CN116817648A - Ceramic temperature equalizing plate and manufacturing method thereof - Google Patents
Ceramic temperature equalizing plate and manufacturing method thereof Download PDFInfo
- Publication number
- CN116817648A CN116817648A CN202310695376.8A CN202310695376A CN116817648A CN 116817648 A CN116817648 A CN 116817648A CN 202310695376 A CN202310695376 A CN 202310695376A CN 116817648 A CN116817648 A CN 116817648A
- Authority
- CN
- China
- Prior art keywords
- ceramic
- ceramic shell
- upper cover
- cover plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 134
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000007788 liquid Substances 0.000 claims abstract description 73
- 239000012530 fluid Substances 0.000 claims abstract description 18
- 238000010521 absorption reaction Methods 0.000 claims abstract description 5
- 238000002347 injection Methods 0.000 claims description 44
- 239000007924 injection Substances 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 239000002245 particle Substances 0.000 claims description 16
- 238000003466 welding Methods 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 238000005245 sintering Methods 0.000 claims description 13
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 12
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 10
- 238000007872 degassing Methods 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 238000005086 pumping Methods 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 210000005056 cell body Anatomy 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 21
- 229910052710 silicon Inorganic materials 0.000 abstract description 4
- 239000010703 silicon Substances 0.000 abstract description 4
- 230000008646 thermal stress Effects 0.000 abstract description 4
- 239000007789 gas Substances 0.000 description 10
- 238000005219 brazing Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical group [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of circuit substrates, in particular to a ceramic temperature equalizing plate and a manufacturing method thereof, wherein the temperature equalizing plate comprises a ceramic shell, a support column and a liquid suction core; the ceramic shell comprises an upper cover plate and a lower groove body, and the upper cover plate covers the notch of the lower groove body to form a sealed cavity structure; a plurality of support columns are arranged in the ceramic shell, and two ends of each support column are respectively connected with the bottoms of the upper cover plate and the lower groove body; the ceramic shell is filled with working fluid and is positioned in the ceramic shell, and liquid absorption cores are respectively arranged on the bottom plates of the upper cover plate and the lower groove body. Compared with the traditional PCB and ceramic plate, the ceramic temperature-equalizing plate substrate has a heat conductivity coefficient of 1000+W/(m.K), has excellent heat conductivity and temperature-equalizing performance, and can be applied to a high-power use scene; the ceramic temperature-equalizing plate has good insulativity, an insulating layer is not needed to be added, the thermal expansion coefficient of the substrate of the ceramic temperature-equalizing plate is close to that of silicon, and the thermal stress can be reduced by directly attaching the chip and the substrate.
Description
Technical Field
The invention relates to the technical field of circuit substrates, in particular to a ceramic temperature equalizing plate and a manufacturing method thereof.
Background
Currently, a ceramic substrate may be used instead of a conventional PCB substrate, for example, alumina ceramic or aluminum nitride ceramic may be used as the material of the ceramic substrate. Advantages of the ceramic substrate include: the chip can be directly welded and etched on the ceramic substrate, and the heat conductivity coefficient can reach 25-230W/(m.K), which is tens of times of that of the traditional PCB material, and has relatively ideal heat transfer performance; in addition, the ceramic material has good insulating property, and an insulating layer is not required to be arranged; and, the ceramic substrate has a thermal expansion coefficient close to that of silicon, so that thermal stress can be reduced.
However, although the thermal conductivity of the ceramic material has a great advantage compared with the traditional PCB material, the current thermal conductivity coefficient still cannot meet the use requirement with reference to the improvement of the current system integration level and the heating value.
Disclosure of Invention
In order to solve at least the technical problems in the prior art, the invention provides a ceramic temperature equalizing plate and a manufacturing method thereof.
The invention provides a ceramic temperature equalizing plate, which comprises a ceramic shell, a support column and a liquid suction core; the ceramic shell comprises an upper cover plate and a lower groove body, and the notch of the lower groove body is covered by the upper cover plate to form a sealed cavity structure; a plurality of support columns are arranged in the ceramic shell, and two ends of each support column are respectively connected with the bottoms of the upper cover plate and the lower groove body; and the ceramic shell is filled with working fluid and is positioned in the ceramic shell, and the liquid absorption cores are respectively arranged on the upper cover plate and the bottom plate of the lower groove body.
In some embodiments, further comprising a fill tube; the liquid injection pipe is arranged on the ceramic shell and communicated with the inside of the ceramic shell, and liquid injection, vacuumizing and degassing operations are carried out on the inside of the ceramic shell through the liquid injection pipe.
In some embodiments, the upper cover plate and the lower tank body are coated with a metal surface layer.
In some embodiments, the wick is sinter molded with the bottom of the upper cover plate or the lower tank; the support column with the upper cover plate with the bottom welding of lower cell body, the edge of upper cover plate with the notch welding of lower cell body.
In some embodiments, the working fluid is deionized water.
In some embodiments, the ceramic shell is made of aluminum oxide or aluminum nitride, and the support posts and the wick are made of aluminum oxide, aluminum nitride or copper.
In some embodiments, the ceramic temperature uniformity plate has a thermal conductivity of 1000 to 6000W/(m·k).
The invention also provides a manufacturing method of the ceramic temperature equalization plate, the ceramic temperature equalization plate comprises a ceramic shell, the ceramic shell comprises an upper cover plate and a lower groove body, a support column and a liquid suction core are arranged in the ceramic shell, and the method comprises the following steps: the support column and the liquid suction core are arranged at preset positions and are respectively and fixedly connected with the upper cover plate and the bottom plate of the lower groove body; inserting a liquid injection pipe into the ceramic shell, and performing liquid injection and vacuum pumping operations; and sealing the liquid injection pipe.
In some embodiments, before the step of positioning the support column and the wick in the predetermined position, the method further comprises: and carrying out surface metal treatment on the ceramic shell, or mixing ceramic powder particles with silver-based powder particles, and setting the mixed particles at a set position for sintering the liquid absorption core.
In some embodiments, after the step of inserting a pour tube over the ceramic shell, the method further comprises: performing a degassing operation within the ceramic shell, the degassing operation comprising: and heating the bottom of the lower tank body, and heating and evaporating industrial fluid in the ceramic shell to form gas, wherein non-condensable gas is accumulated at the top of the liquid injection pipe, and the top of the liquid injection pipe is cut off, so that the operation of removing the non-condensable gas is completed.
According to the ceramic temperature-equalizing plate and the manufacturing method thereof, the structural forms of the ceramic shell, the support column, the liquid suction core and the working fluid are adopted, and compared with the traditional PCB substrate and the traditional ceramic substrate, the ceramic temperature-equalizing plate substrate has a heat conductivity coefficient of 1000+W/(m.K), has excellent heat conductivity and temperature-equalizing performance, and can be applied to high-power use scenes; the ceramic temperature-equalizing plate has good insulativity, an insulating layer is not needed to be added, the thermal expansion coefficient of the substrate of the ceramic temperature-equalizing plate is close to that of silicon, and the thermal stress can be reduced by directly attaching the chip and the substrate.
Drawings
The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present invention will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. Several embodiments of the present invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which:
in the drawings, the same or corresponding reference numerals indicate the same or corresponding parts.
FIG. 1 is a cross-sectional view of a ceramic temperature uniformity plate provided by an embodiment of the present invention;
FIG. 2 is a block diagram of a method for manufacturing a ceramic temperature uniformity plate according to an embodiment of the present invention;
fig. 3 is a block diagram of a process for manufacturing a ceramic temperature uniformity plate according to an embodiment of the present invention.
In the figure:
1: an upper cover plate; 2: a lower tank body; 3: a wick; 4: a support column; 5: and a liquid injection pipe.
Detailed Description
In order to make the objects, features and advantages of the present invention more comprehensible, the technical solutions according to the embodiments of the present invention will be clearly described in the following with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The embodiment of the invention provides a ceramic temperature equalizing plate, which comprises a ceramic shell, a support column and a liquid suction core; the ceramic shell is internally provided with a cavity, working fluid is filled in the cavity, the support column is positioned in the cavity and used as a support, and the liquid suction core is positioned in the cavity and used for increasing heat transfer efficiency.
The structures of the ceramic temperature equalization plate and the connection relationship between the structures are described in detail below with reference to the accompanying drawings.
As shown in fig. 1, the ceramic shell comprises an upper cover plate 1 and a lower groove body 2, wherein the notch of the lower groove body 2 is covered by the upper cover plate 1 to form a sealed cavity structure; the shape of the ceramic shell is the shape of the temperature equalizing plate. A plurality of support columns 4 are arranged in the ceramic shell, and two ends of the support columns 4 are respectively connected with the bottoms of the upper cover plate 1 and the lower groove body 2; the ceramic shell has a certain length/width, and through setting up a plurality of support columns 4, can carry out stable support between upper cover plate 1 and the lower cell body 2, avoid appearing the circumstances of local deformation. For example, the plurality of support columns 4 are uniformly distributed. The ceramic shell is filled with working fluid and is positioned in the ceramic shell, and liquid suction cores 3 are respectively arranged on the bottom plates of the upper cover plate 1 and the lower groove body 2.
The working fluid is used for conducting heat, the liquid suction cores 3 are respectively arranged on the upper cover plate 1 and the lower groove body 2 and used for increasing the heat transfer area, and heat generated by elements connected with the upper cover plate 1 is conducted through the upper cover plate 1, the liquid suction cores 3, the working fluid, the liquid suction cores 3 and the lower groove body 2, so that heat is conducted rapidly, the heat transfer efficiency is improved, and the temperature equalization plate can have higher heat conductivity.
With continued reference to fig. 1, in an embodiment of the present invention, the ceramic temperature equalization plate further includes a liquid injection pipe 5; the liquid injection pipe 5 is arranged on the ceramic shell and communicated with the inside of the ceramic shell, and liquid injection, vacuum pumping and degassing operations are carried out on the inside of the ceramic shell through the liquid injection pipe 5.
After the liquid injection pipe 5 is inserted into the ceramic shell, the liquid injection pipe 5 is welded with the ceramic shell, and a working fluid, for example, deionized water is injected into the ceramic shell through the liquid injection pipe 5; and the ceramic shell is vacuumized, so that the temperature equalizing plate is designed in vacuum, and the heat conduction efficiency can be improved.
In addition, the secondary air discharge can be performed through the liquid injection pipe 5. Specifically, the bottom of the temperature equalization plate is heated, working fluid in the ceramic shell is heated and evaporated into gas, non-condensable gas in the working fluid is accumulated at the top of the liquid injection pipe 5, and the top of the liquid injection pipe 5 is cut off so as to remove the non-condensable gas.
In the embodiment of the invention, the upper cover plate 1 and the lower groove body 2 are coated with metal surface layers. I.e. the ceramic shell is surface metallized, e.g. copper with a thickness of 1 to 3 microns is plated on the surface of the ceramic shell using an electroplating process.
In the embodiment of the disclosure, the wick 3 and the bottom of the upper cover plate 1 or the lower tank body 2 are sintered and molded; the support column 4 is welded with the bottoms of the upper cover plate 1 and the lower groove body 2, and the edge of the upper cover plate 1 is welded with the notch of the lower groove body 2. The ceramic shell is made of aluminum oxide or aluminum nitride, and the support columns 4 and the liquid absorbing cores 3 are made of aluminum oxide, aluminum nitride or copper. For example, the wick 3 is formed by sintering copper powder or a copper wire mesh, or the wick 3 is formed by sintering particles in which aluminum oxide or aluminum nitride powder particles are mixed with silver-based powder particles.
In the embodiment of the invention, the heat conductivity of the ceramic temperature-uniforming plate is 1000-6000W/(m.K), and compared with the traditional PCB substrate with 1-3W/(m.K) and the traditional ceramic substrate with 25-230W/(m.K), the heat conductivity of the ceramic temperature-uniforming plate provided by the embodiment of the invention is effectively improved.
The embodiment of the invention also provides a manufacturing method of the ceramic temperature equalization plate, the ceramic temperature equalization plate comprises a ceramic shell, the ceramic shell comprises an upper cover plate and a lower groove body, a support column and a liquid suction core are arranged in the ceramic shell, and the method comprises the following steps: the support column and the liquid suction core are arranged at preset positions and are fixedly connected with the upper cover plate and the bottom plate of the lower groove body respectively; inserting a liquid injection pipe into the ceramic shell, and performing liquid injection and vacuum pumping operations; and sealing the liquid injection pipe.
According to the method provided by the embodiment of the invention, the ceramic temperature-equalizing plate shown in fig. 1 can be manufactured, the ceramic temperature-equalizing plate is provided with the shell made of ceramic materials, the inside of the shell is filled with the liquid suction cores and the working fluid for accelerating the effect of temperature-equalizing heat conduction, and when elements, such as chips, on the ceramic temperature-equalizing plate generate heat, local heat is transferred to the temperature-equalizing plate, and the temperature-equalizing plate rapidly equalizes and conducts heat, so that the heat conduction efficiency is improved.
In the embodiment of the invention, before the step of arranging the support column and the liquid suction core at the preset position, the method further comprises the following steps: the ceramic shell is surface metallized or ceramic powder particles are mixed with silver-based powder particles and the mixed particles are placed in a set position for wick sintering.
In the embodiment of the invention, after the step of inserting the liquid injection pipe into the ceramic shell, the method further comprises the following steps: and (3) carrying out degassing operation in the ceramic shell, wherein the degassing operation comprises the following steps: and heating the bottom of the lower tank body, and heating and evaporating industrial fluid in the ceramic shell to form gas, wherein non-condensable gas is accumulated at the top of the liquid injection pipe, and the top of the liquid injection pipe is cut off, so that the operation of removing the non-condensable gas is completed.
The method for manufacturing the ceramic temperature uniformity plate in the embodiment of the invention is described below with reference to the accompanying drawings.
As shown in fig. 2, in the embodiment of the invention, a method for manufacturing a ceramic temperature equalization plate includes the following steps:
s1: the ceramic shell is subjected to surface metallization, wherein the surface metallization can be performed by adopting an electroplating process, and the copper plating thickness is 1-3 um. For example, the ceramic shell is made of aluminum oxide or aluminum nitride, and the upper cover plate and the lower groove body of the aluminum oxide or aluminum nitride temperature equalization plate are coated with copper on the surfaces;
s2: the bottoms of the upper cover plate and the lower groove body are respectively subjected to the sintering molding of the liquid absorption cores of the copper powder/copper wire mesh and the presetting of the copper supporting columns. For example, the wick is sintered by high-temperature sintering process in an atmosphere sintering furnace, the atmosphere is nitrogen-hydrogen mixed gas, the sintering temperature is 900-980 ℃, and the sintering time is 1-2 hours; the copper support column is positioned at the design position by presetting the support column and adopting a mould positioning mode.
S3: and welding is performed between the upper cover plate and the lower groove body and the support column so as to form a stable and sealed structure. For example, a welding operation is performed using diffusion welding or copper-based brazing.
S4: the copper liquid injection pipe is inserted into the ceramic shell and is subjected to high-frequency brazing; and the shell is injected with liquid and vacuumized through the liquid injection pipe; the liquid injection mode and the vacuum pumping mode are the liquid injection and vacuum pumping modes commonly used at present, and the embodiment of the invention is not limited. For example, a low temperature vacuum process is used.
S5: sealing the copper liquid injection pipe, and welding to prepare the ceramic temperature equalizing plate. For example, the sealing mode is argon arc welding spot welding heat sealing after cold sealing by diagonal pliers.
As shown in fig. 3, in an embodiment of the present invention, another method for manufacturing a ceramic temperature uniformity plate includes the following steps:
s1: alumina or aluminum nitride powder particles are mixed with silver-based powder particles. For example, the mixing method is to uniformly mix using a planetary mixer, wherein silver-based powder is 2% -10% in proportion, and the bonding of the welding strength of aluminum oxide or aluminum nitride powder particles is performed by melting at a high temperature.
S2: positioning and presetting the mixed powder particles at the design position of a die, and performing sintering liquid suction core forming and support column presetting; for example, the sintered wick is sintered in a vacuum brazing furnace with a vacuum of < 10 -4 Pa, sintering temperature 800-950 ℃, sintering time 1 hour and 2 hours; the copper support column is positioned at the design position by presetting the support column and adopting a mould positioning mode.
S3: the welding surfaces of the upper cover plate and the bottom plate of the lower groove body are preset with silver-based solder for brazing; the upper cover plate and the lower groove body as well as the upper cover plate and the lower groove body are respectively welded and formed with the support column, so that a sealing structure is formed.
S4: the copper liquid injection pipe is inserted into the ceramic shell and is subjected to high-frequency brazing through a silver-based welding ring; the shell is injected with liquid and vacuumized through the liquid injection pipe; the liquid injection mode and the vacuum pumping mode are the liquid injection and vacuum pumping modes commonly used at present, and the embodiment of the invention is not limited. For example, a low temperature vacuum process is used.
S5: sealing the copper liquid injection pipe, and welding to prepare the ceramic temperature equalizing plate. For example, the sealing mode is argon arc welding spot welding heat sealing after cold sealing by diagonal pliers.
According to the ceramic temperature-equalizing plate and the manufacturing method thereof, the structural forms of the ceramic shell, the support column, the liquid suction core and the working fluid are adopted, and compared with the traditional PCB and the ceramic plate, the ceramic temperature-equalizing plate substrate has a heat conductivity coefficient of 1000+W/(m.K), has excellent heat conductivity and temperature-equalizing performance, and can be applied to high-power use scenes; the ceramic temperature-equalizing plate has good insulativity, an insulating layer is not needed to be added, the thermal expansion coefficient of the substrate of the ceramic temperature-equalizing plate is close to that of silicon, and the thermal stress can be reduced by directly attaching the chip and the substrate.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The foregoing is merely illustrative embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the technical scope of the present invention, and the invention should be covered. Therefore, the protection scope of the invention is subject to the protection scope of the claims.
Claims (10)
1. A ceramic temperature equalizing plate is characterized by comprising a ceramic shell, support columns (4) and a liquid suction core (3);
the ceramic shell comprises an upper cover plate (1) and a lower groove body (2), wherein the upper cover plate (1) covers the notch of the lower groove body (2) to form a sealed cavity structure;
a plurality of support columns (4) are arranged in the ceramic shell, and two ends of each support column (4) are respectively connected with the bottoms of the upper cover plate (1) and the lower groove body (1);
the ceramic shell is filled with working fluid and is positioned in the ceramic shell, and the liquid absorbing cores (3) are respectively arranged on the bottom plates of the upper cover plate (1) and the lower groove body (2).
2. Ceramic temperature-equalizing plate according to claim 1, characterized by further comprising a liquid injection tube (5);
the liquid injection pipe (5) is arranged on the ceramic shell and communicated with the inside of the ceramic shell, and liquid injection, vacuumizing and degassing operations are carried out on the inside of the ceramic shell through the liquid injection pipe (5).
3. Ceramic temperature equalizing plate according to claim 1, characterized in that the upper cover plate (1) and the lower tank body (2) are coated with a metal surface layer.
4. Ceramic temperature equalizing plate according to claim 1, characterized in that said wick (3) is sintered and shaped with the bottom of said upper cover plate (1) or of said lower tank (2);
the support column (4) with upper cover plate (1) with the bottom welding of lower cell body (2), the edge of upper cover plate (1) with the notch welding of lower cell body (2).
5. The ceramic temperature uniformity plate according to claim 1, wherein said working fluid is deionized water.
6. Ceramic temperature-equalizing plate according to claim 1, characterized in that the ceramic shell is made of aluminum oxide or aluminum nitride, and the support columns (4) and the liquid-absorbing cores (3) are made of aluminum oxide, aluminum nitride or copper.
7. The ceramic temperature uniformity plate according to any one of claims 1 to 6, characterized in that the thermal conductivity of the ceramic temperature uniformity plate is 1000 to 6000W/(m-K).
8. The manufacturing method of the ceramic temperature equalization plate is characterized in that the ceramic temperature equalization plate comprises a ceramic shell, the ceramic shell comprises an upper cover plate and a lower groove body, a support column and a liquid suction core are arranged in the ceramic shell, and the method comprises the following steps:
the support column and the liquid suction core are arranged at preset positions and are respectively and fixedly connected with the upper cover plate and the bottom plate of the lower groove body;
inserting a liquid injection pipe into the ceramic shell, and performing liquid injection and vacuum pumping operations;
and sealing the liquid injection pipe.
9. The method of claim 8, wherein the step of positioning the support columns and the wick in predetermined positions is preceded by the step of:
and carrying out surface metal treatment on the ceramic shell, or mixing ceramic powder particles with silver-based powder particles, and setting the mixed particles at a set position for sintering the liquid absorption core.
10. The method of manufacturing a ceramic temperature equalization plate according to claim 8, wherein after the step of inserting a pour tube into the ceramic housing, the method further comprises:
performing a degassing operation within the ceramic shell, the degassing operation comprising: and heating the bottom of the lower tank body, and heating and evaporating industrial fluid in the ceramic shell to form gas, wherein non-condensable gas is accumulated at the top of the liquid injection pipe, and the top of the liquid injection pipe is cut off, so that the operation of removing the non-condensable gas is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310695376.8A CN116817648A (en) | 2023-06-12 | 2023-06-12 | Ceramic temperature equalizing plate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310695376.8A CN116817648A (en) | 2023-06-12 | 2023-06-12 | Ceramic temperature equalizing plate and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116817648A true CN116817648A (en) | 2023-09-29 |
Family
ID=88119644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310695376.8A Pending CN116817648A (en) | 2023-06-12 | 2023-06-12 | Ceramic temperature equalizing plate and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116817648A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117870426A (en) * | 2024-03-11 | 2024-04-12 | 深圳大学 | Soaking plate with laser sintering liquid absorption core structure and preparation method thereof |
-
2023
- 2023-06-12 CN CN202310695376.8A patent/CN116817648A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117870426A (en) * | 2024-03-11 | 2024-04-12 | 深圳大学 | Soaking plate with laser sintering liquid absorption core structure and preparation method thereof |
| CN117870426B (en) * | 2024-03-11 | 2024-06-11 | 深圳大学 | Soaking plate with laser sintering liquid absorption core structure and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4727455A (en) | Semiconductor power module with an integrated heat pipe | |
| EP3352233B1 (en) | Thermoelectric conversion module and thermoelectric conversion device | |
| US7814655B2 (en) | Heat sink in the form of a heat pipe and process for manufacturing such a heat sink | |
| CN102498564B (en) | The manufacture method of the power module substrate with radiator, the power module substrate of band radiator and power model | |
| CN109443060B (en) | Ultrathin flat heat pipe and manufacturing process thereof | |
| CN100377340C (en) | Thermal module and manufacturing method thereof | |
| TWI713746B (en) | Power module substrate | |
| US20060246314A1 (en) | Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions | |
| US20080277104A1 (en) | Al-AlN composite material, related manufacturing method and heat exchanger using such composite material | |
| CN101529588A (en) | Power module substrate, method for manufacturing power module substrate, and power module | |
| JP6692299B2 (en) | Silicon nitride circuit board and electronic component module using the same | |
| CN116817648A (en) | Ceramic temperature equalizing plate and manufacturing method thereof | |
| CN110828398A (en) | Integrated soaking substrate for power semiconductor module packaging and manufacturing method thereof | |
| US6647625B2 (en) | Method for fabricating a heat pipe structure in a radiating plate | |
| CN111725144A (en) | High-temperature electronic packaging substrate material device based on gas-liquid phase change and preparation method thereof | |
| CN109585399B (en) | Efficient heat-conducting chip substrate structure and preparation method | |
| CN105202956A (en) | Manufacturing method of composite vapor chamber with base plate made of molybdenum-copper or tungsten-copper alloy and other heat sink materials | |
| WO2009119438A1 (en) | Insulating substrate and method for producing the same | |
| CN107546200B (en) | A kind of heat dissipation element and preparation method thereof and IGBT modules | |
| US7083759B2 (en) | Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions | |
| JP2010251648A (en) | Aluminum-aluminum nitride composite material, method of manufacturing the same, and heat exchanger | |
| CN109309065A (en) | A kind of heat dissipation element and preparation method thereof and IGBT mould group | |
| CN215832538U (en) | Ceramic vapor chamber structure with composite liquid absorption core based on casting method | |
| CN218333774U (en) | Insulating substrate structure of two DBC boards preparation | |
| CN108028306A (en) | Thermo-electric conversion module and thermoelectric conversion device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |