TW202120881A - Ultra-thin vapor chamber and a manufacturing method thereof by welding and sealing the first metal plate with a thin and thermally conductive second metal plate after the sintering process, and then vacuumizing and injecting with a working fluid - Google Patents

Abstract

The present invention relates to an ultra-thin vapor chamber and a manufacturing method thereof. The manufacturing method is to select a metal powder with good thermal conductivity, mix the aforementioned metal powder with good thermal conductivity with a solvent suitable for screen printing, print the aforementioned mixture by screen printing on a thin first metal plate with good thermal conductivity to form a support part having a predetermined height, area, and shape, then sinter the first metal plate of the aforementioned process to form the support part into a porous structure to be combined with the first metal plate, weld and seal the first metal plate with a thin and thermally conductive second metal plate after the aforementioned sintering process, and then perform vacuum pumping and inject a working fluid therein to form an ultra-thin vapor chamber. The aforementioned thermally conductive metal powder is copper powder. The first metal plate and the second metal plate are sealed by diffusion welding.

Description

Ultra-thin temperature equalizing plate and manufacturing method thereof

The invention belongs to the technical field of uniform temperature and heat dissipation, and particularly refers to a new design of an ultra-thin uniform temperature plate and a manufacturing method thereof, which has an environmentally friendly manufacturing process and a high-efficiency uniform temperature effect.

According to the heat dissipation of conventional electronic components, most of them use metal heat sinks, or combine heat pipes, cooling chips, cooling fans, etc., which generally suffer from poor heat dissipation, insufficient heat dissipation speed, complex heat dissipation module structure, and high cost. .

The heat pipe technology was born in Los Alamos National Laboratory in the United States as early as 1963. Its inventor is G.M. Grover. The heat pipe is a kind of heat transfer element, which makes full use of the principle of heat conduction and the fast heat transfer properties of the refrigerating medium. The heat of the heating object is quickly transferred to the heat source through the heat pipe. Its thermal conductivity has far exceeded the thermal conductivity of any known metal. . In the past, heat pipe technology has been widely used in aerospace, military industry and other industries, and it is only a few years ago that it was introduced into the radiator manufacturing industry. Why does heat pipe technology have such high performance? We have to look at this issue from the perspective of thermodynamics. The heat absorption and heat release of an object are relative. Whenever there is a temperature difference, the phenomenon of heat transfer from a high temperature to a low temperature will inevitably occur. There are three ways of heat transfer: radiation, convection, and conduction, of which heat conduction is the fastest. The heat pipe uses evaporative cooling, so that the temperature difference between the two ends of the heat pipe is small, and the heat is quickly transferred. Common heat pipes are composed of a tube shell, a wick and an end cap. The production method is to pump the inside of the heat pipe into a negative pressure state, and then fill it with an appropriate liquid, which has a very low boiling point and is easy to volatilize. The tube wall has a wick, which is made of capillary porous material. heat One end of the tube is the evaporating end, and the other end is the condensing end. When a section of the heat pipe is heated, the liquid in the capillary tube evaporates quickly, and the vapor flows to the other end under a slight pressure difference, releases heat, and recondenses into a liquid. The liquid flows back to the evaporation section along the porous material by capillary force, and the loop is endless. The heat is transferred from one end of the heat pipe to the other end. This loop is carried out quickly, and the heat can be continuously conducted away. However, the current fin-type radiator is inefficient in heat conduction, and it cannot absorb a large amount of heat instantly. It is the invention of how to combine the heat pipe and the fin-type radiator to improve the heat dissipation efficiency. For example, China's patent No. M255446 flat heat expansion plate (refer to the patent announcement data on January 11, 2005), which mainly includes a pair of shells with good heat conduction. The pair of shells has an opening on one side and an appropriate number of pillars. An air flow channel is formed. The inner edge of the shell is sintered with a porous powder layer with good heat conduction, and sealed by a cover, so that a plurality of staggered tubular channels are formed inside the shell, and the working fluid is injected and vacuumed to make the The metal powder layer adsorbs the working fluid to form a flat plate type heat spreading plate. However, the conventionally used uniform temperature plate is composed of sintered powder with good thermal conductivity or a metal mesh with good thermal conductivity in the two shells. Although both have the effect of expanding heat and uniform temperature, they are currently used in the electronics of 4G computer rooms. Components, which may generate instantaneous high heat due to large flow in an instant, the structure of the conventional uniform temperature plate, the speed of heat diffusion and uniform temperature is not fast enough, will cause the electronic components to overheat and crash or be damaged. The applicant previously applied for a temperature equalizing element (Announcement No. M494289), which mainly includes a pair of shells made of metal with good heat conduction. The pair of shells has a working space inside, and the working space has an appropriate number of heat conducting columns to connect the pair The shell, by sealing the pair of shells, forms a plurality of staggered channels inside the shell, and then evacuates and injects an appropriate amount of working fluid to form a uniform temperature plate, which is characterized in that the heat conduction column is made of powder with good heat conduction. The porous structure, through the use of the porous structure of the heat conduction column to absorb the working fluid, has better capillary phenomenon during work, can indeed accelerate the temperature diffusion, and has a more efficient temperature uniformity effect.

In addition, heat pipe products (including temperature equalizing plates) use internal working fluid liquid-vapor phase change and flow heat transfer, and their heat conduction and diffusion capabilities are better than all currently known materials of the same size. If heat pipe products can be introduced into the current thinner and lighter mobile device products, using their uniform temperature characteristics to quickly diffuse the waste heat generated by the high-heating chip from the heat pipe direction, the system operation will be more stable. However, in the heat dissipation modules of light and thin mobile device products, most of the heat pipes commonly used have a diameter of 6mm or 8mm, which is even thicker than that of mobile devices. In addition, the thickness of traditional uniform temperature plates is also more than 2~3mm, so they cannot be directly used in mobile devices. On the device, it must be thinned to have the opportunity to be introduced into mobile devices with limited space. In view of the heat dissipation needs of mobile devices, in recent years, many heat pipe manufacturers have continuously invested in the development of thinner heat pipes or uniform temperature plate products, as the future industry development direction, and released ultra-thin heat pipes or uniform heat plates with a thickness of less than 1mm. The operating principles of the heat pipe and the uniform temperature plate are similar, so the design principles are almost the same. However, compared with the limited width of the thinned heat pipe, it can only be changed in the one-dimensional length direction. The advantage of the thinner temperature equalizing plate is that its area can be changed according to the requirements, so the degree of change in the design is very high, which can be regarded as a two-dimensional temperature equalizing body. For example, the Industrial Technology Research Institute develops a silicon-based thin-type uniform temperature plate using a micro-electromechanical process. It uses silicon wafers as the substrate to etch micron-level capillary structures. Other companies also use etching processes to prepare traditional metal uniform temperature plates, but because of the etching process The etching solution used is not environmentally friendly and it is lacking. How to use other environmentally friendly manufacturing processes to thin the temperature equalizing plate is a problem that the industry needs to overcome urgently.

In view of the aforementioned shortcomings of the conventional technology, the inventor of the present invention has been engaged in the design and manufacture of precision ceramic technology industrial products for many years. After continuous research and improvement, the present invention has finally been successfully developed and made public.

The reason is that the main purpose of the present invention is to provide an ultra-thin uniform temperature plate manufacturing method The manufacturing method is to select metal powder with good thermal conductivity (preferably coarser particles), mix the aforementioned metal powder with good thermal conductivity with a solvent suitable for screen printing, and print the aforementioned mixture on a thin, good thermal conductivity by screen printing. On a metal plate, a support portion of predetermined height, area, and shape is formed, and the first metal plate of the aforementioned process is sintered, so that the support portion forms a porous structure and is combined with the first metal plate, and the first metal plate after the aforementioned process is sintered with The thin second metal plate with good heat conduction is welded and closed, and then vacuumized and injected with working fluid to form an ultra-thin uniform temperature plate.

In the present invention, the inner end surface of the second metal plate is firstly sintered with a porous structure layer with metal powder with good thermal conductivity, and then welded and sealed with the first metal plate to increase the efficiency of heat expansion and temperature uniformity.

The aforementioned metal powder with good thermal conductivity is copper powder.

The aforementioned first metal plate and the second metal plate of the present invention are closed by diffusion welding.

Another main purpose of the present invention is to provide an ultra-thin uniform temperature plate, which mainly includes a thin first metal plate and a second metal plate with good heat conduction. There is a working space between the first metal plate and the second metal plate. The inner edge of the metal plate has a support part with a predetermined height, area, and shape formed by screen printing. The support part is a porous structure sintered with metal powder with good thermal conductivity. The support part is combined when sealing the first metal plate and the second metal plate. Welded to the opposite inner edge of the second metal plate, by sealing the first metal plate and the second metal plate, the inner working space of the first metal plate and the second metal plate form a plurality of staggered channels, and then evacuated and injected with proper amount of work Fluid to form an ultra-thin uniform temperature plate. Since the supporting part is a porous structure formed by sintering powder with good heat conduction, the porous structure supporting part absorbs the working fluid and has better capillary phenomenon during work to accelerate the temperature. Diffusion, with a more efficient uniform temperature effect.

The inner end surface of the aforementioned second metal plate of the present invention has a metal powder sintered with good thermal conductivity The porous structure layer is formed to increase the efficiency of heat expansion and temperature uniformity.

The aforementioned metal powder with good thermal conductivity is copper powder.

(1)‧‧‧Ultra-thin uniform temperature plate

(2)‧‧‧The first metal plate

(3)‧‧‧Second metal plate

(30)‧‧‧Porous structure layer

(4)‧‧‧Working space

(40)‧‧‧Channel

(5)‧‧‧Support

Figure 1 is a top view of an embodiment of the present invention;

Figure 2 is a partial assembly sectional view of the embodiment of the present invention;

Fig. 3 is a partial assembly sectional view of another embodiment of the present invention.

In order to achieve the above-mentioned technical means of the invention, here is an example, with the description of the drawings as follows, from which your reviewer can gain a better understanding of the method, structure, features and effects achieved by the invention.

The ultra-thin temperature equalizing plate of the present invention generally refers to those having a thickness of less than 1 mm and also have flexibility (bendability), which is called a soft temperature equalizing plate, which can be applied to light and thin mobile devices such as mobile phones.

The manufacturing method of the ultra-thin uniform temperature plate of the present invention is as follows:

Use metal powder with good thermal conductivity (coarse particles are better);

Mix the aforementioned metal powder with good thermal conductivity with a solvent suitable for screen printing;

The aforementioned mixture is printed on a thin first metal plate with good thermal conductivity by screen printing to form a support portion of predetermined height, area, and shape (like the shape and area of the support portion shown in Figure 1, the shape and area of the support portion Etc., it is designed to cooperate with the temperature equalizing parts to be bonded);

Sintering the first metal plate of the aforementioned process to form a porous structure on the support part and combine it with the first metal plate, and mix the screen printing into the solvent to burn off, and the porous structure support part absorbs the working fluid, and has better performance during work. Capillary phenomenon to accelerate the diffusion of temperature, with more efficient In addition, the supporting part can avoid the subsequent vacuuming and degassing operation inside the uniform temperature plate, which will cause the surface of the first metal plate and the second metal plate to dent, and prevent the uniform temperature plate from contacting the surface of the electronic heating element. During the contact, due to the aforementioned depression problem, the surface-to-surface smooth contact cannot be achieved, which affects the thermal conductivity efficiency;

Welding and sealing the first metal plate sintered by the aforementioned manufacturing process and the thin, thermally conductive second metal plate;

After vacuuming and injecting working fluid, an ultra-thin uniform temperature plate is made.

In the present invention, the inner end surface of the second metal plate is firstly sintered with a porous structure layer with metal powder with good thermal conductivity, and then welded and sealed with the first metal plate to increase the efficiency of heat expansion and temperature uniformity.

The aforementioned metal powder with good thermal conductivity is copper powder.

The aforementioned first metal plate and the second metal plate of the present invention are closed by diffusion welding. Diffusion Bonding Technology is a solid-state bonding technology that uses high temperature and pressure in a vacuum environment to make the distance between the contact surfaces of two workpieces reach the atomic distance, so that the atoms are embedded and diffused and bonded to each other to bond metals and or ceramics. part. Compared with traditional welding technology, diffusion welding can make the joint surface stronger and reduce deformation.

Please refer to the top view of the embodiment of the present invention in Figure 1 and the partial assembly cross-sectional view of the embodiment of the present invention in Figure 2. It can be seen from the figures that the ultra-thin uniform temperature plate (1) of the present invention mainly includes a thin section with good heat conduction. A metal plate (2) and a second metal plate (3). There is a working space (4) between the first metal plate (2) and the second metal plate (3). The inner edge of the first metal plate (2) has a mesh The plate printing constitutes a predetermined height, area, and shape of the supporting portion (5) [as shown in the embodiment in Figure 1, the shape and area of the supporting portion (5), the shape and area of the supporting portion (5), etc., are matched to the to-be-applied Combined temperature-equalizing component design], the support part (5) is a porous structure sintered with metal powder with good thermal conductivity, and the aforementioned support part (5) seals the first metal plate (2) and the second metal When the plate (3) is welded to the opposite inner edge of the second metal plate (3), by sealing the first metal plate (2) and the second metal plate (3), the first metal plate (2) and the second metal plate (3) The internal working space (4) forms a plurality of staggered channels (40), and then vacuumizes and injects an appropriate amount of working fluid to form an ultra-thin uniform temperature plate (1), because the support part (5) is heat-conducting The fine powder sintered to form a porous structure, the porous structure support part (5) absorbs the working fluid, has better capillary phenomenon during work, can indeed accelerate the temperature diffusion, and has a more efficient temperature uniformity effect. The supporting part (5) can avoid the subsequent vacuuming and degassing operation inside the temperature equalizing plate to cause the surface of the first metal plate (2) and the second metal plate (3) to dent, and prevent the equalizing plate from contacting the electronic heating element When the surface is in contact, due to the aforementioned depression problem, it is impossible to achieve a smooth surface-to-surface contact, which in turn affects the thermal conductivity efficiency.

As shown in Figure 3, the inner end surface of the aforementioned second metal plate (3) of the present invention has a porous structure layer (30) formed by sintering metal powder (such as copper powder) with good thermal conductivity to increase the efficiency of heat diffusion and temperature uniformity.

The aforementioned metal powder with good thermal conductivity is copper powder.

In summary, the "ultra-thin uniform temperature plate and its manufacturing method" disclosed in the present invention is unprecedented, and has not been seen in publications published at home and abroad. It is a novel patent requirement. It is clear that the lack of conventional technology can be eliminated, and the design purpose has been achieved. It has fully met the patent requirements. I filed an application in accordance with the law. I sincerely ask your review committee for the review and grant the patent for this case.

However, what has been described above is only one of the preferred and feasible embodiments of the present invention, and is not intended to limit the scope of the present invention. For those skilled in the art, alternative methods or alternative methods or methods made by using the specification of the present invention and the scope of the patent application are used to limit the scope of the present invention. The equivalent structure change should be included in the patent scope of the present invention.

(1)‧‧‧Ultra-thin uniform temperature plate

(2)‧‧‧The first metal plate

(3)‧‧‧Second metal plate

(4)‧‧‧Working space

(40)‧‧‧Channel

(5)‧‧‧Support

Claims (7)

A manufacturing method of ultra-thin uniform temperature plate, the manufacturing method is as follows: Use metal powder with good thermal conductivity; Mix the aforementioned metal powder with good thermal conductivity with a solvent suitable for screen printing; Print the aforementioned mixture on a thin, thermally conductive first metal plate by screen printing to form a supporting portion with a predetermined height, area, and shape; Sintering the first metal plate of the aforementioned process to form a porous structure on the support part and combine with the first metal plate; Welding and sealing the first metal plate sintered by the aforementioned manufacturing process and the thin, thermally conductive second metal plate; After vacuuming and injecting working fluid, an ultra-thin uniform temperature plate is made. The method for manufacturing an ultra-thin uniform temperature plate as described in the first item of the scope of patent application, wherein the inner end surface of the second metal plate is first sintered with a porous structure layer with metal powder with good thermal conductivity, and then welded and sealed with the first metal plate , In order to increase the heat expansion efficiency. According to the manufacturing method of the ultra-thin uniform temperature plate described in the first item of the scope of patent application, the aforementioned metal powder with good thermal conductivity is copper powder. According to the method for manufacturing an ultra-thin uniform temperature plate described in the first item of the scope of patent application, the first metal plate and the second metal plate are sealed by diffusion welding. An ultra-thin uniform temperature plate, which mainly includes a thin first metal plate and a second metal plate with good heat conduction. There is a working space between the first metal plate and the second metal plate, and the inner edge of the first metal plate is formed by screen printing. A support portion of predetermined height, area, and shape, the support portion is a porous structure sintered with metal powder with good thermal conductivity, and the aforementioned support portion is welded to the opposite inner edge of the second metal plate when sealing the first metal plate and the second metal plate, By sealing the first metal plate and the second metal plate, the inner working space of the first metal plate and the second metal plate form a plurality of staggered channels, and then vacuuming and injecting an appropriate amount of working fluid to form an ultra-thin uniform temperature plate , The working fluid is adsorbed by the support part of the porous structure And support, it has better capillary phenomenon at work to accelerate temperature diffusion and achieve high-efficiency uniform temperature effect. The ultra-thin temperature equalizing plate described in item 5 of the scope of patent application, wherein the inner end surface of the second metal plate has a porous structure layer formed by sintering metal powder with good thermal conductivity to increase the efficiency of heat diffusion and temperature equalization. The ultra-thin uniform temperature plate described in item 5 of the scope of patent application, wherein the aforementioned metal powder with good thermal conductivity is copper powder.

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