CN105202956A - Manufacturing method of composite vapor chamber with base plate made of molybdenum-copper or tungsten-copper alloy and other heat sink materials - Google Patents
Manufacturing method of composite vapor chamber with base plate made of molybdenum-copper or tungsten-copper alloy and other heat sink materials Download PDFInfo
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- CN105202956A CN105202956A CN201410290414.2A CN201410290414A CN105202956A CN 105202956 A CN105202956 A CN 105202956A CN 201410290414 A CN201410290414 A CN 201410290414A CN 105202956 A CN105202956 A CN 105202956A
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Abstract
The invention discloses a manufacturing method of a composite vapor chamber with a base plate made of molybdenum-copper or tungsten-copper alloy and other heat sink materials. The vapor chamber is of a composite structure of heat sink materials and oxygen-free copper. A wick of the vapor chamber is of a copper powder sintered or foamy copper structure. The method comprises the steps that high-temperature reduction treatment is carried out on molded copper powder or foamy copper, the treated copper powder or foamy copper is sintered to a pure-copper upper cover plate and the thin molybdenum-copper or tungsten-copper alloy base plate, a thin copper column or a foamy copper column is used as a supporting column, the oxygen-free copper cover plate and the molybdenum-copper or tungsten-copper alloy base plate are welded through copper-silver alloy, and the needed vapor chamber is manufactured. The vapor chamber is of the composite structure of the oxygen-free copper plate and the base plate made of the high-conductivity low-expansion heat sink materials like molybdenum-copper or tungsten-copper alloy, wherein the molybdenum-copper or tungsten-copper alloy face can directly make tight contact with chips of high-power electric and electronic devices such as a thyristor, an IGBT and an IGCT. It is ensured that the heat expansion coefficients of the chips are matched with those of the heat sink materials in the heated process, the heat sink materials and the vapor chamber are integrated, the heat resistance is greatly reduced, and the requirement for rapid temperature equilibrium and efficient heat dissipation is met.
Description
Technical field
The present invention relates to a kind of manufacture of soaking plate, heat sink material realizes integrated with the structural design of conventional soaking plate by the design of this soaking plate, by required source of heat release as chip can directly be integrated on the heat sink material face of soaking plate, greatly reduce original soaking plate and integrated the produced thermal resistance of heat sink material and required thickness space requirement, the object of quick conductive and heat radiation can be reached, and improve reliability.
Background technology
Heat management is a very important link of Technology for Modern Equipment development, because the effective thermal control of running temperature to semiconductor electronic equipment, can guarantee stability and the reliability of its work.The Apparatus and method for realizing heat management is more, and wherein soaking plate is a kind of primary electron management device of applicable high-power applications.
As semi-conductor electronic device soaking plate (VaporChamber) normally inwall there is the high vacuum cavity of microcosmic capillary structure, its structure is made up of upper cover plate, lower shoe, capillary wick and copper post.Link together through high temperature sintering as between the capillary structure material of liquid-sucking core and upper cover plate lower shoe, be welded through Diffusion Welding or copper silver brazing between upper cover plate and lower shoe, then by cavity by connection capillary brass pipe by vacuumizing, the operation such as fluid injection and welded encapsulation obtains.During application, when heat by the chip heat source of semiconductor to the evaporating area of soaking plate lower shoe time, liquid phase medium inside cavity can in the environment of condition of high vacuum degree, start liquid-phase vaporization occurs, absorb heat energy and rapid spatial expansion, and be full of whole vapor chamber fast, the medium of gas phase is quickly through vapor chamber, just phenomenon of condensing is there is when being transmitted to a colder region, the latent heat of phase change discharging medium is changed by solution-air, liquid phase medium after condensation can by the capillarity of micro-structural on inwall again quick backflow to the evaporation ends of thermal source, this process will circulate rapidly in cavity, the course of work of soaking plate that Here it is.Micro-structural due to evaporation ends liquid-sucking core has very strong capillary force, and media adsorbs is on the liquid-sucking core of capillary, so the work of soaking plate is not affected by gravity, it has the non-directional of antigravity characteristic and application process.Soaking plate has the advantages such as expansion thermal resistance low, uniform heat flux, heat rapid diffusion, lightweight and noiselessness, among being paid attention to and continually developing.
Under normal circumstances, semiconductor chip is particularly if the chip of the device for high-power power electronic such as IGCT, IGBT, IGCT is because very responsive to the thermal stress of variations in temperature generation, usually need be designed is attached on heat sink material, and this heat sink material needs to have good heat conductivility and low thermal coefficient of expansion.When the similar thermal expansion coefficient of the thermal coefficient of expansion of heat sink material and corresponding chip material, chip is just little with the thermal stress produced when use procedure and variation of ambient temperature, guarantees its trouble free service.And then heat sink material is connected on soaking plate and corresponding heat radiation module thereof by welding or heat-conducting glue, realize the heat conduction rapidly and efficiently needed for the thermals source such as chip and heat radiation object.
But, the thermals source such as common chip and the connection procedure of soaking plate are combined by the heat sink material module that dispels the heat with soaking plate again, as shown in Figure 1, so just at least add two-layer thermal resistance, one is the thermal resistance of heat sink material itself, and two is thermal resistances of the weld layer that is connected with soaking plate of heat sink material or heat-conducting glue.Thermal resistance is the vital parameter affecting chip cooling and job stability.In addition add articulamentum, also result in the increase of structure change, physical dimension and weight, relatively reduce the reliability of device.Because many one decks connect, the possibility of inefficacy just how once may be contacted.For this problem, in order to improve radiating effect, reducing thermal resistance and guaranteeing the reliability that chip and heat radiation module combine, proposing the present invention.
Summary of the invention
The present invention is the requirement reducing thermal resistance needed for the thermal source heat conduction such as chip and radiation processes further, promote the reliability of the thermal source integrating process such as chip, propose heat sink material as molybdenum-copper or tungsten-copper alloy are directly designed to the lower shoe of soaking plate, thus by the integrated morphology of routine: chip+binder course+heat sink material+binder course+soaking plate heat radiation module, greatly improve and simplify, forming the integrated morphology of simplifying: chip+binder course+soaking plate heat radiation module.This soaking plate achieves heat sink and effect that is soaking.So this invention greatly reduces integrated the produced thermal resistance of former sandwich construction, and the thickness space needed for saving, achieve light, thin and quick conductive and heat radiation object.
This invention proposes using heat sink material if molybdenum copper or tungsten-copper alloy are as the lower shoe of soaking plate, with the manufacture method of the formation composite construction soaking plate of anaerobic fine copper upper cover plate.Namely the lower shoe of soaking plate is according to designing requirement, adopts molybdenum-copper or tungsten-copper alloy.Because molybdenum-copper and tungsten-copper alloy have good physical property, as high thermal conductivity, heat resistance and low thermal coefficient of expansion etc., also there is good mechanical property as high elastic modulus, the heat sink application of powerful integrated circuit and microwave device can be met.With the face of this heat sink sheet material as soaking plate, so just can realize the integration of heat sink material and soaking plate, ensure that the impact of the temperature variant thermal stress of semiconductor chip is little, greatly reduce chip and the integrated thermal resistance of the whole module of required heat radiation, improve job stability and the reliability of chip, effectively solve the heat dissipation problem of golf calorific value electronic component.
Accompanying drawing explanation
The structural representation of Fig. 1 conventional die and heat sink material and the combination of soaking plate module
The structural representation of Fig. 2 chip and composite construction soaking plate (heat sink material and soaking plate integrated)
The square composite construction soaking plate indoor design of Figure 35 0*50*3.2mm and structural representation
Fig. 4 diameter is 100, and thickness is the composite construction soaking plate indoor design of 2.6mm circle, support column template and structural representation
instantiation
example one, is of a size of the manufacture of the square structure molybdenum copper compound soaking plate of 50*50*3.2mm
What preparation size was that the square structure of 50*50*3.2mm has that heat sink material and soaking plate be integrated concurrently take molybdenum-copper as the ultra-thin soaking plate of base plate, and concrete steps are as follows:
(1) design of soaking plate and the preparation of component materials: base plate adopts molybdenum-copper plate, and be of a size of 50*50mm, thickness is 0.6mm; Upper cover plate is fine copper plate, and thickness is 0.8mm, and through punching press deformation, the deformation degree of depth is 1.8mm, and appearance and size is 50*50mm; The thickness of the sintered copper powder of upper and lower plates is set as 0.5mm, and copper powder particle size is atomized copper powder, and granularity is 180 orders; Support column adopts the copper post of diameter f2mm.
(2) making of soaking plate, as shown in Figure 3:
(i) cleaning and combination: by the upper cover plate oxygen-free copper sheet material after punch process and lower shoe molybdenum-copper plate after cleaning, drying, insert the copper powder of desired thickness, and carry out high temperature reduction sintering processes;
(ii) the coating of solder and layout: above-mentioned ready upper cover plate and lower shoe are combined according to soaking plate, in its edge welding region, even coated copper silver solder (comprising the reserved capillary pure copper tube for vacuum pumping liquid injection), guarantees effect and the quality of welding;
High temperature sintering with weld: combinations thereof is placed in graphite jig, this graphite jig is used to guarantee that the soaking plate prepared is smooth, additional gravity is adopted in sintering and welding under follow-up 900 DEG C of high-temperature hydrogen reduction atmosphere, temperature retention time is 60 minutes, realizes the good sinter bonded between soaking plate sub-assembly and welding effect;
(3) leak detection test: need after welding to carry out leak detection test to surrounding welding quality, guarantee that surrounding welding is good;
(4) vacuumize, fluid injection, encapsulation and secondary degasification and solder up: after leak detection, the capillary of soaking plate is fixed on and vacuumizes, on the fixture of fluid injection and encapsulation, carries out vacuumizing, fluid injection and encapsulation; Vacuum is 10-30Pa, the soaking plate after encapsulation is suitably heated, reaches the object of secondary degasification, then carries out welding and sealing to encapsulation mouth, guarantees the quality of solder up;
(5) aging and thermal performance test: compound soaking plate aging test temperature is decided to be 200 DEG C, completed burn-in test through 6 hours 200 DEG C of insulations; After burn-in test, the hot property of carrying out soaking plate measures, and mainly tests Qmax, the temperature difference and thermal resistance, completes the manufacture of whole soaking plate after mensuration;
(6) preservative treatment: compound soaking plate carries out the surface anticorrosion process of electronickelling.
example two, diameter isf
100mm, thickness is the manufacture of 2.6mm molybdenum copper compound soaking plate
Prepare circular configuration diameter be f100*2.6mm to have the molybdenum copper that heat sink material and soaking plate be integrated concurrently be the soaking plate of base plate, as shown in Figure 4, concrete steps are as follows for structure:
(1) design of soaking plate and the preparation of component materials: the size of base plate molybdenum-copper plate is diameter f100mm, and thickness is 0.6mm; Upper cover plate is anaerobic fine copper, is 0.6mm, and size is through punching press deformation, and the deformation degree of depth is 1.4mm, is of a size of diameter f100mm after deformation; Foam copper adopts the hierarchy construction foam copper of Jiangsu Ge Ye new material Science and Technology Ltd., and thickness is 0.2mm, and porosity is 80%; Support column adopts the hierarchy construction foam copper of Jiangsu Ge Ye new material Science and Technology Ltd. equally, and thickness is 1.0mm, and porosity is 80%.
(2) making of compound soaking plate:
(i) clean and combine: by the oxygen-free copper upper cover plate meeting dimensional requirement after punch process and lower shoe molybdenum-copper plate through cleaning and dry;
(ii) the preparation of liquid-sucking core and support column: liquid-sucking core adopts ultra-thin foam copper, thickness is 0.2 millimeter, and porosity is 80%, according to design, becomes the foam copper formwork structure of required size through Punching Technology; Support column adopts thickness to be the foam copper of 1mm, become diameter to be the support column of f3.5mm, and according to template layout, the center distance between support column is 13mm through Punching Technology.
(iii) the ultra-thin foam copper after die-cut is arranged on upper cover plate and lower shoe, and according to the layout template of support column, lower shoe is arranged foam copper and support column thereof, then carries out high temperature reduction process, guarantee that foam copper and support column effectively sinter on upper cover plate and lower shoe.
(4) copper silver solder welding: the upper cover plate after above-mentioned sintering and the circular edges of lower shoe along around (comprising the reserved capillary pure copper tube for vacuum pumping liquid injection) evenly coated copper silver solder, guarantee the effect of welding and quality; Above-mentioned ready soaking plate sub-assembly is placed in the graphite jig of toroidal, this graphite jig is used to guarantee that the soaking plate prepared is smooth, sinter and welding decompose the reducing atmosphere of obtained hydrogen nitrogen mixing at follow-up 900 DEG C of Ammonias under, and adopt additional gravity, temperature retention time is 60 minutes, realizes the good combination between soaking plate sub-assembly and welding effect good between upper cover plate and lower shoe;
(5) leak detection test: need after welding to carry out leak detection test to surrounding welding quality, guarantee that surrounding welding is good;
(6) vacuumize, fluid injection, encapsulation and secondary degasification and solder up: after leak detection, the capillary of soaking plate is fixed on and vacuumizes, on the fixture of fluid injection and encapsulation, carries out vacuumizing, fluid injection and encapsulation; Vacuum is 10-30Pa, the soaking plate after encapsulation is suitably heated, reaches the object of secondary degasification, then carries out argon arc welding to encapsulation mouth and realizes good involution, guarantee the quality of solder up;
(7) aging and thermal performance test: ultra-thin soaking plate aging test temperature is decided to be 200 DEG C, completed burn-in test through 6 hours 200 DEG C of insulations; After burn-in test, the hot property of carrying out soaking plate measures, and mainly tests Qmax, the temperature difference and thermal resistance, completes the manufacture of whole soaking plate after mensuration;
(8) preservative treatment: ultra-thin soaking plate carries out the surface anticorrosion process of electronickelling.
Detailed description of the invention
As shown in Figure 1, the present invention will realize the integrated of heat sink material and soaking plate to the integrated morphology of conventional chip and heat sink material and the module that dispels the heat, so the structure of chip after designing and composite construction soaking plate as shown in Figure 2.A kind of is the compound soaking plate manufacture method of lower shoe plate and anaerobic fine copper by heat sink materials such as molybdenum copper or tungsten-copper alloys, encapsulated by structural design, high temperature reduction sintering, copper silver or the welding of silver solder and fluid injection, adopt the manufacture method close with conventional soaking plate, realize the composite construction soaking plate that heat sink material and conventional soaking plate are integrated.Its implementation method and concrete steps as follows:
(1) design of soaking plate: soaking plate designs according to specific requirements such as chip sizes usually.Therefore according to size and the heat radiation power requirement of chip, structure and the size of soaking plate is provided;
(2) preparation of soaking plate component materials: according to structure and the size of soaking plate, prepares each parts that corresponding soaking plate manufactures: molybdenum copper or tungsten-copper alloy sheet material, oxygen-free copper (fine copper) sheet material;
(3) preparation of soaking plate modular construction: by upper cover plate oxygen-free copper sheet material according to the structure of soaking plate, carry out suitable punch process, its deformation quantity is a little less than the thickness of ultra-thin foam copper;
(4) clean: by the upper cover plate oxygen-free copper sheet material after processing and lower shoe molybdenum copper or tungsten-copper alloy plate for subsequent use after cleaning, drying;
(5) preparation of soaking plate liquid-sucking core: will according to soaking plate designing requirement as the sintered copper powder of liquid-sucking core or the foam copper of hierarchy construction, be shaped (foam copper) through high temperature reduction sintering (copper powder) or mould Punching Technology, and sintering is on corresponding upper cover plate or lower shoe.
(6) combine: according to the designing requirement of soaking plate, after lower shoe molybdenum copper or tungsten-copper alloy plate, foam copper template, the combination of oxygen-free copper upper cover plate, at its edge surrounding (comprising the reserved capillary pure copper tube for vacuum pumping liquid injection) evenly coated copper silver solder, guarantee the quality that subsequent high temperature welds;
(7) graphite jig is placed in: be placed in graphite jig by above-mentioned ready soaking plate sub-assembly, this graphite jig is used to guarantee that the soaking plate prepared is smooth, gravity or external force can be adopted in subsequent high temperature sintering and copper silver or silver-colored welding, realize the good combination between soaking plate sub-assembly and welding effect;
(8) high temperature sintering with weld: the copper silver soldering carrying out high temperature sintering between upper cover plate and lower shoe and upper cover plate and lower shoe periphery under high-temperature vacuum or hydrogen reduction atmosphere connects, and wherein heating-up temperature is 780-810 DEG C, and temperature retention time is 10 points to 60 minutes;
(9) leak detection test: need after welding to carry out leak detection test, guarantee soaking plate surrounding welding quality;
(10) vacuumize, fluid injection encapsulation: after leak detection, the capillary of soaking plate is fixed on and vacuumizes, on the fixture of fluid injection and encapsulation, carries out vacuumizing, fluid injection and encapsulation;
(11) secondary degasification and solder up: the soaking plate after above-mentioned encapsulation is carried out secondary degasification, then carries out solder up, guarantees the quality of solder up;
(12) burn-in test: according to the situation of soaking plate liquid-sucking core, determines aging test temperature and time, and typical temperature is set as 180 DEG C or 200 DEG C, through the burn-in test of a few hours to 24 hour;
(13) thermal performance test: after burn-in test, the hot property of carrying out soaking plate measures, and the mainly mensuration of Qmax, the temperature difference and thermal resistance, completes the manufacture of whole soaking plate after mensuration.
(14) preservative treatment: soaking plate also needs the surface anticorrosion process carrying out electronickelling or chromium etc. usually.
Claims (5)
1. the invention discloses a kind of manufacture method of composite construction soaking plate, it is characterized in that:
Lower shoe adopts molybdenum copper or tungsten-copper alloy heat sink material;
Upper cover plate adopts according to designing requirement through stamping forming anaerobic fine copper;
Liquid-sucking core adopts copper powder or foam copper sintering structure, support column employing copper post or foam copper post;
With copper-Yin or silver solder, lower shoe and upper cover plate are welded;
After leak detection, carry out vacuumizing, fluid injection and encapsulation and secondary degasification, and carry out thermal performance test.
2. the manufacture method of composite construction soaking plate as claimed in claim 1, it is characterized in that lower shoe adopts thickness at the molybdenum-copper of 0.1 millimeter to 1.2 millimeters or tungsten-copper alloy, the composition of molybdenum copper or tungsten-copper alloy requires to choose according to specific design.
3. the manufacture method of composite construction soaking plate as claimed in claim 1, it is characterized in that the inner liquid-sucking core of soaking plate adopts the capillary structure of copper powder or foam copper sinter bonded, support column can adopt copper post or foam copper post.
4. composite construction soaking plate as claimed in claim 3, it is characterized in that its inner liquid-sucking core and support column are foam copper structure, the structure of this foam copper is the foam copper of hierarchy construction, and its porosity can choose 40-90%.
5. composite construction soaking plate manufacture method as claimed in claim 1, it is characterized in that molybdenum copper or tungsten-copper alloy etc. adopt copper-Yin or silver solder to weld between heat sink material lower shoe with stamping forming anaerobic fine copper upper cover plate, concrete welding temperature is determined according to the kind of solder, usual selective temperature is 750-810 DEG C, and temperature retention time is defined as between 10 minutes to 60 minutes according to structure size.
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| CN108022894A (en) * | 2017-11-14 | 2018-05-11 | 华南理工大学 | Igbt chip and the integrated encapsulation structure and its manufacture method of phase transformation soaking plate |
| CN108076616A (en) * | 2017-12-27 | 2018-05-25 | 珠海格力电器股份有限公司 | Photovoltaic cooling device and photovoltaic centrifuge system |
| CN108801019A (en) * | 2018-07-26 | 2018-11-13 | 华南理工大学 | A kind of phase-change heat transfer element and its manufacturing method with multilayer liquid sucting core structure |
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| CN107068846A (en) * | 2017-03-29 | 2017-08-18 | 华南理工大学 | A kind of LED phase-change heats substrate and preparation method thereof |
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| CN107809055A (en) * | 2017-12-14 | 2018-03-16 | 长春理工大学 | A kind of high-power semiconductor laser chip welding and assembling method |
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| WO2020087357A1 (en) * | 2018-10-31 | 2020-05-07 | 深圳市万景华科技有限公司 | Heat pipe for smart terminal, and manufacturing method for same |
| CN110944493B (en) * | 2019-12-09 | 2022-08-09 | 上海交通大学 | Metal-based composite material device based on gas-liquid phase change and preparation method thereof |
| CN110944493A (en) * | 2019-12-09 | 2020-03-31 | 上海交通大学 | Metal-based composite material device based on gas-liquid phase change and preparation method thereof |
| CN111669939A (en) * | 2020-05-25 | 2020-09-15 | 嵊州天脉导热科技有限公司 | Soaking plate made of composite metal material |
| CN111933585A (en) * | 2020-07-23 | 2020-11-13 | 合肥圣达电子科技实业有限公司 | High-thermal-conductivity microwave TR assembly packaging shell and processing method thereof |
| CN112122616A (en) * | 2020-08-24 | 2020-12-25 | 武汉汉维新材料科技有限责任公司 | Directional microchannel and disordered hole composite heat sink and preparation method thereof |
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Application publication date: 20151230 |
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