effect, disturb the steam flow, inhibit the formation of a condensed liquid film, promote the condensation reflux, increase the burning resistance limit, and further improve the heat transfer efficiency.
Description
Technical Field
The invention relates to the technical field of microelectronic devices and chip heat dissipation, in particular to a micro-channel vapor chamber with a recess structure.
Background
With the miniaturization, integration and function complication of electronic equipment, the heating power of electronic chips is higher and higher. At present, the surface average heat flux density of the electronic chip exceeds 100W/cm2And there is a continuing trend toward increasing. At the same time, high heat flux density can form "hot spots" on the surface of the electronic device, resulting in reduced performance and reliability of the electronic chip.
The soaking plate is a heat dissipation component which transfers heat through phase change, and can quickly transfer and diffuse heat flow gathered on the surface of the electronic component to a condensation surface for heat dissipation, so that the surface heat flow density of the electronic component is effectively reduced. In recent years, vapor chambers have been widely used in the field of heat dissipation technology for electronic devices and chips.
Vapor chambers are generally constructed using upper and lower housings with wick structures. The liquid absorption core structure is used as the core of the soaking plate and is the important factor in the design of the soaking plate. At present, the liquid absorption core structure of the vapor chamber mainly comprises porous metal sintering and a micro-channel array. The porous metal sintered wick has the advantages of large capillary suction force, good burn-dry resistance and the like, and is a wick structure which is applied more at present. However, the porous metal sintered wick has high flow resistance and low permeability and is often used in combination with a steam chamber and a support column, thereby causing the problems of low support strength of the vapor chamber, complex processing, high manufacturing cost and the like. In addition, the porous metal sintered wick structure is easy to deform the soaking plate in the high-temperature packaging process, so that the yield is low, and meanwhile, the shell plate is easy to deform under the action of long-time heating, so that poor contact with a chip is caused, and the like. This problem is well avoided by using microchannel wick structures. The microchannel wick structure has the advantages of small contact thermal resistance, large heat transfer area, small flow resistance, large permeability and the like by directly processing the microchannel structure on the substrate. In addition, the micro-channel structure is adopted to replace a steam cavity and a support column structure, so that the pressure resistance and heat resistance of the soaking plate can be effectively improved, and a condensation reflux path is shortened, thereby effectively improving the heat transfer capacity of the soaking plate. In recent years, with the miniaturization of electronic equipment and the progress of advanced processing technology, vapor chambers are developed towards the direction of ultrathin property, flexibility and high heat transfer performance, and microchannel liquid absorption cores have the advantages of large supporting strength, small flow resistance, large permeability and the like and are more in line with the development trend of ultrathin and flexible vapor chambers.
However, current microchannel wick structures are relatively simple and are mostly straight channel array structures. The straight channel array structure liquid absorption core has smooth and gentle inner surface, when steam is condensed on the inner surface of the channel by cooling, a layer of liquid film is easily formed on the surface to prevent the steam from directly contacting with the condensing plate, so that the heat transfer resistance of the microchannel condensing plate is increased, and the heat exchange capacity is reduced. In addition, when steam is cooled on the inner surface of the channel to form liquid drops, the inner surface of the straight channel is gentle and has large surface tension, so that the steam is not easy to drop and flow back to the evaporation end, the burn-out limit of the soaking plate is further reduced, and the overall heat dissipation performance of the soaking plate is reduced.
Disclosure of Invention
In order to overcome the defects and shortcomings of the prior art, the invention provides the micro-channel soaking plate with the recess structures, and the recess structures are arranged on the two side surfaces in the micro-channel, so that the fluid boundary layer can be effectively damaged, the fluid flow is disturbed, the formation of a condensed liquid film is inhibited, and the heat transfer is effectively promoted. Meanwhile, a low-temperature detention area can be formed by a recess structure in the microchannel, so that condensation and backflow of steam are promoted, and higher heat transfer capacity and superior burn-dry resistance are realized.
The invention adopts the following technical scheme:
the utility model provides a take microchannel soaking plate of pocket structure, includes bottom plate, capillary core and apron, the upper surface of bottom plate is provided with the cavity, and the capillary core sets up in the cavity, the upper surface processing of apron has the microchannel structure, the internal surface both sides of microchannel structure set up the pocket structure, and bottom plate and apron form airtight cavity through the welding mode, annotate the microchannel soaking plate of liquid formation area pocket structure through the evacuation.
The capillary core is in a copper powder sintering, foam metal or wire mesh structure.
The microchannel structure is in the form of an array consisting of a plurality of microchannels, and the array form comprises a linear array and a circumferential array.
The recess structure is a two-dimensional recess structure, the recess structure comprises a plurality of recesses, and the shape of each recess comprises a rectangle, a triangle, a semicircle or a trapezoid.
The plurality of recesses are symmetrically distributed on two sides of the inner surface of the microchannel.
The cross section of the micro-channel is arc-shaped, triangular, rectangular or trapezoidal.
The depth of the microchannel array is equal to the depth of the cavity of the bottom plate minus the height of the capillary wick.
The bottom plate and the cover plate are the same in shape.
The shape of the bottom plate and the cover plate comprises a circle or a square.
When the capillary core is a copper powder sintered liquid absorbing core, the particle size of copper powder particles is 0.075mm-0.150 mm.
The invention has the beneficial effects that:
(1) the invention adopts the microchannel wick structure to replace the traditional porous metal sintered wick structure, on one hand, the microchannel structure is beneficial to the transmission and uniform distribution of working medium steam, the channel wall also expands the condensing area of the working medium, shortens the path of liquid condensation reflux, and realizes lower flow resistance and superior burn-dry resistance; on the other hand, the micro-channel structure is also used as an upper shell plate supporting column and a lower shell plate supporting column, and the metal sintered liquid absorption core structure with more holes has higher strength and can ensure that the soaking plate is tightly attached to the chip under the action of long-time heating;
(2) according to the vapor chamber, the concave structures are processed on two side surfaces in the micro-channel, so that on one hand, a fluid boundary layer can be damaged to cause fluid disturbance, the formation of a condensed liquid film is inhibited, the convective heat transfer capability between steam and the condensed plate is enhanced, and the heat transfer performance of the vapor chamber is improved; on the other hand, the insertion of the recess structure can cause the formation of a low-temperature retention area (as shown in fig. 6 and fig. 7), thereby enhancing the condensation effect (condensation enhancement point) of steam at the recess, promoting the condensation reflux of the liquid working medium and enhancing the burn-out resistance of the soaking plate;
(3) the micro-channel vapor chamber is added with a cavity structure, so that the heat transfer area can be effectively increased, meanwhile, the injection effect is generated at the inlet of the cavity, the throttling effect is generated at the outlet, the two effects effectively promote the formation of secondary flow, further the flow resistance of steam is reduced, the convection heat transfer coefficient of the steam is improved, and finally the temperature equalization and heat dissipation performance of the vapor chamber are effectively improved;
(4) the micro-channel soaking plate with the recessed structure has the advantages of high supporting strength, small flow resistance, good temperature equalizing performance and high heat transfer efficiency, and is more in line with the development trend of ultrathin and flexible soaking plates;
(5) the micro-channel soaking plate with the recessed structure is convenient to manufacture, low in processing cost and convenient for large-scale production and manufacturing of products.
Drawings
FIG. 1 is a schematic view showing the structure of a microchannel soaking plate with a cavity structure according to example 1 of the present invention;
FIG. 2 is a cross-sectional view of FIG. 1;
FIG. 3 is a schematic view of the cover plate of FIG. 1;
FIG. 4 is a schematic structural view of embodiment 2 of the present invention;
FIG. 5 is a schematic top view of a cover plate according to embodiment 2 of the present invention;
FIG. 6 is a graph showing the heat dissipation temperature distribution of the micro-channel vapor chamber of example 1 of the present invention;
fig. 7 is a heat dissipation flow velocity distribution diagram of embodiment 1 of the present invention.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but the present invention is not limited to these examples.
Example 1
As shown in fig. 1-3, a microchannel vapor chamber with a recessed structure comprises a bottom plate 1, a capillary core 2 and a cover plate 3, wherein the recessed cavity is arranged on the inner surface of the bottom plate, and the capillary core 2 is embedded in the recessed cavity of the bottom plate to form an evaporation end of the vapor chamber. The apron and bottom plate are circular in this embodiment, and the processing has the microchannel structure 31 of circumference array at the apron internal surface, and this microchannel structure comprises a plurality of microchannels, and a plurality of microchannels use apron centre of a circle central point, disperse to the edge, evenly set up, and in this embodiment, there are 20 microchannels, the processing of the both sides of microchannel internal surface has concave structure 32.
As shown in fig. 3, in the present embodiment, the cavity structure is formed by a plurality of semicircular cavities 32, the semicircular cavities are symmetrically distributed on both sides of the microchannel, the diameter of the semicircular cavities 32 is equal to the width of the microchannel, and the number of the semicircular cavities in each microchannel is 10.
The bottom plate and the cover plate form a closed cavity in a welding mode, and then a final micro-channel soaking plate with a recess structure is formed in modes of vacuumizing, liquid injection and the like.
In this embodiment, the material of the bottom plate and the cover plate is red copper.
In this embodiment, the bottom plate 1 is formed by directly punching and integrally forming a circular copper plate.
In the embodiment, the capillary core is a copper powder sintered liquid absorbing core, and the particle size of copper powder particles is 0.075mm-0.150 mm. During processing, a designed graphite mold is covered on the upper surface of the recess of the bottom plate, then copper powder particles are quantitatively filled into a gap between the bottom plate and the mold, and the gap is filled through vibration and then placed into a sintering furnace for sintering and forming.
Example 2
Referring to fig. 4 and 5, the present embodiment is different from embodiment 1 in that: the cover plate and the bottom plate are square, the micro-channel array on the cover plate is a parallel rectangular straight micro-channel array, and the recess structure is a rectangular recess.
Other parameter settings and processing in this example were the same as in example 1.
Temperature in fig. 6 indicates Temperature, and 340, 342, 344, etc. indicate changes in Temperature. Velocity in fig. 7 represents the flow rate.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (10)
1. The utility model provides a take microchannel soaking board of pocket structure, its characterized in that, includes bottom plate, capillary core and apron, the upper surface of bottom plate is provided with the cavity, and the capillary core sets up in the cavity, the last surface machining of apron has the microchannel structure, the internal surface both sides of microchannel structure set up the pocket structure, and bottom plate and apron form airtight cavity through the welding mode, annotate the microchannel soaking board of liquid formation area pocket structure through the evacuation.
2. The microchannel heat spreader of claim 1, wherein the wick is a copper powder sintered, metal foam, or wire mesh structure.
3. The microchannel heat spreader of claim 1, wherein the microchannel structure is in the form of an array of a plurality of microchannels, the array comprising a linear array and a circumferential array.
4. The microchannel heat spreader of claim 1, wherein the pocket structure is a two-dimensional pocket structure comprising a plurality of pockets, the pockets having a shape comprising a rectangle, triangle, semicircle, or trapezoid.
5. The microchannel heat spreader of claim 4, wherein the plurality of cavities are symmetrically disposed on opposite sides of the inner surface of the microchannel.
6. The microchannel heat spreader of claim 1, wherein the cross-section of the microchannel is circular arc, triangular, rectangular, or trapezoidal.
7. The microchannel heat spreader of claim 1 wherein the depth of the microchannel array is equal to the depth of the cavity of the bottom plate minus the height of the capillary wick.
8. A microchannel heat spreader as in claim 1 wherein the base plate and cover plate are identical in shape.
9. The microchannel heat spreader of claim 1, wherein the bottom plate and the cover plate comprise a circular or square shape.
10. The microchannel heat spreader of claim 2, wherein the wick is a sintered copper powder wick and the copper powder particles have a size of 0.075mm to 0.150 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911152716.2A CN110828404A (en) | 2019-11-22 | 2019-11-22 | Micro-channel vapor chamber with recess structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911152716.2A CN110828404A (en) | 2019-11-22 | 2019-11-22 | Micro-channel vapor chamber with recess structure |
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| CN110828404A true CN110828404A (en) | 2020-02-21 |
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| CN201911152716.2A Pending CN110828404A (en) | 2019-11-22 | 2019-11-22 | Micro-channel vapor chamber with recess structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111477599A (en) * | 2020-04-29 | 2020-07-31 | 华南理工大学 | Integrated micro-injection soaking plate radiator and manufacturing method thereof |
| CN111642103A (en) * | 2020-04-29 | 2020-09-08 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | High heat flow density porous heat sink flow cooling device |
| CN114141732A (en) * | 2021-12-01 | 2022-03-04 | 广东美的白色家电技术创新中心有限公司 | Heat pipe, chip packaging structure and electronic equipment |
| EP4253891A1 (en) * | 2022-03-28 | 2023-10-04 | Mediatek Inc. | Semiconductor package with vapor chamber lid |
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| US20070056714A1 (en) * | 2005-09-15 | 2007-03-15 | National Tsing Hua University | Flat-plate heat pipe containing channels |
| CN202221259U (en) * | 2011-07-27 | 2012-05-16 | 广东新创意专利发展有限公司 | Groove composite fiber liquid absorption core, micro heat pipe and vapor chamber |
| CN105658032A (en) * | 2016-01-22 | 2016-06-08 | 白鹏飞 | Ultrathin soaking plate and manufacturing method thereof |
| CN210805756U (en) * | 2019-11-22 | 2020-06-19 | 华南理工大学 | Micro-channel vapor chamber with recess structure |
-
2019
- 2019-11-22 CN CN201911152716.2A patent/CN110828404A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070056714A1 (en) * | 2005-09-15 | 2007-03-15 | National Tsing Hua University | Flat-plate heat pipe containing channels |
| CN202221259U (en) * | 2011-07-27 | 2012-05-16 | 广东新创意专利发展有限公司 | Groove composite fiber liquid absorption core, micro heat pipe and vapor chamber |
| CN105658032A (en) * | 2016-01-22 | 2016-06-08 | 白鹏飞 | Ultrathin soaking plate and manufacturing method thereof |
| WO2017124754A1 (en) * | 2016-01-22 | 2017-07-27 | 华南师范大学 | Ultrathin soaking plate and manufacturing method thereof |
| CN210805756U (en) * | 2019-11-22 | 2020-06-19 | 华南理工大学 | Micro-channel vapor chamber with recess structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111477599A (en) * | 2020-04-29 | 2020-07-31 | 华南理工大学 | Integrated micro-injection soaking plate radiator and manufacturing method thereof |
| CN111642103A (en) * | 2020-04-29 | 2020-09-08 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | High heat flow density porous heat sink flow cooling device |
| CN114141732A (en) * | 2021-12-01 | 2022-03-04 | 广东美的白色家电技术创新中心有限公司 | Heat pipe, chip packaging structure and electronic equipment |
| EP4253891A1 (en) * | 2022-03-28 | 2023-10-04 | Mediatek Inc. | Semiconductor package with vapor chamber lid |
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Effective date of registration: 20220526 Address after: 511480 A103, No. 1, Shaxing Road, Lanhe Town, Nansha District, Guangzhou City, Guangdong Province Applicant after: Guangzhou zhileng Energy Saving Technology Co.,Ltd. Address before: 510640 No. five, 381 mountain road, Guangzhou, Guangdong, Tianhe District Applicant before: SOUTH CHINA University OF TECHNOLOGY Applicant before: Guangzhou zhileng Energy Saving Technology Co., Ltd |