CN215832538U - Ceramic vapor chamber structure with composite liquid absorption core based on casting method - Google Patents
Ceramic vapor chamber structure with composite liquid absorption core based on casting method Download PDFInfo
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Abstract
The utility model provides a ceramic vapor chamber structure with a composite liquid absorbing core based on a tape casting method, which comprises a vapor chamber, the composite liquid absorbing core and a working medium fluid, wherein the vapor chamber comprises an upper plate body and a lower plate body, and a cavity is arranged between the upper plate body and the lower plate body; the bottom side surface of the upper plate body and the inner side surface of the lower plate body are respectively provided with a plurality of channels, the channels on the upper plate body and the lower plate body are arranged side by side, the inner sides of the upper plate body and the lower plate body in the vapor chamber are respectively covered with a wire mesh liquid absorption core or a sintered powder plate liquid absorption core, and the wire mesh liquid absorption core or the sintered powder plate liquid absorption core and the adjacent channels form a composite liquid absorption core; the working fluid is sealed in the cavity of the soaking plate. The soaking plate structure can solve the technical problems of poor heat conduction capability and poor soaking performance of the existing soaking plate structure.
Description
Technical Field
The utility model relates to the technical field of ceramic vapor chambers, in particular to a ceramic vapor chamber structure with a composite liquid absorption core based on a tape casting method.
Background
With the rapid development of the third generation semiconductor technology, the power semiconductor device is rapidly developed towards high power, miniaturization, multiple functions and the like, but with the continuous improvement of the system integration level, the power density is rapidly increased, and the system function integration leads to uneven heat distribution. The original traditional packaging technology can not meet the requirements of the third generation of semiconductors on high temperature, high frequency and other characteristics. The ceramic substrate is an ideal component for balancing temperature and heat dissipation as a semiconductor package substrate. The ceramic substrate may also provide attachment for electronic circuitry, and heat dissipation from the electronic circuitry may also be through the ceramic substrate.
The soaking plate is a novel efficient heat exchange technology, can make full use of extremely high heat exchange coefficients brought by gas-liquid phase change, the composite liquid absorption core can greatly improve the capillary capacity of the composite liquid absorption core, good temperature equalization and quick start are realized, heat generated by a packaging device is quickly transmitted, and the composite liquid absorption core is an effective way for solving the heat dissipation problems of semiconductor packaging and electronic circuits. At present, most of vapor chambers or heat pipes in production and research are made of metal materials, such as copper, stainless steel, aluminum and the like. The metal vapor chamber or heat pipe is conductive by itself, and cannot be directly used for semiconductor heat dissipation and circuit board heat dissipation, so that the heat dissipation advantage of the vapor chamber is difficult to exert.
In a conventional power semiconductor module, most of the heat generated by the power loss of the chip is diffused to a heat sink through a chip solder layer, a ceramic backing plate, a backing plate solder layer, a substrate and a tim (thermal Interface material) in sequence. The ceramic soaking plate can directly conduct heat to replace a ceramic lining plate, a lining plate welding layer and a substrate, and the packaging structure is optimized.
The existing ceramic soaking plate channel is difficult to process and simple in shape, and cannot meet efficient backflow; the capillary force and permeability of a single wick are low, and thus the heat transfer limit is low; the structure is welded or bonded by an upper plate and a lower plate, so that the phenomena of cracking and liquid leakage often occur, and the performance of the equipment is seriously influenced.
Therefore, how to provide the integrated soaking substrate with good uniform heat performance, non-conductivity, high capillary force and permeability and good heat matching performance and the manufacturing method thereof has important significance for packaging the power semiconductor module.
SUMMERY OF THE UTILITY MODEL
The technical problem that this application will solve is: the ceramic vapor chamber structure with the composite liquid absorption core based on the tape casting method is provided to solve the technical problems of poor heat conduction capability and poor vapor chamber performance of the existing vapor chamber structure.
In order to solve the technical problem, the technical scheme of the application is as follows: a ceramic vapor chamber structure with a composite wick based on a tape casting method, comprising:
the vapor chamber comprises a vapor chamber body and a vapor chamber body, wherein the vapor chamber body comprises an upper plate body and a lower plate body which are made of ceramic materials;
the bottom side surface of the upper plate body and the inner side surface of the lower plate body are respectively provided with a plurality of channels, the channels on the upper plate body and the lower plate body are arranged side by side, the inner sides of the upper plate body and the lower plate body in the vapor chamber are respectively covered with a wire mesh liquid absorbing core or a sintered powder plate liquid absorbing core, and the wire mesh liquid absorbing core or the sintered powder plate liquid absorbing core and the adjacent channels form the composite liquid absorbing core; and
working medium fluid is sealed and stored in the cavity of the soaking plate.
Preferably, the material of the wire mesh wick or the sintered powder plate wick is copper, iron or titanium.
Preferably, the soaking plate is designed to be quadrilateral, circular or trapezoidal according to the required heat transfer shape.
Preferably, the cross section of the soaking plate channel is trapezoidal or V-shaped or inverted omega-shaped.
Preferably, the channels on the upper plate body and the lower plate body are straight channels or curved channels, and the channels on the upper plate body and the lower plate body are distributed at equal intervals or in a gradual change mode.
The technical effect obtained by adopting the technical scheme is as follows:
the application provides a be used for semiconductor power device encapsulation and electronic circuit integration vapor chamber structure, including last plate body, lower plate body, vapor chamber internal surface composite wick and the working medium fluid of the ceramic vapor chamber that has composite wick, vapor chamber structure integration shaping structure. Through this integration soaking plate, can realize the target of good heat conductivility and soaking.
The integrated vapor chamber plate body is provided with a channel array structure on the inner side, sintered powder can be arranged in the channel, meanwhile, the inner sides of the upper plate body and the lower plate body of the vapor chamber plate are provided with the silk screen structure liquid absorption cores or the sintered powder plate structure liquid absorption cores, the upper plate body and the lower plate body of the vapor chamber plate are integrally sintered to form the composite liquid absorption cores, and due to the existence of the composite liquid absorption cores, the capillary force and the permeability of the liquid absorption cores are greatly improved, so that the limit heat transfer capacity of the vapor chamber plate is improved.
The manufacturing method of the ceramic soaking plate structure with the composite liquid absorbing core based on the tape casting method has the following effects:
(1) the casting method has no pressure effect in the implementation process, can avoid the crushing of the reverse shape of the channel or the difficulty in laser processing of complex shapes, greatly reduces the limitation of ceramic materials on the shape of the channel, and improves the working medium reflux capacity. The capillary force and the permeability of the liquid absorption core are greatly improved by adding the composite liquid absorption core, so that the ultimate heat transfer capacity of the vapor chamber is improved; the tape casting method is integrated with sintering molding, so that cracking and liquid leakage phenomena caused by difficult welding or infirm bonding of the upper plate and the lower plate of the ceramic soaking plate are greatly avoided.
(2) The adoption of the tape casting method can ensure that the channel structure is singly expanded from the ceramic laser processing and pressure processing structure to the processing of various shapes and even three-dimensional structures, thereby improving the reflux capacity; the tape casting method is integrated with sintering molding, and the characteristics of low thermal resistance and good soaking property are realized.
(3) The utility model provides a ceramic vapor chamber with composite liquid absorption cores based on a tape casting method and a preparation method thereof, wherein the upper plate body, the lower plate body, the composite liquid absorption cores on the inner surfaces of the vapor chamber and a working medium fluid injection opening of the vapor chamber are integrally sintered and formed, so that the problems of cracking and liquid leakage are solved by using welding or bonding forming of the upper plate body and the lower plate body, and meanwhile, the ceramic vapor chamber can replace related structures in packaging, and the effects of low thermal resistance, good vapor uniformity and structure optimization are achieved.
Drawings
The utility model is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic structural view of a ceramic vapor chamber with a composite wick;
FIG. 2 is an isometric view of a wax pattern of a wire mesh composite wick;
FIG. 3 is a side view of a wax pattern for a wire mesh composite wick;
FIG. 4 is an isometric view of a paraffin mold for an integrated metal channel inverse shaped composite wick;
FIG. 5 is a side view of FIG. 4;
FIG. 6 is a schematic representation of the casting process used in a ceramic vapor chamber with a composite wick;
FIG. 7 is a schematic view of an upper or lower plate with a working fluid injection port;
FIG. 8 is a schematic view of a flow chart for making a ceramic vapor chamber structure with composite wicks based on tape casting;
wherein, 1, a lower plate body; 2. a channel; 3. a wick; 4. a chamber; 5. an upper plate body; 6. the reverse shape of the channel; 7. a wire mesh; 8. a cavity wax pattern; 9. sintering the powder board liquid absorption core; 10. a working fluid injection port; 11. a ceramic slurry; 12. a scraper; 13. and (4) a composite liquid absorption core paraffin mold.
Detailed Description
As shown in fig. 1 to 3, a ceramic vapor chamber structure with a composite liquid absorption core based on a tape casting method comprises a vapor chamber, a metal liquid absorption core 3 and a working fluid. The soaking plate comprises an upper plate body 5 and a lower plate body 1, and the soaking plate can be designed to be quadrilateral, circular or trapezoidal according to the required heat transfer shape. A cavity 4 is arranged between the upper plate body 5 and the lower plate body 1, a plurality of channels 2 are arranged on the bottom side surface of the upper plate body 5 and the top side surface of the lower plate body 1, and the cross section of each soaking plate channel 2 is trapezoidal, V-shaped or inverted omega-shaped. The channels 2 on the upper plate body 5 and the lower plate body 1 are arranged side by side; the channels 2 on the upper plate body 5 and the lower plate body 1 can be straight channels or curved channels, and the channels 2 on the upper plate body 5 and the lower plate body 1 are distributed at equal intervals or in a gradual change mode.
The vapor chamber is internally covered with a wire mesh liquid absorption core or a sintered powder plate liquid absorption core 9 at the inner sides of the upper plate body 5 and the lower plate body 1, and the wire mesh liquid absorption core or the sintered powder plate liquid absorption core 9 and a plurality of adjacent channels form a composite liquid absorption core. The metal wick 3 is preferably a mesh or sintered powder plate structure, and the mesh or sintered powder plate wick 9 is made of copper, iron or titanium. Working fluid is sealed in the chamber of the soaking plate. The working fluid can adopt one or a mixture of deionized water, ammonia, methanol, Freon and acetone to form a working fluid compatible with the composite liquid absorption core 3 material, and the injection amount and the vacuum degree depend on the working condition of the heat dissipation device.
The application provides a vapor chamber structure for integration of semiconductor power device encapsulation and electronic circuit, including last plate body 5, lower plate body 1 and the working medium fluid that has compound imbibition core, vapor chamber structure integration shaping structure. Through this integration soaking plate, can realize the target of good heat conductivility and soaking.
Be equipped with 2 array structure of channel on this integration vapor chamber plate body inboard, metal sintering powder can be filled in 2 of channel, and the vapor chamber inboard is equipped with silk screen structure imbibition core 3 or sintering powder plate structure imbibition core 3 simultaneously, and silk screen structure imbibition core 3 or sintering powder plate structure imbibition core 3 and adjacent a plurality of the channel constitutes compound imbibition core, because the existence of compound imbibition core, thereby greatly improves the limit heat transfer ability that the capillary force and the permeability of imbibition core 3 improve the vapor chamber.
As shown in fig. 4 to 8, the method for manufacturing the ceramic vapor chamber structure with the composite liquid absorption core based on the tape casting method comprises the following steps:
step 1: the compound wick paraffin mould of preparation pours out cavity wax matrix 8 with the paraffin through the mould, in metal wick is arranged respectively to both sides about 8 cavity wax matrices, and metal wick is silk screen wick or sintering powder board wick 9, and metal wick 3 can be silk screen or metal sintering powder board structure, and its material can be copper, iron or titanium. Respectively arranging channel inverse shapes 2 at the outer sides of the two metal liquid absorbing cores 3, wherein the channel inverse shapes 2 are formed by processing paraffin or molding metal powder, and obtaining a composite liquid absorbing core paraffin mold after solidification;
step 2: scraping the bottom of the lower plate body of the soaking plate by using ceramic slurry through a tape casting method, putting the composite liquid absorption core paraffin mold prepared in the step 1, scraping the upper plate body of the soaking plate to seal the composite liquid absorption core paraffin mold between the upper plate body and the lower plate body, and forming a ceramic soaking plate body after the ceramic slurry is solidified, wherein the ceramic slurry is formed by mixing one or more of aluminum oxide, aluminum nitride, silicon nitride and boron nitride;
and step 3: and (3) sintering the plate body, arranging a working medium fluid injection port 10 communicated with the cavity 4 on the surface of the ceramic soaking plate body, sintering the soaking plate body to gasify paraffin to form the integrated ceramic soaking plate, and preferably integrally sintering and molding the soaking plate by adopting a low-temperature gradient sintering or high-temperature gradient sintering process.
And 4, step 4: and (4) filling the cavity, vacuumizing the integrated ceramic soaking plate through the working medium fluid filling port 10, filling working medium fluid, and sealing the working medium fluid filling port 10 to obtain the ceramic soaking plate.
In step 1, the inverse shape of the channel 2 can be made of paraffin or formed by die pressing metal powder, so that four different composite liquid absorbing cores can be formed through step 3, wherein the four different composite liquid absorbing cores are respectively as follows: sintering a composite liquid absorption core consisting of a powder plate layer 7 and a plate inner side channel 2; sintering the composite liquid absorption core formed by the inverse shape of the powder plate layer 7 and the integrated metal channel and the inner side channel 2 of the plate; a composite liquid absorption core consisting of the wire mesh 7 and the plate inner side channel 2; and fourthly, the composite liquid absorption core is composed of the silk screen 7, the inverse shape 6 of the metal sintering powder and the inner side channel 2 of the plate.
The manufacturing method of the ceramic soaking plate structure with the composite liquid absorbing core based on the tape casting method has the following effects:
(1) the casting method has no pressure effect in the implementation process, can avoid the crushing of the reverse shape of the channel 2 or the difficulty in laser processing of complex shapes, greatly reduces the limitation of ceramic materials on the shape of the channel 2, and improves the working medium reflux capacity. The capillary force and the permeability of the liquid absorption core can be greatly improved by adding the composite liquid absorption core, so that the ultimate heat transfer capacity of the vapor chamber is improved; the tape casting method is integrated with sintering molding, so that the phenomena of cracking and liquid leakage of the ceramic soaking plate caused by difficult welding or infirm bonding of the upper plate and the lower plate are greatly avoided.
(2) The adoption of the tape casting method leads the structure of the channel 2 to be singly expanded to various shapes or even three-dimensional structures from the ceramic laser processing and pressure processing structure, thereby improving the reflux capacity; the tape casting method is integrated with sintering molding and has the characteristics of low thermal resistance and good soaking property.
(3) The utility model provides a ceramic vapor chamber structure with composite liquid absorption cores based on a tape casting method and a preparation method thereof, wherein the upper plate and the lower plate of the vapor chamber, the upper channel 2 structure of the plate, the liquid absorption cores on the inner surface of the vapor chamber and the working medium fluid injection ports 10 are integrally sintered and formed, so that the problems of cracking and liquid leakage are solved by using the upper plate and the lower plate for welding or bonding and forming, and meanwhile, the ceramic vapor chamber structure can replace related structures in packaging, thereby achieving the effects of low thermal resistance, good vapor uniformity and structure optimization.
The integrated vapor chamber plate is characterized in that an array structure of a channel 2 is arranged on the inner side of the integrated vapor chamber plate body, sintering powder can be covered or not in the channel 2, meanwhile, a wire mesh structure liquid absorption core 3 or a sintering powder plate structure liquid absorption core 3 is arranged on the inner side of the vapor chamber plate, the wire mesh structure liquid absorption core 3 or the sintering powder plate structure liquid absorption core 3 and the channel structure are sintered into a whole to form a composite liquid absorption core, due to the existence of the composite liquid absorption core, the capillary force and the permeability of the liquid absorption core are greatly improved, and when working medium fluid at one side with higher temperature in a chamber 4 is vaporized, the composite liquid absorption core can absorb the liquid working medium fluid at one side with lower temperature in the chamber 4 to one side with higher temperature, so that the ultimate heat transfer capacity of the vapor chamber plate is improved; the adoption of the tape casting method can ensure that the structure of the channel 2 is singly expanded from the structure of ceramic laser processing and pressure processing to realize various shapes and even three-dimensional structures, thereby improving the reflux capacity; the tape casting method is integrated with sintering molding, thereby greatly avoiding the phenomena of cracking and liquid leakage caused by difficult welding or infirm bonding of the upper plate and the lower plate of the ceramic soaking plate, and having the characteristics of low thermal resistance and good soaking property.
It should be apparent that the foregoing description and illustrations are by way of example only and are not intended to limit the present disclosure, application or uses. While embodiments have been described in the embodiments and depicted in the drawings, the present invention is not limited to the particular examples illustrated by the drawings and described in the embodiments as the best mode presently contemplated for carrying out the teachings of the present invention, and the scope of the present invention will include any embodiments falling within the foregoing description and the appended claims.
Claims (5)
1. The utility model provides a ceramic soaking plate structure that has compound wick based on curtain coating method which characterized in that includes: the vapor chamber comprises a vapor chamber body and a vapor chamber body, wherein the vapor chamber body comprises an upper plate body and a lower plate body which are made of ceramic materials; the bottom side surface of the upper plate body and the inner side surface of the lower plate body are respectively provided with a plurality of channels, the channels on the upper plate body and the lower plate body are arranged side by side, the inner sides of the upper plate body and the lower plate body in the vapor chamber are respectively covered with a wire mesh liquid absorbing core or a sintered powder plate liquid absorbing core, and the wire mesh liquid absorbing core or the sintered powder plate liquid absorbing core and the adjacent channels form the composite liquid absorbing core; and the working medium fluid is sealed and stored in the cavity of the soaking plate.
2. The ceramic vapor chamber structure with composite wick based on casting method according to claim 1 characterized in that the wire mesh wick or sintered powder plate wick is made of copper, iron or titanium.
3. A ceramic soaking plate structure with composite liquid absorbing core based on casting method as claimed in claim 1, characterized in that the soaking plate is designed to be quadrilateral, circular or trapezoidal according to the required heat transfer shape, and the cross section of the soaking plate channel is trapezoidal or V-shaped or inverted Ω -shaped.
4. The ceramic vapor chamber structure with composite wick based on tape casting method of claim 1 wherein the channels on the upper and lower plates are straight or curved and the channels on the upper and lower plates are equally spaced or gradually distributed.
5. A ceramic soaking plate structure with composite liquid absorbing core based on casting method as claimed in claim 1, characterized in that the working fluid is one of de-ionized water, ammonia, methanol, freon, acetone.
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| CN202120645544.9U CN215832538U (en) | 2021-03-30 | 2021-03-30 | Ceramic vapor chamber structure with composite liquid absorption core based on casting method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113048823A (en) * | 2021-03-30 | 2021-06-29 | 华南理工大学 | Ceramic soaking plate structure with composite liquid absorption core based on tape casting method and manufacturing method thereof |
| CN117870426A (en) * | 2024-03-11 | 2024-04-12 | 深圳大学 | Soaking plate with laser sintering liquid absorption core structure and preparation method thereof |
-
2021
- 2021-03-30 CN CN202120645544.9U patent/CN215832538U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113048823A (en) * | 2021-03-30 | 2021-06-29 | 华南理工大学 | Ceramic soaking plate structure with composite liquid absorption core based on tape casting method and manufacturing method thereof |
| CN113048823B (en) * | 2021-03-30 | 2024-07-02 | 华南理工大学 | Ceramic soaking plate structure with composite liquid absorption core based on casting method and manufacturing method thereof |
| CN117870426A (en) * | 2024-03-11 | 2024-04-12 | 深圳大学 | Soaking plate with laser sintering liquid absorption core structure and preparation method thereof |
| CN117870426B (en) * | 2024-03-11 | 2024-06-11 | 深圳大学 | Soaking plate with laser sintering liquid absorption core structure and preparation method thereof |
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