CN110740612A - Vapor chamber - Google Patents

Abstract

A soaking plate is used to conduct and dissipate the heat generated by the heating element, including a bottom plate and a cover plate. The cover plate is buckled with the bottom plate, a sealed and vacuum chamber is formed between the cover plate and the bottom plate, the chamber is filled with a heat-conducting fluid, and the surface of the bottom plate is provided with a space for connecting with the heating element. contact with the thermally conductive area. The soaking plate further includes a liquid absorbing wick arranged in the chamber, and the inside of the liquid absorbing wick is distributed with capillary holes that communicate between the bottom plate and the cover plate. The heat-conducting fluid is heated in the heat-conducting area and evaporates into steam and diffuses. After the steam contacts the cover plate, it releases heat and condenses into a heat-conducting fluid. At the heat conduction area, the uniform heat conduction and heat dissipation of the small heat dissipation design space and the high heat flux density device can be solved.

Description

Vapor chamber

technical field

The present invention relates to a soaking plate.

Background technique

With the rapid development of electronic chip technology, consumer electronic devices are becoming thinner and lighter, and the performance of products is becoming more and more powerful. As the internal space of electronic devices is getting narrower and narrower, the heat dissipation problem of the internal core processing unit becomes more and more difficult. increasingly important. Specifically, the local heat flux density in electronic equipment is increasing, and the heat is easily focused locally, resulting in excessive local temperature and affecting the performance stability of the product. For example, with the rapid development of industries such as modern communication equipment, smart phones, solar energy and new energy vehicles, thermal management systems are an important part of product technology research and development. Electronic devices are developing in the direction of high performance, multi-function and miniaturization, but with it comes the high heat flux density and small heat dissipation space of electronic devices. With the increase of temperature, the failure rate of electronic devices increases exponentially, and the working performance and stability of the whole machine are greatly affected. Therefore, small and high-performance cooling devices have broad application prospects.

SUMMARY OF THE INVENTION

In view of this, it is necessary to provide a vapor chamber, which aims to solve the uniform conduction and heat dissipation of heat in a small heat dissipation design space and a high heat flux density device.

A vapor chamber for conducting and dissipating heat generated by heating elements, comprising:

the bottom plate; and

a cover plate, the cover plate is buckled with the bottom plate;

A sealed and vacuum chamber is formed between the cover plate and the bottom plate, and the chamber is filled with heat-conducting fluid; the surface of the bottom plate is provided with a heat-conducting area for contacting with the heating element;

The soaking plate further comprises a liquid absorbing wick arranged in the chamber, and the inside of the liquid absorbing wick is distributed with capillary holes connected between the bottom plate and the cover plate;

The heat-conducting fluid is heated in the heat-conducting area and evaporates into steam and diffuses. After the steam contacts the cover plate, it releases heat and condenses into a heat-conducting fluid. at the heat transfer zone.

Preferably, one end of the absorbent core is in contact with the bottom plate, and the other end is in contact with the cover plate.

Preferably, the chamber is recessed on one side of the cover plate; the peripheral side of the cover plate and the peripheral side of the bottom plate are respectively provided with mutually matching sealing areas;

The cover plate is in contact with the peripheral side of the bottom plate through the sealing area and seals the chamber.

Preferably, the sealing area is a welding area, and the peripheral sides of the cover plate and the bottom plate are welded through the welding area.

Preferably, the soaking plate further comprises an evacuated pipe communicated with the chamber;

The evacuation tube serves as an evacuation channel for the chamber and is used to fill the chamber with a thermally conductive fluid.

Preferably, the bottom plate is provided with a first liquid injection port matched with the vacuum pipe and communicated with the chamber; the cover plate is provided with a first liquid injection port matched with the vacuum pipe and the first liquid injection port, a second liquid injection port communicating with the chamber;

The evacuation tube is clamped between the first liquid injection port and the second liquid injection port.

Preferably, a plurality of the chambers are formed between the cover plate and the bottom plate; the soaking plate further includes a plurality of liquid-absorbing wicks corresponding to the plurality of chambers.

Preferably, the absorbent core includes a foamed metal plate, and the foamed metal plate includes a heat-conducting part and a plurality of extension parts connected to the heat-conducting part; a steam flow channel is formed between the adjacent extension parts;

The liquid-absorbing wick is in contact with the bottom plate through the heat-conducting portion and the extension portion, and the heat-conducting fluid is heated in the heat-conducting area and evaporates into steam and spreads along the steam flow channel.

Preferably, the heat-conducting portion is located in the middle of the foam metal plate, and the plurality of extension portions are distributed on the peripheral side of the heat-conducting portion.

Preferably, the heat-conducting portion and the plurality of extending portions are distributed on the peripheral side of the foam metal plate.

In the above-mentioned soaking plate, capillary holes connected between the bottom plate and the cover plate are distributed inside the liquid-absorbing core; the heat-conducting fluid is heated and evaporated into steam in the heat-conducting area and diffuses, and the steam contacts the cover. The heat is released after the plate and condenses into a heat-conducting fluid, and the condensed heat-conducting fluid flows back to the heat-conducting area under the capillary action of the capillary holes of the liquid-absorbing core, and participates in the next cycle, thereby solving the problem of small heat dissipation design space and high heat flow. Uniform conduction and dissipation of heat from density devices.

Description of drawings

FIG. 1 is a schematic structural diagram of a vapor chamber in a preferred embodiment.

FIG. 2 is a partial enlarged view of part A of the vapor chamber of FIG. 1 .

FIG. 3 is a schematic diagram of an exploded structure of the vapor chamber of FIG. 1 .

FIG. 4 is a schematic structural diagram of a foamed metal plate in a vapor chamber in a preferred embodiment.

FIG. 5 is a schematic structural diagram of the liquid absorbent core corresponding to the foamed metal plate of FIG. 4 .

Description of main component symbols

10 Bottom plate

20 wicks

30 Cover

40 Evacuation tube

50 heat source

100 Vapor Chambers

110 The first liquid injection port

201 Foam Metal Sheet

210 Thermal part

220 Steam runner

230 Extension

310 chamber

320 Second liquid injection port

The following specific embodiments will further illustrate the present invention in conjunction with the above drawings.

Detailed ways

As shown in FIGS. 1 to 3 , the vapor chamber 100 is used to conduct and dissipate the heat generated by the heating element. For example, the vapor chamber 100 can be used as a heat dissipation device and a heat conduction device in the fields of electronic equipment, solar equipment, electric vehicles, and the like.

The vapor chamber 100 includes a bottom plate 10 , a cover plate 30 and a liquid absorbing core 20 .

The cover plate 30 is fastened to the bottom plate 10 , and a sealed and vacuum chamber 310 is formed between the cover plate 30 and the bottom plate 10 .

The cavity 310 is filled with thermally conductive fluid. For example, in specific implementations, the thermally conductive fluid may be water, butanol, or a mixture of water and butanol.

The surface of the bottom plate 10 is provided with a heat conduction area for contacting with the heating element.

The wick 20 is disposed in the chamber 310 . Capillary holes connected between the bottom plate 10 and the cover plate 30 are distributed inside the absorbent core 20 .

The heat-conducting fluid is heated and evaporated into steam in the heat-conducting area of the bottom plate 10 and diffuses. After the steam contacts the cover plate 30 , it releases heat and condenses into a heat-conducting fluid. Under the capillary action of the pores, it flows back to the heat conducting zone. The returned heat transfer fluid can participate in the next cycle of evaporation and condensation.

In a specific implementation, one end of the wick 20 is in contact with the bottom plate 10 , and the other end is in contact with the cover plate 30 .

The cavity 310 may be recessed on one side of the cover plate 30 . The peripheral side of the cover plate 30 and the peripheral side of the bottom plate 10 are respectively provided with mutually matching sealing areas. The cover plate 30 is in contact with the peripheral side of the bottom plate 10 through the sealing area and seals the cavity 310 .

For example, in a specific implementation, the sealing area is a welding area, and the peripheral sides of the cover plate 30 and the bottom plate 10 are welded through the welding area.

The vapor chamber 100 further includes an evacuation pipe 40 in communication with the chamber 310 .

The evacuation tube 40 is used as an evacuation channel for the chamber 310 , and the evacuation tube 40 is used to fill the heat transfer fluid into the chamber 310 . After the chamber 310 is evacuated and filled with heat transfer fluid, the evacuated tube 40 is welded closed.

The bottom plate 10 is provided with a first liquid injection port 110 which is matched with the evacuation tube 40 and communicates with the chamber 310 . Correspondingly, the cover plate 30 is provided with a second liquid injection port 320 which cooperates with the evacuating tube 40 and the first liquid injection port 110 and communicates with the chamber 310 .

The evacuation tube 30 is sandwiched between the first liquid injection port 110 and the second liquid injection port 320 .

In a preferred embodiment, a plurality of the chambers 310 may be formed between the cover plate 30 and the bottom plate 10 . Correspondingly, the vapor chamber 100 further includes a plurality of wicks 20 correspondingly disposed in the plurality of chambers 310 .

The vapor chamber 100 with a single chamber 310 has its optimal size limit. The vapor chamber 100 with multiple chambers 310 can break through this limitation and increase the maximum size limit of a single vapor chamber 100 to ensure its rapidity. The design and application range of the heat soaking plate 100 is expanded while the heat soaking performance is increased.

In a specific implementation, the absorbent core 20 includes a foamed metal plate 201 . The foamed metal plate 201 includes a heat conducting portion 210 and a plurality of extending portions 230 connected to the heat conducting portion 210 . For example, in a specific implementation, the foamed metal plate 201 may be a foamed copper plate. The porosity of the foamed copper plate may be 80%-95%.

Steam flow channels 220 are formed between adjacent extension parts 230 .

The wick 20 is in contact with the bottom plate 10 through the heat conducting portion 210 and the extending portion 230 . The heat-conducting fluid is heated in the heat-conducting region and evaporates into steam and diffuses along the steam flow channel 220 .

By means of the evaporation and diffusion of the heat transfer fluid, the heat conduction efficiency can be improved, the heat can be quickly transferred to a large heat dissipation area, and the rapid heat distribution of the vapor chamber 100 can be realized, so that the heat can be fully exported by the external heat dissipation fins, etc., and the overall performance of the heat dissipation system can be improved. .

Referring to FIGS. 3 to 5 at the same time, in a specific implementation, the heat-conducting portion 210 may be located in the middle of the foam metal plate 201 , and the plurality of extension portions 230 are distributed on the peripheral side of the heat-conducting portion 210 (eg, 3), this distribution can be used in a situation where the heat sources 50 are more dispersed.

In another embodiment, the heat conducting portion 210 and the plurality of extending portions 230 may be distributed on the peripheral side of the foam metal plate 201 (as shown in FIG. 4 ). Referring to FIG. 5 , this distribution can be applied to a situation where the heat sources 50 are concentrated.

The shape of the foam metal plate 201 in the chamber 310 is designed by different heating positions of the heat source 50 to increase the space for steam circulation and reduce the resistance of steam flow, and a communication channel can be provided on the edge of the foam metal plate 201 to improve the circulation of steam sex.

The foamed metal plate 201 not only provides a channel for backflow of the heat transfer fluid, but also supports the bottom plate 10 and the cover plate 30 to form the cavity 310 .

In the above-mentioned vapor chamber 100 , capillary holes connected between the bottom plate 10 and the cover plate 30 are distributed inside the liquid absorbing core 20 . The heat-conducting fluid is heated in the heat-conducting area and evaporates into steam and diffuses. After the steam contacts the cover plate 30 , it releases heat and condenses into a heat-conducting fluid. Return to the heat conduction area to participate in the next cycle, so as to solve the uniform conduction and heat dissipation of the small heat dissipation design space and the high heat flux density device.

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included in the protection of the present invention. within the range.

Claims (10)

1. A vapor chamber of the type for conducting and dissipating heat generated by a heat-generating component, comprising:

   a base plate; and

   the cover plate is buckled with the bottom plate;

   a sealed and vacuum cavity is formed between the cover plate and the bottom plate, and a heat-conducting fluid is filled in the cavity; the surface of the bottom plate is provided with a heat conduction area used for being in contact with the heating element;

   the vapor chamber is characterized by also comprising a liquid absorbing core arranged in the chamber, and capillary holes communicated between the bottom plate and the cover plate are distributed in the liquid absorbing core;

   the heat-conducting fluid is heated and evaporated in the heat-conducting area to form steam and the steam is diffused, the steam is contacted with the cover plate to release heat and is condensed to form the heat-conducting fluid, and the heat-conducting fluid formed by condensation flows back to the heat-conducting area under the capillary action of the capillary pores of the liquid absorption core.
2. 2. The vapor chamber of claim 1, wherein said wick is in contact with said bottom plate at end and said cover plate at end .
3. 3. The soaking plate according to claim 1, wherein the chamber is concavely arranged on the side of the cover plate , and mutually matched sealing zones are respectively arranged on the peripheral side of the cover plate and the peripheral side of the bottom plate;

   the cover plate contacts and seals the chamber with the peripheral side of the base plate via the sealing region.
4. 4. The soaking plate according to claim 3, wherein: the sealing area is a welding area, and the peripheral sides of the cover plate and the bottom plate are welded through the welding area.
5. 5. The soaking plate according to claim 4, wherein: the soaking plate also comprises a vacuumizing pipe communicated with the cavity;

   the evacuation tube serves as an evacuation passage of the chamber and is used to fill a heat transfer fluid into the chamber.
6. 6. The soaking plate according to claim 5, wherein the bottom plate is provided with a th liquid injection port matched with the vacuum tube and communicated with the chamber, the cover plate is provided with a second liquid injection port matched with the vacuum tube and the th liquid injection port and communicated with the chamber;

   the vacuum tube is clamped between the th liquid injection port and the second liquid injection port.
7. 7. The soaking plate according to claim 1, wherein: a plurality of the chambers are formed between the cover plate and the bottom plate; the vapor chamber also comprises a plurality of wicks correspondingly arranged in the chambers.
8. 8. The soaking plate according to claim 7, wherein: the wick comprises a metal foam plate, and the metal foam plate comprises a heat conducting part and a plurality of extending parts connected with the heat conducting part; a steam flow channel is formed between the adjacent extension parts;

   the liquid absorbing core is contacted with the bottom plate through the heat conducting part and the extending part, and the heat conducting fluid is heated and evaporated into steam in the heat conducting area and is diffused along the steam flow channel.
9. 9. The soaking plate according to claim 8, wherein: the heat conducting part is located in the middle of the foam metal plate, and the plurality of extending parts are distributed on the periphery of the heat conducting part.
10. 10. The soaking plate according to claim 8, wherein: the heat conducting part and the plurality of extending parts are distributed on the periphery of the foam metal plate.

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