CN101394726A - Manufacturing method for heat transferring device without liquid injection tube - Google Patents

Manufacturing method for heat transferring device without liquid injection tube Download PDF

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Publication number
CN101394726A
CN101394726A CN 200710030341 CN200710030341A CN101394726A CN 101394726 A CN101394726 A CN 101394726A CN 200710030341 CN200710030341 CN 200710030341 CN 200710030341 A CN200710030341 A CN 200710030341A CN 101394726 A CN101394726 A CN 101394726A
Authority
CN
China
Prior art keywords
heat transfer
transfer unit
welding
htu
manufacture method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200710030341
Other languages
Chinese (zh)
Inventor
金积德
吕树申
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangmen Jiatai Electronics Co.,Ltd.
Original Assignee
CHANGSHU RUILEI ELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGSHU RUILEI ELECTRONIC TECHNOLOGY Co Ltd filed Critical CHANGSHU RUILEI ELECTRONIC TECHNOLOGY Co Ltd
Priority to CN 200710030341 priority Critical patent/CN101394726A/en
Priority to PCT/CN2008/072407 priority patent/WO2009039774A1/en
Publication of CN101394726A publication Critical patent/CN101394726A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/09—Heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention discloses a method of manufacturing a heat transfer unit without a liquid charge tube. The method comprises the following steps: (1) welding and sealing a heat transfer unit, and reserving a gap which is not welded at first; (2) charging a working medium liquid in the heat transfer unit through the gap by using a thin needle tube; (3) placing the heat transfer unit under the vacuum condition and quickly welding and sealing the reserved gap. The invention provides the heat transfer unit free of a liquid charge tube, thereby simplifying mass production process, and greatly improving the performance and reliability.

Description

A kind of manufacture method of not having the heat transfer unit (HTU) of liquid injection pipe
Technical field
The present invention relates to a kind of manufacture method of heat transfer unit (HTU).
Background technology
When electronic product moves towards high-orderization, lightening and multifunction gradually, make electronic building brick must under littler volume, possess strong functions more and higher radiating requirements to increase life-span, reliability and the stability thereof of electronic product.The cooling system of electronic chip is most important to the normal working temperature that keeps chip; When chip design, packaged after, its thermal reliability depends primarily on the heat dispersion of cooling system.Moreover at present the product used of LED is also very extensive, as the application of backlight, mobile phone key backlight and the mobile phone screen backlight of sound equipment panel in the 3C Product.Yet, because brightness along with the positive raising LED of all circles, cause the LED power consumption heat energy big and that distribute of each surging rapidly, thus use LED all to be subjected to the problem of " heat radiation " at present as the product of light emitting source, and further limit the development of LED application product size.Also become the major issue that need solve at present so how effectively to solve the LED heat dissipation problem.
In view of this, flat plate heat tube or temperature-uniforming plate (Vapor chamber) and loop heat pipe (Loop heat pipe) all are considered to the electronic radiation components and parts that very likely become main flow of future generation.Why be not widely used at present, except heat transfer device itself quantize processing procedure still have to be strengthened (thickness, evenness, internal structure, profile ...), also the difference because of customer demand has different package assembly requirements; Secondly, can effectively save manufacturing cost and also become another bottleneck, if add factors such as internal work fluid circulation circuit makes a circulation, then stability and the reliability for flat electronics heat transfer device and loop-type electronics heat transfer device more can increase many uncertain factors.
Existing heat transfer device is to adopt the worker quality liquid Transformation Principle to conduct heat mostly, as flat plate heat tube, loop heat pipe or samming heat transfer plate or the like.Flat apparatus of uniform heat transfer is an inner vacuum and the airtight container that contains liquid refrigerant.And loop heat pipe also is a kind of two-phase high-efficiency heat transfer device, the capillary force that it utilizes the capillary wick in the evaporator to produce drives the loop operation, utilize the evaporation and the condensation of working medium to transmit heat, therefore can under the situation of the little temperature difference, long distance, transmit a large amount of heats.
The manufacture method of existing heat transfer unit (HTU) is: at first must weld around it, follow steps such as boring, welded tube, vacuum fluid injection, tube sealing mouth, spot welding to finish again, or when upper and lower plates lid punch die, omit the boring step in advance with regard to reserving liquid injection hole, all the other are roughly the same.Utilize the heat transfer device of this manufacture method manufacturing generally can stay 0.5～3 centimeter not isometric liquid injection pipe, and often because the control on the processing procedure is difficult for, thereby cause the heat sinking benefit of samming or heat transfer unclear.
Summary of the invention
The objective of the invention is to overcome the deficiency that prior art exists, a kind of manufacture method of not having the heat transfer unit (HTU) of liquid injection pipe is provided.
To achieve these goals, the present invention adopts following technical scheme:
The manufacture method of the heat transfer unit (HTU) of no liquid injection pipe of the present invention comprises the steps
(1) welded seal heat transfer unit (HTU) stays slit, a place not weld earlier;
(2) in heat transfer unit (HTU), fill worker quality liquid by the slit with small needle tube;
(3) be placed under the vacuum condition slit that the rapid welding sealing is stayed.
In above-mentioned manufacture method, heat transfer unit (HTU) is meant the heat transfer unit (HTU) that utilizes the worker quality liquid Transformation Principle to conduct heat, and this manufacture method is applicable to the heat transfer unit (HTU) that all utilize the worker quality liquid phase-change heat transfer.
In above-mentioned manufacture method, described rapid welding is meant that employing can produce high-energy in the part, the equipment of moment welding, for example high-frequency argon arc welding or laser welding.This manufacture method can not adopt common welding method, and common welding can produce high temperature and cause the softening and oxidation of heat transfer unit (HTU) material, and influences worker quality liquid.
Compared with prior art, the present invention has following beneficial effect: manufacture method of the present invention provides the heat transfer unit (HTU) of no liquid injection pipe, can not only simplify the volume production processing procedure, has also improved performance and reliability greatly.
Embodiment
Embodiment 1
Be that three side welds around the heat transfer unit (HTU) connect sealing earlier with the meet sb. at the airport high-energy that provided of high-frequency argon arc-welding, pass through the filled worker quality liquid in slit on heat transfer unit (HTU) the 4th limit again with superfine needle tubing, carry out with the anchor clamps of high tightness afterwards and clamp action, be placed into vacuum welding chamber then with high-frequency argon arc welding sealing, checked at last.
Embodiment 2
Be that three side welds around the heat transfer unit (HTU) connect sealing earlier with the meet sb. at the airport high-energy that provided of high-frequency argon arc-welding, pass through the filled worker quality liquid in slit on heat transfer unit (HTU) the 4th limit again with superfine needle tubing, carry out with the anchor clamps of high tightness afterwards and clamp action, be placed into vacuum welding chamber then with laser welded seal, checked at last.

Claims (4)

1. a manufacture method of not having the heat transfer unit (HTU) of liquid injection pipe is characterized in that comprising the steps:
(1) welded seal heat transfer unit (HTU) stays slit, a place not weld earlier;
(2) in heat transfer unit (HTU), fill worker quality liquid by the slit with small needle tube;
(3) be placed under the vacuum condition slit that the rapid welding sealing is stayed.
2. manufacture method as claimed in claim 1 is characterized in that described heat transfer unit (HTU) is meant the heat transfer unit (HTU) that utilizes the worker quality liquid phase-change heat transfer.
3. manufacture method as claimed in claim 1 is characterized in that described rapid welding is to adopt the welding equipment that can produce the welding of high-energy and moment in the part.
4. manufacture method as claimed in claim 3 is characterized in that the described welding equipment that can produce the welding of high-energy and moment in the part is high-frequency argon arc welding or laser welding.
CN 200710030341 2007-09-20 2007-09-20 Manufacturing method for heat transferring device without liquid injection tube Pending CN101394726A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN 200710030341 CN101394726A (en) 2007-09-20 2007-09-20 Manufacturing method for heat transferring device without liquid injection tube
PCT/CN2008/072407 WO2009039774A1 (en) 2007-09-20 2008-09-18 A manufacturing method of a heat transfer device without pouring tube

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200710030341 CN101394726A (en) 2007-09-20 2007-09-20 Manufacturing method for heat transferring device without liquid injection tube

Publications (1)

Publication Number Publication Date
CN101394726A true CN101394726A (en) 2009-03-25

Family

ID=40494730

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200710030341 Pending CN101394726A (en) 2007-09-20 2007-09-20 Manufacturing method for heat transferring device without liquid injection tube

Country Status (2)

Country Link
CN (1) CN101394726A (en)
WO (1) WO2009039774A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102748967A (en) * 2012-07-19 2012-10-24 苏州聚力电机有限公司 Thinning heat conduction device with pipeless sealing structure and forming method of thinning heat conduction device
WO2013107026A1 (en) * 2012-01-19 2013-07-25 极致科技股份有限公司 Manufacturing method of temperature equalization device without liquid injection tube and temperature equalization device manufactured by the method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103217042A (en) * 2012-01-19 2013-07-24 极致科技股份有限公司 Method for manufacturing temperature equalizing device without liquid injection tube and temperature equalizing device manufactured by using method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06129788A (en) * 1992-10-06 1994-05-13 Ryukan Boku Manufacture of heat pipe
JPH08136173A (en) * 1994-11-07 1996-05-31 Nippon Sangyo Kikaku:Kk Method and apparatus for manufacturing heat pipe
TW200510088A (en) * 2003-09-09 2005-03-16 Ya No Chao Tao Technology Co Ltd Method of sealing heat pipe
CN1737484A (en) * 2004-08-19 2006-02-22 林项武 Heat pipe vacuum sealing method and apparatus thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013107026A1 (en) * 2012-01-19 2013-07-25 极致科技股份有限公司 Manufacturing method of temperature equalization device without liquid injection tube and temperature equalization device manufactured by the method
CN102748967A (en) * 2012-07-19 2012-10-24 苏州聚力电机有限公司 Thinning heat conduction device with pipeless sealing structure and forming method of thinning heat conduction device

Also Published As

Publication number Publication date
WO2009039774A1 (en) 2009-04-02

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Effective date of registration: 20090220

Address after: East Mongolia Industrial Park Wuniu town of Zhejiang County of Yongjia Province

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