WO2009039774A1 - A manufacturing method of a heat transfer device without pouring tube - Google Patents

A manufacturing method of a heat transfer device without pouring tube Download PDF

Info

Publication number
WO2009039774A1
WO2009039774A1 PCT/CN2008/072407 CN2008072407W WO2009039774A1 WO 2009039774 A1 WO2009039774 A1 WO 2009039774A1 CN 2008072407 W CN2008072407 W CN 2008072407W WO 2009039774 A1 WO2009039774 A1 WO 2009039774A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat transfer
transfer device
manufacturing
welding
gap
Prior art date
Application number
PCT/CN2008/072407
Other languages
French (fr)
Chinese (zh)
Inventor
Jide Jin
Shushen Lv
Original Assignee
Zhejiang Acmecools Electronic Technology Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Acmecools Electronic Technology Co., Ltd filed Critical Zhejiang Acmecools Electronic Technology Co., Ltd
Publication of WO2009039774A1 publication Critical patent/WO2009039774A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/09—Heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a method of manufacturing a heat transfer device.
  • each LED has the backlight of the audio panel in the product, the backlight of the mobile phone button and the backlight of the mobile phone screen.
  • each LED has the positive improvement of the brightness of LEDs.
  • the power consumption is large and the heat generated is rapidly rising, so LEDs are currently used.
  • the heat dissipation problem has also become an important issue that needs to be solved at present.
  • the flat type uniform temperature heat transfer device is a sealed container with an internal vacuum and a liquid working medium.
  • the loop heat pipe is also The utility model relates to a two-phase high-efficiency heat transfer device, which utilizes the capillary force generated by the capillary core in the evaporator to drive the circuit to operate, and uses the evaporation and condensation of the working medium to transfer heat, so that a large amount of heat can be transmitted under a small temperature difference and a long distance. Heat.
  • the existing heat transfer device is manufactured by: firstly welding the surrounding parts, and then following the drilling and welding pipes.
  • Heat transfer devices generally leave a liquid injection pipe of 0.5 to 3 cm unequal length, and often because the control on the process is not easy, the heat dissipation effect of the uniform temperature or heat transfer is not good.
  • An object of the present invention is to overcome the deficiencies of the prior art and to provide a method of manufacturing a heat transfer device without a liquid injection tube.
  • the heat transfer device refers to a heat transfer device that transfers heat by the principle of the phase change of the working fluid, and the manufacturing method is applicable to all heat transfer devices that use the phase change heat transfer of the working fluid.
  • the rapid welding means that a device capable of locally generating high energy and instantaneous welding, such as high frequency argon arc welding or laser welding, is used.
  • the manufacturing method cannot use the ordinary welding method, and the ordinary welding causes high temperature to soften and oxidize the material of the heat transfer device, and affects the working fluid.
  • the manufacturing method of the invention provides a heat transfer device without a liquid injection pipe, which not only simplifies the mass production process, but also greatly improves the performance and reliability.
  • the high energy provided by the machine is the three-side welded seal around the heat transfer device, and then passes through the heat transfer through the extremely thin needle tube.
  • the gap on the fourth side of the device is filled with the working fluid, and then the clamping action is performed with a high-tightness clamp, and then placed in the vacuum welding chamber to be sealed by high-frequency argon arc welding, and the final inspection is completed.
  • the high energy provided by the machine is the three-side welding seal around the heat transfer device, and then the working fluid is filled through the gap of the fourth side of the heat transfer device with a very fine needle tube, and then the clamping action is performed with the high-tightness clamp. Then, it is placed in a vacuum welding chamber and sealed by laser welding, and the final inspection is completed.

Abstract

A manufacturing method of a heat transfer device without pouring tube includes the following steps: (1) welding the heat transfer device for sealing it, and a slot being left unwelded; (2) pouring the working liquid into the heat transfer device by a thin needle tube through the slot; (3)putting the device into a vacuum conditon, and welding the slot being left quickly. The manufacturing method provides a heat transfer device without pouring tube. The manufacturing process is simplified and the performance and reliability is improved.

Description

说明书 一种无注液管的传热装置的制造方法  Method for manufacturing heat transfer device without liquid injection pipe
[1] 技术领域  [1] Technical field
[2] 本发明涉及一种传热装置的制造方法。  [2] The present invention relates to a method of manufacturing a heat transfer device.
[3] 背景技术  [3] Background Art
[4] 在电子产品逐渐走向高阶化、 轻薄化及多功能化之际， 使得电子组件必须在更 小的体积下具备更强大的功能及更高的散热需求以增加电子产品的寿命、 可靠 度及其稳定性。 电子芯片的散热系统对保持芯片的正常工作温度至关重要； 当 芯片设计、 封装好后， 其热可靠性主要取决于散热系统的散热性能。 再则， 目 前 LED应用的产品也非常广泛， 如 3C  [4] As electronic products move toward higher-order, thinner, and more versatile, electronic components must have more powerful functions and higher heat dissipation requirements in a smaller volume to increase the lifespan and reliability of electronic products. Degree and its stability. The heat dissipation system of the electronic chip is crucial to maintain the normal operating temperature of the chip; when the chip is designed and packaged, its thermal reliability mainly depends on the heat dissipation performance of the heat dissipation system. In addition, the current LED application products are also very extensive, such as 3C
产品中音响面板的背光源、 手机按键背光源及手机屏幕背光源的应用。 然而， 因为随着各界积极的提高 LED的亮度， 造成每一颗的 LED  The backlight of the audio panel in the product, the backlight of the mobile phone button and the backlight of the mobile phone screen. However, because with the positive improvement of the brightness of LEDs, each LED
功率消耗大及散发的热能迅速高涨， 所以目前使用 LED The power consumption is large and the heat generated is rapidly rising, so LEDs are currently used.
为发光源的产品皆受到 「散热」 的问题， 而进一步限制 LED  Products that are illuminating sources are subject to "heat dissipation" and further limit LEDs
应用产品尺寸的发展。 所以如何有效的解决 LED  Application product size development. So how to effectively solve the LED
散热问题也成为目前亟须解决的重要问题。  The heat dissipation problem has also become an important issue that needs to be solved at present.
[5] 有鉴于此， 平板式热管或均温板（Vapor chamber)及回路热管（Loop heat pipe) 均被认为是下一代极有可能成为主流的电子散热元器件。 目前之所以未被广泛 使用，除了传热器件本身量化制程尚有待加强外（ [5] In view of this, flat-plate heat pipes or Vapor chambers and loop heat pipes are considered to be the next generation of electronic heat-dissipating components that are likely to become mainstream. At present, the reason why it is not widely used, in addition to the heat transfer device itself, the quantitative process has yet to be strengthened (
厚度、 平整度、 内部结构、 外形…）  Thickness, flatness, internal structure, shape...)
， 也因客户需求的不同而有不同的组装结构要求； 其次， 能有效节省制造成本 也成为另一项瓶颈， 若再加上内部工作流体循环回路迂回等因素， 则对于平板 式电子传热器件及回路式电子传热器件的稳定性及可靠度更会增添了许多不确 定的因素。  , also because of different customer requirements, there are different assembly structure requirements; Secondly, the effective saving of manufacturing costs has become another bottleneck, if coupled with internal working fluid circulation loops, etc., for flat-plate electronic heat transfer devices The stability and reliability of loop-type electronic heat transfer devices add many uncertainties.
[6] 现有的传热器件大多是釆用工质液体相变原理传热的， 如平板式热管、 回路热 管或均温传热板等等。  [6] Most of the existing heat transfer devices are heat transfer using the phase change principle of working fluids, such as flat heat pipes, loop heat pipes or uniform temperature heat transfer plates.
平板式均温传热装置为一内部真空并含液态工质的密封容器。 而回路热管也是 一种两相高效传热装置， 它利用蒸发器内的毛细芯产生的毛细力驱动回路运行 ， 利用工质的蒸发和冷凝来传递热量， 因此能够在小温差、 长距离的情况下传 递大量的热量。 The flat type uniform temperature heat transfer device is a sealed container with an internal vacuum and a liquid working medium. And the loop heat pipe is also The utility model relates to a two-phase high-efficiency heat transfer device, which utilizes the capillary force generated by the capillary core in the evaporator to drive the circuit to operate, and uses the evaporation and condensation of the working medium to transfer heat, so that a large amount of heat can be transmitted under a small temperature difference and a long distance. Heat.
[7] 现有传热装置的制造方法为： 首先须将其四周焊接好， 再依循钻孔、 焊管 [7] The existing heat transfer device is manufactured by: firstly welding the surrounding parts, and then following the drilling and welding pipes.
、 真空注液、 封管口、 点焊等步骤完成， 或事先在上下板盖冲模吋就预留注液 孔而省略钻孔步骤， 其余大致相同。 利用该制造方法制造的 The steps of vacuum injection, sealing nozzle, spot welding, etc. are completed, or the injection hole is reserved in the upper and lower plate cover, and the drilling step is omitted, and the rest are substantially the same. Manufactured by the manufacturing method
传热器件一般会留下 0.5〜 3公分不等长的注液管， 且往往因为制程上的 控制不易， 从而造成均温或传热的散热效益不彰。  Heat transfer devices generally leave a liquid injection pipe of 0.5 to 3 cm unequal length, and often because the control on the process is not easy, the heat dissipation effect of the uniform temperature or heat transfer is not good.
[8] 发明内容  [8] Summary of the invention
[9] 本发明的目的在于克服现有技术存在的不足， 提供一种无注液管的传热装置的 制造方法。  [9] An object of the present invention is to overcome the deficiencies of the prior art and to provide a method of manufacturing a heat transfer device without a liquid injection tube.
[10] 为了实现上述目的， 本发明釆用如下技术方案：  [10] In order to achieve the above object, the present invention uses the following technical solutions:
[11] 本发明的无注液管的传热装置的制造方法， 包括如下步骤  [11] A method for manufacturing a heat transfer device without a liquid injection tube according to the present invention, comprising the following steps
[12] ( 1 ) 焊接密封传热装置， 留一处缝隙先不焊接；  [12] (1) Welding and sealing heat transfer device, leaving a gap to be welded first;
[13] ( 2 ) 用细针管通过缝隙往传热装置内充注工质液体；  [13] (2) Filling the heat transfer device with a fine needle through the gap;
[14] ( 3 ) 放置到真空条件下， 快速焊接密封所留的缝隙。  [14] (3) Place the vacuum to seal the gap left by the seal.
[15] 在上述制造方法中， 传热装置是指利用工质液体相变原理传热的传热装置， 该 制造方法适用于所有利用工质液体相变传热的传热装置。  [15] In the above manufacturing method, the heat transfer device refers to a heat transfer device that transfers heat by the principle of the phase change of the working fluid, and the manufacturing method is applicable to all heat transfer devices that use the phase change heat transfer of the working fluid.
[16] 在上述制造方法中， 所述快速焊接是指釆用能在局部产生高能量， 瞬间焊接的 设备， 例如高频氩弧焊接或激光焊接。 该制造方法不能釆用普通的焊接方法， 普通的焊接会产生高温造成传热装置材质软化与氧化， 并影响工质液体。 [16] In the above manufacturing method, the rapid welding means that a device capable of locally generating high energy and instantaneous welding, such as high frequency argon arc welding or laser welding, is used. The manufacturing method cannot use the ordinary welding method, and the ordinary welding causes high temperature to soften and oxidize the material of the heat transfer device, and affects the working fluid.
[17] 与现有技术相比 [17] Compared with the prior art
， 本发明具有如下有益效果： 本发明的制造方法提供了无注液管的传热装置， 不仅能简化量产制程， 也大大提高了性能及可靠度。  The invention has the following beneficial effects: The manufacturing method of the invention provides a heat transfer device without a liquid injection pipe, which not only simplifies the mass production process, but also greatly improves the performance and reliability.
[18] 具体实施方式 [18] Specific implementation
[19] 实施例 1 [19] Example 1
[20] 先以高频氩弧焊接 [20] First high frequency argon arc welding
机所提供的高能量为传热装置四周的三边焊接密封， 再以极细的针管通过传热 装置第四边的缝隙充注工质液体， 之后用高紧密度的夹具做好夹紧动作， 然后 放置到真空焊接室以高频氩弧焊接密封， 最后检査完成。 The high energy provided by the machine is the three-side welded seal around the heat transfer device, and then passes through the heat transfer through the extremely thin needle tube. The gap on the fourth side of the device is filled with the working fluid, and then the clamping action is performed with a high-tightness clamp, and then placed in the vacuum welding chamber to be sealed by high-frequency argon arc welding, and the final inspection is completed.
[21] 实施例 2  [21] Example 2
[22] 先以高频氩弧焊接  [22] First high frequency argon arc welding
机所提供的高能量为传热装置四周的三边焊接密封， 再以极细的针管通过传热 装置第四边的缝隙充注工质液体， 之后用高紧密度的夹具做好夹紧动作， 然后 放置到真空焊接室以激光焊接密封， 最后检査完成。  The high energy provided by the machine is the three-side welding seal around the heat transfer device, and then the working fluid is filled through the gap of the fourth side of the heat transfer device with a very fine needle tube, and then the clamping action is performed with the high-tightness clamp. Then, it is placed in a vacuum welding chamber and sealed by laser welding, and the final inspection is completed.

Claims

权利要求书 [1] 一种无注液管的传热装置的制造方法， 其特征在于包括如下步骤： Claims [1] A method of manufacturing a heat transfer device without a liquid injection tube, comprising the steps of:
( 1 ) 焊接密封传热装置， 留一处缝隙先不焊接；  (1) Weld the sealed heat transfer device, leaving a gap to be welded first;
( 2 ) 用细针管通过缝隙往传热装置内充注工质液体；  (2) using a fine needle tube to fill the heat transfer device with a working fluid through the gap;
( 3 ) 放置到真空条件下， 快速焊接密封所留的缝隙。  (3) Place the vacuum to seal the gap left by the seal.
[2] 如权利要求 1 [2] as claimed in claim 1
所述的制造方法， 其特征在于所述传热装置是指利用工质液体相变传热的 传热装置。  The manufacturing method described above is characterized in that the heat transfer device refers to a heat transfer device that utilizes a phase change heat transfer of a working fluid.
[3] 如权利要求 1所述的制造方法， 其特征在于所述快速焊接是釆用能  [3] The manufacturing method according to claim 1, wherein the rapid welding is an energy application
在局部产生高能量及瞬间焊接的焊接设备。  High-energy and instantaneous welding equipment for local production.
[4] 如权利要求 3所述的制造方法， 其特征在于所述能 [4] The manufacturing method according to claim 3, characterized in that the energy
在局部产生高能量及瞬间焊接的焊接设备为高频氩弧焊接或激光焊接。  Welding equipment that locally produces high energy and instantaneous welding is high frequency argon arc welding or laser welding.
PCT/CN2008/072407 2007-09-20 2008-09-18 A manufacturing method of a heat transfer device without pouring tube WO2009039774A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200710030341.3 2007-09-20
CN 200710030341 CN101394726A (en) 2007-09-20 2007-09-20 Manufacturing method for heat transferring device without liquid injection tube

Publications (1)

Publication Number Publication Date
WO2009039774A1 true WO2009039774A1 (en) 2009-04-02

Family

ID=40494730

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2008/072407 WO2009039774A1 (en) 2007-09-20 2008-09-18 A manufacturing method of a heat transfer device without pouring tube

Country Status (2)

Country Link
CN (1) CN101394726A (en)
WO (1) WO2009039774A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103217042A (en) * 2012-01-19 2013-07-24 极致科技股份有限公司 Method for manufacturing temperature equalizing device without liquid injection tube and temperature equalizing device manufactured by using method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140116479A (en) * 2012-01-19 2014-10-02 아크메쿨스 테크. 엘티디. Manufacturing method of temperature equalization device without liquid injection tube and temperature equalization device manufactured by the method
CN102748967A (en) * 2012-07-19 2012-10-24 苏州聚力电机有限公司 Thinning heat conduction device with pipeless sealing structure and forming method of thinning heat conduction device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06129788A (en) * 1992-10-06 1994-05-13 Ryukan Boku Manufacture of heat pipe
JPH08136173A (en) * 1994-11-07 1996-05-31 Nippon Sangyo Kikaku:Kk Method and apparatus for manufacturing heat pipe
US20050051259A1 (en) * 2003-09-09 2005-03-10 Chin-Kuang Luo Method for sealing heat pipes
CN1737484A (en) * 2004-08-19 2006-02-22 林项武 Heat pipe vacuum sealing method and apparatus thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06129788A (en) * 1992-10-06 1994-05-13 Ryukan Boku Manufacture of heat pipe
JPH08136173A (en) * 1994-11-07 1996-05-31 Nippon Sangyo Kikaku:Kk Method and apparatus for manufacturing heat pipe
US20050051259A1 (en) * 2003-09-09 2005-03-10 Chin-Kuang Luo Method for sealing heat pipes
CN1737484A (en) * 2004-08-19 2006-02-22 林项武 Heat pipe vacuum sealing method and apparatus thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103217042A (en) * 2012-01-19 2013-07-24 极致科技股份有限公司 Method for manufacturing temperature equalizing device without liquid injection tube and temperature equalizing device manufactured by using method

Also Published As

Publication number Publication date
CN101394726A (en) 2009-03-25

Similar Documents

Publication Publication Date Title
WO2021203825A1 (en) Heat dissipation device, preparation method for heat dissipation device, and electronic apparatus
CN204291722U (en) A kind of heat abstractor
CN103000595A (en) Multidirectional access phase change heat transfer device and manufacturing method thereof
WO2009039774A1 (en) A manufacturing method of a heat transfer device without pouring tube
CN207019516U (en) Hot superconductive radiating plate
TWI288814B (en) Process of a heat pipe by aspirating and filling with a suction disk
CN208848885U (en) A kind of New IGBT module copper soleplate structure
TWI324541B (en)
TWI288815B (en) A heat pipe manufacturing process
JP3552553B2 (en) Planar heat pipe and method of manufacturing the same
CN209546220U (en) Ultra-thin heat-transfer device
CN209230377U (en) A kind of novel uniform heating plate structure
CN102581586B (en) Method for manufacturing and heat-radiation column
CN201378002Y (en) Phase-change heat transmission device without liquid injection pipe
CN103124490B (en) Hollow vapor chamber
CN208690240U (en) A kind of heat radiation combined device of big heat flow density chip
CN202941084U (en) Hollow-type uniform temperature plate
CN103579141B (en) A kind of composite radiating structure and application thereof
CN107068846A (en) A kind of LED phase-change heats substrate and preparation method thereof
CN202738367U (en) Heat dissipation apparatus
CN201904323U (en) Heat homogenizing plate
CN206619614U (en) A kind of LED phase-change heats substrate
CN101605445B (en) Heat transfer unit without liquid injection pipe and manufacture method thereof
CN204697453U (en) Uniform-temperature radiator
CN105188313A (en) Temperature equalizing plate with heat-conducting pipe

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08800901

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08800901

Country of ref document: EP

Kind code of ref document: A1