CN208690240U - A kind of heat radiation combined device of big heat flow density chip - Google Patents
A kind of heat radiation combined device of big heat flow density chip Download PDFInfo
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- CN208690240U CN208690240U CN201820696976.0U CN201820696976U CN208690240U CN 208690240 U CN208690240 U CN 208690240U CN 201820696976 U CN201820696976 U CN 201820696976U CN 208690240 U CN208690240 U CN 208690240U
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Abstract
The utility model provides a kind of heat radiation combined device of big heat flow density chip, promptly expands to a biggish plane using the heat that soaking plate generates chip this heat point source, soaking plate is then carried out radiating and cooling by liquid cold plate；Including liquid cold plate and soaking plate, the soaking plate is bonded with the liquid cold plate；The soaking plate includes evaporation plate and cold plate, the evaporation plate and cold plate are tightly connected and form vacuum chamber therebetween, it is disposed with the oven wire mesh blanket being bonded to each other and metal foam layers from the evaporation plate to cold plate in the vacuum chamber, and is filled with liquid working substance in the vacuum chamber.Soaking plate and liquid cold plate are applied in combination, suitable for the chip cooling of big heat flow density, heat point source can be promptly extended to plane heat source, be effectively reduced surface temperature when chip operation, its reliability is improved, to solve the problems, such as chip small size, the heat dissipation difficulty of big calorific value.
Description
Technical field
The utility model relates to the cooling devices of chip cooling, and in particular to a kind of heat radiation combination of big heat flow density chip
Device.
Background technique
As circuit integration degree is higher and higher, the density and body of the high frequency of electronic device, high speed and integrated circuit
Product tends to microminiaturization and the electronic component calorific value of unit volume and the energy consumption of one single chip is increased, and the heat flow density of chip is high
Up to 200W/cm2The design of facility compact structure is so that heat dissipation is more difficult, hence it is imperative that it is difficult to solve high efficiency and heat radiation technology
Topic.
Widely used radiating mode now: it is cooperated, chip is carried out scattered using heat exchange of heat pipe and fan
Heat, the device only can solve heat flow density 100W/cm2Heat dissipation problem below.
Summary of the invention
To solve the problems, such as chip small size, big calorific value, the utility model provides a kind of dissipating for big heat flow density chip
Heat combination unit promptly expands to a biggish plane using the heat that soaking plate generates chip this heat point source, so
Soaking plate is carried out by radiating and cooling by liquid cold plate afterwards.
A kind of heat radiation combined device of big heat flow density chip, it is characterised in that: described including liquid cold plate and soaking plate
Soaking plate is bonded with the liquid cold plate.
Further are as follows: the soaking plate includes evaporation plate and cold plate, the evaporation plate and cold plate be tightly connected and
Vacuum chamber is formed between the two, is disposed with the metal being bonded to each other from the evaporation plate to cold plate in the vacuum chamber
Silk screen layer and metal foam layers, and it is filled with liquid working substance in the vacuum chamber.
Further are as follows: be equipped with several reinforcing props in the vacuum chamber, the reinforcing prop runs through the oven wire mesh blanket
And metal foam layers, the both ends end face of the reinforcing prop is fixed with the inner wall of the inner wall of the evaporation plate and cold plate respectively to be connected
It connects.
Further are as follows: described reinforcing prop one end end be small styletable, other end end be big styletable, the small styletable it is straight
Diameter is less than the diameter of the big styletable；The small styletable connection integrated with the cold plate, the big styletable and the evaporation
Plate integration connection.
Further are as follows: filling liquid pipe is equipped in the soaking plate, the filling liquid pipe is communicated with the vacuum chamber.
Further are as follows: the liquid cold plate includes upper plate, lower plate and fin, the fin be located at the upper plate and lower plate it
Between in the heat exchange chamber that is formed, the two sides of the fin are bonded with the upper plate and lower plate respectively, on the liquid cold plate
Equipped with the equal cold plate inlet and cold plate liquid outlet communicated with the heat exchange chamber.
Further are as follows: the evaporation plate is all made of aluminium alloy with cold plate and is made, and the metal foam layers use copper foam
It is made, the oven wire mesh blanket is made of stainless steel cloth.
The utility model has the beneficial effects that soaking plate and liquid cold plate are applied in combination, the core suitable for big heat flow density
Piece heat dissipation, can promptly be extended to plane heat source for heat point source, be effectively reduced surface temperature when chip operation, improving it can
By property, to solve the problems, such as chip small size, the heat dissipation difficulty of big calorific value.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the structural exploded view of soaking plate in the utility model；
Fig. 3 is the cross-sectional view of the utility model when in use.
In figure, 1, soaking plate；11, evaporation plate；12, cold plate；13, filling liquid pipe；14, oven wire mesh blanket；15, metal foam
Layer；16, reinforcing prop；2, liquid cold plate；21, cold plate inlet；22, cold plate liquid outlet；23, upper plate；24, fin；25, lower plate；
3, chip；4, chip supporting table.
Specific embodiment
It elaborates with reference to the accompanying drawing to the utility model.
As shown in Figure 1, a kind of heat radiation combined device of big heat flow density chip, including liquid cold plate 2 and soaking plate 1, institute
Soaking plate 1 is stated to be bonded with the liquid cold plate 2；
Wherein, as shown in Fig. 2, the soaking plate 1 includes evaporation plate 11 and cold plate 12, the evaporation plate 11 and cold plate
12 are tightly connected and form vacuum chamber therebetween, successively set from the evaporation plate 11 to cold plate 12 in the vacuum chamber
The oven wire mesh blanket 14 being bonded to each other and metal foam layers 15 are equipped with, and are filled with liquid working substance in the vacuum chamber；Institute
It states and is equipped with several reinforcing props 16 in vacuum chamber, the reinforcing prop 16 runs through the oven wire mesh blanket 14 and metal foam layers 15,
The both ends end face of the reinforcing prop 16 is fixedly connected with the inner wall of the inner wall of the evaporation plate 11 and cold plate 12 respectively；It is described to add
Strong 16 one end end of column is small styletable, and other end end is big styletable, and the diameter of the small styletable is less than the straight of the big styletable
Diameter；Small styletable connection integrated with the cold plate 12, big styletable connection integrated with the evaporation plate 11；Institute
Soaking plate 1 is stated equipped with filling liquid pipe 13, the filling liquid pipe 13 is communicated with the vacuum chamber.
As shown in figure 3, the liquid cold plate 2 includes upper plate 23, lower plate 25 and fin 24, the fin 24 is located on described
In the heat exchange chamber formed between plate 23 and lower plate 25, the two sides of the fin 24 are pasted with the upper plate 23 and lower plate 25 respectively
It closes, the cold plate inlet 21 and cold plate liquid outlet 22 communicated with the heat exchange chamber is equipped on the liquid cold plate 2.
In addition, the evaporation plate 11 is all made of aluminium alloy with cold plate 12 and is made, the metal foam layers 15 are steeped using copper
Foam is made, and the oven wire mesh blanket 14 is made of stainless steel cloth.
Specifically, evaporation plate 11 is welded on cold plate 12 by high-frequency pressure diffusion welding (DW) or vacuum brazing in soaking plate 1
Together, vacuum chamber has had the cylinder cylinder i.e. reinforcing prop 16, Neng Gouyou for reinforcing evaporation plate 11 and 12 connection function of cold plate
Effect improves the bond strength of product, improves product reliability, after the completion of Product jointing, welds filling liquid pipe 13, first to vacuum chamber into
Row vacuumizes, and liquid working substance is then injected vacuum chamber, is finally sealed to filling liquid pipe 13.Metal foam in vacuum chamber
Foam layer 15 and oven wire mesh blanket 14 are used as capillary structure, provide power for the flowing of liquid working substance.
Liquid cold plate 2 is made of upper plate 23, lower plate 25, fin 24 etc., liquid cold plate 2 can be used high-frequency pressure diffusion welding (DW),
Any one mode in vacuum brazing, nitrogen protection weldering and agitating friction weldering is welded, upper plate 23 and fin 24, lower plate 25
It needs to be laid with solder foil between fin 24, clamping is carried out to product by fixture, is compressed, is then welded into furnace.
Evaporation plate 11 in soaking plate 1, cold plate 12, filling liquid pipe 13 material be all made of aluminium alloy, metal foam layers 15
Material is copper foam, and copper foam is formed by sintering furnace by powder sintered, and metal foam layers 15 are 200 ~ 800 mesh, specially without
Oxygen copper, with a thickness of 0.5 ~ 3mm.Oven wire mesh blanket 14 is worked out by the way that multilayer stainless steel cloth is compound, and oven wire mesh blanket is 20 ~
80 mesh, 1 ~ 5mm of thickness.Liquid working substance can make acetone, pure water, ammonia etc., specially acetone, and charging amount is the 50% of cavity volume,
Vacuum level requirements are 10-3Pa or less.
Upper plate 23, lower plate 25,24 material of fin are aluminium alloy in liquid cold plate 2, and heat-exchange working medium uses ethylene glycol water
Solution, heat-exchange working medium are flowed in heat exchange chamber by cold plate inlet 21 and cold plate liquid outlet 22.
Working principle of the utility model is: the heat that chip 3 generates is imported inside soaking plate 1 by evaporation plate 11, metal
The heated upward, surrounding that gasifies of evaporating of liquid working substance in froth bed 15 flows, and into oven wire mesh blanket 14, steam is conducted to cold
Solidifying plate 12, then heat enters liquid cold plate inner fins 24 by the upper plate 23 of liquid cold plate 2, and 24 temperature of fin increases, makes
24 surrounding heat-exchange working medium temperature of fin increases, and transports heat-exchange working medium by dynamical system, achievees the purpose that heat dissipation.Make soaking in this way
Vapor (steam) temperature reduces liquefaction in the oven wire mesh blanket 14 of plate 1, then by the hair inside metal foam layers 15 and oven wire mesh blanket 14
Thin power is transported to evaporation plate 11, and a heat dissipation circulation is consequently formed.Wherein, the mesh number of metal foam layers 15 is more, metallic particles
Diameter is small, and material capillary radius is small, and capillary force is larger；14 mesh number of oven wire mesh blanket is fewer than metal foam, and string diameter is larger, capillary force
It is smaller.
The usage mode of the utility model, as shown in figure 3, chip supporting table 4 and chip 3, chip 3 and soaking plate 1, soaking
It is fitted closely by heat-conducting silicone grease between plate 1 and liquid cold plate 2, after the heat that chip 3 generates expands to soaking plate 1, by soaking
Plate 1 imports heat in liquid cold plate 2, and then, heat-exchange working medium is flowed by dynamical system, and heat is taken away.The dress
Tiltable installation, right angle setting etc. during the work time are set, the influence to gravity and acceleration has certain adaptability.
The utility model is suitable for heat dissipation of electronic chip, including CPU, GPU, LED, high energy high-frequency electronic chip etc., can use
In multiple fields such as aerospace, medical instruments.
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above.Current row
The technical staff of industry is described in above embodiments and description it should be appreciated that the present utility model is not limited to the above embodiments
Only illustrate the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model is also
It will have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.The utility model
Claimed range is defined by the appending claims and its equivalent thereof.
Claims (6)
1. a kind of heat radiation combined device of big heat flow density chip, it is characterised in that: described equal including liquid cold plate and soaking plate
Hot plate is bonded with the liquid cold plate, and the soaking plate includes evaporation plate and cold plate, and the evaporation plate and cold plate sealing connect
It connects and forms vacuum chamber therebetween, be disposed be bonded to each other to cold plate from the evaporation plate in the vacuum chamber
Oven wire mesh blanket and metal foam layers, and in the vacuum chamber be filled with liquid working substance.
2. a kind of heat radiation combined device of big heat flow density chip according to claim 1, it is characterised in that: described true
Several reinforcing props are equipped in cavity, the reinforcing prop runs through the oven wire mesh blanket and metal foam layers, the reinforcing prop
Both ends end face is fixedly connected with the inner wall of the inner wall of the evaporation plate and cold plate respectively.
3. a kind of heat radiation combined device of big heat flow density chip according to claim 2, it is characterised in that: the reinforcement
Column one end end is small styletable, and other end end is big styletable, and the diameter of the small styletable is less than the diameter of the big styletable；Institute
State the connection integrated with the cold plate of small styletable, the big styletable connection integrated with the evaporation plate.
4. a kind of heat radiation combined device of big heat flow density chip according to claim 3, it is characterised in that: described equal
Hot plate is equipped with filling liquid pipe, and the filling liquid pipe is communicated with the vacuum chamber.
5. according to claim 1 to a kind of heat radiation combined device of big heat flow density chip described in any claim in 4,
Be characterized in that: the evaporation plate is all made of aluminium alloy with cold plate and is made, and the metal foam layers are made of copper foam, described
Oven wire mesh blanket is made of stainless steel cloth.
6. a kind of heat radiation combined device of big heat flow density chip according to claim 5, it is characterised in that: the liquid cooling
Cold plate includes upper plate, lower plate and fin, in the heat exchange chamber that the fin is formed between the upper plate and lower plate, the wing
The two sides of piece are bonded with the upper plate and lower plate respectively, are equipped on the liquid cold plate and are communicated with the heat exchange chamber
Cold plate inlet and cold plate liquid outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820696976.0U CN208690240U (en) | 2018-05-11 | 2018-05-11 | A kind of heat radiation combined device of big heat flow density chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820696976.0U CN208690240U (en) | 2018-05-11 | 2018-05-11 | A kind of heat radiation combined device of big heat flow density chip |
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| CN208690240U true CN208690240U (en) | 2019-04-02 |
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| CN201820696976.0U Active CN208690240U (en) | 2018-05-11 | 2018-05-11 | A kind of heat radiation combined device of big heat flow density chip |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110986651A (en) * | 2019-12-10 | 2020-04-10 | 常州大学 | Finned tube heat exchanger with heat exchange cavity in fin |
| CN112129150A (en) * | 2020-10-03 | 2020-12-25 | 追信数字科技有限公司 | Aluminum alloy heat pipe heat dissipation mobile phone back shell and manufacturing method thereof |
-
2018
- 2018-05-11 CN CN201820696976.0U patent/CN208690240U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110986651A (en) * | 2019-12-10 | 2020-04-10 | 常州大学 | Finned tube heat exchanger with heat exchange cavity in fin |
| CN110986651B (en) * | 2019-12-10 | 2021-11-02 | 常州大学 | Finned tube heat exchanger with heat exchange cavity in fin |
| CN112129150A (en) * | 2020-10-03 | 2020-12-25 | 追信数字科技有限公司 | Aluminum alloy heat pipe heat dissipation mobile phone back shell and manufacturing method thereof |
| CN112129150B (en) * | 2020-10-03 | 2021-11-02 | 追信数字科技有限公司 | Aluminum alloy heat pipe heat dissipation mobile phone back shell and manufacturing method thereof |
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