CN110260697A - A kind of aluminium base soaking plate - Google Patents
A kind of aluminium base soaking plate Download PDFInfo
- Publication number
- CN110260697A CN110260697A CN201910657438.XA CN201910657438A CN110260697A CN 110260697 A CN110260697 A CN 110260697A CN 201910657438 A CN201910657438 A CN 201910657438A CN 110260697 A CN110260697 A CN 110260697A
- Authority
- CN
- China
- Prior art keywords
- plate body
- aluminium base
- plate
- airtight cavity
- base soaking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 54
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 239000004411 aluminium Substances 0.000 title claims abstract description 52
- 238000002791 soaking Methods 0.000 title claims abstract description 50
- 239000000463 material Substances 0.000 claims abstract description 15
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims abstract description 8
- 239000013618 particulate matter Substances 0.000 claims description 37
- 239000010410 layer Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000000945 filler Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 239000011797 cavity material Substances 0.000 description 33
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910000632 Alusil Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000005098 hot rolling Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- -1 Copper-Aluminum compound Chemical class 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to aluminium base soaking plate fields, specifically disclose a kind of aluminium base soaking plate, including the first plate body and the second plate body being bonded to each other, airtight cavity is provided between first plate body and second plate body, phase-change working substance is provided in the airtight cavity, the material of first plate body and the second plate body uses aluminium or aluminium alloy, it further include heat-conducting layer, the heat-conducting layer is arranged at the side on first plate body and/or second plate body far from the airtight cavity, the thermal coefficient of the heat-conducting layer is greater than the thermal coefficient of first plate body and second plate body, aluminium base soaking plate provided by the invention uses aluminium, reduce material and processing cost simultaneously, reduce the weight of aluminium base soaking plate, make its more lightweight, the side of aluminium base soaking plate is provided with the higher heat-conducting layer of thermal coefficient on in-plane, energy Enough significantly improve the heat transfer efficiency and heat dissipation performance of aluminium base soaking plate.
Description
Technical field
The present invention relates to aluminium base soaking plate technical field more particularly to a kind of aluminium base soaking plates.
Background technique
Soaking plate is the plank frame being combined by two pieces of substrates, and has hollow closed chamber between two pieces of substrates
Body.Airtight cavity is in negative pressure state, is filled with phase-change working substance in cavity, also there are portion cavities.Soaking plate is flat on one side
Face, and be bonded with pyrotoxin, another side can be equipped with radiating fin.Pyrotoxin transfers heat to soaking plate, in vacuum cavity
Liquid refrigerant be heated under subnormal ambient after rapid evaporation be steam, and rapidly diffuse into entire vacuum cavity, by equal
It is condensed after the radiating fin heat dissipation on the surface or surface of hot plate, the fluid of condensed liquid passes through gravity again or capillary structure returns
Bottom cycle is flowed to, to reach temperature uniforming heat radiation effect.The material of existing soaking plate uses copper, and there are material and processing cost are high
And the disadvantage that weight is big.
Summary of the invention
The purpose of the present invention is to solve the material of soaking plate made of copper existing in the prior art and processing cost are high
And the disadvantage that weight is big, and a kind of aluminium base soaking plate proposed.
To achieve the goals above, present invention employs following technical solutions:
A kind of aluminium base soaking plate, including the first plate body and the second plate body being bonded to each other, first plate body and described the
It is provided with airtight cavity between two plate bodys, phase-change working substance, first plate body and the second plate body are provided in the airtight cavity
Material use aluminium or aluminium alloy.
It preferably, further include heat-conducting layer, the heat-conducting layer is arranged on first plate body and/or second plate body remote
Side from the airtight cavity, the heat-conducting layer are greater than first plate body, the second plate body in the thermal coefficient of in-plane
In the thermal coefficient of in-plane.
Preferably, the material of the heat-conducting layer is one of copper, silver, lamellar graphite, graphene or multiple combinations.
Preferably, first plate body, the second plate body with a thickness of 0.5-2.5 millimeters, the heat-conducting layer with a thickness of
0.02-0.25 millimeters.
Preferably, articulamentum is provided between first plate body and second plate body, the fusing point of the articulamentum is low
In first plate body or the fusing point of the second plate body, first plate body and second plate body are fixed by soldering, the pricker
It welds temperature and is higher than the fusing point of the articulamentum and lower than first plate body, the fusing point of the second plate body.
Preferably, capillary structure is provided in the airtight cavity, the capillary structure is to be arranged in the airtight cavity
Inner wall filler, the filler be particulate matter and/or metal mesh.
Preferably, the filler is particulate matter and metal mesh, metal mesh setting the particulate matter with it is described close
Between the inner wall of closed chamber body, the mesh aperture of the metal mesh is 100-200 mesh, and the partial size of the particulate matter is 50-100 mesh.
Preferably, capillary structure is provided in the airtight cavity, the capillary structure is to be arranged in the airtight cavity
Inner wall filler, the filler includes the first particulate matter and the second particulate matter, and the fusing point of first particulate matter is higher than
The fusing point of brazing temperature, second particulate matter is lower than brazing temperature.
Preferably, capillary structure is provided in the airtight cavity, the capillary structure is microflute, and the microflute includes setting
It sets in the first groove on first plate body and/or the second groove being arranged on second plate body, first groove
Have multiple, and is arranged in parallel in the side that first plate body is located at the airtight cavity, second groove has multiple and flat
The side that second plate body is located at the airtight cavity is arranged in row.
Preferably, the length direction of the length direction of first groove and second groove has angle, and described
The range of angle is at 30-90 °.
The beneficial effects of the present invention are:
Aluminium base soaking plate provided by the invention uses aluminium, reduces material and processing cost simultaneously, reduces aluminium base soaking
The weight of plate makes its more lightweight.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one of embodiment one aluminium base soaking plate;
Fig. 2 is the structural schematic diagram of one of embodiment two aluminium base soaking plate;
Fig. 3 is the structural schematic diagram of one of embodiment three aluminium base soaking plate;
Fig. 4 is the bottom view of the first plate body in embodiment three;
Fig. 5 is the top view of the second plate body in embodiment three;
Fig. 6 is the structural schematic diagram of one of example IV aluminium base soaking plate.
In figure: 1 first plate body, 2 second plate bodys, 3 heat-conducting layers, 4 airtight cavities, 5 capillary structures, 6 articulamentums, 7 first recessed
Slot, 8 second grooves, 9 metal meshes.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give better embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure
Add thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term used herein is intended merely to the mesh of description specific embodiment
, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more relevant listed items
Any and all combinations.
Embodiment one:
Please refer to Fig. 1, a kind of aluminium base soaking plate, including the first plate body 1 and the second plate body 2 being bonded to each other, described first
It is provided with airtight cavity 4 between plate body 1 and second plate body 2, is provided with phase-change working substance in the airtight cavity 4, described
The material of one plate body 1 and the second plate body 2 uses aluminium or aluminium alloy.
The aluminium base soaking plate further includes heat-conducting layer 3, and the heat-conducting layer 3 is arranged at first plate body 1 and/or institute
The thermal coefficient that heat-conducting layer 3 described in the side on the second plate body 2 far from the airtight cavity 4 is stated in in-plane is greater than described the
One plate body 1, second plate body 2 in-plane thermal coefficient.
Layers of copper specifically can be used in the heat-conducting layer 3, and the layers of copper can constitute copper-aluminum composite board with second plate body 2,
The copper-aluminum composite board can be complex as a whole by cold rolling, hot rolling or the quick-fried modes such as composite algorithm, or explosion rolling of shining.Institute
The clad ratio of layers of copper is stated, i.e., the ratio between the described layers of copper and the copper-aluminum composite board are 3-30%.Specifically, to the Copper-Aluminum compound
Plate is stamped and formed out groove, and after the Copper-Aluminum compound layer and the first plate body 1 are fixed, the groove and first plate body 1 are constituted
The airtight cavity 4.Finally airtight cavity 4 is vacuumized, fills formation aluminium base soaking plate after phase-change working substance and sealing.
It is to be appreciated that heat-conducting layer 3 can also be using above-mentioned one or more combinations such as silver, lamellar graphite, graphenes
Material.
The side on the second plate body 2 far from the airtight cavity 4, the second plate body 2 and hair can be set in the heat-conducting layer 3
Heat source connects, and can be connected with radiating fin on the first plate body 1.The heat-conducting layer with a thickness of 0.02-0.25 millimeters, the first plate body
The thickness of 1 perhaps the second plate body 2 only has 0.5~2 millimeter and the length of the plane of the first plate body 1 or the second plate body 2 is generally up to
More than to tens to several hundred millimeters, therefore the first plate body 1 or the second plate body 2 are much smaller than its plane in the thermal resistance of its short transverse
The thermal resistance in direction.Layers of copper and pyrotoxin mount, so that the in-plane between aluminium base soaking plate and pyrotoxin is thermally conductive using layers of copper,
Thermal coefficient is higher, prepared by aluminium base soaking plate thickness very little, the influence to heat transfer efficiency, heat dissipation performance can ignore not
Meter, and then the heat transfer efficiency between pyrotoxin and aluminium base soaking plate is improved, and then improve the heat dissipation performance of aluminium base soaking plate,
Compensate for the bad disadvantage of aluminum heat dissipation effect.While reducing the material and processing cost of aluminium base soaking plate using aluminium,
The weight for reducing aluminium base soaking plate makes its more lightweight.
It is to be appreciated that the side on the first plate body 1 far from the airtight cavity 4 can also be arranged in the heat-conducting layer 3,
Second plate body 2 is connect with pyrotoxin, and thermal component (for example, radiating fin) can be connected on the first plate body 1.Similarly, described thermally conductive
Layer 3 can be improved the heat transfer efficiency between aluminium base soaking plate and radiating fin, and then improve the heat dissipation performance of aluminium base soaking plate.
It is worth noting that, being additionally provided with capillary structure 5 in the airtight cavity 4.Specifically, capillary structure 5 is filling
Object, the filler are particulate matter, and particulate matter can be metal particulate and/or inorganic particulate matter.
In the manufacturing process of aluminium base soaking plate, it is provided with articulamentum 6 between first plate body 1 and the second plate body 2, is led
Thermosphere 3 is arranged on first plate body 1 and/or the second plate body 2, by filler put into the first plate body 1 and the second plate body 2 it
Between, and after the first plate body 1 is bonded with the second plate body 2 assembly, it is sent into heating soldering in furnace.The temperature of soldering is in articulamentum 6
Fusing point and the first plate body 1, the second plate body 2 fusing point between, the fusing of articulamentum 6 condense again after by the first plate body 1 and the second plate
While body 2 is fixed, filler, which is fixed in airtight cavity 4, forms capillary structure 5.Then by vacuumizing, filling and mutually exchange work
Aluminium base soaking plate is formed after matter and sealing.
Specifically, the material of first plate body 1 and second plate body 2 is aluminum or aluminum alloy, wherein aluminium alloy packet
Include but be not limited to one of 3 line aluminium alloys, 6 line aluminium alloys, 7 line aluminium alloys or a variety of, it is preferred to use 3003,3A11,6061,
6951,7072.The material of the articulamentum 6 be alusil alloy, it is preferred to use 4 be in alusil alloy 4004,4045,4047,
4343。
Embodiment two:
Referring to figure 2., the present embodiment and embodiment one the difference is that, the processing method of aluminium base soaking plate is different.
Specifically, the setting of heat-conducting layer 3 forms composite plate on first plate body 1 and/or the second plate body 2, in 1 He of the first plate body
It is provided with resistance between second plate body 2 and rolls agent, resistance, which is rolled, is provided with the filler in agent, wherein it can be graphite that agent is rolled in resistance.By institute
Plank frame is formed after stating the first plate body 1 and the progress hot rolling of the second plate body 2, filler and resistance are rolled agent and be all compacted.Then to upper
Plank frame inflation is stated, forms the seal cavity so that being printed on and hindering the part for rolling agent, the filler is attached to the sealing
The inner wall of cavity forms capillary structure 5.Finally by formation aluminium base soaking plate after vacuumizing, filling phase-change working substance and seal.
It is to be appreciated that can also by by with the cladding plate of 3 same material of heat-conducting layer and first plate body 1 and second
The plank frame with heat-conducting layer 3 is made in hot rolling to plate body 2 together.According still further to aforesaid way by inflation, vacuumize, fill
Aluminium base soaking plate is formed after phase-change working substance and sealing.
Embodiment three:
Referring to figure 3. -5, the present embodiment and embodiment one the difference is that, the capillary structure 5 is microflute.
The microflute includes the first groove 7 being arranged on first plate body 1 and/or is arranged in second plate body 2
On the second groove 8.First groove 7 has multiple, and is arranged in parallel in the first plate body 1 is located at the airtight cavity 4 one
Side, second groove 8 have multiple, and are arranged in parallel in the side that the second plate body 2 is located at the airtight cavity 4.The microflute
For strip, the groove depth of microflute is 0.2-2 millimeters, and the width of microflute is 0.2-2 millimeters.The length direction of first groove 7 and
The length direction of two grooves 8 has an angle, and the range of the angle is at 30-90 °.In first plate body 1 and described
After two plate bodys 2 are fixed, reticular structure can be collectively formed in first groove 7 and second groove 8, so that aluminium base is equal
At work, the first groove 7 and the second groove 8 can generate capillarity to hot plate.
It is to be appreciated that the microflute in the present embodiment is equally applicable to embodiment two.
Example IV:
Please refer to Fig. 6, the present embodiment and embodiment one the difference is that, the capillary structure further includes metal mesh 9.
Specifically, being first laid with metal mesh 9 in the groove, then the particulate matter is arranged on the metal mesh 9, the metal
The mesh aperture of net 9 is less than the partial size of the particulate matter.Specifically, the mesh aperture of metal mesh 9 is in 100-200 mesh, particulate matter
Partial size in 50-100 mesh.Since the mesh aperture of the metal mesh 9 is less than the partial size of particulate matter, particulate matter is covered on gold
Belong to top and the surrounding of net.It can not be fitted closely completely between metal mesh 9 and the inner wall of airtight cavity 4, there is certain seam
Gap, so that the particulate matter of 9 top of metal mesh forms capillary structure 5 after oversintering.Therefore, in the present embodiment, sintered
Grain object, metal mesh 9, groove inner wall collectively form capillary structure 5, the capillary structure be different from existing sintering capillary structure
Layer, existing sinter layer, and seamed gap layer, are more conducive to the reflux of condensate liquid.
Embodiment five:
The present embodiment and embodiment one the difference is that, capillary structure 5 is filler, and filler includes first
Grain object and the second particulate matter, the fusing point of first particulate matter are higher than brazing temperature, and the fusing point of second particulate matter is lower than pricker
Weld temperature.Specifically, the first particulate matter is or mixtures thereof copper powder, aluminium oxide, silica, the partial size of first particulate matter
For 25-100 mesh, fusing point is higher than 800 DEG C.Second particulate matter is alusil alloy particle, wherein silicone content 3-10%, second
The partial size of particulate matter is 100-200 mesh, and fusing point is 580-620 DEG C, the volume of first particulate matter and second particulate matter
Than for 3:1-10:1.In the present embodiment, compared with the low melting point of small particle the second particulate matter and greater particle size dystectic first
Particulate matter mixing, after brazed, the second particulate matter is connected between the first particulate matter and the inner wall of airtight cavity, and forms capillary
Structure.Particularly, capillary structure 5 formed in the present embodiment, far from airtight cavity 4 inner wall at surface layer voidage compared with
Greatly, the bottom voidage and at the inner wall of airtight cavity 4 is smaller, has better capillary wick ability.
Existing copper soaking plate, using copper powder sintering process, the voidage of sinter layer is in 30-50%;And in the present embodiment
Sinter layer, the voidage of bottom is in 20-40%, and the voidage on surface layer, in 30-70%, this capillary structure is more conducive to
The reflux of condensate liquid.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (10)
1. a kind of aluminium base soaking plate, which is characterized in that including the first plate body and the second plate body being bonded to each other, first plate body
Be provided with airtight cavity between second plate body, be provided with phase-change working substance in the airtight cavity, first plate body and
The material of second plate body uses aluminium or aluminium alloy.
2. a kind of aluminium base soaking plate according to claim 1, which is characterized in that further include heat-conducting layer, the heat-conducting layer is set
The side on first plate body and/or second plate body far from the airtight cavity is set, the heat-conducting layer is in plane side
To thermal coefficient be greater than first plate body, the second plate body in-plane thermal coefficient.
3. a kind of aluminium base soaking plate according to claim 2, which is characterized in that the material of the heat-conducting layer is copper, silver, layer
One of shape graphite, graphene or multiple combinations.
4. a kind of aluminium base soaking plate according to claim 2, which is characterized in that the thickness of first plate body, the second plate body
Degree be 0.5-2.5 millimeters, the heat-conducting layer with a thickness of 0.02-0.25 millimeters.
5. a kind of aluminium base soaking plate according to claim 1, which is characterized in that first plate body and second plate body
Between be provided with articulamentum, the fusing point of the articulamentum is lower than first plate body or the fusing point of the second plate body, first plate
Body and second plate body are fixed by soldering, and the brazing temperature is higher than the fusing point of the articulamentum and is lower than first plate
The fusing point of body, the second plate body.
6. a kind of aluminium base soaking plate according to any one of claims 1 to 5, which is characterized in that set in the airtight cavity
It is equipped with capillary structure, the capillary structure is the filler that the inner wall of the airtight cavity is arranged in, and the filler is particle
Object and/or metal mesh.
7. a kind of aluminium base soaking plate according to claim 6, which is characterized in that the filler is particulate matter and metal
Net, the metal mesh are arranged between the particulate matter and the inner wall of the airtight cavity, and the mesh aperture of the metal mesh is
100-200 mesh, the partial size of the particulate matter are 50-100 mesh.
8. a kind of aluminium base soaking plate according to claim 5, which is characterized in that be provided with capillary knot in the airtight cavity
Structure, the capillary structure are the filler that the inner wall of the airtight cavity is arranged in, the filler include the first particulate matter and
Second particulate matter, the fusing point of first particulate matter are higher than brazing temperature, and the fusing point of second particulate matter is lower than brazing temperature.
9. a kind of aluminium base soaking plate according to any one of claims 1 to 5, which is characterized in that set in the airtight cavity
Be equipped with capillary structure, the capillary structure is microflute, the microflute include the first groove being arranged on first plate body and/
Or the second groove on second plate body is set, first groove has multiple, and is arranged in parallel in first plate body
Positioned at the side of the airtight cavity, second groove have it is multiple, and be arranged in parallel in second plate body be located at it is described close
The side of closed chamber body.
10. a kind of aluminium base soaking plate according to claim 9, which is characterized in that the length direction of first groove with
The length direction of second groove has angle, and the range of the angle is at 30-90 °.
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CN201910657438.XA CN110260697B (en) | 2019-07-19 | 2019-07-19 | Aluminum-based soaking plate |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110966882A (en) * | 2019-12-17 | 2020-04-07 | 广州视源电子科技股份有限公司 | Temperature-uniforming plate, preparation method of temperature-uniforming plate and electronic equipment |
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Address after: 213176 No.20, Jiandong Road, Lijia Town, Wujin District, Changzhou City, Jiangsu Province Patentee after: Changzhou Hengchuang Thermal Management System Co.,Ltd. Country or region after: China Address before: 213000 No.20, Jiandong Road, Lijia Town, Wujin District, Changzhou City, Jiangsu Province Patentee before: CHANGZHOU HENGCHUANG HEAT MANAGEMENT Co.,Ltd. Country or region before: China |