CN217280746U - Heat radiation structure and electronic equipment of chip - Google Patents
Heat radiation structure and electronic equipment of chip Download PDFInfo
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- CN217280746U CN217280746U CN202123123854.3U CN202123123854U CN217280746U CN 217280746 U CN217280746 U CN 217280746U CN 202123123854 U CN202123123854 U CN 202123123854U CN 217280746 U CN217280746 U CN 217280746U
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Abstract
The utility model discloses a heat radiation structure of a chip and an electronic device, the heat radiation structure of the chip comprises a circuit board and a chip, a heat conduction mechanism is filled between the chip and a shell, the heat conduction mechanism comprises a connecting component, a first heat conduction layer, a metal heat conduction piece and a second heat conduction layer; the first heat conduction layer is arranged between the chip and the metal heat transfer element, and the connecting component is arranged to connect the metal heat transfer element and the circuit board; the second heat-conducting layer sets up metal heat transfer spare with between the shell, the second heat-conducting layer includes the cotton filling member of graphite alkene bubble, the cotton filling member of graphite alkene bubble sets up to be in the extrusion state and hugs closely the shell. The electronic equipment comprises the heat dissipation structure of the chip. The utility model relates to a chip heat dissipation field provides a heat radiation structure and electronic equipment of chip, has both guaranteed the heat dissipation, utilizes the cotton packing member compressible volume of graphite alkene bubble big, advantage that compressive force is little again, can avoid the stress problem.
Description
Technical Field
The utility model relates to a chip heat dissipation field, more specifically relates to a heat radiation structure and electronic equipment of chip.
Background
For the intelligent terminal box with natural heat dissipation, the heat dissipation of the chip in the intelligent terminal box needs to be conducted to the shell through the intelligent terminal box, and in order to guarantee the heat conduction, a heat conducting pad needs to be filled between the chip and the shell.
When the distance tolerance between the circuit board and the shell is large, the circuit board is deformed by selecting the thick heat conducting pad, the chip welding point has the risk of breakage, and the thin heat conducting pad has the risk of poor contact. Certainly, the stress risk can be solved by selecting a heat-conducting gel scheme, but the heat-conducting gel needs to be smeared by a dispenser, the full-automatic dispenser is expensive, the manufacturing cost is high, the efficiency is low if manual gluing is carried out, the consistency of the manual gluing is poor, and serious heat dissipation risk is generated if the glue quantity cannot meet the design requirement.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a heat radiation structure of a chip, which comprises a circuit board and a chip arranged on the circuit board, wherein a heat conduction mechanism is filled between the chip and a shell, the heat conduction mechanism comprises a connecting component, a first heat conduction layer, a metal heat conduction piece and a second heat conduction layer which are sequentially stacked;
the first heat conduction layer is arranged between the chip and the metal heat transfer element, and the connecting component is arranged to connect the metal heat transfer element and the circuit board so as to press the first heat conduction layer;
the second heat-conducting layer sets up metal heat transfer spare with between the shell, the second heat-conducting layer includes the cotton filling member of graphite alkene bubble, the cotton filling member of graphite alkene bubble sets up to be in the extrusion state and hugs closely the shell.
The utility model provides a possible design, the cotton filler of graphite alkene bubble includes a plurality of graphite alkene bubble cotton monomers, the cotton monomer of graphite alkene bubble is rectangular shape subassembly, the cotton monomer of graphite alkene bubble is by the cotton core of bubble and parcel the graphene film of the cotton core of bubble is constituteed.
A possible design is a plurality of the cotton monomer of graphite alkene bubble sets up side by side along first direction, and is adjacent the cotton monomer of graphite alkene bubble is hugged closely.
In a possible design, the second heat conduction layer further includes a heat conduction substrate sandwiched between the graphene foam filler and the metal heat transfer element.
In one possible embodiment, the heat conducting substrate is bonded to the metal heat transfer element and the graphene foam filler, respectively.
In one possible design, the area of the heat-conducting substrate is greater than or equal to the area of the graphene foam filling member.
One possible design is that the connecting assembly comprises a pin and an elastic element, the pin penetrates through the circuit board and the metal heat transfer element, the elastic element is sleeved on the pin, and the elastic element is arranged on one side of the circuit board, which faces away from the chip;
the chip comprises a pin, a metal heat transfer element and a chip, wherein one end of the pin is provided with an elastic end, the metal heat transfer element is provided with a through hole for the pin to penetrate through, a countersunk groove is formed in one end, back to the chip, of the through hole, and the elastic end is arranged in the countersunk groove.
In one possible embodiment, the thickness of the first heat conducting layer is smaller than the thickness of the second heat conducting layer, and the first heat conducting layer is configured as a heat conducting pad, a heat conducting silicone grease, a heat conducting gel, or a heat conducting phase change material.
A possible design, the area of metal heat transfer member is greater than the area of chip, metal heat transfer member with be equipped with a plurality ofly between the circuit board coupling assembling, it is a plurality of coupling assembling evenly sets up the chip periphery.
An embodiment of the utility model provides an electronic equipment, including the heat radiation structure of foretell chip.
The utility model discloses heat radiation structure passes through metal heat transfer spare and the cotton filling member of graphite alkene bubble, gives the shell with the heat transfer of chip, has both guaranteed the heat dissipation, utilizes the cotton advantage that the compressible volume of graphite alkene bubble is big, compressive force is little again, can avoid the stress problem.
The utility model discloses metal heat transfer member among the heat radiation structure can reduce the thermal power density of heat transfer route.
The utility model discloses heat radiation structure through the coupling assembling of pin and elastic component for the distance non-fixed spacing between metal heat transfer member and the circuit board also can extrude first heat transfer layer, guarantees to transfer heat, reduces the temperature difference of both sides.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the embodiments of the present invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the embodiments of the invention and not to limit the embodiments of the invention.
Fig. 1 is a schematic view of a heat dissipation structure according to an embodiment of the present invention;
FIG. 2 is a partial schematic view of the heat dissipation structure shown in FIG. 1;
fig. 3 is a schematic view of the graphene foam filling member in fig. 1.
Reference numerals: 100-shell, 200-second heat conduction layer, 201-graphene foam filling piece, 202-heat conduction base material, 203-graphene foam monomer, 204-foam core material, 205-graphene film, 300-metal heat transfer piece, 301-through hole, 302-countersunk groove, 400-first heat conduction layer, 500-chip, 600-circuit board, 700-connection assembly, 701-pin, 702-elastic piece, 703-elastic end and 704-nut.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
Please refer to fig. 1 to fig. 3, which illustrate a heat dissipation structure of a chip according to the present invention. The heat dissipation structure is suitable for natural heat dissipation of high-power-density chips with large tolerance intervals, and comprises a circuit board 600 and a chip 500 arranged on the circuit board, wherein a heat conduction mechanism is filled between the chip 500 and a shell 600, and the heat conduction mechanism comprises a connecting component 700, and a first heat conduction layer 400, a metal heat transfer element 300 and a second heat conduction layer 200 which are sequentially stacked. The first heat conduction layer 400 is disposed between the chip 500 and the metal heat transfer element 300, and the connection assembly 700 is disposed to connect the metal heat transfer element 300 and the circuit board 500 to press the first heat conduction layer 400 to ensure heat transfer. The second heat conduction layer 200 is disposed between the metal heat transfer element 300 and the housing 100, the second heat conduction layer 200 includes a graphene foam filler 201, and the graphene foam filler 201 is disposed in a pressing state and clings to the housing 100. From this, this heat radiation structure passes through metal heat transfer piece 300 and the cotton filler 201 of graphite alkene bubble, gives shell 100 with the heat transfer of chip 500, has both guaranteed the heat dissipation, utilizes the cotton filler compressible volume of graphite alkene bubble advantage big, that the compressive force is little again, can avoid the stress problem.
As shown in fig. 1, the circuit board 600 is fixed in the casing 100, and is provided with the chip 500, the chip 500 is close to the inner wall of one side of the casing 100, and the heat conducting mechanism is provided between the chip 500 and the casing 100, so that the heat of the chip 500 can be transferred to the casing 100, and the heat of the chip 500 can be dissipated. The metal heat transfer member 300 is a thin metal plate, and may be a copper plate, but is not limited to a copper plate, and may also be a metal plate having a good heat transfer effect, such as an aluminum plate or an iron plate, or a VC soaking plate. Since the chip 500 and the metal heat transfer element 300 are both made of hard materials and are affected by the roughness of the surface, and even if the chip 500 and the metal heat transfer element are mutually offset, the chip and the metal heat transfer element are difficult to be fully attached, and the heat transfer effect is difficult to be ensured, the first heat conduction layer 400 with elasticity is added between the chip 500 and the metal heat transfer element 300 to make up for the problem of insufficient attachment. Due to the manufacturing variations and mounting position variations of the metal heat transfer element 300, the circuit board 600 and the chip 500, there is a structural gap tolerance between the metal heat transfer element 300 and the housing 100 after mounting, and therefore, the second heat conduction layer 200 having elasticity is added between the metal heat transfer element 300 and the housing 100 to compensate for the structural gap tolerance. Therefore, the heat dissipation structure sequentially comprises, from bottom to top, a circuit board 600, a chip 500, a first heat conduction layer 400, a metal heat transfer element 300, a second heat conduction layer 500 and a housing 100.
As shown in fig. 1, a gap is formed between the circuit board 600 and the metal heat transfer member 300, and between the metal heat transfer member 300 and the casing 100, and the metal heat transfer member 300 is integrally fixed to the circuit board 600 by a connecting member 700. The first heat conducting layer 400 and the second heat conducting layer 200 are respectively and centrally arranged on the upper surface and the lower surface of the metal heat transfer element 300, the size of the metal heat transfer element 300 is larger than that of the chip 500, and the metal heat transfer element 300 can reduce the thermal power density. The connection assemblies 700 are arranged in a plurality, and the connection assemblies 700 are uniformly arranged on the periphery of the chip 500, so that the horizontal direction is stable and limited, and the connection assemblies do not need to penetrate through the first heat conduction layer 400 and the second heat conduction layer 200. Any connecting component 700 comprises a pin 701 and an elastic component 702, the pin 701 penetrates through the circuit board 600 and the metal heat transfer component 300, and two ends of the pin 701 respectively protrude out of the circuit board 600 and the metal heat transfer component 300, the elastic component 702 is a spring and is sleeved on the pin 701, two ends of the pin 701 are respectively provided with an elastic end 703 and a nut 704 to form limiting, wherein the pin 701 penetrates through the circuit board 600 and the metal heat transfer component 300, the metal heat transfer component 300 is respectively and correspondingly provided with a through hole 301 for penetration, and the circuit board 600 is also correspondingly provided with an opening. The elastic end 703 is tapered and abuts against the upper surface of the metal heat transfer element 300 to limit the pin 701 downward, the nut abuts against the lower side of the circuit board 600, the elastic element 702 is disposed on the side of the circuit board 600 opposite to the chip 500, and two ends of the elastic element respectively abut against the nut 704 and the circuit board 600 to provide a force for the pin 701 to move away from the casing 100, so as to pull the metal heat transfer element 300 to approach the chip 500. And the amount of compression of the resilient member 702 can be adjusted as the nut is rotated.
As shown in fig. 2, the metal heat transfer element 300 is provided with a countersunk groove 302 at an end surface of a side opposite to the chip 500, the countersunk groove 302 corresponds to the through hole 301, wherein one end of the through hole 301 is located at a bottom of the countersunk groove, the elastic end 703 of the pin 701 is located in the countersunk groove 302, and the countersunk groove 302 provides an installation space for the elastic end 703 of the pin 701. In some exemplary embodiments, the metal heat transfer element 300 is not provided with countersunk grooves 302, and the elastic tips 703 of the pins 701 directly abut the end surface of the metal heat transfer element 300. As described above, under the action of the elastic element 702, the gap between the circuit board 600 and the metal heat transfer element 300 is variable in size, so as to eliminate the tolerance of the structural gap between the chip 500 and the metal heat transfer element 300, so that the thickness of the first heat conduction layer 400 can be reduced as much as possible, the heat transfer effect can be improved, the metal heat transfer element 300 does not need to be finished to ensure the tolerance, the overall structure is convenient to process, and the manufacturing cost is relatively low. The cross section of the first heat conducting layer 400 is the same as that of the chip 500 to ensure heat transfer, while the cross section of the second heat conducting layer 200 is smaller than that of the metal heat transfer member 300, so that pins do not need to penetrate through the second heat conducting layer 200, and the processing and production are convenient. The first heat conduction layer 400 and the second heat conduction layer 500 are made of heat conduction materials, the first heat conduction layer 400 is made of heat conduction phase-change materials with lower heat conduction temperature difference performance, but not limited to the heat conduction materials, heat conduction pads, heat conduction silicone grease, heat conduction gel and the like can also be adopted in other examples, and multiple heat conduction materials are taken into consideration, the thickness of the first heat conduction layer 400 is set to be 0.1-0.2mm, which is about one tenth of the thickness of a heat conduction piece commonly used at present, the first heat conduction layer 400 made of the heat conduction phase-change materials can be in a semi-liquefied state after being heated, under the extrusion action of the elastic piece 702, the thickness of the first heat conduction layer 400 can be further reduced, and the heat dissipation effect can be further improved.
Therefore, the heat dissipation structure can utilize the connection assembly 700 to press the metal heat transfer element 300 to the first heat conduction layer 400, so that the structural gap tolerance between the chip 500 and the metal heat transfer element 300 can be avoided, the thickness of the first heat conduction layer 400 can be reduced as much as possible, the temperature difference caused by the first heat conduction layer 400 is reduced, and the chip 500 is guaranteed to dissipate heat quickly. The connecting assembly 700 can eliminate the structural clearance tolerance between the chip 500 and the metal heat transfer element 300, and simultaneously, the metal heat transfer element 300 does not need to be finished to ensure the tolerance, the whole structure is convenient to process, and the manufacturing cost is relatively low. The heat dissipation structure further utilizes the pin 701 to connect the circuit board 500 and the metal heat transfer element 300, and horizontally limits the metal heat transfer element 300 to avoid displacement during transportation or use.
As shown in fig. 2 and fig. 3, the second heat conduction layer 200 further includes a heat conduction substrate 202, the heat conduction substrate 202 is sandwiched between the graphene foam filling member 201 and the metal heat conduction member 300, and two side end surfaces of the heat conduction substrate 202 are pre-bonded with the graphene foam filling member 201 and the metal heat conduction member 300 respectively. In addition, the thermal conductive substrate 202 is connected to the graphene foam filling member 200, but not limited thereto, for example, the thermal conductive substrate 202 is connected to the graphene foam filling member 200 more than the graphene foam filling member 200, so that when the graphene foam filling member 200 is compressed to become more flat and wider, the thermal conductive substrate 202 can still cover the entire graphene foam filling member 200. The graphene foam filling member 200 comprises a plurality of graphene foam single bodies 201 arranged side by side, wherein each graphene foam single body 201 is a strip-shaped assembly and linearly extends along a second direction, the plurality of graphene foam single bodies 201 are sequentially arranged along a first direction, and adjacent graphene foam single bodies 201 are tightly attached; this cotton monomer 201 of graphite alkene bubble's quantity is more, and the heat conduction effect is better, so adopt many to make up, and the designer can increase this cotton monomer 201 of graphite alkene bubble according to the heat production condition of chip 5 in an appropriate amount. Specifically, the graphene foam monomer 201 comprises a foam core 203 and a graphene film 204 wrapping the foam core 203. The foam core material 203 is made of foam, has large compression amount and small compression force, is compressed and has a small volume, namely, an extrusion state, and the graphene film 204 is made of graphene, can transfer heat and has good heat conduction performance. Therefore, when the heat dissipation structure is used, the heat of the chip 5 is sequentially transferred to the graphene foam monomer 201 through the first heat conduction layer 400, the metal heat transfer element 300 and the heat conduction substrate 202, and the graphene foam monomer 201 further transfers the heat to the housing 100 by using the graphene film 204. This cotton monomer 201 of graphite alkene bubble can satisfy the heat dissipation to avoid circuit board 600 to warp, avoid the stress risk.
In some exemplary embodiments, an electronic device includes the heat dissipation structure described above.
Combine above-mentioned embodiment, the utility model discloses heat radiation structure passes through metal heat transfer spare and the cotton filling member of graphite alkene bubble, gives the shell with the heat transfer of chip, has both guaranteed the heat dissipation, utilizes the cotton filling member of graphite alkene bubble compressible volume big, advantage that compressive force is little again, can avoid the stress problem. The utility model discloses metal heat transfer member among the heat radiation structure can reduce the thermal power density of heat transfer route. The utility model discloses heat radiation structure through the coupling assembling of pin and elastic component for the distance non-fixed spacing between metal heat transfer member and the circuit board also can extrude first heat transfer layer, guarantees to transfer heat, reduces the temperature difference of both sides.
In the description of the present invention, it should be noted that the terms "upper", "lower", "one side", "the other side", "one end", "the other end", "side", "opposite", "four corners", "periphery", "mouth" word structure "and the like indicate the directions or positional relationships based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the structure referred to has a specific direction, is constructed and operated in a specific direction, and thus, cannot be construed as limiting the present invention.
In the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "connected," "directly connected," "indirectly connected," "fixedly connected," "mounted," and "mounted" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; the terms "mounted," "connected," and "fixedly connected" may be directly connected or indirectly connected through intervening media, or may be connected through two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Although the embodiments of the present invention have been described above, the description is only for the convenience of understanding the present invention, and the present invention is not limited thereto. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A heat radiation structure of a chip comprises a circuit board and a chip arranged on the circuit board, wherein a heat conduction mechanism is filled between the chip and a shell, and the heat radiation structure is characterized in that the heat conduction mechanism comprises a connecting component, a first heat conduction layer, a metal heat conduction piece and a second heat conduction layer which are sequentially stacked;
the first heat conduction layer is arranged between the chip and the metal heat transfer element, and the connecting component is arranged to connect the metal heat transfer element and the circuit board so as to press the first heat conduction layer;
the second heat-conducting layer sets up metal heat-transfer piece with between the shell, the second heat-conducting layer includes the cotton filling member of graphite alkene bubble, the cotton filling member of graphite alkene bubble sets up to be in the extrusion state and hugs closely the shell.
2. The heat dissipation structure of the chip according to claim 1, wherein the graphene foam filling member includes a plurality of graphene foam monomers, the graphene foam monomers are strip-shaped components, and the graphene foam monomers are composed of a foam core material and a graphene film wrapping the foam core material.
3. The heat dissipation structure of the chip as claimed in claim 2, wherein the plurality of graphene foam monomers are arranged side by side along a first direction, and adjacent graphene foam monomers are tightly attached to each other.
4. The heat dissipation structure of the chip as claimed in claim 2, wherein the second thermal conductive layer further comprises a thermal conductive substrate sandwiched between the graphene foam filler and the metal thermal conductive member.
5. The heat dissipation structure of the chip as claimed in claim 4, wherein the heat conductive substrate is bonded to the metal heat transfer member and the graphene foam filling member, respectively.
6. The heat dissipation structure of the chip as claimed in claim 4, wherein the area of the heat conductive substrate is greater than or equal to the area of the graphene foam filling member.
7. The heat dissipation structure of chip as claimed in claim 2, wherein the connection assembly includes a pin and an elastic member, the pin penetrates through the circuit board and the metal heat transfer member, the elastic member is sleeved on the pin, and the elastic member is disposed on a side of the circuit board facing away from the chip;
the chip comprises a pin, a metal heat transfer element and a chip, wherein one end of the pin is provided with an elastic end, the metal heat transfer element is provided with a through hole for the pin to penetrate through, a countersunk groove is formed in one end, back to the chip, of the through hole, and the elastic end is arranged in the countersunk groove.
8. The heat dissipation structure of the chip as claimed in any one of claims 1 to 7, wherein the thickness of the first heat conduction layer is smaller than that of the second heat conduction layer, and the first heat conduction layer is configured as a heat conduction pad, a heat conduction silicone grease, a heat conduction gel or a heat conduction phase change material.
9. The heat dissipating structure of a chip as claimed in any one of claims 1 to 7, wherein the area of the metal heat conducting element is larger than that of the chip, a plurality of the connecting members are disposed between the metal heat conducting element and the circuit board, and the plurality of the connecting members are uniformly disposed on the periphery of the chip.
10. An electronic device comprising the heat dissipation structure of the chip as recited in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123123854.3U CN217280746U (en) | 2021-12-10 | 2021-12-10 | Heat radiation structure and electronic equipment of chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123123854.3U CN217280746U (en) | 2021-12-10 | 2021-12-10 | Heat radiation structure and electronic equipment of chip |
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| CN217280746U true CN217280746U (en) | 2022-08-23 |
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| CN202123123854.3U Active CN217280746U (en) | 2021-12-10 | 2021-12-10 | Heat radiation structure and electronic equipment of chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115379735A (en) * | 2022-08-30 | 2022-11-22 | 深圳市卓汉材料技术有限公司 | Elastic heat conductor |
-
2021
- 2021-12-10 CN CN202123123854.3U patent/CN217280746U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115379735A (en) * | 2022-08-30 | 2022-11-22 | 深圳市卓汉材料技术有限公司 | Elastic heat conductor |
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