CN110167317A - Heat-transfer device - Google Patents

Heat-transfer device Download PDF

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Publication number
CN110167317A
CN110167317A CN201910116538.1A CN201910116538A CN110167317A CN 110167317 A CN110167317 A CN 110167317A CN 201910116538 A CN201910116538 A CN 201910116538A CN 110167317 A CN110167317 A CN 110167317A
Authority
CN
China
Prior art keywords
heat
conducting layer
transfer device
main body
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201910116538.1A
Other languages
Chinese (zh)
Inventor
金善基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Joinset Co Ltd
Original Assignee
Joinset Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Joinset Co Ltd filed Critical Joinset Co Ltd
Publication of CN110167317A publication Critical patent/CN110167317A/en
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2235/00—Means for filling gaps between elements, e.g. between conduits within casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming

Abstract

Disclosing one kind can independently fix, and be easy to the heat-transfer device of high density attachment.The heat-transfer device includes: the main body of metal material, forms tube body by sealing in such a way that inside maintains vacuum；And heat-conducting layer, there is elasticity and flexibility, and wrap up the main body and bond.

Description

Heat-transfer device
Technical field
It can independently be fixed the present invention relates to a kind of heat-transfer device more particularly to one kind and be easy to carry out high density attachment Heat-transfer device.
Background technique
Recently, since the calorific value of the electronic component of fever or the highly integrated and high performance of module is increasing. Also, due to the progress of product miniaturization, so that heat generation density increases, therefore heat dissipating method is becoming more important.
Such case is more obvious in the mobile terminals such as smart phone or tablet computer, and the heat for needing to generate is directly cold But it or is transferred to elsewhere and cools down.
Although heat-conducting plate or graphite plate in the horizontal direction with Thermal conductivity can be enumerated as heat-transfer device Deng but if heat conduction amount is not enough, then will use heat conducting pipe, cooling fin or soaking plate (hereinafter referred to as " heat conducting pipe "), lead As a whole, the pure metal such as apparent thermal conductivity ratio copper or aluminium are outstanding for heat pipe, and are several times to tens times.
Heat conducting pipe notoriously has pipe structure, so that vacuum is formed in inside, in one end, for example, such as Fruit generates heat in the part contacted with the processor as heat-generating electronic part, then a small amount of volatility refrigeration in heat conducting pipe Agent, water or ethylene glycol can be vaporized by the heat, and the refrigerant being vaporized is pushed due to the pressure difference between gas and liquid It is discharged after heat and is cooled off again as liquid to opposite side, transmitted the heat generated from processor and this process repeatedly To being cooled down elsewhere, to finally carry out cooling to processor and so that it will not overheat.
Heat conducting pipe is widely used to general personal computer, recently then for removing the hair of the processor of smart phone Heat.
However, forming container in metal shell and in the bottom of container to use heat conducting pipe in smart phone Bond the one side of heat conducting pipe at an upper portion thereof after attaching heat-conducting double-sided adhesive tape to be fixed to metal shell.
Therefore, it in the complicated and longer situations of length such as the shape bending of heat conducting pipe, needs correspondingly to prepare double The shape of face adhesive tape, in the longer situation of thinner thickness or length of adhesive tape, with the matched side of container It is difficult when formula is prepared and installed.
Also, in order to fix heat conducting pipe, need using additional double sided adhesive tape, therefore has and be inconvenient to carry out height Density mounts and needs the shortcomings that spending additional setup fee.
Also, since heat conducting pipe is made of metal material, it can not flexiblely thermally contact to pyrotoxin or be used for Cooling metal shell, thus can not be quickly and reliably thermally conductive.
Therefore, usually have and need between heat conducting pipe and pyrotoxin, or additional sandwiched heat conductive pad between cooling shell (Thermal Pad), hot grease (Thermal Grease) or heat-dissipating space filler (ThermalGap Filler) etc. have The shortcomings that conducting-heat elements of elasticity.
In particular, in the case where heat conducting pipe made of metal contacts in conjunction with multiple metal fins for cooling, Since metal and metal can be contacted directly, to have the shortcomings that cause heat-conducting effect bad.
Summary of the invention
Therefore, additional conducting adhesive unit is not needed the purpose of the present invention is to provide a kind of, therefore can independently consolidated The fixed and simple heat-transfer device of structure.
Another object of the present invention is to provide a kind of when the object with opposite high rigidity contacts, can be effectively Carry out good thermally conductive heat-transfer device.
Another object of the present invention is to provide the heat-transfer devices for being easy to high density attachment.
It is easy to set up and economical another object of the present invention is to provide a kind of quantity for reducing component to lead Thermal.
The purpose passes through to include: main body, forms tube body by sealing so that its inside maintains vacuum, and is Metal material；And heat-conducting layer, it bonds with wrapping up the main body and there is elasticity and flexibility to be characterized, heating conduction is The heat conducting pipe of raising is reached.
The purpose passes through to include: main body, forms tube body by sealing so that its inside maintains vacuum, and is Metal material；And heat-conducting layer, bond with wrapping up the main body and have elasticity and flexibility, and under the main body The corresponding heat-conducting layer in surface is inserted into the container, so that the bottom of the container of the heat-conducting layer and metal shell connects Touching, the upper surface of the main body are exposed to outside, are characterized to directly or indirectly thermally contact with pyrotoxin, thermal conductivity The heat conducting pipe that can be increased is reached.
The purpose passes through to include: main body, forms tube body by sealing so that its inside maintains vacuum, and is Metal material；First heat-conducting layer has self-adhesive power in outer surface, to be bonded in the one side of the main body, and has bullet Property；And second heat-conducting layer, there is self-adhesive power in outer surface, to be bonded in the reverse side of the main body, and there is elasticity It is characterized, the heat conducting pipe that heating conduction increases is reached.
According to the above configuration, it is used additionally due to not needing in order to which heat conducting pipe to be fixed on to the container of metal shell Heat-conducting double-sided adhesive tape or heat-conductive bonding agent, therefore it is easy to fixed, and be easy to carry out high density attachment in small space, also It is economical.
Also, by increasing the thermocontact area between heat conducting pipe and the container of metal shell, so that heat transmitting is quick And it is reliably completed.
Also, by making flexiblely to be close between heating tube and metal shell or heating tube and pyrotoxin, so that hot Transmitting effectively and can be carried out well.
Also, in the case where application has the thermally conductive sheet of autohesion, due to being arranged on release paper or release film, because This is easy to use.
Detailed description of the invention
Fig. 1 be show an embodiment according to the present invention heat conducting pipe be applied to smart phone state figure.
Fig. 2 is by the perspective view of heat conducting pipe interception a part.
Fig. 3 is the figure for showing the situation that heat conducting pipe is installed on to container.
Fig. 4 is the sectional view for showing another embodiment of heat conducting pipe.
Symbol description
10: rear cover (back cover)
12: container
14: battery
16: circuit substrate
100,200: heat conducting pipe
110,210: main body
120,220: heat-conducting layer
Specific embodiment
What is needed to pay attention to is that technical term used in the present invention uses, mesh just to illustrate specific embodiment Be not limit the present invention.Contain in addition, technical term used in the present invention is not defined as other especially in the present invention In adopted situation, should be construed as the personnel for having basic knowledge in technical field belonging to the present invention it can be generally understood that contain Justice should not be construed as the meaning excessively covered or the meaning excessively reduced.Moreover, working as technical term used in the present invention is nothing When method accurately expresses the technical term of the falsehood of thought of the invention, should replace with those skilled in the art can correct understanding Technical term and understood.Also, general terms used in the present invention should be interpreted meaning defined in dictionary, Or should be explained according to front and back context, it is not necessarily to be construed as the meaning excessively reduced.
Fig. 1 be show an embodiment according to the present invention heat conducting pipe be applied to smart phone state figure.
Battery 14 is installed in the rear cover (Back Cover) 10 of smart phone, and can be in the region around battery 14 The circuit substrate 16 for having mounted multiple electronic components is installed.
Although listing rear cover 10 made of metal as exothermic object in Fig. 1, but it is not limited to this, can also To be typically used for other metal shells of heat-sink unit.
In the multiple electronic components mounted on circuit substrate 16, make the fever of the big calorimetric of the generations such as application processor (AP) Source is contacted with metal heat-conducting tube 100, is discharged with passing through rear cover 10 in a short time for the heat of generation.
For this purpose, the insertion of heat conducting pipe 100 is formed in the container 12 of rear cover 10 and is fixed, as described below, Ke Yitong It crosses the autohesion bonding of heat-conducting layer and is fixed.
Fig. 2 is shown the perspective view of heat conducting pipe interception a part.
Heat conducting pipe 100 may include: the main body 110 of metal material, by forming tube body by sealing so that internal remain true It is empty；Flexible heat-conducting layer 120 wraps up main body 110 and bonds and constitute.
Main body 110 is made of metal material, such as can be made of copper or aluminium.
Heat-conducting layer 120 can be the thermally conductive sheet being made of heat-conducting silicon rubber or thermally conductive acrylic resin, at this point, thermally conductive sheet Main body 110 can be wrapped up, and the both ends of width direction can be against each other in the lower surface of main body 110 or be spaced.
Also, heat-conducting layer 120 can be by being immersed in the thermally conductive of the liquid that conductive particle is mixed and dispersed for main body 110 Solidify after rubber or resin and bond perhaps bonding mode formed or can by the outer surface of main body 110 spray It is formed after the heat conductive rubber or resin of liquid with the mode that heat or UV solidify and bonds or bond.
Heat-conducting layer 120 can form closed loop (closed loop) along the width direction of main body 110 and make it in length direction Continue.
Heat-conducting layer 120 can be thermally conductive by utilization ceramic powders etc. and electrical isolation particle is with electrical insulating property, if Only consider thermal conductivity, then metal powder, carbon dust, graphite powder or graphite fibre can be used, although having in this case It is conductive, but heating conduction is outstanding.
Since heat-conducting layer 120 has the composition on silicon rubber or acrylic resin basis, there is elasticity and flexibility, Therefore it is close to heat-conducting layer 120 flexibly with the inner sidewall of container 12 and heat conducting pipe 100 is pressed into container 12 by force, It is filled with the gap between heat conducting pipe 100 and the inner sidewall of container 12, so as to be reliably achieved heat at bigger position Contact, to make thermally conductive more smooth.
The thickness of heat-conducting layer 120 can be more thinner than the core of main body 110 formed, it is particularly possible to there is such as 0.02mm The thickness of~0.3mm or so, but it is not limited to this.
Heat-conducting layer 120 can be separated along the length direction of main body 110 and be formed, and the total length of heat-conducting layer 120 can be formed Based on 110 total length 1/2 or more so that thermally conductive can go on smoothly.
The outer surface of heat-conducting layer 120 can have autohesion, at this point, being formed in the heat-conducting layer 120 of the lower surface of main body 110 Then it is bonded in the bottom of the container 12 of rear cover 10.Therefore, additional heat-conducting double-sided adhesive tape or thermally conductive can not used Heat conducting pipe 100 is just fixed on container 12 by adhesive.
And it is possible to arrange heat conducting pipe in release paper or release film using the autohesion of 120 outer surface of heat-conducting layer 100 and provide.
Fig. 3 shows the situation that heat conducting pipe is installed on to container.
Heat conducting pipe 100 can be inserted into the container 12 of rear cover 10 by force and be mounted, and due to the bullet of heat-conducting layer 120 Property, flexibly it is close to the bottom of container 12 and two side walls, to keep thermo-contact good and improve thermo-contact reliability.
In particular, in the case where the outer surface of heat-conducting layer 120 has autohesion container can be bonded to due to autohesion 12 bottom and/or two sidewalls.
Therefore, compared with previous technology, due to without using volume in order to which heat conducting pipe 100 is fixed to container 12 Outer heat-conducting double-sided adhesive tape, heat-conductive bonding agent, or the double sided adhesive tape of manufacture and 100 same shape of heat conducting pipe, because This is simple to manufacture and reduces manufacturing cost, and is suitble to high density attachment.
Further, since being only folded with the elastic conducting thermosphere 120 of the main body 110 of package heat conducting pipe 100 and being inserted and fixed to receive Tank 12, therefore be easily installed, and thermal conductivity is outstanding, to improve heat transfer efficiency.
Similarly, be mounted directly on heat conducting pipe 100 fixed and being inserted into container 12 circuit substrate 16 or its His pyrotoxin or the simple thermally conductive sheet of sandwiched and install, improving heat transfer efficiency simultaneously improves yield.
In an above-mentioned embodiment, although by taking heat-conducting layer 120 wraps up the entire surface of main body 110 as an example, but not limited to this, it leads Thermosphere 120 for example can only be bonded in the upper and lower surfaces of main body 110.
At this point it is possible to keep the thermal conductivity for being bonded to the heat-conducting layer of upper and lower surfaces respectively and autohesion respectively different.
For example, the thermal conductivity of the heat-conducting layer of upper surface can be made lower than the thermal conductivity of the heat-conducting layer of lower surface, to make The heat-conducting layer on surface is contacted with cooling shell, and contacts the heat-conducting layer of lower surface with pyrotoxin.
In addition, the heat-conducting layer for making upper surface autohesion be greater than lower surface heat-conducting layer autohesion, and make upper surface Heat-conducting layer in the state that cooling shell contacts and the heat-conducting layer of lower surface is contacted with pyrotoxin, can when lifting cooling shell So that heat conducting pipe maintains the state for being attached to cooling shell by the heat-conducting layer of upper surface.
Fig. 4 is the sectional view for showing another embodiment of heat conducting pipe.
According to this embodiment, it is shown as amplified in circle, conductive particle is made by high temperature and pressure, vacuum or plasma coated It is attached to the outer surface of heat-conducting layer 220 and forms conductive particle layer 230, to substantially increase the surface area of heat conducting pipe 200.
Conductive particle can be the good metal powder of thermal conductivity, carbon dust, powdered graphite, ceramic powders or carbon fiber Dimension.
As a result, have due to the surface area for having expanded heat-conducting layer 220 from pyrotoxin absorption heat in the short time, and Transmit the advantage of heat in short time well to objects such as rear covers 10.
More than, it is illustrated centered on the embodiment of the present invention, but it is clear that can be those skilled in the art's Apply the deformation of multiplicity in level to the present invention.Therefore, interest field of the invention should not be limited to above-described embodiment and be solved It releases, and should be explained according to the range recorded in claims.

Claims (15)

1. a kind of heat-transfer device characterized by comprising
The main body of metal material forms tube body by sealing in such a way that inside maintains vacuum；And
Heat-conducting layer has elasticity and flexibility, and wraps up the main body and bond.
2. heat-transfer device as described in claim 1, which is characterized in that
The heat-conducting layer is thermally conductive sheet, and the both ends of the width direction of the thermally conductive sheet are against each other or separate, and along the master The length direction of body continues.
3. heat-transfer device as described in claim 1, which is characterized in that
The heat-conducting layer is formed in the following way: the outer surface of the main body being immersed in, conductive particle is mixed and dispersed Solidified after the heat conductive rubber or resin of liquid and bonded or bonded；Or in the outer surface of main body injection liquid Solidified after the heat conductive rubber or resin and bonded or bonded.
4. heat-transfer device as described in claim 1, which is characterized in that
The heat-transfer device is heat conducting pipe, cooling fin or soaking plate.
5. heat-transfer device as described in claim 1, which is characterized in that
The outer surface of the heat-conducting layer has autohesion.
6. heat-transfer device as described in claim 1, which is characterized in that
The heat-conducting layer has electrical insulating property.
7. heat-transfer device as described in claim 1, which is characterized in that
Conductive particle is attached on the heat-conducting layer.
8. heat-transfer device as claimed in claim 7, which is characterized in that
The conductive particle is adhered to by high temperature and pressure, vacuum or plasma coated mode.
9. heat-transfer device as claimed in claim 7, which is characterized in that
The conductive particle is the good metal powder of thermal conductivity, carbon dust, ceramic powders, powdered graphite or carbon fiber.
10. a kind of heat-transfer device characterized by comprising
The main body of metal material forms tube body by sealing in such a way that inside maintains vacuum；And
Heat-conducting layer has elasticity and flexibility, and is formed in the main body,
Heat-conducting layer corresponding with the lower surface of the main body is inserted in a manner of contacting with the bottom of the container of metal shell The upper surface of the container, the heat-conducting layer is exposed to outside, thus with the direct or indirect thermal contact of pyrotoxin.
11. heat-transfer device as claimed in claim 10, which is characterized in that
The outer surface of the heat-conducting layer has autohesion, so that the heat-conducting layer is bonded in the bottom of the container.
12. heat-transfer device as claimed in claim 10, which is characterized in that
Heat-conducting layer elasticity corresponding with the side of the main body is tightly attached to the two side walls of the container.
13. heat-transfer device as claimed in claim 10, which is characterized in that
The heat-conducting layer is heat-conducting silicon rubber or thermally conductive acrylic resin.
14. a kind of heat-transfer device characterized by comprising
The main body of metal material forms tube body by sealing in such a way that inside maintains vacuum；
First heat-conducting layer has elasticity, and has autohesion in outer surface, to be bonded in the one side of the main body；And
Second heat-conducting layer has elasticity, and has autohesion in outer surface, to be bonded in the reverse side of the main body.
15. heat-transfer device as claimed in claim 14, which is characterized in that
The autohesion of first heat-conducting layer is higher than the autohesion of second heat-conducting layer, and the thermal conductivity of first heat-conducting layer is low In the thermal conductivity of second heat-conducting layer,
First heat-conducting layer is contacted with cooling shell, and second heat-conducting layer is contacted with pyrotoxin.
CN201910116538.1A 2018-02-12 2019-02-12 Heat-transfer device Withdrawn CN110167317A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180016952A KR20190097475A (en) 2018-02-12 2018-02-12 Heat pipe having improved thermal transfer
KR10-2018-0016952 2018-02-12

Publications (1)

Publication Number Publication Date
CN110167317A true CN110167317A (en) 2019-08-23

Family

ID=67541433

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910116538.1A Withdrawn CN110167317A (en) 2018-02-12 2019-02-12 Heat-transfer device

Country Status (3)

Country Link
US (1) US20190249927A1 (en)
KR (1) KR20190097475A (en)
CN (1) CN110167317A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230200019A1 (en) * 2021-12-20 2023-06-22 Meta Platforms Technologies, Llc Thermal conduit for electronic device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69525081D1 (en) * 1995-06-08 2002-02-28 Ibm MECHANICAL STRUCTURE OF AN INFORMATION PROCESSING DEVICE
JP4085536B2 (en) * 1998-11-09 2008-05-14 株式会社日本自動車部品総合研究所 ELECTRIC DEVICE, ITS MANUFACTURING METHOD, AND PRESSURE SEMICONDUCTOR DEVICE
US9568255B2 (en) * 2014-04-21 2017-02-14 Htc Corporation Electronic device

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US20190249927A1 (en) 2019-08-15
KR20190097475A (en) 2019-08-21

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Application publication date: 20190823