CN219577673U - Vapor chamber - Google Patents

Vapor chamber Download PDF

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Publication number
CN219577673U
CN219577673U CN202320301799.2U CN202320301799U CN219577673U CN 219577673 U CN219577673 U CN 219577673U CN 202320301799 U CN202320301799 U CN 202320301799U CN 219577673 U CN219577673 U CN 219577673U
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cover plate
plate
bottom shell
elastic supporting
cavity
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CN202320301799.2U
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Chinese (zh)
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鲁靖宜
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Changzhi Zhuoyi Hengtong Information Security Co ltd
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Changzhi Zhuoyi Hengtong Information Security Co ltd
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Abstract

The utility model provides a soaking plate which comprises a bottom shell, a cover plate, two capillary structure layers, a plurality of elastic supporting pieces and condensate, wherein the cover plate is covered on the bottom shell to form a cavity, and the condensate is positioned in the cavity; the two capillary structure layers are positioned in the cavity and are respectively arranged on the inner surfaces of the bottom shell and the cover plate; the plurality of elastic supporting pieces are positioned in the cavity, the two capillary structure layers are respectively provided with a plurality of through holes corresponding to the plurality of elastic supporting pieces, and two ends of each elastic supporting piece respectively penetrate through the corresponding through holes and respectively prop against the inner surfaces of the bottom shell and the cover plate. The soaking plate can deform under the stress, so that the soaking plate can be in closer contact with a heating device, the heat conduction efficiency can be improved, and the assembly error can be reduced.

Description

Vapor chamber
Technical Field
The utility model relates to the field of heat dissipation plates, in particular to a soaking plate.
Background
With rapid development of technology, electronic products have become indispensable for life and work of people, and the electronic products include notebook computers, tablet computers, smart phones, wearable electronic devices and the like.
Nowadays, the size of electronic products is smaller and smaller, and the power consumption of the electronic products is higher and higher, so that the working temperature of related electronic devices faces serious overtemperature risks. Therefore, the heat dissipation problem is important to maintain the life and reliability of the electronic product. In order to quickly transfer heat from a chip on a circuit board of an electronic product to a heat sink, the chip is generally directly attached to the heat sink. Because of the existence of tolerance between the chip and the radiator, a larger gap needs to be arranged, and at present, an interface material is generally used for directly filling the gap, but the interface material is generally small in heat conduction coefficient, so that heat on the chip is difficult to conduct effectively, and then the overtemperature risk exists. And the heat conduction structure for heat dissipation of the heating element of the electronic product at present can only conduct vertical heat dissipation, so that heat dissipation is uneven, and normal operation and service life of the heating element are affected. In addition, the existing heat conduction structure cannot be in close contact with the heating element, and the problem of poor heat dissipation effect can be caused.
The Vapor Chamber (VC) is also called a vapor chamber, can be used for heat dissipation of electronic products such as smart phones, tablet computers, high-grade light and thin notebook computers, wearable electronic devices and the like, has the advantage of rapid heat conduction, and can transfer heat from a hot spot to the whole surface for heat dissipation. However, the size of the temperature equalization plate in the prior art is usually fixed, assembly errors may exist during assembly, and pressure cannot be provided so that the temperature equalization plate is in close enough contact with the chip and the shell, and heat conduction efficiency needs to be further improved.
Disclosure of Invention
The utility model aims to provide a soaking plate which can be in closer contact with a heating device, can improve heat conduction efficiency and reduce assembly errors.
In order to achieve the above-mentioned objective, the present utility model provides a soaking plate, which includes a bottom shell, a cover plate, two capillary structure layers, a plurality of elastic supporting members, and condensate, wherein the cover plate is covered on the bottom shell to form a chamber, and the condensate is located in the chamber; the two capillary structure layers are positioned in the cavity and are respectively arranged on the inner surfaces of the bottom shell and the cover plate; the plurality of elastic supporting pieces are positioned in the cavity, the two capillary structure layers are respectively provided with a plurality of through holes corresponding to the plurality of elastic supporting pieces, and two ends of each elastic supporting piece respectively penetrate through the corresponding through holes and respectively prop against the inner surfaces of the bottom shell and the cover plate.
The bottom shell comprises a bottom plate and a plurality of side walls connected with the bottom plate, and one of the two capillary structure layers is arranged on the inner surface of the bottom plate.
The cross-sectional shape of the side wall is wavy.
The two capillary structure layers are respectively welded on the inner surfaces of the bottom plate and the cover plate.
The two capillary structure layers are adhered to the inner surfaces of the bottom plate and the cover plate through heat conduction adhesives respectively.
The elastic support is a spring.
The plurality of elastic supporting pieces are arranged in the cavity in an array mode.
The number of the elastic supporting pieces is 33, and the elastic supporting pieces are arranged in 3 rows and 11 columns.
The bottom shell and the cover plate are made of metal.
The bottom shell and the cover plate are made of pure copper or copper alloy.
The utility model has the beneficial effects that: the utility model discloses a vapor chamber, which comprises a bottom shell, a cover plate, two capillary structure layers, a plurality of elastic supporting pieces and condensate, wherein the cover plate is covered on the bottom shell to form a cavity, and the condensate is positioned in the cavity; the two capillary structure layers are positioned in the cavity and are respectively arranged on the inner surfaces of the bottom shell and the cover plate; the plurality of elastic supporting pieces are positioned in the cavity, the two capillary structure layers are respectively provided with a plurality of through holes corresponding to the plurality of elastic supporting pieces, and two ends of each elastic supporting piece respectively penetrate through the corresponding through holes and respectively prop against the inner surfaces of the bottom shell and the cover plate. The soaking plate can deform under the stress, so that the soaking plate can be in closer contact with a heating device, the heat conduction efficiency can be improved, and the assembly error can be reduced.
Drawings
For a further understanding of the nature and technical aspects of the present utility model, reference should be made to the following detailed description of the utility model and to the accompanying drawings, which are provided for purposes of reference only and are not intended to limit the utility model.
In the drawings of which there are shown,
FIG. 1 is a perspective view of a vapor chamber of the present utility model;
FIG. 2 is an exploded view of the vapor chamber of the present utility model;
FIG. 3 is a cross-sectional view of the vapor chamber of the present utility model;
FIG. 4 is a schematic view of the vapor chamber of the present utility model in use.
Detailed Description
In order to further explain the technical means adopted by the present utility model and the effects thereof, the following detailed description is given with reference to the preferred embodiments of the present utility model and the accompanying drawings.
Referring to fig. 1, 2 and 3, the present utility model provides a soaking plate, which includes a bottom shell 1, a cover plate 3, two capillary structure layers 5, a plurality of elastic supporting members 7, and a condensate 9, wherein the cover plate 3 is covered on the bottom shell 1 to form a chamber 10, and the condensate 9 is located in the chamber 10. Two capillary structure layers 5 are located in the chamber 10 and are respectively arranged on the inner surfaces of the bottom shell 1 and the cover plate 3. The plurality of elastic supporting members 7 are located in the chamber 10, the two capillary structure layers 5 are respectively provided with a plurality of through holes 51 corresponding to the plurality of elastic supporting members 7, and two ends of each elastic supporting member 7 respectively pass through the corresponding through holes 51 and respectively prop against the inner surfaces of the bottom shell 1 and the cover plate 3.
Specifically, the bottom shell 1 includes a bottom plate 12 and a plurality of side walls 14 connected to the bottom plate 12, and the cross-sectional shape of the side walls 14 is wavy. One of the two wicking layers 5 is provided on the inner surface of the bottom plate 12. Further, the two capillary structure layers 5 are bonded to the inner surfaces of the bottom plate 12 and the cover plate 3 by welding, respectively, or the two capillary structure layers 5 are bonded to the inner surfaces of the bottom plate 12 and the cover plate 3 by heat conductive adhesive, respectively.
In particular, the elastic support 7 is a spring. In some embodiments of the utility model, several elastic supports 7 are arranged in an array within the chamber 10. Preferably, the number of the elastic supports 7 is 33, arranged in 3 rows and 11 columns.
Specifically, the materials of the bottom case 1 and the cover plate 3 are metals, preferably pure copper or copper alloy.
The working principle of the vapor chamber A of the utility model is as follows: the heat emitted by the heat generating device C is transferred to the outer surface of the soaking plate a (for example, the outer surface of the cover plate 3) through direct contact with the soaking plate a, and the capillary structure layer 5 positioned on the inner surface of the cover plate 3 transfers the heat to condensate 9 (for example, water) in the chamber 10, and the condensate 9 absorbs the heat to evaporate into gas, thereby taking away the heat. Because of the latent heat of the condensed gas (e.g. water vapor), the hot gas in the chamber 10 will move along the chamber 10 to the inner wall (the capillary layer 5 on the inner surface of the bottom plate 12) with a lower temperature, and will liquefy and release heat energy, and these condensed liquids 9 will dissipate heat through the capillary layer 5 on the inner surface of the bottom plate 12, and because the distance between the two capillary layers 5 will not be too large, there will be a certain capillary force between them, and after the heat dissipation of the condensed liquid 9 will return to the capillary layer 5 on the inner surface of the cover plate 3 through the capillary force, and will absorb heat again, and circulate in this way, so as to derive the heat emitted by the heat generating device C.
When the soaking plate a is used, as shown in fig. 4, the soaking plate a can be placed between the casing B and the heating device C, and because the elastic supporting piece 7 can be compressed, the soaking plate a can be stressed and deformed, and the wavy side wall 14 is also favorable for bearing a certain pressure, so that the pressure can be properly applied to the casing B and the heating device C, so that the soaking plate a can be in closer contact with the casing B and the heating device C, the heat conduction efficiency can be improved, and the assembly error can be reduced.
In summary, the soaking plate provided by the utility model comprises a bottom shell, a cover plate, two capillary structure layers, a plurality of elastic supporting pieces and condensate, wherein the cover plate is covered on the bottom shell to form a cavity, and the condensate is positioned in the cavity; the two capillary structure layers are positioned in the cavity and are respectively arranged on the inner surfaces of the bottom shell and the cover plate; the plurality of elastic supporting pieces are positioned in the cavity, the two capillary structure layers are respectively provided with a plurality of through holes corresponding to the plurality of elastic supporting pieces, and two ends of each elastic supporting piece respectively penetrate through the corresponding through holes and respectively prop against the inner surfaces of the bottom shell and the cover plate. The soaking plate can deform under the stress, so that the soaking plate can be in closer contact with a heating device, the heat conduction efficiency can be improved, and the assembly error can be reduced.
In the above, it is obvious to those skilled in the art that various other corresponding changes and modifications can be made according to the technical scheme and the technical idea of the present utility model, and all such changes and modifications are intended to fall within the scope of the appended claims.

Claims (10)

1. The soaking plate is characterized by comprising a bottom shell (1), a cover plate (3), two capillary structure layers (5), a plurality of elastic supporting pieces (7) and condensate (9), wherein the cover plate (3) is covered on the bottom shell (1) to form a cavity (10), and the condensate (9) is positioned in the cavity (10); the two capillary structure layers (5) are positioned in the cavity (10) and are respectively arranged on the inner surfaces of the bottom shell (1) and the cover plate (3); the plurality of elastic supporting pieces (7) are positioned in the cavity (10), the two capillary structure layers (5) are respectively provided with a plurality of through holes (51) corresponding to the plurality of elastic supporting pieces (7), and two ends of each elastic supporting piece (7) respectively penetrate through the corresponding through holes (51) and respectively prop against the inner surfaces of the bottom shell (1) and the cover plate (3).
2. A vapor chamber as claimed in claim 1, characterized in that the bottom shell (1) comprises a bottom plate (12) and a plurality of side walls (14) connected to the bottom plate (12), one of the two capillary layers (5) being provided on the inner surface of the bottom plate (12).
3. A soaking plate according to claim 2, characterized in that the cross-sectional shape of the side walls (14) is wave-shaped.
4. A vapor chamber as claimed in claim 2, characterized in that the two capillary layers (5) are joined to the inner surfaces of the base plate (12) and the cover plate (3), respectively, by welding.
5. A vapor chamber as claimed in claim 2, characterized in that the two capillary layers (5) are glued to the inner surfaces of the base plate (12) and the cover plate (3) by means of a heat-conducting glue, respectively.
6. A soaking plate according to claim 1, characterized in that the elastic support (7) is a spring.
7. A soaking plate according to claim 1, characterized in that several elastic supports (7) are arranged in an array in the chamber (10).
8. A soaking plate according to claim 7, characterized in that the number of elastic supports (7) is 33, arranged in 3 rows and 11 columns.
9. A vapor chamber according to claim 1, wherein the bottom shell (1) and the cover plate (3) are made of metal.
10. A soaking plate according to claim 9, characterized in that the bottom shell (1) and the cover plate (3) are made of pure copper or copper alloy.
CN202320301799.2U 2023-02-21 2023-02-21 Vapor chamber Active CN219577673U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320301799.2U CN219577673U (en) 2023-02-21 2023-02-21 Vapor chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320301799.2U CN219577673U (en) 2023-02-21 2023-02-21 Vapor chamber

Publications (1)

Publication Number Publication Date
CN219577673U true CN219577673U (en) 2023-08-22

Family

ID=87649806

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320301799.2U Active CN219577673U (en) 2023-02-21 2023-02-21 Vapor chamber

Country Status (1)

Country Link
CN (1) CN219577673U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117500244A (en) * 2023-11-25 2024-02-02 深圳威铂驰热技术有限公司 Heat transfer structure for strengthening activation of porous capillary structure, radiator and server

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117500244A (en) * 2023-11-25 2024-02-02 深圳威铂驰热技术有限公司 Heat transfer structure for strengthening activation of porous capillary structure, radiator and server

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