CN110740612A

CN110740612A - Vapor chamber

Info

Publication number: CN110740612A
Application number: CN201810810518.XA
Authority: CN
Inventors: 谭成; 陈明伟; 王曼; 姚志江
Original assignee: Hongfujin Precision Industry Wuhan Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Wuhan Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2018-07-20
Filing date: 2018-07-20
Publication date: 2020-01-31

Abstract

soaking plate for conducting and dissipating heat generated by heating element, comprising a bottom plate, a cover plate, wherein the cover plate is buckled with the bottom plate, a sealed and vacuum chamber is formed between the cover plate and the bottom plate, a heat-conducting fluid is filled in the chamber, a heat-conducting area for contacting with the heating element is arranged on the surface of the bottom plate, the soaking plate also comprises a wick arranged in the chamber, capillary holes communicated between the bottom plate and the cover plate are distributed in the wick, the heat-conducting fluid is heated and evaporated in the heat-conducting area to form steam and diffused, the steam is contacted with the cover plate to release heat and condensed to form heat-conducting fluid, and the heat-conducting fluid formed by condensation flows back to the heat-conducting area under the capillary action of the capillary holes of the wick, thereby solving the uniform conduction and heat dissipation of heat of small heat dissipation design space and high heat flux density device.

Description

Vapor chamber

Technical Field

The invention relates to soaking plates.

Background

Specifically, the local heat flow density in the electronic equipment is higher and higher, and heat is easily focused locally, so that the local temperature is too high, and the performance stability of the product is affected.

Disclosure of Invention

Accordingly, there is a need to provide kinds of vapor chamber, which aims to solve the problem of uniform heat conduction and heat dissipation of the device with small heat dissipation space and high heat flux density.

soaking plate for conducting and dissipating heat generated by the heating element, comprising:

a base plate; and

the cover plate is buckled with the bottom plate;

a sealed and vacuum cavity is formed between the cover plate and the bottom plate, and a heat-conducting fluid is filled in the cavity; the surface of the bottom plate is provided with a heat conduction area used for being in contact with the heating element;

the vapor chamber also comprises a liquid absorption core arranged in the cavity, and capillary holes communicated between the bottom plate and the cover plate are distributed in the liquid absorption core;

the heat-conducting fluid is heated and evaporated in the heat-conducting area to form steam and the steam is diffused, the steam is contacted with the cover plate to release heat and is condensed to form the heat-conducting fluid, and the heat-conducting fluid formed by condensation flows back to the heat-conducting area under the capillary action of the capillary pores of the liquid absorption core.

Preferably, the wick is in contact with the base plate at end and the cover plate at end .

Preferably, the chamber is concavely arranged on the side of the cover plate , and sealing areas matched with each other are respectively arranged on the peripheral sides of the cover plate and the bottom plate;

the cover plate contacts and seals the chamber with the peripheral side of the base plate via the sealing region.

Preferably, the sealing region is a welding region, and the peripheral sides of the cover plate and the base plate are welded by the welding region.

Preferably, the soaking plate further comprises an evacuation tube communicated with the chamber;

the evacuation tube serves as an evacuation passage of the chamber and is used to fill a heat transfer fluid into the chamber.

Preferably, the bottom plate is provided with an th liquid injection port which is matched with the vacuumizing pipe and is communicated with the chamber, and the cover plate is provided with a second liquid injection port which is matched with the vacuumizing pipe and the th liquid injection port and is communicated with the chamber;

the vacuum tube is clamped between the th liquid injection port and the second liquid injection port.

Preferably, a plurality of said chambers are formed between said cover plate and said base plate; the vapor chamber also comprises a plurality of wicks correspondingly arranged in the chambers.

Preferably, the wick comprises a metal foam plate including a heat-conducting portion and a plurality of extending portions connected to the heat-conducting portion; a steam flow channel is formed between the adjacent extension parts;

the liquid absorbing core is contacted with the bottom plate through the heat conducting part and the extending part, and the heat conducting fluid is heated and evaporated into steam in the heat conducting area and is diffused along the steam flow channel.

Preferably, the heat conducting portion is located in the middle of the metal foam plate, and the plurality of extending portions are distributed on the periphery of the heat conducting portion.

Preferably, the heat conducting portion and the plurality of extending portions are distributed on the periphery side of the metal foam plate.

The heat-conducting fluid is heated and evaporated in the heat-conducting area to form steam and the steam is diffused, the steam is contacted with the cover plate and then releases heat and is condensed to form heat-conducting fluid, the heat-conducting fluid formed by condensation flows back to the heat-conducting area under the capillary action of the capillary holes of the liquid absorption core and participates in times of circulation, and therefore the uniform heat conduction and heat dissipation of a small heat dissipation design space and a high heat flow density device are achieved.

Drawings

Fig. 1 is a schematic view of the structure of a vapor chamber in a preferred embodiment of .

Fig. 2 is a partially enlarged view of a portion a of the soaking plate of fig. 1.

Fig. 3 is an exploded view of the soaking plate of fig. 1.

Fig. 4 is a schematic structural view of a metal foam board in a soaking board in preferred embodiment.

Fig. 5 is a schematic diagram of the structure of a wick corresponding to the metal foam sheet of fig. 4.

Description of the main elements

10 base plate

20 wick

30 cover plate

40 vacuum tube

50 heat source

100 soaking plate

110 st th pouring outlet

201 foam metal plate

210 heat conducting part

220 steam flow passage

230 extension part

310 chamber

320 second liquid filling opening

The following detailed description is provided to further illustrate the present invention in conjunction with the above-described figures.

Detailed Description

As shown in fig. 1 to 3, the soaking plate 100 serves to conduct and dissipate heat generated from the heat generating component. For example, the soaking plate 100 can be used as a heat dissipating device and a heat conducting device in the fields of electronic equipment, solar equipment, electric vehicles, and the like.

The vapor chamber 100 includes a base plate 10, a cover plate 30, and a wick 20.

The cover plate 30 is snap-fitted to the base plate 10, and a sealed and vacuum chamber 310 is formed between the cover plate 30 and the base plate 10.

The chamber 310 is filled with a heat-conductive fluid. For example, in implementations, the thermally conductive fluid may be water, butanol, or a mixture of water and butanol.

The surface of the base plate 10 is provided with a heat conduction area for contacting the heating element.

The wick 20 is disposed within the chamber 310. Capillary holes communicated between the base plate 10 and the cover plate 30 are distributed in the liquid absorption core 20.

The heat-conducting fluid is heated in the heat-conducting area of the base plate 10 to be evaporated into vapor and diffused, the vapor releases heat after contacting the cover plate 30 and condenses into heat-conducting fluid, and the heat-conducting fluid formed by condensation flows back to the heat-conducting area under the capillary action of the capillary pores of the wick 20.

In one embodiment, the wick 20 is in contact with the base plate 10 at end and the cover plate 30 at end .

The chamber 310 may be recessed from the side of the cover plate 30, and the peripheral sides of the cover plate 30 and the base plate 10 are respectively provided with sealing zones matching with each other, and the peripheral sides of the cover plate 30 and the base plate 10 are in contact with each other through the sealing zones and seal the chamber 310.

For example, in a specific implementation, the sealing area is a welding area, and the peripheral sides of the cover plate 30 and the base plate 10 are welded by the welding area.

The vapor chamber 100 also includes an evacuation tube 40 in communication with the chamber 310.

The evacuation tube 40 serves as an evacuation passage of the chamber 310, and the evacuation tube 40 is used to fill the heat transfer fluid into the chamber 310. The evacuation tube 40 is welded closed after the chamber 310 is evacuated and filled with a thermally conductive fluid.

The bottom plate 10 is provided with an th liquid injection port 110 which is matched with the vacuum tube 40 and is communicated with the chamber 310, and correspondingly, the cover plate 30 is provided with a second liquid injection port 320 which is matched with the vacuum tube 40 and the th liquid injection port 110 and is communicated with the chamber 310.

The evacuation tube 30 is held between the -th pouring outlet 110 and the second pouring outlet 320.

, a plurality of the chambers 310 can be formed between the cover 30 and the base 10. correspondingly, the vapor chamber 100 further includes a plurality of wicks 20 disposed within the plurality of chambers 310.

The thermal spreader 100 having a single chamber 310 has its optimal size limit, and the thermal spreader 100 having a plurality of chambers 310 may break through this limit, increasing the maximum size limit of a single thermal spreader 100, ensuring its rapid thermal spreading performance while expanding the design application range of the thermal spreader 100.

In a specific implementation, the wick 20 includes a metal foam sheet 201. The metal foam plate 201 includes a heat conduction portion 210 and a plurality of extension portions 230 connected to the heat conduction portion 210. For example, in a specific implementation, the metal foam plate 201 may be a copper foam plate. The porosity of the copper foam plate can be 80-95%.

The steam flow passage 220 is formed between the adjacent extensions 230.

The wick 20 is in contact with the base plate 10 through the heat-conducting portion 210 and the extending portion 230. The heat transfer fluid is heated in the heat transfer area to evaporate into steam and spread along the steam flow channel 220.

By means of the evaporation and diffusion of the heat-conducting fluid, the heat conduction efficiency can be improved, heat can be quickly conducted to a large heat dissipation area, the quick heat equalization of the soaking plate 100 is realized, the heat can be led out by fully utilizing external heat dissipation fins and the like, and the overall performance of a heat dissipation system is improved.

Referring to fig. 3 to 5, in an implementation, the heat conducting portion 210 may be located in the middle of the metal foam plate 201, and the plurality of extending portions 230 are distributed on the periphery of the heat conducting portion 210 (as shown in fig. 3), which may be used in a situation where the heat source 50 is more distributed.

In another embodiment , the heat conducting portion 210 and the plurality of extending portions 230 may be distributed on the periphery of the metal foam 201 (as shown in fig. 4). referring to fig. 5, such distribution may be suitable for a situation where the heat source 50 is concentrated.

The shape of the metal foam plate 201 in the cavity 310 is designed through different heating positions of the heat source 50, the space for steam to flow is increased, the resistance of steam flow is reduced, and the edges of the metal foam plate 201 can be provided with communicated channels, so that the steam circulation is improved.

The metal foam plate 201 not only provides a channel for the backflow of the heat transfer fluid, but also supports the base plate 10 and the cover plate 30 to form the chamber 310.

In the vapor chamber 100, the capillary holes communicating between the bottom plate 10 and the cover plate 30 are distributed in the wick 20, the heat transfer fluid is heated and evaporated in the heat transfer area to form vapor and is diffused, the vapor releases heat after contacting the cover plate 30 and is condensed to form the heat transfer fluid, and the condensed heat transfer fluid flows back to the heat transfer area under the capillary action of the capillary holes of the wick 20 to participate in times of circulation, so that the uniform heat transfer and heat dissipation of a small heat dissipation design space and a high heat flux density device are achieved.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims

A vapor chamber of the type for conducting and dissipating heat generated by a heat-generating component, comprising:

a base plate; and

the cover plate is buckled with the bottom plate;

a sealed and vacuum cavity is formed between the cover plate and the bottom plate, and a heat-conducting fluid is filled in the cavity; the surface of the bottom plate is provided with a heat conduction area used for being in contact with the heating element;

the vapor chamber is characterized by also comprising a liquid absorbing core arranged in the chamber, and capillary holes communicated between the bottom plate and the cover plate are distributed in the liquid absorbing core;

the heat-conducting fluid is heated and evaporated in the heat-conducting area to form steam and the steam is diffused, the steam is contacted with the cover plate to release heat and is condensed to form the heat-conducting fluid, and the heat-conducting fluid formed by condensation flows back to the heat-conducting area under the capillary action of the capillary pores of the liquid absorption core.
2. The vapor chamber of claim 1, wherein said wick is in contact with said bottom plate at end and said cover plate at end .
3. The soaking plate according to claim 1, wherein the chamber is concavely arranged on the side of the cover plate , and mutually matched sealing zones are respectively arranged on the peripheral side of the cover plate and the peripheral side of the bottom plate;

the cover plate contacts and seals the chamber with the peripheral side of the base plate via the sealing region.
4. The soaking plate according to claim 3, wherein: the sealing area is a welding area, and the peripheral sides of the cover plate and the bottom plate are welded through the welding area.
5. The soaking plate according to claim 4, wherein: the soaking plate also comprises a vacuumizing pipe communicated with the cavity;

the evacuation tube serves as an evacuation passage of the chamber and is used to fill a heat transfer fluid into the chamber.
6. The soaking plate according to claim 5, wherein the bottom plate is provided with a th liquid injection port matched with the vacuum tube and communicated with the chamber, the cover plate is provided with a second liquid injection port matched with the vacuum tube and the th liquid injection port and communicated with the chamber;

the vacuum tube is clamped between the th liquid injection port and the second liquid injection port.
7. The soaking plate according to claim 1, wherein: a plurality of the chambers are formed between the cover plate and the bottom plate; the vapor chamber also comprises a plurality of wicks correspondingly arranged in the chambers.
8. The soaking plate according to claim 7, wherein: the wick comprises a metal foam plate, and the metal foam plate comprises a heat conducting part and a plurality of extending parts connected with the heat conducting part; a steam flow channel is formed between the adjacent extension parts;

the liquid absorbing core is contacted with the bottom plate through the heat conducting part and the extending part, and the heat conducting fluid is heated and evaporated into steam in the heat conducting area and is diffused along the steam flow channel.
9. The soaking plate according to claim 8, wherein: the heat conducting part is located in the middle of the foam metal plate, and the plurality of extending parts are distributed on the periphery of the heat conducting part.
10. The soaking plate according to claim 8, wherein: the heat conducting part and the plurality of extending parts are distributed on the periphery of the foam metal plate.