CN107068846A - A kind of LED phase-change heats substrate and preparation method thereof - Google Patents
A kind of LED phase-change heats substrate and preparation method thereof Download PDFInfo
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- CN107068846A CN107068846A CN201710197905.6A CN201710197905A CN107068846A CN 107068846 A CN107068846 A CN 107068846A CN 201710197905 A CN201710197905 A CN 201710197905A CN 107068846 A CN107068846 A CN 107068846A
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- 239000000758 substrate Substances 0.000 title claims abstract description 48
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 238000003466 welding Methods 0.000 claims abstract description 27
- 239000007788 liquid Substances 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000000126 substance Substances 0.000 claims abstract description 16
- 238000005538 encapsulation Methods 0.000 claims abstract description 9
- 230000010412 perfusion Effects 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 31
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- 239000012298 atmosphere Substances 0.000 claims description 21
- 238000009413 insulation Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 19
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 238000004140 cleaning Methods 0.000 claims description 11
- 238000005516 engineering process Methods 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 10
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 9
- 239000002159 nanocrystal Substances 0.000 claims description 9
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 9
- 238000005245 sintering Methods 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000010041 electrostatic spinning Methods 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims description 6
- 238000009938 salting Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 5
- 238000005219 brazing Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000000356 contaminant Substances 0.000 claims description 5
- 238000004320 controlled atmosphere Methods 0.000 claims description 5
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical group Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 5
- 229960004643 cupric oxide Drugs 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 229910017770 Cu—Ag Inorganic materials 0.000 claims description 3
- 239000004568 cement Substances 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 238000000354 decomposition reaction Methods 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- 230000009467 reduction Effects 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
- 238000012546 transfer Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000009466 transformation Effects 0.000 abstract description 3
- 238000009833 condensation Methods 0.000 abstract description 2
- 230000005494 condensation Effects 0.000 abstract description 2
- 238000009826 distribution Methods 0.000 abstract description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 5
- 229910001928 zirconium oxide Inorganic materials 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000012153 distilled water Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000002121 nanofiber Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000005749 Copper compound Substances 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of LED phase-change heats substrate and preparation method thereof.The substrate includes upper cover plate（1）, nanometer liquid-sucking core（2）, lower cover（3）With the liquid working substance being filled in substrate；The nanometer liquid-sucking core（2）It is sintered in upper cover plate（1）And lower cover（3）Medial surface on；The upper cover plate（1）And lower cover（3）By welding split, closed cavity is internally formed after welding split, cavity is vacuumized and liquid working substance is irrigated.Preparation process includes：（1）The preparation of sheet material；（2）The manufacture of nanometer liquid-sucking core；（3）The welding of sheet material；（4）Working medium perfusion encapsulation.The substrate of the present invention uses phase-change heat transfer principle, working medium passes through the efficient fast endothermic of phase transformation, and uniformly flowed back distribution by the capillary force of nanometer liquid-sucking core after condensation, with more excellent heat transfer property, while having the characteristics of heat-transfer capability is strong, lightweight, thickness is small.
Description
Technical field
The present invention relates to LED heat radiation substrate preparing technical field, more particularly to a kind of LED phase-change heats substrate and its preparation
Method.
Background technology
With the development of LED semiconductor illumination techniques, LED energy-saving and environmental protection and long-life three advantages make it just progressively
Replace conventional light source to turn into the green light source of a new generation, penetrate into daily life.LED/light source has been widely applied to
The fields, such as automobile front, mine lamp, projecting apparatus, plane display backlight frontier such as illumination, display.
As LED technology is in the expansion application in different application field, various extreme environments are adapted to further as LED technology
One of requirement of development, therefore higher requirement is proposed to LED performance.LED performance has close pass with operating temperature
System, the rise of temperature can not only reduce luminous efficiency, and can influence service life.As semiconductor devices is to small size, big
The direction of power is developed, and great power LED turns into the light source requirements of numerous frontiers, but because its heat-dissipating space is small, result in height
The fatal problem of heat flow density, therefore application and further development of the thermal control to great power LED have great influence.
In LED encapsulation process, the substrate used at present mainly has ceramic substrate, glass substrate, metal substrate etc., wherein gold
The heat-transfer capability for belonging to substrate is optimal, mainly there is copper and aluminium, haves the shortcomings that volume is big, quality is big, and the heat of great power LED module
Current density is also beyond ordinary copper or the heat transport limitation of aluminum, and the specific surface area of traditional increase radiating has been no longer appropriate for greatly
The development of power LED package technology.Phase-change heat transfer technology carries out the absorption and transmission of heat, its heat-transfer capability using Working fluid phase changing
It is the hundreds of times of same material, is the effective way for solving limit heat dissipation problem in high-power LED encapsulation using phase transformation substrate.
The content of the invention
Present invention aim to address limit heat dissipation problem in high-power LED encapsulation, there is provided a kind of New LED phase-change heat
Substrate and preparation method thereof, the New LED phase-change heat substrate for preparing of the present invention has that heat-transfer capability is strong, lightweight, thickness is small
The characteristics of.
The present invention is achieved through the following technical solutions.
A kind of LED phase-change heats substrate, including upper cover plate, nanometer liquid-sucking core, lower cover and the liquid being filled in substrate
Working medium；The nanometer liquid-sucking core is sintered on the medial surface of upper cover plate and lower cover；The upper cover plate and lower cover pass through welding
Split, is internally formed closed cavity after welding split, cavity is vacuumized and liquid working substance is irrigated.
Further, insulation glue-line is provided with the lateral surface of the upper cover plate, circuit is provided with insulation glue-line.
Further, the insulation glue-line is nano level zirconium oxide.
Further, the medial surface of the lower cover is provided with support rim.
Further, the upper cover plate and lower cover are provided with the adpting flange for welding.
Further, the material of the upper cover plate and lower cover is red copper, and thickness is 0.08mm ~ 0.1mm, and profile is logical
Sheet Metal Forming Technology is crossed to be made.
Further, the nanometer liquid-sucking core is inter-adhesive and the multi-layer nano copper cash wire mesh membrane of laminating on the cover board,
The thickness of nanometer liquid-sucking core is 0.1mm ~ 0.15mm, and porosity is 75% ~ 90%.
Further, a diameter of 0.1 μm ~ 0.5 μm of described NANO CRYSTAL COPPER WIRE.
Further, the gross thickness of the LED phase-change heats substrate is 0.6mm ~ 0.8mm.
Further, the liquid working substance is any of pure water, methanol and ethanol.
Further, the welding procedure of the upper cover plate and lower cover is Cu-Ag deposits technology, and solder is CuPSnNi series
Solder, the fusing point interval of solder is 590 DEG C ~ 610 DEG C.
The method for preparing a kind of described LED phase-change heats substrate, comprises the following steps：
（1）The preparation of sheet material：Using stamping machine, by copper sheet, upper cover plate and the mould punching of lower cover profile needed for are molded simultaneously
Upper cover plate and lower cover are determined, after cleaning, insulating cement is coated in the lateral surface of upper cover plate, insulation glue-line is formed, in insulating cement
Set circuit that upper cover plate finished product is made on layer；
（2）The preparation of nanometer liquid-sucking core：Nanometer is made by electrostatic spinning process in the salting liquid that the copper of polyvinyl alcohol will be dissolved with
On fiber, the medial surface for sticking in upper cover plate and lower cover, and obtained cupric oxide nano line is decomposed in sintering furnace high temperature, finally
NANO CRYSTAL COPPER WIRE is reduced into high-temperature atmosphere furnace, and is sintered on the medial surface of upper cover plate and lower cover；
（3）The welding of sheet material：The solder-coating on the flange and boss of lower cover, after lower cover and upper cover plate split, uses mould
Tool clamps and applies prestressing force, is placed in soldering oven and carries out brazing in controlled atmosphere；
（4）Working medium perfusion encapsulation：Liquid working substance is injected into the upper cover plate after welding and the die cavity after lower cover split, is vacuumized
Processing, finally carries out cold pressing sealing to taking out mouth, and uses argon arc welding solder up, obtains the LED phase-change heats substrate.
Further, step（1）In, the cleaning is the first ultrasonic wave in the HF-223 metal cleaners for dilute 10 times
3 ~ 7min is cleaned, surface and oil contaminant and burrs on edges is washed away, then washes with clear water the remaining cleaning fluid of lid surface；
Further, step（2）In, the proportioning of the salting liquid of the described copper for being dissolved with polyvinyl alcohol is：Polyvinyl alcohol is accounted for always
The 10% ~ 15% of solution quality, copper compound accounts for the 10% ~ 20% of total solution quality.
Further, step（2）In, the salting liquid of the copper is copper chloride solution or copper-bath.
Further, step（2）In, the temperature of the pyrolytic is 480 DEG C ~ 670 DEG C, and decomposition atmosphere is big compression ring
Border, the resolving time is 50min ~ 60min.
Further, step（2）In, the temperature of the reduction is 820 DEG C ~ 900 DEG C, and atmosphere is hydrogen shield atmosphere, when
Between be 30min ~ 40min.
Further, step（3）In, the temperature of the soldering is 610 DEG C ~ 630 DEG C, and soldering atmosphere is nitrogen protective atmosphere
Enclose, the time is 10min ~ 20min.
Compared with prior art, the invention has the advantages that and beneficial effect：
（1）Substrate manufactured by the present invention uses phase-change heat transfer principle, and working medium is by the efficient fast endothermic of phase transformation, and after condensation
Uniformly flowed back distribution by the capillary force of nanometer liquid-sucking core, with more excellent heat transfer property, its heat-transfer capability is traditional gold
Belong to hundreds times of substrate, thermal control of the great power LED under limit heat dissipation environment can be achieved, it is ensured that high-power in the course of work
LED stability；
（2）Be cavity structure inside substrate manufactured by the present invention, can neatly control base board thickness, while ensureing to dissipate
Enable substrate lightweight on the premise of hot property.
Brief description of the drawings
Fig. 1 is the structure sectional view of the LED phase-change heat substrates of the present invention；
Fig. 2 is the axonometric drawing of the lateral surface of stamping forming upper cover plate；
Fig. 3 is the axonometric drawing of the medial surface of stamping forming upper cover plate；
Fig. 4 is the axonometric drawing of the lateral surface of stamping forming lower cover；
Fig. 5 is the axonometric drawing of the medial surface of stamping forming lower cover；
Fig. 6 has the axonometric drawing of the lateral surface of the upper cover plate of circuit for preparation；
Fig. 7 manufactures the schematic diagram of nanometer liquid-sucking core for electrostatic spinning on the cover board；
Fig. 8 is the structural perspective of the LED phase-change heat substrate finished products of the present invention.
Embodiment
The present invention is done below in conjunction with relevant drawings and specific embodiment and is further described in detail, but the implementation of the present invention
Mode not limited to this.
As shown in figure 1, the structure sectional view of the LED phase-change heat substrates for the present invention, gross thickness is 0.6mm ~ 0.8mm,
Including upper cover plate 1, nanometer liquid-sucking core 2, lower cover 3 and the liquid working substance being filled in substrate；
Insulation glue-line 4 is provided with the lateral surface of upper cover plate 1, circuit 7 is provided with insulation glue-line 4；Insulation glue-line 4 is to receive
The zirconium oxide of meter level；
The medial surface of lower cover 3 is provided with support rim；Upper cover plate 1 and lower cover 3 are provided with the adpting flange for welding；
The material of upper cover plate 1 and lower cover 3 is red copper, and thickness is 0.08mm ~ 0.1mm, and profile is made up of Sheet Metal Forming Technology；
Nanometer liquid-sucking core 2 is NANO CRYSTAL COPPER WIRE wire mesh membrane that is inter-adhesive and being fitted on upper cover plate 1 and the medial surface of lower cover 3, is received
The thickness of rice liquid-sucking core 2 is 0.1mm ~ 0.15mm, and porosity is 75% ~ 90%, a diameter of the 0.1 of the NANO CRYSTAL COPPER WIRE of nanometer liquid-sucking core
μm~0.5μm；Nanometer liquid-sucking core 2 is sintered on the medial surface of upper cover plate 1 and lower cover 3；
Upper cover plate 1 and lower cover 3 must be internally formed closed cavity after welding split, cavity taken out very by welding split
Sky simultaneously irrigates liquid working substance；The welding procedure of upper cover plate 1 and lower cover 3 is Cu-Ag deposits technology, and solder is CuPSnNi series welderings
Material, the fusing point interval of solder is 590 DEG C ~ 610 DEG C；Liquid working substance is any of pure water, methanol and ethanol.
Embodiment 1
A kind of preparation method of LED phase-change heats substrate, comprises the following steps：
（1）The preparation of sheet material：First with stamping machine by copper sheet needed for the mould of upper cover plate 1 and the profile of lower cover 3 it is outer
Shape punch forming simultaneously determines upper cover plate 1 and lower cover 3, and upper cover plate 1 and lower cover 3 are put into and dilute 10 times of HF-223 metals
Ultrasonic wave cleans 5min in cleaning agent, washes away surface and oil contaminant and burrs on edges, upper cover plate 1 and lower cover are finally washed with clear water
The cleaning fluid of 3 surface residuals, obtains upper cover plate 1 and lower cover 3；
Lateral surface shaft side figure and medial surface the shaft side figure difference of upper cover plate 1 are as shown in Figures 2 and 3；The lateral surface axle side of lower cover 3
Figure and medial surface shaft side figure difference are as shown in Figure 4 and Figure 5；
Then the nano level zirconium oxide of insulating materials is coated in the lateral surface of upper cover plate, one layer of insulation glue-line 4 is formed, thickness is
0.02mm, and set circuit 7 that upper cover plate finished product 1 is made on insulation glue-line 4, as shown in Figure 6；
（2）The manufacture of nanometer liquid-sucking core 2：2.5g polyvinyl alcohol and 3g copper chlorides are dissolved in 20g distilled water poly- second is made
Enol-copper chloride composite solution, diameter is made in 0.1 μm ~ 0.5 μm interval nanofiber 5, adhesion by electrostatic spinning process
The multi-layer nano copper cash wire mesh membrane that formation porosity is 80% on upper and lower cover plate medial surface and thickness is 0.1mm, such as Fig. 7, and
550 DEG C of insulation 50min, which are decomposed, in sintering furnace is made cupric oxide nano line, is finally placed in high-temperature atmosphere furnace, using hydrogen as burning
880 DEG C of high temperature sintering 35min of atmosphere are tied, NANO CRYSTAL COPPER WIRE are reduced into, and be sintered on the medial surface of upper cover plate 1 and lower cover 3；
（3）The welding of sheet material：The solder-coating first on the flange and boss of lower cover 3（CuPSnNi series）, by lower cover 3
With apply with mold cramping and suitably prestressing force after the split of upper cover plate 1, then be placed in soldering oven, using nitrogen as protection atmosphere
20min is incubated under 610 DEG C of environment, brazing in controlled atmosphere is carried out；
（4）Working medium perfusion encapsulation：0.5ml liquid working substance is injected into the die cavity after upper cover plate 1 and the split of lower cover 3, then
Vacuumize process is carried out to it, finally cold pressing sealing is carried out to taking out mouth, and use argon arc welding technique solder up, it is ensured that sealed
It is good, the LED phase-change heats substrate is obtained, the structural perspective of finished product is as shown in Figure 8.
Embodiment 2
A kind of preparation method of LED phase-change heats substrate, comprises the following steps：
（1）The preparation of sheet material：First with stamping machine by copper sheet needed for the mould of upper cover plate 1 and the profile of lower cover 3 it is outer
Shape punch forming simultaneously determines upper cover plate 1 and lower cover 3, upper cover plate 1 and lower cover 3 are put into dilute 10 times HF-223 cleaning
Ultrasonic wave cleans 7min in liquid, washes away surface and oil contaminant and burrs on edges, upper cover plate 1 and the table of lower cover 3 are finally washed with clear water
The remaining cleaning fluid in face, obtains upper cover plate 1 and lower cover 3；Then the nano level zirconium oxide of insulating materials is coated in upper cover plate
Lateral surface, formed one layer insulation glue-line 4, thickness is 0.02mm, and insulation glue-line 4 on set circuit 7 upper cover plate is made
Finished product 1, as shown in Figure 6；
（2）The manufacture of nanometer liquid-sucking core 2：3g polyvinyl alcohol and 4g copper chlorides are dissolved in 20g distilled water polyethylene is made
Alcohol-copper chloride composite solution, is made diameter in 0.1 μm ~ 0.5 μm interval nanofiber 5 by electrostatic spinning process, sticks in
The multi-layer nano copper cash wire mesh membrane that formation porosity is 85% on upper and lower cover plate medial surface and thickness is 0.12mm, such as Fig. 7, and
550 DEG C of insulation 50min, which are decomposed, in sintering furnace is made cupric oxide nano line, is finally placed in high-temperature atmosphere furnace, using hydrogen as sintering
850 DEG C of high temperature sintering 40min of atmosphere, are reduced into NANO CRYSTAL COPPER WIRE, and be sintered on the medial surface of upper cover plate 1 and lower cover 3；
（3）The welding of sheet material：The solder-coating first on the flange and boss of lower cover 3（CuPSnNi series）, by lower cover 3
With apply with mold cramping and suitably prestressing force after the split of upper cover plate 1, then be placed in soldering oven, using nitrogen as protection atmosphere
15min is incubated under 620 DEG C of environment, brazing in controlled atmosphere is carried out；
（4）Working medium perfusion encapsulation：0.8ml liquid working substance is injected into the die cavity after upper cover plate 1 and the split of lower cover 3, then
Vacuumize process is carried out to it, finally cold pressing sealing is carried out to taking out mouth, and use argon arc welding technique solder up, it is ensured that sealed
It is good, obtain the LED phase-change heats substrate.
Embodiment 3
A kind of preparation method of LED phase-change heats substrate, comprises the following steps：
（1）The preparation of sheet material：First with stamping machine by copper sheet needed for the mould of upper cover plate 1 and the profile of lower cover 3 it is outer
Shape punch forming simultaneously determines upper cover plate 1 and lower cover 3, upper cover plate 1 and lower cover 3 are put into dilute 10 times HF-223 cleaning
Ultrasonic wave cleans 3min in liquid, washes away surface and oil contaminant and burrs on edges, upper cover plate 1 and the table of lower cover 3 are finally washed with clear water
The remaining cleaning fluid in face, obtains upper cover plate 1 and lower cover 3；Then the nano level zirconium oxide of insulating materials is coated in upper cover plate
Lateral surface, formed one layer insulation glue-line 4, thickness is 0.02mm, and insulation glue-line 4 on set circuit 7 upper cover plate is made
Finished product 1, as shown in Figure 6；
（2）The manufacture of nanometer liquid-sucking core 2：2.5g polyvinyl alcohol and 3g copper chlorides are dissolved in 20g distilled water poly- second is made
Enol-copper chloride composite solution, diameter is made in 0.1 μm ~ 0.5 μm interval nanofiber 5, adhesion by electrostatic spinning process
The multi-layer nano copper cash wire mesh membrane that formation porosity is 90% on upper and lower cover plate medial surface and thickness is 0.15mm, such as Fig. 7, and
480 DEG C of insulation 60min, which are decomposed, in sintering furnace is made cupric oxide nano line, is finally placed in high-temperature atmosphere furnace, using hydrogen as burning
820 DEG C of high temperature sintering 40min of atmosphere are tied, NANO CRYSTAL COPPER WIRE are reduced into, and be sintered on the medial surface of upper cover plate 1 and lower cover 3；
（3）The welding of sheet material：The solder-coating first on the flange and boss of lower cover 3（CuPSnNi series）, by lower cover 3
With apply with mold cramping and suitably prestressing force after the split of upper cover plate 1, then be placed in soldering oven, using nitrogen as protection atmosphere
10min is incubated under 630 DEG C of environment, brazing in controlled atmosphere is carried out；
（4）Working medium perfusion encapsulation：1ml liquid working substance is injected into the die cavity after upper cover plate 1 and the split of lower cover 3, it is then right
It carries out vacuumize process, finally carries out cold pressing sealing to taking out mouth, and use argon arc welding technique solder up, it is ensured that sealing is intact,
Obtain the LED phase-change heats substrate.
The specific embodiment of the present invention is only to say bright example of the present invention to be clear, and is not to of the invention real
Apply the restriction of mode.For the skilled worker in corresponding field, similar change can also be made on the basis of the above description
Dynamic, variation within the scope of the claims also can be achieved, and can not and all embodiments need not be exhaustive herein.It is all
Any modifications, equivalent substitutions and improvements made within the spirit and principles in the present invention etc., should be included in right of the present invention will
Within the protection domain asked.
Claims (10)
1. a kind of LED phase-change heats substrate, it is characterised in that including upper cover plate（1）, nanometer liquid-sucking core（2）, lower cover（3）With
It is filled in the liquid working substance in substrate；The nanometer liquid-sucking core（2）It is sintered in upper cover plate（1）And lower cover（3）Medial surface on；
The upper cover plate（1）And lower cover（3）By welding split, closed cavity is internally formed after welding split, by cavity
Vacuumize and irrigate liquid working substance.
2. a kind of LED phase-change heats substrate according to claim 1, it is characterised in that the upper cover plate（1）Lateral surface
On be provided with insulation glue-line（4）, in insulation glue-line（4）On be provided with circuit（7）；The insulation glue-line（4）For nano level oxygen
Change zirconium.
3. a kind of LED phase-change heats substrate according to claim 1, it is characterised in that the lower cover（3）Medial surface
It is provided with support rim；The upper cover plate（1）And lower cover（3）It is provided with the adpting flange for welding；The upper cover plate（1）
And lower cover（3）Material be red copper, thickness is 0.08mm ~ 0.1mm, and profile is made up of Sheet Metal Forming Technology.
4. a kind of LED phase-change heats substrate according to claim 1, it is characterised in that the nanometer liquid-sucking core（2）It is phase
Mutual adhesion and it is fitted in upper cover plate（1）And lower cover（3）On multi-layer nano copper cash wire mesh membrane, nanometer liquid-sucking core（2）Thickness
For 0.1mm ~ 0.15mm, porosity is 75% ~ 90%；A diameter of 0.1 μm ~ 0.5 μm of described NANO CRYSTAL COPPER WIRE.
5. a kind of LED phase-change heats substrate according to claim 1, it is characterised in that the LED phase-change heats substrate
Gross thickness is 0.6mm ~ 0.8mm；The liquid working substance is any of pure water, methanol and ethanol；The upper cover plate（1）With
Lower cover（3）Welding procedure be Cu-Ag deposits technology, solder be CuPSnNi series solders, solder fusing point interval be 590 DEG C
~610℃。
6. prepare a kind of method of LED phase-change heats substrate described in any one of claim 1 ~ 5, it is characterised in that including such as
Lower step：
（1）The preparation of sheet material：Using stamping machine by copper sheet according to required upper cover plate（1）And lower cover（3）The mould punching of profile
It is molded and determines upper cover plate（1）And lower cover（3）, after cleaning, insulating cement is coated in upper cover plate（1）Lateral surface, formed exhausted
Edge glue-line（4）, in insulation glue-line（4）Upper setting circuit（7）Upper cover plate is made（1）Finished product；
（2）The preparation of nanometer liquid-sucking core：Nanometer is made by electrostatic spinning process in the salting liquid that the copper of polyvinyl alcohol will be dissolved with
Fiber, sticks in upper cover plate（1）And lower cover（3）Medial surface on, and sintering furnace high temperature decompose be made cupric oxide nano
Line, is finally reduced into NANO CRYSTAL COPPER WIRE, and be sintered in upper cover plate in high-temperature atmosphere furnace（1）And lower cover（3）Medial surface on；
（3）The welding of sheet material：In lower cover（3）Flange and boss on solder-coating, by lower cover（3）And upper cover plate（1）Spell
After conjunction, with mold cramping and application prestressing force, it is placed in soldering oven and carries out brazing in controlled atmosphere；
（4）Working medium perfusion encapsulation：Upper cover plate toward after welding（1）And lower cover（3）Liquid working substance is injected in die cavity after split,
Vacuumize process, finally carries out cold pressing sealing to taking out mouth, and uses argon arc welding solder up, obtains the LED phase-change heats substrate.
7. a kind of preparation method of LED phase-change heats substrate according to claim 6, it is characterised in that step（1）In,
The cleaning is that first ultrasonic wave cleans 3 ~ 7min in the HF-223 metal cleaners for dilute 10 times, washes away surface and oil contaminant and side
Echinid is pierced, then washes with clear water the remaining cleaning fluid of lid surface.
8. a kind of preparation method of LED phase-change heats substrate according to claim 6, it is characterised in that step（2）In,
The proportioning of the salting liquid of the described copper for being dissolved with polyvinyl alcohol is：Polyvinyl alcohol accounts for the 10% ~ 15% of total solution quality, copper chemical combination
Thing accounts for the 10% ~ 20% of total solution quality；The salting liquid of the copper is copper chloride solution or copper-bath.
9. a kind of preparation method of LED phase-change heats substrate according to claim 6, it is characterised in that step（2）In,
The temperature of the pyrolytic is 480 DEG C ~ 670 DEG C, and decomposition atmosphere is atmospheric environment, and the resolving time is 50min ~ 60min；It is described
The temperature of reduction is 820 DEG C ~ 900 DEG C, and atmosphere is hydrogen shield atmosphere, and the time is 30min ~ 40min.
10. a kind of preparation method of LED phase-change heats substrate according to claim 6, it is characterised in that step（3）In,
The temperature of the soldering is 610 DEG C ~ 630 DEG C, and soldering atmosphere is enclosed for nitrogen protective atmosphere, and the time is 10min ~ 20min.
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