CN208139909U - A kind of multichannel loop type temperature-uniforming plate - Google Patents

A kind of multichannel loop type temperature-uniforming plate Download PDF

Info

Publication number
CN208139909U
CN208139909U CN201820424199.4U CN201820424199U CN208139909U CN 208139909 U CN208139909 U CN 208139909U CN 201820424199 U CN201820424199 U CN 201820424199U CN 208139909 U CN208139909 U CN 208139909U
Authority
CN
China
Prior art keywords
capillary
heat
liquid medium
capillary portion
steam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201820424199.4U
Other languages
Chinese (zh)
Inventor
陈漳胤
刘威风
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhongshan Weiqiang Technology Co Ltd
Original Assignee
Zhongshan Weiqiang Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhongshan Weiqiang Technology Co Ltd filed Critical Zhongshan Weiqiang Technology Co Ltd
Priority to CN201820424199.4U priority Critical patent/CN208139909U/en
Application granted granted Critical
Publication of CN208139909U publication Critical patent/CN208139909U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses a kind of multichannel loop type temperature-uniforming plates, including a thermally conductive mainboard body, mainboard body has endothermic section and radiating part, there is heat-absorbing chamber in endothermic section, there is the liquid medium that can be absorbed heat in the heat-absorbing chamber, there is heat dissipation cavity in radiating part, be provided with the liquid medium channel for being used to be connected to heat-absorbing chamber with heat dissipation cavity and steam channel in mainboard body;Endothermic section can absorb extraneous heat and transfer heat to liquid medium, the steam generated after the liquid medium heat absorption can enter heat dissipation cavity by steam channel, radiating part can absorb the heat of steam in heat dissipation cavity and distribute heat to the external world, and the liquid medium that the steam heat dissipation condensation in heat dissipation cavity generates can flow back into heat-absorbing chamber via liquid medium channel.The utility model can effectively improve heat transference efficiency, and structure is simple, small in size, applied widely, be easy to use.

Description

A kind of multichannel loop type temperature-uniforming plate
Technical field
The utility model relates to a kind of temperature-uniforming plates.
Background technique
Temperature-uniforming plate is usually used in the electronic equipments such as computer, communication product, is usually used in cooling down to heater elements such as chips, Its heat absorbing part is used to absorb the heat of heater element when use, and radiator portion passes through external radiating fin, radiator fan etc. It radiates, the steam generated after the liquid mediums such as internal water are heated is flowed to radiator portion, after radiator portion condensation It flows back into heat absorbing part, is achieved in the heat dissipation to heater element, the usually not special steam passage of existing temperature-uniforming plate And fluid path, the frequent reverse flow in same channels of steam and liquid can cause to hinder to the flowing of steam and liquid medium The liquid medium for hindering, and flowing back after condensing can also absorb the heat of a part of steam to will affect the heat transmitting effect of temperature-uniforming plate Rate.
Utility model content
To solve the above-mentioned problems, simple, small in size, hot transmitting effect that the purpose of this utility model is to provide a kind of structures The high multichannel loop type temperature-uniforming plate of rate.
The utility model be solve its technical problem and the technical solution adopted is that:
A kind of multichannel loop type temperature-uniforming plate, including a thermally conductive mainboard body, the mainboard body has endothermic section and dissipates Hot portion has heat-absorbing chamber in the endothermic section, has the liquid medium that can be absorbed heat, the radiating part in the heat-absorbing chamber It is interior that there is heat dissipation cavity, the liquid medium channel for being used to be connected to the heat-absorbing chamber with heat dissipation cavity and steaming are provided in mainboard body Vapour channel;
The endothermic section can absorb extraneous heat and transfer heat to the liquid medium, and the liquid is situated between The steam generated after matter heat absorption can enter the heat dissipation cavity by the steam channel, and the radiating part can absorb The heat of steam in heat dissipation cavity, the liquid medium that the steam heat dissipation condensation in heat dissipation cavity generates can be via the liquid medium Channel flows back into the heat-absorbing chamber.
Preferably, it is provided with capillary part in the mainboard body, there is capillary channel, the capillary in the capillary part Part includes the first capillary portion in the liquid medium channel, the first capillary portion fill full liquid medium channel or By liquid medium passageway break, the liquid medium in heat dissipation cavity can pass through first mao by the capillary channel in the first capillary portion Thin portion and enter the heat-absorbing chamber.
Preferably, the capillary part further includes the second capillary portion in the heat-absorbing chamber and is located at the heat dissipation cavity Interior third capillary portion, the liquid medium in heat-absorbing chamber can be absorbed by the second capillary portion, and the liquid medium in heat dissipation cavity can It is absorbed by third capillary portion, the liquid medium in third capillary portion can be flowed into the second capillary portion by the first capillary portion.
Preferably, there is the first cavity in the heat-absorbing chamber, there is the second cavity, first cavity in heat dissipation cavity It is connected with the second cavity by the steam channel, the liquid medium in heat-absorbing chamber is able to enter by thermogenetic steam In two cavitys, steam in the second cavity can enter first cavity via the steam channel, in the first cavity Steam condensation after the liquid medium that generates can be absorbed by the second capillary portion.
Preferably, the second capillary portion include on the heat-absorbing chamber on inner wall second on capillary portion and be located at heat absorption The second lower capillary portion under chamber on inner wall, first cavity are located on second between capillary portion and the second lower capillary portion, institute The capillary part stated further includes the first capillary conducting portion in first cavity, the top of the first capillary conducting portion with Capillary portion is connected on second, and lower part is connected with the second lower capillary portion, and the liquid medium on second in capillary portion can be by described First capillary conducting portion flows into the second lower capillary portion;
In the third capillary portion includes the capillary portion in the third in heat dissipation cavity on inner wall that is located at and is located under heat dissipation cavity Capillary portion under third on wall, second cavity are located in third under capillary portion and third between capillary portion, the hair Assembly further includes the second capillary conducting portion in second cavity;The top of the second capillary conducting portion and third Upper capillary portion is connected, and lower part is connected with capillary portion under third, and the liquid medium in third in capillary portion can pass through described second Capillary conducting portion flows into capillary portion under third.
Preferably, the capillary part further includes capillary portion on the 4th be arranged on the steam channel on inner wall, sets It sets under steam channel capillary portion under the 4th on inner wall and is arranged on the described 4th under capillary portion and the 4th between capillary portion Third capillary conducting portion;The top of the third capillary conducting portion is connect with capillary portion on the 4th, capillary under lower part and the 4th Portion connects, and the liquid medium on the 4th in capillary portion can pass through the third capillary conducting portion and flow into the 4th lower capillary portion;Institute Capillary portion is connected with capillary portion on the described the 4th in capillary portion and third on second stated, the described second lower capillary portion and Capillary portion is connected with the described the 4th lower capillary portion under third.
Preferably, the first capillary portion includes capillary on first on the upper inner wall in the liquid medium channel Portion, the on the lower inner wall in the liquid medium channel first lower capillary portion and the capillary under capillary portion on first and first Capillary blocking portion between portion, the capillary blocking portion is by liquid medium passageway break;Capillary portion and third on described second Upper capillary portion is connected with capillary portion on described first, under the described second lower capillary portion and third capillary portion with it is described First lower capillary portion is connected.
Preferably, at a distance between the endothermic section and radiating part, the liquid medium channel and steam are logical It is at a distance between road.
Preferably, there is vertical through-hole, the liquid medium channel and steam channel are by institute on the mainboard body The through-hole stated separates.
The utility model has the beneficial effects that:When the utility model is used, endothermic section absorbs heat, makes the liquid in heat-absorbing chamber Body medium generates steam, and steam enters heat dissipation cavity via steam channel, and radiating part passes through external radiating fin etc. again will be hot Amount is rapidly dispersed into the external world, and the steam condensate (SC) for condensing generation flows back into heat-absorbing chamber via liquid medium channel again, so Refrigerating function can be realized in circulation, in the process, due to endothermic section, radiating part, steam channel and liquid medium on mainboard body Channel is independently arranged, and the heat of steam is not easy conduction into the condensed water of reflux, can effectively improve heat transference efficiency, structure Simply, small in size, it is applied widely, it is easy to use.
Detailed description of the invention
Utility model will be further described in detail below with reference to the attached drawings and specific embodiments.
Fig. 1 is the overall structure figure of the utility model;
Fig. 2 is the exploded view of the utility model;
Fig. 3 is structure chart of the utility model after section at steam channel;
Fig. 4 is the partial enlarged view of part A in Fig. 3;
Fig. 5 is structure chart of the utility model after section at liquid medium channel;
Fig. 6 is the partial enlarged view of part B in Fig. 5.
Specific embodiment
Referring to figs. 1 to Fig. 6, a kind of multichannel loop type temperature-uniforming plate, including a thermally conductive mainboard body 10, mainboard body 10 has Endothermic section 11 and radiating part 12, endothermic section 11 is interior to have heat-absorbing chamber 111, has the liquid medium that can be absorbed heat in heat-absorbing chamber 111, There is heat dissipation cavity 121 in radiating part 12, be provided with the liquid for being used to be connected to heat-absorbing chamber 111 with heat dissipation cavity 121 in mainboard body 10 Body medium channel 13 and steam channel 14;Endothermic section 11 can absorb extraneous heat and transfer heat to liquid medium, liquid The steam generated after the heat absorption of body medium can enter heat dissipation cavity 121 by steam channel 14, and radiating part 12 can absorb heat dissipation cavity The heat of steam in 121, can be by radiating fin, radiator fan etc. again by heat Quick diffusing to the external world, heat dissipation cavity in use The liquid medium that steam heat dissipation condensation in 121 generates can flow back into heat-absorbing chamber 111 via liquid medium channel 13.This reality With novel in use, the absorption of endothermic section 11 heat, makes the liquid medium in heat-absorbing chamber 111 generate steam, steam is logical via steam Road 14 enters heat dissipation cavity 121, and heat is rapidly dispersed into the external world by external radiating fin etc. again, condensed by radiating part 12 The steam condensate (SC) of generation flows back into heat-absorbing chamber 111 via liquid medium channel 13 again, and so cooling function can be realized in circulation Can, in the process, since endothermic section 11, radiating part 12, steam channel 14 and liquid medium channel 13 are only on mainboard body 10 It erects and sets, the heat of steam is not easy conduction into the condensed water of reflux, can effectively improve heat transference efficiency, structure is simple, body Product is small, applied widely, is easy to use.
It is provided with capillary part in mainboard body 10, there is capillary channel in capillary part, capillary part includes logical positioned at liquid medium The first capillary portion in road 13, the first capillary portion fill full liquid medium channel 13 or separate liquid medium channel 13, radiate Liquid medium in chamber 121 can pass through the first capillary portion by the capillary channel in the first capillary portion and enter heat-absorbing chamber 111. When endothermic section 11 absorbs external heat, when gases are heated, they expand in the heated generation steam of liquid medium and heat-absorbing chamber 111, can make The pressure obtained in endothermic section 11 increases, and after radiating part 12 distributes heat, steam condensation can make in heat dissipation cavity 121 Pressure reduce, pressure difference is consequently formed and flows steam to radiating part 12, the first capillary portion is due to filling full liquid medium Channel 13 has separated liquid medium channel 13, and the air velocity at liquid medium channel 13 is enabled to slow down or block gas Stream, just enables steam is greater concentration of to flow into heat dissipation cavity 121 from steam channel 14 in this way, without having steam or only There is minute quantity steam that can enter heat dissipation cavity 121 from liquid medium channel 13, and in the pressure for the steam for entering heat dissipation cavity 121 Under, the liquid medium in heat dissipation cavity 121 can be flowed back into heat-absorbing chamber 111 again by the capillary channel in the first capillary portion, by This can preferably realize the separation individual flow of steam and liquid medium, so that the heat of steam is not easy to be transmitted to reflux In liquid medium, the heat transference efficiency of the utility model can be effectively improved.It certainly, can also be by making steam in practical application Channel 14 and liquid medium channel 13 tilt, and enable steam channel 14 be located at liquid medium channel 13 upper equal other are common square Formula enables steam and the liquid medium circulate respectively via steam channel 14 and liquid medium channel 13, it is not limited to this.
Capillary part further includes the second capillary portion in the heat-absorbing chamber 111 and the third capillary portion in heat dissipation cavity 121, Liquid medium in heat-absorbing chamber 111 can be absorbed by the second capillary portion, and the liquid medium in heat dissipation cavity 121 can be by third capillary Portion absorbs, and the liquid medium in third capillary portion can be flowed into the second capillary portion by the first capillary portion, enables in this way Liquid medium in heat-absorbing chamber 111 and heat dissipation cavity 121 more disperses and uniformly, helps to improve steam generation efficiency and steam is cold Solidifying efficiency, and all liq medium can be promoted to be involved in phase transition and flowing, so as to improve the heat of the utility model Transmission efficiency, in addition also can be avoided liquid medium there is great fluctuation process and block steam channel 14 and liquid medium channel 13 after And the normal use of the utility model is influenced, more securely and reliably.There is the first cavity 15, in heat dissipation cavity 121 in heat-absorbing chamber 111 With the second cavity 16, the first cavity 15 is connected with the second cavity 16 by steam channel 14, and the liquid in heat-absorbing chamber 111 is situated between Matter is able to enter in the second cavity 16 by thermogenetic steam, and the steam in the second cavity 16 can enter via steam channel 14 First cavity 15, the liquid medium generated after the steam condensation in the first cavity 15 can be absorbed by the second capillary portion, the first sky Chamber 15 and the second cavity 16 can accommodate steam, enable steam in the first cavity 15, the second cavity 16 and steam channel 14 Interior flowing, and help to increase the pressure difference between heat dissipation cavity 121 and heat-absorbing chamber 111, promote the stream of steam and liquid medium It is dynamic.
Steam in heat-absorbing chamber 111 and heat dissipation cavity 121 has part and condenses at the top of heat-absorbing chamber 111 and heat dissipation cavity 121, The condensed water of generation can be attached on heat-absorbing chamber 111 and the upper inner wall of heat dissipation cavity 121, to can to participate in phase transition and stream Dynamic liquid medium is reduced, and can hinder the flowing of steam and the heat of absorption steam that steam heat is passed back to where its again Endothermic section 11 or radiating part 12, heat transference efficiency is influenced, in addition, the condensed water of attachment can drop down when reaching certain volume Impact is generated, so that liquid medium generates fluctuation, the utility model generation is easy to cause to be oscillated or vibrated, it also can be to liquid medium Flowing impact, may result in the damage of corresponding electric elements when serious.In the utility model, the second capillary portion includes On inner wall on heat-absorbing chamber 111 second on capillary portion 31 and the second lower capillary portion 32 on the lower inner wall of heat-absorbing chamber 111, First cavity 15 is located on second between capillary portion 31 and the second lower capillary portion 32, and capillary part further includes being located in the first cavity 15 The first capillary conducting portion 33, the top of the first capillary conducting portion 33 is connected with capillary portion 31 on second, lower part and the second lower hair Thin portion 32 is connected, and the liquid medium on second in capillary portion 31 can flow into the second lower capillary portion by the first capillary conducting portion 33 32, in this way, the liquid medium that the steam condensation in heat-absorbing chamber 111 generates can be absorbed and be passed through in time by capillary portion 31 on second First capillary conducting portion 33 flows back into the second lower capillary portion 32, can prevent the upper inner wall of heat-absorbing chamber 111 from forming droplet and water droplet, Water droplet drippage is avoided to generate impact and fluctuation, capable of also making endothermic section 11, temperature is more uniform everywhere, therefore more safe and reliable; Likewise, third capillary portion includes the capillary portion 41 in the third in heat dissipation cavity 121 on inner wall that is located at and is located at interior under heat dissipation cavity 121 Capillary portion 42 under third on wall, the second cavity 16 are located in third under capillary portion 41 and third between capillary portion 42, capillary part It further include the second capillary conducting portion 43 in the second cavity 16;Capillary portion on the top of second capillary conducting portion 43 and third 41 are connected, and lower part is connected with capillary portion 42 under third, and the liquid medium in third in capillary portion 41 can be led by the second capillary Logical portion 43 flows into capillary portion 42 under third, equally can also make the temperature of radiating part 12 everywhere more uniform, condensed water is avoided to assemble Droplet and water droplet are formed, it is safer reliable.
It is condensed likewise, also having some vapor in steam channel 14, therefore, in the utility model, capillary part is also Including be arranged on steam channel 14 on inner wall the 4th on capillary portion 51, be arranged under steam channel 14 on inner wall the 4th under Capillary portion 52 and the third capillary conducting portion 53 being arranged between capillary portion 51 on the 4th and the 4th lower capillary portion 52;Third capillary The top of conducting portion 53 is connect with capillary portion 51 on the 4th, and lower part is connect with the 4th lower capillary portion 52, on the 4th in capillary portion 51 Liquid medium can pass through third capillary conducting portion 53 and flow into the 4th lower capillary portion 52;Hair in capillary portion 31 and third on second Thin portion 41 is connected with capillary portion 51 on the 4th, and second descends capillary portion 42 under capillary portion 32 and third to descend capillary portion 52 with the 4th It is connected, the condensed water generated in steam channel 14 can be absorbed by capillary portion 51 on the 4th in time, then be led by third capillary Logical portion 53 flows into the 4th lower capillary portion 52 and is flowed under the second lower capillary portion 32 or third in capillary portion 42 again, or can also be direct It is flowed on second capillary portion 41 in capillary portion 31 or third, can be avoided and the steam flowing in steam channel 14 is caused to hinder Hinder, improves the heat transference efficiency of the utility model.
First capillary portion includes capillary portion 21 on first be located on the upper inner wall in liquid medium channel 13, is located at liquid Jie First on the lower inner wall in matter channel 13 descends capillary portion 22 and between capillary portion 21 on first and the first lower capillary portion 22 Capillary blocking portion 23, capillary blocking portion 23 separate liquid medium channel 13;Capillary portion 41 in capillary portion 31 and third on second It is connected with capillary portion 21 on first, capillary portion 42 is connected with the first lower capillary portion 22 under the second lower capillary portion 32 and third, It equally can timely absorb the condensed water at the top of liquid medium channel 13, condensed water can flow to the via capillary blocking portion 23 Once in capillary portion 22, capillary portion 41 in capillary portion 31 or third can also be flowed directly on second and enter heat-absorbing chamber 111 or dissipate Hot chamber 121, more securely and reliably.In addition, capillary blocking portion 23 is located in liquid medium channel 13 close to heat absorption in the present embodiment One end of chamber 111 can effectively avoid steam from entering in liquid medium channel 13 and cause the cooling medium of reflux to absorb and steam Vapour heat, helps to ensure that heat transference efficiency.
In the utility model, the capillary channel inside capillary part through capillary action can generate liquid medium certain Suction, so as to promote the flowing and dispersion of liquid medium, and it is more quick after water in capillary channel can be made heated Be converted into steam, improve the heat transference efficiency of the utility model, heat-conducting production can be used in capillary part, so that heat absorption The heat that portion 11 absorbs can be in the liquid medium being transmitted in capillary part faster also more evenly, and makes in heat dissipation cavity 121 Steam can faster more evenly be transmitted to radiating part 12, the heat transference efficiency of the utility model can be effectively improved.
It is at a distance between endothermic section 11 and radiating part 12, it can reduce and pass through master between endothermic section 11 and radiating part 12 The heat transfer that plate body 10 carries out keeps the temperature difference between endothermic section 11 and radiating part 12, then improves the generation efficiency of steam And condensation efficiency, guarantee heat transference efficiency, it is at a distance between liquid medium channel 13 and steam channel 14, liquid can be reduced The heat of liquid medium transmitting of the steam of body medium channel 13 by mainboard body 10 into steam channel 14, guarantees to endothermic section 11 cooling, to help to improve the heat transference efficiency of the utility model.
In the present embodiment, there is vertical through-hole 17, liquid medium channel 13 and steam channel 14 are by leading on mainboard body 10 Hole 17 separates, and can more effectively reduce the heat transfer between liquid medium channel 13 and steam channel 14 in this way, improves this The heat transference efficiency of utility model, likewise, between the endothermic section 11 in the present embodiment and radiating part 12 also by through-hole 17 every It opens, equally can more effectively keep the temperature difference between endothermic section 11 and radiating part 12, improve heat transference efficiency.
Liquid medium generallys use pure water in the utility model, other common liquid can also be used certainly, in practical application. Mainboard body 10 in the present embodiment includes upper housing 181 and the lower case 182 that be located in together, heat-absorbing chamber 111, heat dissipation cavity 121, Steam channel 14, liquid medium channel 13 have upper housing 181 and lower case 182 to surround, manufacture easy to process, upper housing 181 It can weld and be fixed together with lower case 182, facilitate processing, can also liquid medium be effectively prevent to leak, have on mainboard body 10 Have a water injection end 19, in production process, water injection end 19 can reserve a water filling port, to after 10 internal water flooding of mainboard body again by the note Mouth of a river closing, convenient for assembly and processing.It is provided with support column 183 in upper housing 181 and/or lower case 182, is propped up after the assembly is completed Dagger 183 is supported between upper housing 181 and lower case 182, helps to improve the structural strength of the utility model, mainboard body 10 The preferable material production of the heat-conductings such as copper, aluminium and metal alloy can be used.
Capillary part in the present embodiment includes upper wick plate 61, lower wick plate 62, capillary block and capillary circle, capillary on first Capillary portion 31 in portion 21, second, capillary portion 51 is respectively positioned on this in wick plate 61 in capillary portion 41 and the 4th in third, under first Capillary portion 42 and the 4th lower capillary portion 52 are respectively positioned in the lower wick plate 62 under lower capillary portion 32 of capillary portion 22, second, third, benefit With capillary circle as the first capillary conducting portion 33, the second capillary conducting portion 43 and third capillary conducting portion 53, capillary snare It is located on support column 183, capillary circle can be positioned, while the upper end of capillary circle is connected in wick plate 61, lower end It is connected in lower wick plate 62, upper wick plate 61 and lower wick plate 62 can be positioned and supported, capillary block work is utilized For capillary blocking portion 23, convenient that capillary part is processed and assembled, certainly, in practical application, capillary part also be may be molded to One entirety uses other common composition forms, it is not limited to this.Upper wick plate 61 in the present embodiment is under Wick plate 62 is micropore copper mesh, and capillary block and capillary circle are micropore copper powder block, its internal micropore is utilized as hair Thin channel has excellent heating conduction, is also convenient for fabricating, certainly, in practical application, cake of gold is can also be used in capillary part Belong to part, mesh grid rotation structure metalwork, sintering metal powder, nano metal part, nanometer plastic part etc. other with pore or The structure of capillary fiber, it is not limited to this.
The quantity in steam channel 14 and liquid medium channel 13 is one in the utility model, certainly, in practical application, The quantity in steam channel 14 and liquid medium channel 13 can also be as needed using the number of the other quantities such as two, three and the two Amount can not also be identical.
The foregoing is merely the preferred embodiments of the utility model, as long as realizing the utility model with essentially identical means The technical solution of purpose belongs within the protection scope of the utility model.

Claims (9)

1. a kind of multichannel loop type temperature-uniforming plate, it is characterised in that:Including a thermally conductive mainboard body (10), the mainboard body (10) there is endothermic section (11) and radiating part (12), there are heat-absorbing chamber (111) in the endothermic section (11), the heat-absorbing chamber (111) there is the liquid medium that can be absorbed heat in, there are heat dissipation cavity (121) in the radiating part (12), in mainboard body (10) It is provided with the liquid medium channel (13) for being used to be connected to the heat-absorbing chamber (111) with heat dissipation cavity (121) and steam channel (14);
The endothermic section (11) can absorb extraneous heat and transfer heat to the liquid medium, and the liquid is situated between The steam generated after matter heat absorption can enter the heat dissipation cavity (121), the heat dissipation by the steam channel (14) Portion (12) can absorb the heat of heat dissipation cavity (121) interior steam, and the liquid that the steam heat dissipation condensation in heat dissipation cavity (121) generates is situated between Matter can be flowed back into via the liquid medium channel (13) in the heat-absorbing chamber (111).
2. a kind of multichannel loop type temperature-uniforming plate according to claim 1, it is characterised in that:In the mainboard body (10) It is provided with capillary part, there is capillary channel in the capillary part, the capillary part includes being located at the liquid medium channel (13) the first capillary portion in, the first capillary portion fill full liquid medium channel (13) or by liquid medium channel (13) Partition, the liquid medium in heat dissipation cavity (121) can be passed through by the capillary channel in the first capillary portion the first capillary portion into Enter the heat-absorbing chamber (111).
3. a kind of multichannel loop type temperature-uniforming plate according to claim 2, it is characterised in that:The capillary part further includes The second capillary portion in the heat-absorbing chamber (111) and the third capillary portion in the heat dissipation cavity (121), heat-absorbing chamber (111) liquid medium in can be absorbed by the second capillary portion, and the liquid medium in heat dissipation cavity (121) can be by third capillary portion It absorbs, the liquid medium in third capillary portion can be flowed into the second capillary portion by the first capillary portion.
4. a kind of multichannel loop type temperature-uniforming plate according to claim 3, it is characterised in that:The heat-absorbing chamber (111) Inside have the first cavity (15), there is the second cavity (16), first cavity (15) and the second cavity in heat dissipation cavity (121) (16) it is connected by the steam channel (14), the liquid medium in heat-absorbing chamber (111) can be by thermogenetic steam Enter in the second cavity (16), the steam in the second cavity (16) can enter described first via the steam channel (14) Cavity (15), the liquid medium generated after the steam condensation in the first cavity (15) can be absorbed by the second capillary portion.
5. a kind of multichannel loop type temperature-uniforming plate according to claim 4, it is characterised in that:The second capillary portion packet Include capillary portion (31) on second be located on heat-absorbing chamber (111) on inner wall and be located under heat-absorbing chamber (111) on inner wall second under Capillary portion (32), first cavity (15) is located on second between capillary portion (31) and second lower capillary portion (32), described Capillary part further include the first capillary conducting portion (33) in first cavity (15), the first capillary conducting portion (33) top is connected with capillary portion (31) on second, and lower part is connected with second lower capillary portion (32), capillary portion (31) on second Interior liquid medium can flow into second lower capillary portion (32) by the first capillary conducting portion (33);
The third capillary portion includes the capillary portion (41) in the third on heat dissipation cavity (121) on inner wall that is located at and is located at heat dissipation cavity (121) capillary portion (42) under the third under on inner wall, second cavity (16) are located at capillary portion (41) and third in third Between lower capillary portion (42), the capillary part further includes the second capillary conducting portion in second cavity (16) (43);The top of the second capillary conducting portion (43) is connected with capillary portion (41) in third, capillary portion under lower part and third (42) it is connected, the liquid medium in third in capillary portion (41) can be flowed under third by the second capillary conducting portion (43) Capillary portion (42).
6. a kind of multichannel loop type temperature-uniforming plate according to claim 5, it is characterised in that:The capillary part further includes Capillary portion (51) on the 4th on inner wall is set on the steam channel (14), is arranged under steam channel (14) on inner wall The third capillary of 4th lower capillary portion (52) and setting on the described 4th under capillary portion (51) and the 4th between capillary portion (52) Conducting portion (53);The top of the third capillary conducting portion (53) is connect with capillary portion (51) on the 4th, hair under lower part and the 4th Thin portion (52) connection, the liquid medium on the 4th in capillary portion (51) can flow into the by the third capillary conducting portion (53) Four lower capillary portion (52);On described second in capillary portion (31) and third capillary portion (41) with the described the 4th on capillary portion (51) it is connected, described second descends capillary portion (42) under capillary portion (32) and third to descend capillary portion (52) phase with the described the 4th Even.
7. a kind of multichannel loop type temperature-uniforming plate according to claim 5, it is characterised in that:The first capillary portion packet It includes capillary portion (21) on first on the upper inner wall of the liquid medium channel (13), be located at the liquid medium channel (13) first on lower inner wall descends capillary portion (22) and is located on first between capillary portion (21) and first lower capillary portion (22) Capillary blocking portion (23), the capillary blocking portion (23) by liquid medium channel (13) separate;Capillary portion on described second (31) and in third capillary portion (41) are connected with capillary portion (21) on described first, described second lower capillary portion (32) and Capillary portion (42) are connected with described first lower capillary portion (22) under third.
8. a kind of multichannel loop type temperature-uniforming plate according to claim 1, it is characterised in that:The endothermic section (11) and It is at a distance between radiating part (12), it is at a distance between the liquid medium channel (13) and steam channel (14).
9. a kind of multichannel loop type temperature-uniforming plate according to claim 8, it is characterised in that:On the mainboard body (10) With vertical through-hole (17), the liquid medium channel (13) and steam channel (14) are separated by the through-hole (17), The endothermic section (11) and radiating part (12) is separated also by the through-hole (17).
CN201820424199.4U 2018-03-27 2018-03-27 A kind of multichannel loop type temperature-uniforming plate Active CN208139909U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820424199.4U CN208139909U (en) 2018-03-27 2018-03-27 A kind of multichannel loop type temperature-uniforming plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820424199.4U CN208139909U (en) 2018-03-27 2018-03-27 A kind of multichannel loop type temperature-uniforming plate

Publications (1)

Publication Number Publication Date
CN208139909U true CN208139909U (en) 2018-11-23

Family

ID=64290533

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820424199.4U Active CN208139909U (en) 2018-03-27 2018-03-27 A kind of multichannel loop type temperature-uniforming plate

Country Status (1)

Country Link
CN (1) CN208139909U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108332593A (en) * 2018-03-27 2018-07-27 中山伟强科技有限公司 A kind of multichannel loop type temperature-uniforming plate
CN110763059A (en) * 2019-10-16 2020-02-07 东莞领杰金属精密制造科技有限公司 Ultrathin uniform temperature plate and manufacturing method thereof
TWI713435B (en) * 2018-12-21 2020-12-11 訊凱國際股份有限公司 Heat dissipation device having irregular shape

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108332593A (en) * 2018-03-27 2018-07-27 中山伟强科技有限公司 A kind of multichannel loop type temperature-uniforming plate
TWI713435B (en) * 2018-12-21 2020-12-11 訊凱國際股份有限公司 Heat dissipation device having irregular shape
CN110763059A (en) * 2019-10-16 2020-02-07 东莞领杰金属精密制造科技有限公司 Ultrathin uniform temperature plate and manufacturing method thereof

Similar Documents

Publication Publication Date Title
CN208139909U (en) A kind of multichannel loop type temperature-uniforming plate
TWI262285B (en) Loop-type heat exchange apparatus
CN100480611C (en) Heat pipe
CN208655616U (en) A kind of phase transformation chip radiator
CN100498184C (en) Heat pipe
TW200907273A (en) Evaporator, loop heat pipe module and heat generating apparatus
CN205726840U (en) Heat radiation module
CN1936481A (en) Heat pipe and radiating model group
CN103307917A (en) Micro-channel radiator
CN107241887B (en) A kind of micro-channel evaporator with staggeredly sawtooth pattern rib wall
CN108167792A (en) A kind of closed micro jet flow fine channel LED cooling devices
CN101995183A (en) Flat heat pipe
TWI443294B (en) Heat take-out device
CN108332593A (en) A kind of multichannel loop type temperature-uniforming plate
CN101776407A (en) Flat-plate loop heat pipe
CN106714509B (en) Radiator
CN207422134U (en) The unlimited efficient COBLED luminescence components liquid-gas phase transition radiating module in direction
CN107094360B (en) A kind of flat-plate minitype loop circuit heat pipe system
CN206329930U (en) A kind of cooling device of LED array device
TW201719101A (en) Heat dissipation device
CN100513975C (en) Micro slot cluster liquid absorption chip, micro slot cluster liquid absorption core and integrated heat thermal tube radiator
CN209546220U (en) Ultra-thin heat-transfer device
CN106024736B (en) Integrated low-grade fever tube radiator based on MEMS technology
TWM399307U (en) Looped heat dissipation module
CN203642761U (en) Super-thermal-conduction column

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant