CN117500244A - Heat transfer structure for strengthening activation of porous capillary structure, radiator and server - Google Patents
Heat transfer structure for strengthening activation of porous capillary structure, radiator and server Download PDFInfo
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- CN117500244A CN117500244A CN202311594609.1A CN202311594609A CN117500244A CN 117500244 A CN117500244 A CN 117500244A CN 202311594609 A CN202311594609 A CN 202311594609A CN 117500244 A CN117500244 A CN 117500244A
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- 238000012546 transfer Methods 0.000 title claims abstract description 81
- 230000004913 activation Effects 0.000 title claims description 13
- 238000005728 strengthening Methods 0.000 title abstract description 7
- 230000017525 heat dissipation Effects 0.000 claims abstract description 39
- 239000007788 liquid Substances 0.000 claims description 11
- 230000005855 radiation Effects 0.000 claims description 9
- 238000004891 communication Methods 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 4
- 238000002791 soaking Methods 0.000 abstract description 12
- 230000003213 activating effect Effects 0.000 abstract description 5
- 239000012071 phase Substances 0.000 description 86
- 239000007791 liquid phase Substances 0.000 description 22
- 230000007704 transition Effects 0.000 description 12
- 230000009466 transformation Effects 0.000 description 9
- 238000013461 design Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application relates to a heat transfer structure for strengthening and activating a porous capillary structure, a radiator and a server, wherein the heat transfer structure comprises a heat conduction shell, and a vacuum accommodating cavity is formed in the heat conduction shell; the main phase change heat conduction structures are arranged in the vacuum accommodating cavity, the two main phase change heat conduction structures are positioned on two opposite large surfaces of the vacuum accommodating cavity, and one main phase change heat conduction structure is internally provided with a main phase change heat conduction working medium; and a heat transfer element disposed on an outer surface of the heat conductive housing, the heat transfer element configured to increase a path of heat transfer to the heat conductive housing away from the heat source. The heat dissipation efficiency of the soaking plate is improved.
Description
Technical Field
The present disclosure relates to the field of heat dissipation technologies, and in particular, to a heat transfer structure with a reinforced activated porous capillary structure, a heat sink, and a server.
Background
Nowadays, with the development of technology, electronic products have become indispensable for life, and the problem of heat dissipation is important to maintain the life and reliability of electronic products.
In the related art, as disclosed in CN219577673U, a soaking plate comprises a bottom shell 1, a cover plate 3, two capillary structure layers 5, a plurality of elastic supporting members 7 and condensate 9, wherein the cover plate 3 is covered on the bottom shell 1 to form a chamber 10, and the condensate 9 is located in the chamber 10. Two wicking layers 5 are located within the chamber 10 and are disposed on the inner surfaces of the bottom housing 1 and the cover plate 3, respectively. The plurality of elastic supporting members 7 are located in the chamber 10, the two capillary structure layers 5 are respectively provided with a plurality of through holes 51 corresponding to the plurality of elastic supporting members 7, and two ends of each elastic supporting member 7 respectively pass through the corresponding through holes 51 and respectively prop against the inner surfaces of the bottom shell 1 and the cover plate 3.
The working principle is as follows: the heat emitted by the heat generating device is transferred to the outer surface of the soaking plate (taking the outer surface of the cover plate 3 as an example) through direct contact with the soaking plate, and the capillary structure layer 5 positioned on the inner surface of the cover plate 3 transfers the heat to condensate 9 (such as water) in the cavity 10, so that the condensate 9 absorbs the heat and evaporates into gas, thereby taking away the heat. Because of the latent heat of the condensed gas (e.g. water vapor), the hot gas in the chamber 10 will move along the chamber 10 to the inner wall (the capillary layer 5 on the inner surface of the bottom plate 12) with a lower temperature, and will liquefy and release heat energy, and these condensed liquids 9 will dissipate heat through the capillary layer 5 on the inner surface of the bottom plate 12, and because the distance between the two capillary layers 5 will not be too large, there will be a certain capillary force between them, and after the heat dissipation of the condensed liquid 9 will return to the capillary layer 5 on the inner surface of the cover plate 3 through the capillary force, and will absorb heat again, and circulate in this way, so as to derive the heat emitted by the heat generating device.
For the related art, the surface area of the contact part of the vapor chamber and the heating device is significantly larger than that of the heating device, so that the heat generated by the heating device can cause the vapor chamber to generate liquid phase change, and most of the position of the whole vapor chamber cannot be covered, thus the defect of lower heat dissipation efficiency of the vapor chamber is caused.
Disclosure of Invention
In order to improve the heat dissipation efficiency of the vapor chamber, the application provides a heat transfer structure for strengthening and activating a porous capillary structure, a heat radiator and a server.
In a first aspect, the present application provides a heat transfer structure for strengthening and activating a porous capillary structure, which adopts the following technical scheme:
a heat transfer structure for enhanced activation of a porous capillary structure, comprising:
a heat conducting shell, the inside of which is provided with a vacuum accommodating cavity;
the main phase change heat conduction structures are arranged in the vacuum accommodating cavity, the two main phase change heat conduction structures are positioned on two large opposite surfaces of the vacuum accommodating cavity, and one main phase change heat conduction structure is internally provided with a main phase change heat conduction working medium;
and the heat transfer element is arranged on the outer surface of the heat conducting shell and used for increasing the path of heat transfer to the heat conducting shell away from the heat source.
By adopting the technical scheme, one part of heat emitted by the heat source is directly transferred from the heat dissipation contact area to the main phase change heat conduction structure closest to the heat source, so that the main phase change heat conduction working medium near the heat source is subjected to liquid phase change, and the other part of heat is firstly moved to the position on the heat conduction shell, which is far from the heat dissipation contact area, through the heat conduction shell and then transferred to the main phase change heat conduction structure at the position, so that the main phase change heat conduction working medium at the position far from the heat source can also be subjected to liquid phase change, and the soaking plate is subjected to liquid phase change in a larger range, so that the heat dissipation efficiency of the soaking plate can be improved.
Preferably, the heat conducting shell is used for being in contact with the heat source to form a heat dissipation contact area, one end of the heat transfer element is close to the heat dissipation area, the other end of the heat transfer element extends to be away from the heat dissipation contact area, and the plurality of heat transfer elements are arranged in a central symmetry mode with the heat dissipation contact area as a center.
Through adopting above-mentioned technical scheme, then the heat of the different positions of heat source along circumferencial direction can be transmitted and spread by different heat transfer element respectively, so can have more regions more far away from the heat source can take place liquid phase transition more rapidly under the cooperation of dual heat to can further increase the region that takes place liquid phase transition, and then can promote the radiating efficiency of vapor chamber.
Preferably, a heat transfer phase change heat conduction structure is arranged in the heat transfer element in vacuum, and a heat transfer phase change heat conduction working medium is arranged in the heat transfer phase change heat conduction structure.
Through adopting above-mentioned technical scheme, compare in the mode that adopts common metal to heat conduction, this kind of design mode, heat transfer phase transition heat conduction structure's heat conduction ability is better to can make the regional liquid phase transition that takes place more fast far away from the heat source, and then can promote the radiating efficiency of vapor chamber.
Preferably, the heat conducting shell comprises a bottom shell and a cover plate, the outer surface of the bottom shell is used for being abutted against an external heat source, and the cover plate is covered on the bottom shell to form the vacuum accommodating cavity.
Through adopting above-mentioned technical scheme, because other components such as main phase transition heat conduction structure can be loaded in the vacuum holding intracavity, so the heat conduction shell necessarily needs the component combination more than two to form, and selects the mode of drain pan and apron, just need seal processing can in the concatenation department between drain pan and apron after the follow-up equipment is accomplished to can, thereby can make the manufacturing of vapor chamber simpler.
Preferably, a plurality of support columns are arranged in the vacuum accommodating cavity, the support columns are uniformly arranged at intervals, and two end faces of the support columns are respectively abutted to two opposite inner walls of the vacuum accommodating cavity.
Through adopting above-mentioned technical scheme, because of the setting of support column for the vacuum holding chamber is under external pressure and high temperature's environment, can effectively avoid heat conduction shell to collapse or expand, thereby influences the radiating effect of vapor chamber, and the support column can also play the effect of refluence simultaneously, makes main phase change heat conduction working medium can be along the support column landing to the main phase change heat conduction structure that is close to heat source one end after the liquefaction in, is favorable to forming the heat dissipation circulation.
Preferably, the circumferential side wall of the support column is provided with a communicating phase-change heat conduction structure, and the two main phase-change heat conduction structures of the communicating phase-change heat conduction structure are communicated.
Through adopting above-mentioned technical scheme, because of the setting of intercommunication phase transition heat conduction structure, the main phase transition heat conduction structure of two big faces that the intercommunication phase transition heat conduction structure has linked together the vacuum holding chamber relatively relies on the effort that the main phase transition heat conduction working medium after the intercommunication phase transition heat conduction structure produced to the liquefaction, has further promoted the main phase transition heat conduction working medium after liquefaction landing to be close to in the main phase transition heat conduction structure of heat source one end, has promoted the heat dissipation cycle efficiency of vapor chamber.
Preferably, the main phase change heat conducting structure, the heat transfer phase change heat conducting structure and the communication phase change heat conducting structure all have porous structures, and the pore sizes of the main phase change heat conducting structure, the heat transfer phase change heat conducting structure and the communication phase change heat conducting structure are different.
Through adopting above-mentioned technical scheme, because main phase transformation heat conduction structure, heat transfer phase transformation heat conduction structure and intercommunication phase transformation heat conduction structure all have porous structure, more capillary duct has been formed, capillary duct produces the capillary effort to the main phase transformation heat conduction working medium after the liquefaction, further promote the flow of main phase transformation heat conduction working medium, because main phase transformation heat conduction structure and intercommunication phase transformation heat conduction structure hole are different, then the capillary duct can produce different capillary effort to the main phase transformation heat conduction working medium of different positions, the circulation efficiency of main phase transformation heat conduction working medium has been promoted.
Preferably, the heat conducting shell is further provided with a liquid reservoir, heat radiation fins and a flow guide pipe, the liquid reservoir is arranged on the heat conducting shell, one end of the flow guide pipe is communicated with the liquid reservoir, the other end of the flow guide pipe is communicated with the vacuum accommodating cavity, and the heat radiation fins are arranged on the surface of the flow guide pipe.
Through adopting above-mentioned technical scheme, because the heat radiation fin has good heat conductivity, this kind of design mode can be efficient with the heat dissipation of vacuum holding intracavity away to the radiating efficiency of vapor chamber has further been promoted.
In a second aspect, the present application provides a radiator, which adopts the following technical scheme:
a heat sink comprising a heat transfer structure that enhances activation of a porous capillary structure.
By adopting the technical scheme, the phase-change heat conduction structure in the radiator can be enhanced, and the heat dissipation capacity is improved.
In a third aspect, the present application provides a server, which adopts the following technical scheme:
a server includes a heat sink.
By adopting the technical scheme, the server has stronger heat radiation capability.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the heat generated by the heat source is partially directly transferred from the heat radiation contact area to the main phase change heat conduction structure closest to the heat source, so that the main phase change heat conduction working medium near the heat source is subjected to liquid phase change, and the other part of the heat source is firstly moved to a position on the heat conduction shell, which is far away from the heat radiation contact area, through the heat conduction shell and then transferred to the main phase change heat conduction structure at the position, so that the main phase change heat conduction working medium far away from the heat source can also be subjected to liquid phase change, and the soaking plate is further subjected to liquid phase change in a larger range, so that the heat radiation efficiency of the soaking plate can be improved;
2. compared with the mode of conducting heat by adopting common metals, the design mode has better heat conducting capacity of the heat transfer phase change heat conducting structure, so that the liquid phase change can be generated in a region far away from a heat source more quickly, and the heat dissipation efficiency of the vapor chamber can be improved.
Drawings
FIG. 1 is a schematic diagram of a heat transfer structure adapted for different heat sources in an embodiment of the present application.
Fig. 2 is a schematic cross-sectional view of the internal structure of the heat conductive housing in an embodiment of the present application.
Fig. 3 is a schematic view of the placement of support columns in a thermally conductive housing in an embodiment of the present application.
Reference numerals illustrate: 1. a thermally conductive housing; 11. a vacuum receiving chamber; 12. a bottom case; 13. a cover plate; 2. a main phase change heat conduction structure; 3. a heat transfer element; 4. a support column; 5. a phase change heat conduction structure is communicated; 6. a heat source.
Detailed Description
The present application is described in further detail below in conjunction with figures 1-3.
The embodiment of the application discloses a heat transfer structure for strengthening and activating a porous capillary structure. Referring to fig. 1 and 2, the heat transfer structure includes a heat conductive housing 1, a main phase change heat conductive structure 2 and a heat transfer element 3, the heat conductive housing 1 is a flat cuboid structure, a vacuum accommodating cavity 11 is provided inside the heat conductive housing 1, the main phase change heat conductive structure 2 is fixedly arranged in the vacuum accommodating cavity 11, the number of the main phase change heat conductive structures 2 is two, the two main phase change heat conductive structures 2 are located on two opposite large surfaces of the vacuum accommodating cavity 11, a main phase change heat conductive working medium is provided in one main phase change heat conductive structure 2, and deionized water can be selected as the main phase change heat conductive working medium.
Referring to fig. 1, the heat transfer elements 3 are fixedly disposed on the outer surface where the heat conductive housing 1 contacts the heat source 6, wherein the area where the heat conductive housing 1 contacts the heat source 6 is set as a heat dissipation contact area, the number of the heat transfer elements 3 is plural, the plurality of heat transfer elements 3 are distributed symmetrically around the heat dissipation contact area, specifically, if the heat source 6 is in a rectangular parallelepiped shape, the plurality of heat transfer elements 3 may be respectively distributed on four sides of the heat source 6, if the heat source 6 is in a cylindrical shape, the plurality of heat transfer elements 3 may be uniformly distributed around the centroid of the heat source 6, and in addition, the thermal resistance of the heat transfer elements 3 is smaller than the thermal resistance of the heat conductive housing 1, the material selection manner between the heat transfer elements 3 and the heat conductive housing 1 may be two, wherein the heat conductive housing 1 is made of stainless steel, the heat transfer elements 3 are made of copper, the heat conductive housing 1 is made of stainless copper, and the heat transfer elements 3 are made of silver, and other materials are of course, as long as the heat transfer capability of the heat transfer elements 3 is stronger than the heat conductive housing 1.
Referring to fig. 1 and 2, a part of heat emitted by the heat source 6 is directly transferred from the heat dissipation contact area to the main phase change heat conduction structure 2 closest to the heat source 6, so that the main phase change heat conduction working medium near the heat source 6 is subjected to liquid phase change, and the other part of heat is firstly moved to a position on the heat conduction shell 1 further away from the heat dissipation contact area through the heat conduction element 3 and then is transferred to the main phase change heat conduction structure 2 at the position through the heat conduction shell 1, so that the main phase change heat conduction working medium further away from the heat source 6 can also be subjected to liquid phase change, and the soaking plate is subjected to liquid phase change in a larger range, so that the heat dissipation efficiency of the soaking plate can be improved.
Referring to fig. 1, the core principle of the scheme is to increase the conduction path for transferring heat to a position far away from the heat dissipation contact area by means of the better heat conduction capability of the heat transfer element 3 than that of the heat conduction shell 1, so that before the heat source 6 is lowered to a predetermined temperature, the area where the liquid phase change of the vapor chamber can occur is larger, and the heat dissipation efficiency of the vapor chamber is improved, that is, the finally formed liquid phase change area is the liquid phase change area (the area indicated by the inner dotted line in the figure) directly generated by the original heat source 6 and the liquid phase change area (the area indicated by the outer dotted line in the figure) generated by expanding the heat transfer element 3.
In other embodiments, if the heat-conducting housing 1 is elongated, and the heat-dissipating contact area is located at one end of the heat-conducting housing 1 in the length direction, the heat-transferring element 3 may be disposed only at one end of the heat-conducting housing 1 in the length direction, so as to transfer heat to the other end.
In addition, in other embodiments, in order to further enhance the heat conducting capability of the heat transfer element 3 without considering the manufacturing cost, the heat transfer element 3 may be provided with a heat transfer phase change heat conducting structure in vacuum, and the heat transfer phase change heat conducting structure is provided with a heat transfer phase change heat conducting working medium, and the heat transfer phase change heat conducting working medium may also be deionized water, so that the principle of heat transfer of the heat transfer phase change heat conducting structure is the same as that of the main phase change heat conducting structure 2, so that the heat transferred by the heat source 6 can be received more quickly in the area far from the heat source 6, and therefore, the liquid phase change can occur more quickly in the position far from the heat source 6, and the heat dissipation efficiency of the vapor chamber is further improved.
Referring to fig. 1 and 2, in order to facilitate assembly of elements such as the main phase change heat conducting structure 2 inside the vacuum accommodating cavity 11, the heat conducting shell 1 is correspondingly provided with a bottom shell 12 and a cover plate 13, the outer surface of the bottom shell 12 is abutted against the heat source 6, the cover plate 13 is covered on one end of the bottom shell 12 far away from the heat source 6, a vacuum accommodating cavity 11 is formed between the bottom shell 12 and the cover plate 13, and after the assembly of the elements inside the vacuum accommodating cavity 11 is completed, only the joint of the bottom shell 12 and the cover plate 13 is required to be subjected to sealing treatment so that the vacuum accommodating cavity 11 meets the preset sealing requirement, thereby making the manufacture of the vapor chamber simpler.
Referring to fig. 2 and 3, in order to maintain the structural stability of the vacuum accommodating cavity 11, a plurality of support columns 4 are disposed in the vacuum accommodating cavity 11, for example, the support columns 4 may be uniformly disposed at intervals, and may be disposed in a rectangular array, where two end surfaces of the support columns 4 are respectively abutted against inner walls of two opposite large surfaces of the vacuum accommodating cavity 11, so that the heat conducting shell 1 is not easy to collapse or expand due to the influence of external air pressure and high temperature in the vacuum accommodating cavity 11, and in addition, the support columns 4 may also play a role of drainage, and after one end far from the heat source 6 is liquefied, the main phase-change heat conducting working medium may quickly slide into the main phase-change heat conducting structure 2 near one end of the heat source 6 along the support columns 4, thereby forming a heat dissipation cycle, so as to improve the heat dissipation efficiency.
Referring to fig. 2 and 3, in order to improve the heat dissipation circulation efficiency of the main phase change heat conducting medium, the following arrangement is correspondingly provided, the communicating phase change heat conducting structures 5 are arranged on the circumferential side walls of the supporting columns 4, the communicating phase change heat conducting structures 5 are used for communicating the two main phase change heat conducting structures 2, the acting force of the communicating phase change heat conducting structures 5 on the liquefied main phase change heat conducting medium is used for accelerating the flow of the liquefied main phase change heat conducting medium into the main phase change heat conducting structures 2 close to one end of the heat source 6, and the circulation flow speed of the main phase change heat conducting medium is improved.
Referring to fig. 1 and 2, in order to promote the circulation speed of the main phase change heat conducting working medium, the following settings are corresponding, the main phase change heat conducting structure 2, the heat transfer phase change heat conducting structure and the communication phase change heat conducting structure 5 are all provided with porous structures, the porous structures form a plurality of capillary channels, the capillary channels generate certain capillary force on the liquefied main phase change heat conducting working medium, the pores of the main phase change heat conducting structure 2 and the communication phase change heat conducting structure 5 are different, and then the capillary channels generate different capillary forces on the main phase change heat conducting working medium at different positions, so that the design of the pores can be carried out according to actual requirements, and the liquefied main phase change heat conducting working medium is accelerated to flow back to the position close to the heat source 6, thereby further improving the circulation efficiency of the main phase change heat conducting working medium.
Referring to fig. 1, in order to further improve heat dissipation efficiency, the heat conduction housing 1 is further provided with a liquid reservoir, heat dissipation fins and a flow guide pipe, the liquid reservoir is arranged on the heat conduction housing 1, one end of the flow guide pipe is communicated with the liquid reservoir, the other end of the flow guide pipe is communicated with the vacuum accommodating cavity 11, and the heat dissipation fins are arranged on the surface of the flow guide pipe.
The implementation principle of the heat transfer structure for strengthening and activating the porous capillary structure in the embodiment of the application is as follows: because the heat transfer element 3 has stronger heat conduction capability than the heat conduction shell 1, a part of heat emitted by the heat source 6 is directly transferred from the heat dissipation contact area to the main phase change heat conduction structure 2 closest to the heat source 6, so that the main phase change heat conduction working medium near the heat source 6 is subjected to liquid phase change, and the other part of the heat is firstly moved to the position on the heat conduction shell 1 far from the heat dissipation contact area through the heat transfer element 3 and then is transferred to the main phase change heat conduction structure 2 at the position through the heat conduction shell 1, so that the main phase change heat conduction working medium far from the heat source 6 can also be subjected to liquid phase change, and the soaking plate is further subjected to liquid phase change in a larger range of the main phase change heat conduction working medium, so that the heat dissipation efficiency of the soaking plate can be improved.
The application also provides a radiator, which comprises the heat transfer structure with the enhanced activation porous capillary structure in the embodiment, so that the radiating efficiency of the radiator can be improved.
The application also provides a server, which comprises the radiator in the embodiment, so that the radiating efficiency of the server can be improved.
The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.
Claims (10)
1. A heat transfer structure for enhanced activation of porous capillary structures, comprising
A heat conduction shell (1) is internally provided with a vacuum accommodating cavity (11);
the main phase change heat conduction structures (2) are arranged in the vacuum accommodating cavity (11), the two main phase change heat conduction structures (2) are positioned on two large opposite surfaces of the vacuum accommodating cavity (11), and one main phase change heat conduction structure (2) is internally provided with a main phase change heat conduction working medium;
and a heat transfer element (3) arranged on the outer surface of the heat conducting shell (1), wherein the heat transfer element (3) is used for increasing the path of heat transfer to the heat conducting shell (1) at a position far away from the heat source (6).
2. A heat transfer structure for enhanced activation of porous wicking structure according to claim 1, wherein: the heat conducting shell (1) is used for being in contact with the heat source (6) and is provided with a heat dissipation contact area, one end of the heat transfer element (3) is close to the heat dissipation contact area, the other end of the heat transfer element extends to a direction away from the heat dissipation contact area, and a plurality of heat transfer elements (3) are arranged in a central symmetry mode with the heat dissipation contact area as a center.
3. A heat transfer structure for enhanced activation of porous wicking structure according to claim 1, wherein: the heat transfer element (3) is internally provided with a heat transfer phase change heat conduction structure in vacuum, and the heat transfer phase change heat conduction structure is internally provided with a heat transfer phase change heat conduction working medium.
4. A heat transfer structure for enhanced activation of porous wicking structure according to claim 1, wherein: the heat conduction shell (1) comprises a bottom shell (12) and a cover plate (13), wherein the outer surface of the bottom shell (12) is used for being abutted against an external heat source (6), and the cover plate (13) is arranged on the bottom shell (12) in a covering mode to form the vacuum accommodating cavity (11).
5. A heat transfer structure for enhanced activation of porous wicking structure according to claim 1, wherein: a plurality of support columns (4) are arranged in the vacuum accommodating cavity (11), the support columns (4) are uniformly arranged at intervals, and two end faces of the support columns (4) are respectively abutted to two opposite inner walls of the vacuum accommodating cavity (11).
6. A heat transfer structure for enhanced activation of porous wicking structure according to claim 5, wherein: the phase-change heat conduction structure is characterized in that a communicating phase-change heat conduction structure (5) is arranged on the circumferential side wall of the supporting column (4), and the communicating phase-change heat conduction structure (5) is communicated with the two main phase-change heat conduction structures (2).
7. A heat transfer structure for enhanced activation of porous wicking structure according to claim 6, wherein: the main phase change heat conduction structure (2), the heat transfer phase change heat conduction structure and the communication phase change heat conduction structure (5) are all provided with porous structures, and the pore sizes of the main phase change heat conduction structure (2), the heat transfer phase change heat conduction structure and the communication phase change heat conduction structure (5) are different.
8. A heat transfer structure for enhanced activation of porous wicking structure according to claim 1, wherein: the heat conduction shell (1) is further provided with a liquid reservoir, heat radiation fins and a flow guide pipe, the liquid reservoir is arranged on the heat conduction shell (1), one end of the flow guide pipe is communicated with the liquid reservoir, the other end of the flow guide pipe is communicated with the vacuum accommodating cavity (11), and the heat radiation fins are arranged on the surface of the flow guide pipe.
9. A heat sink comprising a heat transfer structure of the enhanced active porous wick structure of any one of claims 1 to 8.
10. A server comprising the heat sink of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311594609.1A CN117500244A (en) | 2023-11-25 | 2023-11-25 | Heat transfer structure for strengthening activation of porous capillary structure, radiator and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311594609.1A CN117500244A (en) | 2023-11-25 | 2023-11-25 | Heat transfer structure for strengthening activation of porous capillary structure, radiator and server |
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| Publication Number | Publication Date |
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| CN117500244A true CN117500244A (en) | 2024-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202311594609.1A Pending CN117500244A (en) | 2023-11-25 | 2023-11-25 | Heat transfer structure for strengthening activation of porous capillary structure, radiator and server |
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| CN (1) | CN117500244A (en) |
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|---|---|---|---|---|
| CN110260697A (en) * | 2019-07-19 | 2019-09-20 | 常州恒创热管理有限公司 | A kind of aluminium base soaking plate |
| CN209546220U (en) * | 2019-01-14 | 2019-10-25 | 唐山达创传导科技有限公司 | Ultra-thin heat-transfer device |
| CN214747430U (en) * | 2021-03-18 | 2021-11-16 | 爱美达（深圳）热能系统有限公司 | Soaking plate |
| CN215524313U (en) * | 2021-05-27 | 2022-01-14 | 广东英维克技术有限公司 | Vapor chamber |
| WO2023024498A1 (en) * | 2021-08-25 | 2023-03-02 | 中兴通讯股份有限公司 | Vapor chamber and electronic device |
| CN116583068A (en) * | 2023-04-11 | 2023-08-11 | 中铁工程装备集团有限公司 | Reinforced radiating structure, frequency converter radiating device and tunneling equipment |
| CN219577673U (en) * | 2023-02-21 | 2023-08-22 | 长治市卓怡恒通信息安全有限公司 | Vapor chamber |
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2023
- 2023-11-25 CN CN202311594609.1A patent/CN117500244A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN209546220U (en) * | 2019-01-14 | 2019-10-25 | 唐山达创传导科技有限公司 | Ultra-thin heat-transfer device |
| CN110260697A (en) * | 2019-07-19 | 2019-09-20 | 常州恒创热管理有限公司 | A kind of aluminium base soaking plate |
| CN214747430U (en) * | 2021-03-18 | 2021-11-16 | 爱美达（深圳）热能系统有限公司 | Soaking plate |
| CN215524313U (en) * | 2021-05-27 | 2022-01-14 | 广东英维克技术有限公司 | Vapor chamber |
| WO2023024498A1 (en) * | 2021-08-25 | 2023-03-02 | 中兴通讯股份有限公司 | Vapor chamber and electronic device |
| CN219577673U (en) * | 2023-02-21 | 2023-08-22 | 长治市卓怡恒通信息安全有限公司 | Vapor chamber |
| CN116583068A (en) * | 2023-04-11 | 2023-08-11 | 中铁工程装备集团有限公司 | Reinforced radiating structure, frequency converter radiating device and tunneling equipment |
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