CN115151075A

CN115151075A - Middle frame assembly and electronic equipment

Info

Publication number: CN115151075A
Application number: CN202110336519.7A
Authority: CN
Inventors: 张博; 黄犊子; 刘明艳; 赵凯亮
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2021-03-29
Filing date: 2021-03-29
Publication date: 2022-10-04

Abstract

The invention discloses a middle frame assembly and electronic equipment. The middle frame assembly comprises a middle frame body and a soaking plate, wherein the middle frame body comprises a first surface; the vapor chamber comprises a first heat dissipation part, a second heat dissipation part and a third heat dissipation part, the first heat dissipation part is fixedly arranged on the first surface, the first heat dissipation part is provided with a heat source installation part arranged towards the second heat dissipation part, the second heat dissipation part is connected with the first heat dissipation part through the third heat dissipation part, and the second heat dissipation part and the first heat dissipation part are arranged at intervals relatively to form a heat dissipation space. This center subassembly and electronic equipment can improve the radiating efficiency to avoid the local overheated phenomenon of electronic equipment to take place.

Description

Middle frame assembly and electronic equipment

Technical Field

The present disclosure relates to the field of electronic technologies, and in particular, to a middle frame assembly and an electronic device.

Background

At present, electronic devices such as mobile phones, tablet computers, wearable devices, distance measuring devices, scanning devices and the like have become essential scientific and technological products in the life, study and entertainment processes of people. With the development of electronic devices, the core number of CPUs (Central Processing units) used by the electronic devices is increased, and the performance of the electronic devices is increasingly enhanced, so that the electronic devices generate more and more heat. Especially in recent years the temperature rise experience has become an important consideration for consumers to buy electronic devices.

However, in the related heat dissipation technical solution of the electronic device, the problem of local overheating of the electronic device caused by untimely heat dissipation still exists.

Disclosure of Invention

The present disclosure provides a middle frame assembly and an electronic device, which can improve heat dissipation efficiency to avoid local overheating of the electronic device.

The technical scheme is as follows:

according to a first aspect of the embodiments of the present disclosure, there is provided an intermediate frame assembly including an intermediate frame body and a vapor chamber, the intermediate frame body including a first surface; the vapor chamber comprises a first heat dissipation piece, a second heat dissipation piece and a third heat dissipation piece, wherein the first heat dissipation piece is fixedly arranged on the first surface, the first heat dissipation piece is provided with a heat source installation part arranged towards the second heat dissipation piece, the second heat dissipation piece is connected with the first heat dissipation piece through the third heat dissipation piece, and the second heat dissipation piece and the first heat dissipation piece can be arranged at intervals relatively to form a heat dissipation space.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

the vapor chamber is bent into a first heat dissipation part and a second heat dissipation part which are oppositely arranged to form a heat dissipation space by using the third heat dissipation part, and the first heat dissipation part is arranged on the middle frame body, so that the heat dissipation efficiency of the middle frame body can be improved; when being applied to electronic equipment with the center subassembly simultaneously, can set firmly the heat source module in the heat dissipation space through the heat source installation department, and then can make full use of first radiating piece, second radiating piece and third radiating piece dispel the heat to the heat source module for electronic equipment radiating efficiency is high, is favorable to avoiding the local overheated emergence of heat source module, and then is favorable to guaranteeing electronic equipment's operating stability.

According to a second aspect of the embodiments of the present disclosure, there is also provided an electronic device, including a heat source module and the middle frame assembly, where the heat source module is fixed to the first heat sink through the heat source mounting portion.

when the electronic equipment is used, the heat source module is fixedly arranged in the heat dissipation space, and the first heat dissipation piece, the second heat dissipation piece and the third heat dissipation piece can be fully utilized to dissipate heat of the heat source module, so that the electronic equipment is high in heat dissipation efficiency, the local overheating phenomenon of the heat source module can be avoided, and the operation stability and the reliability can be improved. In addition, first radiating piece sets up on the center body, and the area that can make full use of center body dispels the heat, is favorable to further improving the radiating efficiency.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

Brief description of the drawingsthe accompanying drawings, which are included to provide a further understanding of the disclosure, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure and are not intended to limit the disclosure.

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a mobile terminal shown in an embodiment.

Fig. 2 is an exploded view of a portion of the structure of the mobile terminal shown in fig. 1.

Fig. 3 is a schematic front view of the middle frame assembly shown in fig. 2.

FIG. 4 is a side view of the center frame assembly shown in FIG. 3.

FIG. 5 is a side view of another embodiment of a bezel assembly.

FIG. 6 is a schematic view, partially in section, of another embodiment of a center frame assembly.

FIG. 7 is a schematic view, partially in section, of an alternative embodiment of a center frame assembly.

Fig. 8 is a schematic top view of a passive heat dissipation structure according to an embodiment.

Fig. 9 is a rear view schematically illustrating the structure of the middle frame assembly shown in fig. 2.

Fig. 10 is an exploded view of the structure of the middle frame assembly shown in fig. 9.

Fig. 11 is a partial structural view of the middle frame assembly shown in fig. 10.

Fig. 12 is an enlarged schematic view of a shown in fig. 11.

Fig. 13 is a schematic view illustrating a heat dissipation state of the middle frame assembly shown in fig. 11.

Fig. 14 is an enlarged schematic view of B shown in fig. 13.

Fig. 15 is a schematic structural diagram of another embodiment of the middle frame assembly shown in fig. 9.

Fig. 16 is a partial structural view of a middle frame assembly according to another embodiment.

Description of the reference numerals:

10. a middle frame component; 100. a middle frame body; 101. a first side; 102. a second face; 110. a cooling section; 120. a battery mounting portion; 130. a loop pipe groove; 140. mounting grooves; 200. a vapor chamber; 210. a heat source mounting section; 220. a first heat sink; 230. a second heat sink; 240. a third heat sink; 250. a heat dissipation space; 260. a heat conducting layer; 300. a heat dissipating device; 310. a heat radiation fan; 320. a passive heat dissipation structure; 321. a heat conductor; 322. heat dissipation fins; 330. a semiconductor refrigeration member; 400. a loop heat pipe; 410. an evaporator; 411. a fluid infusion end; 412. an air outlet end; 413. an evaporation section; 414. a liquid storage cavity; 420. a piping unit; 421. a first delivery pipe, 422, a second delivery pipe; 423. a condenser tube; 424. a fluid infusion branch; 425. an air outlet branch; 430. an anti-reflux structure; 432. a Tesla valve structure; 500. a working fluid; 600. a sealing cover; 700. a thermally conductive adhesive layer; 20. a heat source module; 21. a circuit board; 22. a heat source member; 30. a protective cover; 31. and (4) a vent hole.

Detailed Description

For the purpose of making the purpose, technical solutions and advantages of the present disclosure more apparent, the present disclosure will be described in further detail below with reference to the accompanying drawings and detailed description. It should be understood that the detailed description and specific examples, while indicating the scope of the disclosure, are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein in the description of the disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure.

For convenience of understanding, technical terms involved in the embodiments of the present disclosure are explained and described below.

The Vapor Chamber (VC) has a vacuum Chamber with a fine structure, and has a good heat dissipation function, and the material of the Vapor Chamber includes, but is not limited to, copper, stainless steel, titanium alloy, and the like.

The heat radiation fan includes a micro turbo fan or an axial fan, etc.

Semiconductor refrigeration devices (Thermal Electric Cooler, TEL for short) are also known as peltier refrigeration devices.

The Thermal Interface Material (TEL) has good Thermal conductivity, and its specific implementation modes include but are not limited to Thermal silicone grease, thermal adhesive, thermal gasket, etc.

The Loop Heat Pipe (Loop Heat Pipe, abbreviated as LHP in English) has good Heat dissipation function.

The passive heat dissipation structure and the passive heat dissipation part are provided with flaky heat dissipation teeth.

Resistor-capacitor element, resistor and capacitor elements are commonly called.

At present, electronic devices such as mobile phones, tablet computers, wearable devices, distance measuring devices, scanning devices and the like have become essential scientific and technological products in the life, study and entertainment processes of people. With the development of electronic devices, the core number of CPUs (Central Processing units) used by the electronic devices is increased, and the performance of the electronic devices is increasingly enhanced, so that the electronic devices generate more and more heat, and the heat dissipation performance of the electronic devices is challenged more and more. Especially in recent years the temperature rise experience has become an important consideration for consumers to buy electronic devices. Meanwhile, the better the heat dissipation performance is, the more balanced the heat dissipation is, the more attractive the consumer can purchase, so that the heat dissipation efficiency of the electronic equipment is improved, the local overheating is avoided, and the problem that the industry attaches more and more importance is solved.

However, in the related heat dissipation technical solutions of the applied electronic devices, the phenomenon of untimely heat dissipation is easily generated, and the heat dissipation efficiency is difficult to improve. And the heat dissipation is not timely, can lead to the local overheat of electronic equipment, influences the operating performance of electronic equipment easily, even the phenomenon of halting appears.

Based on this, this disclosure provides a center subassembly, can improve the radiating efficiency, avoids the emergence of local overheat phenomenon to guarantee electronic equipment's operating performance, be favorable to improving electronic equipment's reliability.

The technical scheme of the disclosure is further explained by combining the specific structural drawings.

Fig. 1 to 4 are structural diagrams of an electronic device and a middle frame assembly shown in an embodiment. Fig. 1 is a schematic structural diagram of a mobile terminal shown in an embodiment. Fig. 2 is an exploded view of a portion of the structure of the mobile terminal shown in fig. 1. Fig. 3 is a schematic front view of the middle frame assembly shown in fig. 2. FIG. 4 is a side view of the center frame assembly shown in FIG. 3.

An embodiment of the present disclosure provides an electronic device, which may be: cell-phone, panel computer, electronic reader, notebook computer, mobile device, wearable equipment, range finding equipment, scanning device etc. it includes center subassembly 10 and heat source module 20.

The middle frame assembly 10 comprises a middle frame body 100 and a soaking plate 200, wherein the middle frame body 100 comprises a first surface 101; the vapor chamber 200 includes a first heat sink 220, a second heat sink 230, and a third heat sink 240, the first heat sink 220 is fixedly disposed on the first surface 101, the first heat sink 220 is provided with a heat source mounting portion 210 disposed toward the second heat sink 230, the second heat sink 230 is connected to the first heat sink 220 through the third heat sink 240, and the second heat sink 230 and the first heat sink 220 can be relatively spaced to form a heat dissipation space 250.

And the heat source module 20 is fixed to the first heat sink 220 through the heat source mounting part 210.

Thus, the vapor chamber 200 is bent by the third heat sink 240 to form the first heat sink 220 and the second heat sink 230 which are oppositely disposed to form the heat dissipation space 250, and the first heat sink 220 is disposed on the middle frame body 100, so that the heat dissipation efficiency of the middle frame body 100 can be improved. When the electronic device is used, the heat source module 20 is fixedly arranged in the heat dissipation space 250, and the first heat dissipation part 220, the second heat dissipation part 230 and the third heat dissipation part 240 can be fully utilized to dissipate heat of the heat source module 20, so that the electronic device disclosed by the invention has high heat dissipation efficiency, and further can avoid the local overheating phenomenon of the heat source module 20, and is beneficial to improving the operation stability and reliability. In addition, the first heat dissipation member 220 is disposed on the middle frame body 100, so that the area of the middle frame body 100 can be fully utilized for heat dissipation, and further improvement of heat dissipation efficiency is facilitated.

In the embodiment of the present disclosure, the middle frame body 100 may be a frame structure of an electronic device, and except that the soaking plate 200 and the heat source module 20 may be integrated, some or all of the components of the electronic device may be directly or indirectly disposed on the middle frame body 100 to assemble the electronic device.

Alternatively, the middle frame body 100 may be disposed inside the electronic device, and the edge of the middle frame body 100 may be designed to be a part of the housing of the electronic device. When the edge of the middle frame body 100 is used as a housing of the electronic device, the electronic device can be protected.

Alternatively, the middle frame body 100 may have a flat surface or a structure similar to a flat surface, and thus, two side surfaces of the middle frame body 100, which may be referred to as a front surface and a back surface of the middle frame body 100, or one side surface and the other side surface of the middle frame body 100, may be visually distinguished. In the inside of center body 100, can carry out part fretwork as required to set up other components and parts in the electronic equipment.

Alternatively, part or all of the middle frame body 100 may be made of a metal or an alloy material (e.g., an aluminum alloy). Of course, the material of the middle frame body 100 may be other materials, and this is not particularly limited in the embodiments of the present disclosure.

In addition to any of the above embodiments, in an embodiment, at least a part of the third heat dissipation element 240 has flexibility. Thus, the second heat dissipation member 230 is conveniently bent above the first heat dissipation member 220 to form the heat dissipation space 250.

Alternatively, in another embodiment, the soaking plate 200 is a flexible soaking cold plate. Thus, the first heat dissipation member 220, the third heat dissipation member 240 and the second heat dissipation member 230 can be integrally molded, so that the second heat dissipation member 230 can be conveniently bent over the first heat dissipation member 220 to form the heat dissipation space 250, and the heat transfer path can be shortened to reduce the thermal conduction resistance.

In addition, the soaking plate 200 is integrally formed, which is advantageous for improving reliability.

On the basis of any of the above embodiments, in an embodiment, the vapor chamber 200 further includes a phase change working medium, and the phase change working medium is disposed in at least one of the first heat dissipation member 220, the second heat dissipation member 230, or the third heat dissipation member 240. Therefore, the electronic equipment can be selected according to actual needs, so that better cost performance is obtained while the heat dissipation requirement of the electronic equipment is met.

Alternatively, the phase change tools are disposed in the first heat dissipation element 220, the second heat dissipation element 230, and the third heat dissipation element 240. Thus, the heat dissipation of the soaking plate 200 is more uniform, which is beneficial to further avoiding the local overheating of the electronic device caused by the heat generated by the heat source module 20.

On the basis of any one of the above embodiments, in one embodiment, the boiling point of the phase change working medium is 20 ℃ to 90 ℃. Thus, the vapor chamber 200 has good thermal conductivity and heat dissipation performance at the operating temperature of 10-45 ℃. Further, the heat generated by the heat source module 20 can be dissipated and conducted through the soaking plate 200 in time, thereby preventing the electronic device from local overheating.

The phase-change working medium includes but is not limited to formaldehyde, methanol, ethanol or a mixture of the formaldehyde, the methanol and the ethanol and pure water.

In addition, the start-up temperature of the soaking plate 200 may be more in need of adjustment. For example, the starting temperature of the soaking plate 200 is reduced by adjusting the vacuum degree in the cavity of the soaking plate 200 and/or using phase-change working media with different boiling points, so that the equilibrium state of full phase change of gas and liquid is achieved in advance.

In order to further improve the heat dissipation efficiency of the middle frame assembly 10, fig. 5 to 7 are structural diagrams of the middle frame assembly 10 shown in some embodiments. Fig. 5 is a schematic side view of another embodiment of the middle frame assembly 10. Figure 6 is a partially cross-sectional schematic view of another embodiment of the middle frame assembly 10. FIG. 7 is a partially cut-away, schematic view of another embodiment of the midframe assembly 10. Fig. 8 is a schematic top view of a passive heat dissipation structure 320 according to an embodiment.

In some embodiments, the middle frame assembly 10 further includes a heat dissipation device 300, and the heat dissipation device 300 is disposed outside the heat dissipation space 250 for actively dissipating heat of the second heat dissipation member 230. In this way, the heat dissipation device 300 can be used to actively dissipate heat from the second heat dissipation member 230, so as to further improve the heat dissipation efficiency of the electronic device. Meanwhile, the heat dissipation of the heat source module 20 is more uniform by the cooperation of the middle frame body 100 and the heat dissipation device 300, which is beneficial to further avoiding local overheating.

The specific implementation of the heat dissipation device 300 may be various:

for example, in one embodiment, the heat dissipation device 300 includes a heat dissipation fan 310, and the heat dissipation fan 310 is disposed toward the second heat dissipation member 230. In this way, the turbulent airflow generated by the heat dissipation fan 310 can further achieve uniform heat dissipation of the middle frame assembly 10. In addition, if interact with the outside gas, with the leading-in electronic equipment of outside cold gas in, cool down electronic equipment, can further improve electronic equipment's radiating efficiency.

The heat dissipation fan 310 may be disposed in the electronic device, or may be detachably disposed in the electronic device, which is not limited herein.

Alternatively, in another embodiment, the heat dissipation device 300 includes a semiconductor cooling element 330 disposed on the second heat dissipation element 230, and the semiconductor cooling element 330 includes a heat absorption portion in heat-conductive cooperation with the second heat dissipation element 230. In this way, the semiconductor cooling element 330 is used as an active heat dissipation element, and the heat absorption portion actively absorbs the heat transmitted from the second heat dissipation element 230, so as to cool the heat dissipation space 250, reduce the temperature of the heat dissipation space 250, and further improve the heat dissipation efficiency of the electronic device.

Alternatively, in another embodiment, the heat dissipation device 300 includes a heat dissipation fan 310 and a semiconductor cooling member 330 disposed on the second heat dissipation member 230, the semiconductor cooling member 330 includes a heat dissipation portion and a heat absorption portion in heat conduction fit with the second heat dissipation member 230, and the heat dissipation fan 310 is disposed toward the heat dissipation portion. Therefore, the heat dissipation part can be actively supplied with air or form negative pressure by using the heat dissipation fan 310, so that the air flow speed of the heat dissipation part is increased, and the heat dissipation is accelerated; meanwhile, the heat absorption part is accelerated to absorb the heat of the second body, the temperature of the heat dissipation space 250 is further reduced, and the heat dissipation efficiency of the electronic device can be further improved.

In addition, the heat dissipation device 300 may be provided with an active heat dissipation component, and may further integrate a passive heat dissipation structure 320.

For example, in an embodiment, the heat dissipation device 300 includes a heat dissipation fan 310 and a passive heat dissipation structure 320, the passive heat dissipation structure 320 is fixedly disposed on the second heat dissipation member 230, and the heat dissipation fan 310 is disposed on the passive heat dissipation structure 320. In this way, the passive heat dissipation structure 320 absorbs the heat of the second heat dissipation member 230, and the heat dissipation of the second heat dissipation member 230 is accelerated. Meanwhile, the heat dissipation fan 310 can generate a turbulent airflow to improve the heat dissipation efficiency of the passive heat dissipation structure 320, so that the heat dissipation efficiency of the middle frame assembly 10 is high and the heat is uniformly dissipated.

Alternatively, in another embodiment, the heat dissipation device 300 includes a passive heat dissipation structure 320 and a semiconductor cooling element 330 disposed on the second heat dissipation element 230, the semiconductor cooling element 330 includes a heat dissipation portion and a heat absorption portion in heat conduction fit with the second heat dissipation element 230, the heat dissipation portion is in heat conduction fit with the heat absorption portion, and the passive heat dissipation structure 320 is disposed on the heat dissipation portion. In this way, the semiconductor cooling element 330 is used as an active heat dissipation element to actively absorb the heat transmitted from the second heat dissipation element 230 through the heat absorption portion, so as to cool the heat dissipation space 250; meanwhile, the heat of the heat dissipation part is absorbed by the passive heat dissipation structure 320, so that the heat dissipation efficiency of the semiconductor refrigeration part 330 is improved.

Alternatively, in another embodiment, the heat dissipation device 300 includes a passive heat dissipation structure 320, a heat dissipation fan 310, and a semiconductor cooling element 330 disposed on the second heat dissipation element 230, where the semiconductor cooling element 330 includes a heat dissipation portion and a heat absorption portion in heat conduction fit with the second heat dissipation element 230, the heat dissipation portion is in heat conduction fit with the heat absorption portion, the passive heat dissipation structure 320 is disposed on the heat dissipation portion, and the heat dissipation fan 310 is disposed on the passive heat dissipation structure 320. In this way, the semiconductor cooling element 330 is used as an active heat dissipation element to actively absorb the heat transmitted from the second heat dissipation element 230 through the heat absorption portion, so as to cool the heat dissipation space 250; meanwhile, the heat of the heat dissipation part is absorbed by the passive heat dissipation structure 320, so that the heat dissipation efficiency of the semiconductor refrigeration part 330 is improved. Furthermore, the heat dissipation fan 310 can generate a turbulent airflow to improve the heat dissipation efficiency of the passive heat dissipation structure 320, so that the heat dissipation efficiency of the electronic device is high and the heat is uniformly dissipated.

On the basis of the above embodiments, in an embodiment, the heat dissipation fan 310 or the heat dissipation fan 310 and the passive heat dissipation structure 320 are detachably disposed in the electronic device, and the electronic device is provided with the vent hole 31 matching with the heat dissipation fan 310. Thus, when the electronic device can meet the heat dissipation requirement by using the semiconductor cooling element 330, the heat dissipation fan 310 can be detached. When the semiconductor cooling device 330 cannot meet the heat dissipation requirement, the heat dissipation fan 310 may be externally connected to an external power source and installed in the electronic device, and the external air is sent into the electronic device through the vent hole 31, so as to improve the heat dissipation efficiency of the electronic device.

Further, the electronic device further includes a protective cover 30 cooperating with the middle frame body 100 to form a protective space, and the middle frame assembly 10 further includes a passive heat dissipation device 300, wherein at least a portion of the heat dissipation device 300 is detachably connected to the protective cover 30. As such, when the heat dissipating device 300 includes the heat dissipating fan 310, the heat dissipating fan 310 may be detachably disposed on the protective cover 30.

In some embodiments, the protective cover 30 is a rear cover when the electronic device is a mobile terminal.

Optionally, the electronic device is a smart television, and in any implementation of the cooling fan 310, the cooling fan 310 is detachably disposed on the rear cover. Therefore, the heat dissipation fan 310 can be selectively installed according to the intelligent television models corresponding to different specifications of the central processing unit, so that the production cost is reduced, and meanwhile, the heat dissipation performance is prevented from being wasted.

In some embodiments, the passive heat dissipation structure 320 includes a heat conductor 321 and heat dissipation fins 322, the heat dissipation fins 322 are disposed on an outer surface of the heat conductor 321 in a wrapping manner, and the heat conductor 321 transfers heat generated by the heat source module to the heat dissipation fins 322, and further transfers the heat from the heat dissipation fins 322 to the outside air, so as to enhance the heat dissipation effect. For example, the heat conductor 321 and the heat dissipation fins 322 are separate components, and for example, the passive heat dissipation structure 320 is integrally formed by casting to enhance mechanical performance.

The passive heat dissipation structure 320 is made of aluminum alloy. For example, the specific surface area of the heat dissipation fins 322 is 4 to 10 times the specific surface area of the heat conductor 321, and for example, the specific surface area of the heat dissipation fins 322 is 6.8 times the specific surface area of the heat conductor 321.

When the heat dissipation fan 310 is combined with the passive heat dissipation structure 320, the heat dissipation fan 310 is disposed outside the heat conductor 321, the heat dissipation fin 322 includes a plurality of fins, a heat dissipation flow channel is formed between two adjacent fins, and the heat dissipation flow channel is used for guiding an air flow generated by the heat dissipation fan 310, which is beneficial to improving heat dissipation efficiency.

In the embodiment of the present disclosure, the heat source module 20 refers to a device that radiates more heat in the electronic equipment, and includes at least one heat source device, that is, a heat generating element.

In an exemplary embodiment, the heat source module 20 includes a circuit board 21 and a heat source component 22 disposed on the circuit board 21.

In the practical application process, the heat radiated by the components is generally positively correlated with the power consumption of the components, and the larger the power consumption of the components is, the larger the heat radiated by the components is. Accordingly, the heat source component 22 in the present disclosure may be a device in an electronic device that consumes more than M% of the overall power consumption, where M may be 20, 30, 40, etc.

Alternatively, the heat source part 22 may include a central processing unit, a processing device integrating processing and storage functions, a power supply part (e.g., a battery), and the like.

In an exemplary embodiment, the heat source 22 includes a Central Processing Unit (CPU) and a resistance-capacitance device, and is disposed on two surfaces of the circuit board 21.

Optionally, the cpu is fixedly disposed on the heat source mounting portion 210 through the heat conducting layer 260. The heat conduction layer 260 may be disposed between the cpu and the heat source mounting portion 210 in various manners, such as being formed by adhering, painting, or spraying, or the formed heat conduction layer 260 is clamped between the cpu and the heat source mounting portion 210 by a fixed connection manner.

In an exemplary embodiment, the heat conductive layer 260 has elasticity and is pressed between the cpu and the heat source mounting portion 210. Thus, the heat conducting layer 260 can fully fill the gap between the cpu and the heat source mounting portion 210, increase the contact area, and improve the heat dissipation efficiency of the heat conducting cpu. In addition, the heat conduction layer 260 has elasticity, and can play a role in buffering, and can protect the central processing unit.

In some examples, the heat conductive layer 260 is one of heat conductive gel such as heat conductive silicone, heat conductive rubber, and the like.

Of course, the heat source module 20 may be other, and the embodiment of the disclosure is not limited in this respect.

In addition, in some embodiments, the heat conduction layer 260 with elasticity may be disposed between the independent adjacent components to improve the heat conduction effect between the adjacent components, and the heat dissipation efficiency is improved by the heat conduction layer 260.

The heat conduction layer 260 may be disposed between the middle frame body 100 and the first heat dissipation member 220, and/or between the second heat dissipation member 230 and the heat dissipation device 300, and/or between the first heat dissipation member 220 and the heat source module 20, and so on.

In order to further improve the heat dissipation efficiency and the heat dissipation effect of the electronic device, the heat dissipation efficiency of the middle frame body 100 can be further improved, so that the components directly or indirectly arranged on the middle frame body 100 have a good heat dissipation environment.

As shown in fig. 9 and 14, some embodiments are schematic structural diagrams of the middle frame assembly 10. Fig. 9 is a rear view of the middle frame assembly 10 shown in fig. 2. Fig. 10 is an exploded view of the structure of the middle frame assembly 10 shown in fig. 9. Fig. 11 is a partial structural view of the middle frame assembly 10 shown in fig. 10. Fig. 12 is an enlarged schematic view of a shown in fig. 11. Fig. 13 is a schematic view illustrating a heat dissipation state of the middle frame assembly 10 shown in fig. 11. Fig. 14 is an enlarged schematic view of B shown in fig. 13.

In some embodiments, the middle frame body 100 further includes a cooling portion 110 and a second face 102 disposed opposite to the first face 101, and the middle frame assembly 10 further includes a loop heat pipe 400 and a working fluid 500; the loop heat pipe 400 is disposed on the second surface 102, the loop heat pipe 400 includes an evaporator 410 and a pipeline unit 420, the evaporator 410 is disposed opposite to the heat source installation portion 210, the evaporator 410 includes a fluid infusion end 411 and an air outlet end 412, one end of the pipeline unit 420 is communicated with the fluid infusion end 411, the other end is communicated with the air outlet end 412, and a part of the pipeline unit 420 is in heat conduction fit with the cooling portion 110; the working fluid 500 is disposed in the loop heat pipe 400, the liquid working fluid 500 can be converted into a gas state by the evaporator 410, and the gaseous working fluid 500 can flow into the pipeline unit 420 through the gas outlet 412; the working fluid 500 in the gaseous state can be re-liquefied in the pipe unit 420 and fed into the fluid infusion port 411.

Thus, the loop heat pipe 400 is integrated into the middle frame body 100, the evaporator 410 absorbs heat from the heat source installation portion 210, the heat source device is actively cooled, the pipeline unit 420 transfers the heat to the cooling portion 110, and the space of the middle frame body 100 can be fully utilized for cooling, so that the heat dissipation performance of the middle frame body 100 can be improved, the heat dissipation efficiency of components integrated into the middle frame body 100 can be improved, and particularly the heat source module 20 which is easy to heat is provided.

In some embodiments, the first side 101 is a front side of the middle frame body 100, and the second side 102 is a back side of the middle frame body 100.

The "cooling unit 110" generally refers to a position where the temperature rises more slowly than the heat source mounting unit 210, that is, a position where the internal temperature of the electronic device is lower than the temperature of the "heat source mounting unit 210" during use of the electronic device.

Alternatively, a cooling portion 110 may be provided in a region corresponding to a rear surface, such as a battery compartment and a small plate region, which are remote from the "heat source mounting portion 210" to accelerate liquefaction of the working fluid 500.

It should be noted that the "working fluid 500" includes, but is not limited to, a cooling liquid (such as water, etc.) and other fluids that can be applied to the loop heat pipe 400, and a boiling point of the "working fluid 500" can be adjusted according to actual needs, and is not limited herein.

Such as the working fluid 500, including but not limited to formaldehyde, methanol, ethanol, or a mixture thereof with pure water.

It should be noted that "evaporator 410" includes a capillary wick and other structures, and the specific structure thereof includes, but is not limited to, other structures of evaporator 410 that can be applied to loop heat pipe 400.

In some embodiments, when the electronic device of the present disclosure is used, the heat source module 20 generates heat due to operation, and the evaporator 410 can actively absorb the heat transferred by the heat source module 20 through the heat source mounting portion 210, so that the liquid working fluid 500 in the evaporator 410 absorbs heat to evaporate, consumes heat energy, and flows to the cooling portion 110 through the pipeline unit 420 due to volume expansion. In this process, the gaseous working fluid 500 transfers heat to the middle frame body 100, and can release a large amount of heat to be condensed into liquid when flowing through the cooling portion 110, and the liquefied working fluid 500 flows back to the fluid infusion end 411 under the capillary force driving action of the capillary wick in the evaporator 410. And the liquid in the compensation chamber is evaporated again by the evaporator 410 and continues to absorb heat. Thus, an evaporation-condensation cycle is formed, the circulation of the working fluid 500 is driven by the capillary pressure generated by the capillary wick of the evaporator 410, the flow direction of the working fluid 500 is regular and the flow rate is fast, and the heat dissipation can be accelerated. And then can further utilize center body 100 to initiatively cool down the heat of heat source module 20 to carry out remote transport and the row with the heat to cooling part 110 such as battery compartment and platelet, make full use of center body 100's size dispels the heat, promoted electronic equipment's radiating efficiency greatly.

The middle frame assembly 10 of the present disclosure achieves the core capacity improvement of large heat transfer amount and long heat transfer distance without increasing the stacking thickness of the conventional middle frame body 100 and the whole machine, and combines the distribution of the heat source part and the non-heat source part (i.e., the cooling part 110), and makes full use of the whole middle frame area to perform efficient heat dissipation.

In some embodiments, at least a portion of the loop heat pipe 400 is embedded in the middle frame body 100. Therefore, the thickness space of the middle frame body 100 can be fully utilized to integrate the loop heat pipe 400, which can increase the contact area, thereby improving the heat dissipation efficiency, and actively reducing the protruding thickness of the heat dissipation structure. Furthermore, the middle frame assembly 10 of the present disclosure can meet the requirement of electronic device design, so that the electronic device of the present disclosure can be designed to be more light and thin, and has good heat dissipation performance, and the product competitiveness can be improved.

As shown in fig. 4, in some embodiments, the heat source mounting portion 210 and the cooling portion 110 are disposed at both sides of the battery mounting portion 120 at an interval. In this way, heat can be sufficiently dissipated by separating the heat source mounting portion 210 from the cooling portion 110. While allowing heat to be dissipated from the battery mounting portion 120 when flowing through the battery mounting portion 120.

For example, the electronic apparatus of the present disclosure may integrate the central processor as the heat source module 20 onto a main board, and have the main board disposed at one end of the battery, and a small board or a charge control board or the like placed at the other end of the battery. When the battery is not charged and the electronic device is used and the cpu is heated, the loop heat pipe 400 is used to dissipate heat, and the heat dissipation layer of the battery and the heat dissipation layer of the charge control board are used to accelerate heat dissipation by flowing through the battery and the charge control board, thereby further improving heat dissipation efficiency. When the battery is charged, the loop heat pipe 400 may be used to dissipate heat.

As shown in fig. 3 and 9, in some embodiments, in a projection plane of the front view direction of the middle frame body 100, at least a part of the evaporator 410 coincides with at least a part of the heat source mounting portion 210. In this manner, the heat source device is mounted to the heat source mounting part 210. When electronic equipment used, the heat source device can utilize center body 100 to dispel the heat while, also makes its heat energy only need through center body 100's thickness size distance, can give evaporimeter 410 with heat transfer, improves evaporimeter 410 and absorbs heat efficiency, makes working fluid 500 be heated and vaporize, dispels the heat fast to the heat source device, further accelerates radiating efficiency.

In addition to any of the above embodiments, as shown in fig. 10 to 11, in some embodiments, the middle frame body 100 is provided with a loop pipe groove 130, and the middle frame assembly 10 further includes a sealing cover 600 covering the loop pipe groove 130 and forming at least a part of the loop heat pipe 400. Therefore, the loop pipe groove 130 is directly formed on the middle frame body 100, and the sealing cover 600 is covered, so that at least part of the loop pipeline can be formed by fully utilizing the thickness of the middle frame body 100. Such as at least a portion of at least one of line unit 420 or reservoir 414.

The loop pipe groove 130 may be formed by stamping, etching, laser engraving, milling, etc.

In some embodiments, the loop pipe tank 130 is an etch tank. Thus, by using the etching technique, more loop heat pipes 400 can be formed on the middle frame body 100, such as the pipe unit 420, the liquid storage cavity 414, the evaporator 410, the one-way valve, and the like, and the thickness of the middle frame body 100 is fully utilized to accommodate more loop heat pipes 400, which is beneficial to the ultra-light and thin design of the electronic device. Meanwhile, a more precise loop heat pipe 400 structure can be obtained, and the reliability of the middle frame assembly 10 can be improved.

In one example, the loop pipe slots 130 are etch slots, which include capillary slots. Loop heat pipe 400 is formed by loop pipe groove 130 and sealing cap 600. Thus, the evaporator 410 can be directly formed on the middle frame body 100 by etching, thereby simplifying the assembly process and improving the production efficiency of the middle frame assembly 10.

Optionally, in some embodiments, the sealing cover 600 is welded and sealed with the middle frame body 100. Therefore, by using the welding and sealing technology, the sealing cover 600 and the middle frame body 100 are reliably sealed and fixed, and the two are attached more tightly, which is beneficial to reducing the size of the middle frame assembly 10 in the thickness direction.

In addition to any of the above embodiments, as shown in fig. 9 or fig. 15, in some embodiments, the loop heat pipe 400 is flat. Thus, the dimension of the middle frame assembly 10 in the thickness direction can be further reduced by fully utilizing the dimension of the middle frame body 100 in the width direction and/or the length direction to form the fluid channel, which is beneficial to making the electronic device thinner. Meanwhile, the contact area between the working fluid and the working fluid can be increased, so that the working fluid 500 can absorb and dissipate heat better.

Optionally, the maximum thickness of loop heat pipe 400 is less than or equal to 0.5mm. In this way, the electronic device can be adapted to ultra-light thin designs, or more space is provided for other components. For example, a larger battery can be accommodated by using the space, and the cruising ability of the electronic apparatus can be improved.

Optionally, the maximum thickness of loop heat pipe 400 is less than or equal to 0.4mm.

The thickness of loop heat pipe 400 includes, but is not limited to, 0.5mm, 0.45mm, 0.4mm, 0.35mm, 0.3mm, and the like.

In some embodiments, the evaporator 410 includes an evaporation portion 413, the evaporation portion 413 covers the heat source mounting portion 210 in a projection plane of the front view direction of the middle frame body 100, and an area of the evaporation portion 413 is 1.5 times to 2 times an area of the heat source mounting portion 210. Therefore, the evaporation part 413 can be used for fully radiating the heat source device, so that the heat source device can be uniformly and fully radiated, and the local overheating of the heat source device is avoided.

Optionally, the evaporation section 413 comprises a wick.

Based on any of the above embodiments, as shown in fig. 11 and 13, in some embodiments, the pipeline unit 420 includes a first conveying pipe, a second conveying pipe, and a condensing pipe 423 in heat-conducting fit with the cooling portion 110, where the condensing pipe 423 includes a cold end and a hot end, the cold end is communicated with the fluid infusion end 411 through the first conveying pipe, and the hot end is communicated with the air outlet end 412 through the second conveying pipe. By providing the condensation pipe 423 in this manner, a bypass condensation path can be formed, and heat dissipation of the cooling unit 110 can be fully utilized. Meanwhile, the condenser 423 is matched with the evaporator 410 through the first delivery pipe and the second delivery pipe to realize the circulation switching and the orderly flow of the liquid working fluid 500 and the gaseous working fluid 500, so that the heat dissipation reliability of the loop heat pipe 400 is higher.

In addition to any of the embodiments described above, in some embodiments, the second delivery tube has an inner diameter greater than an inner diameter of the first delivery tube. In this way, after the liquid working fluid 500 is vaporized, the liquid working fluid can rapidly flow into the second conveying pipe (airflow flowing from positive pressure to negative pressure is easily generated), and the liquid working fluid is conveyed into the condensation pipe 423 for cooling, which is beneficial for the gaseous working fluid 500 to push the liquid working fluid 500 to circularly flow.

Optionally, the inner diameter of the second delivery tube is equal to 1 or 1.5 or 2 times the inner diameter of the first delivery tube, etc.

In addition to any of the above embodiments, in some embodiments, in a projection plane of the front view direction of the middle frame body 100, at least part of the condensation pipe 423 overlaps with at least part of the cooling portion 110. In this way, the heat radiation distance can be reduced as much as possible, and the gas in the condensation pipe 423 can be cooled by the low temperature of the cooling unit 110.

In addition to any of the above embodiments, as shown in fig. 11 and 12, in some embodiments, the loop heat pipe 400 further includes a backflow preventing structure 430, and the backflow preventing structure 430 is disposed on the middle frame body 100, so that the working fluid 500 passes through one end of the pipe unit 420 and flows into the evaporator 410 through the backflow preventing structure 430. In this way, the backflow preventing structure 430 enables the working fluid 500 to stably circulate in the designed direction, so as to ensure the stability and reliability of the operation of the loop heat pipe 400.

The anti-backflow structure 430 includes, but is not limited to, a one-way valve, etc.

Optionally, the anti-reflux mechanism is a tesla valve structure 432.

As shown in fig. 12 and 14, in some embodiments, the loop heat pipe 400 further includes a tesla valve structure 432, and the tesla valve structure 432 is disposed on the middle frame body 100, so that the working fluid 500 passes through one end of the pipeline unit 420 and flows into the evaporator 410 through the tesla valve structure 432. Due to the characteristics of the tesla valve that the forward flow resistance is small and the reverse flow resistance is great, the tesla valve structure 432 is applied to the loop heat pipe 400, so that the low-resistance backflow of the liquid working fluid 500 can be realized, the backflow of the liquid working fluid 500 in the evaporator 410 is prevented, the one-way low-resistance flow of the working fluid 500 in the evaporator 410 is ensured, the driving force is generated, and the stable circulation of the loop heat pipe 400 is ensured.

Alternatively, the output area of the tesla valve structure 432 is generally designed to be equal or approximately equal to the input area of the capillary wick of the evaporator 410.

In addition to any of the above embodiments, in some embodiments, the evaporator 410 includes an evaporation portion 413 disposed between the fluid infusion end 411 and the air outlet end 412, and the tesla valve structure 432 is disposed between the fluid infusion end 411 and the evaporation portion 413, so that the working fluid 500 flows into the evaporation portion 413 through the tesla valve structure 432. Thus, the evaporator 410 and the tesla valve structure 432 are coupled together, which is beneficial to the ultra-bode design, so that the loop heat pipe 400 is in an ultra-thin flat plate shape, and the overall thickness is less than 0.5mm. Meanwhile, the evaporators 410 after the structure integration can be flexibly arranged, namely, a plurality of evaporators 410 can be correspondingly arranged according to a plurality of heat source positions on the electronic equipment, turbulence can be effectively prevented by utilizing the Tesla valve structures 432 among the evaporators 410, so that the evaporators 410 operate stably, modularization assembly is facilitated, and the production efficiency of the middle frame assembly 10 is improved.

In addition to the above embodiments, as shown in fig. 13 and 14, in some embodiments, the evaporator 410 includes a liquid storage cavity 414, the liquid storage cavity 414 is disposed between the fluid replenishing end 411 and the evaporation portion 413, and the tesla valve structure 432 is disposed in the liquid storage cavity 414. Thus, the tesla valve structure 432 is disposed in the liquid storage cavity 414, so as to prevent the liquid working fluid 500 from flowing out of the evaporator 410, and further facilitate to maintain the liquid working fluid 500 in the liquid storage cavity 414, so that the evaporation portion 413 can obtain the liquid working fluid 500 in time to continuously generate the driving force. Meanwhile, when the electronic device is not used, the liquid storage chamber 414 can store the liquid working fluid 500 for the evaporation portion 413 to evaporate.

In addition to any of the above embodiments of the evaporation portion 413, as shown in fig. 12 and 14, in some embodiments, at least two tesla valve structures 432 are disposed in parallel between the fluid infusion end 411 and the evaporation portion 413. As such, the ability to one-way divert of the tesla valve structure 432 of the present disclosure is enhanced by the use of at least two tesla valve parallel structures.

Optionally, the tesla valve structures 432 have a width less than 1mm, a height less than 0.5mm, and a spacing between two adjacent tesla valve structures 432 less than 1.5mm.

As shown in fig. 15, in some embodiments, the middle frame body 100 is provided with a mounting groove 140 adapted to the loop heat pipe 400, and at least a portion of the loop heat pipe 400 is embedded in the middle frame body 100 through the mounting groove 140. In this way, the installation groove 140 is utilized to accommodate at least part of the loop heat pipe 400, so that the loop heat pipe 400 can be embedded in the middle frame body 100 to reduce the thickness dimension of the middle frame assembly 10.

In addition to the above embodiments, in some embodiments, the middle frame assembly 10 further includes a heat conductive adhesive layer 700, and at least a portion of the loop heat pipe 400 is fixed in the installation groove 140 through the heat conductive adhesive layer 700. Thus, the loop heat pipe 400 can be initially placed on the mounting groove 140, and then fixed by the heat-conducting adhesive layer 700, so that the heat-conducting efficiency of the loop heat pipe and the heat-conducting adhesive layer can be improved, and the loop heat pipe and the heat-conducting adhesive layer can be easily assembled.

The loop heat pipe 400 has a long heat transfer distance and strong antigravity capability, and can solve the problem that the traditional heat pipe is limited by the use direction and length. In addition, the loop heat pipe 400 of the present disclosure separates the vapor channel and the liquid channel, and the vapor and the liquid are respectively transmitted in the respective pipelines (e.g., the vapor flows in the first delivery pipe, and the liquid flows in the second delivery pipe), so that the occurrence of the mutual carrying phenomenon is avoided, and the heat dissipation reliability is high; and the installation of the loop heat pipe 400 becomes flexible and convenient, and is not limited by the orientation and distance between the heat source and the heat sink.

Based on any of the above embodiments, as shown in fig. 16, in some embodiments, the evaporators 410 include more than two evaporators 410, two adjacent evaporators 410 are disposed on the middle frame body 100 at intervals, the pipeline unit 420 includes a liquid supplementing branch 424 and an air outlet branch 425 corresponding to the evaporators 410 one by one, the liquid supplementing branch 424 is communicated with the corresponding liquid supplementing end 411, and the air outlet branch 425 is communicated with the corresponding air outlet end 412. Thus, the middle frame assembly 10 of the present disclosure can actively dissipate heat of different heat source devices on the electronic device, and further improve the heat dissipation efficiency.

By combining the tesla valve structure 432 or the backflow prevention structure 430, each evaporator 410 has a unidirectional flow characteristic, so that when the thermal load difference is large, the circulation power of each evaporator 410 can be stably improved, and the stable operation performance of the parallel evaporator 410 structure can be improved.

In addition to any of the above embodiments, in some embodiments, the larger the vapor generation rate between two adjacent evaporators 410, the larger the inner tube diameter of the corresponding liquid replenishing branch 424 and/or the inner tube diameter of the gas outlet branch 425. Thus, the working fluid 500 can be reasonably distributed, so that the compensation of the liquid working fluid 500 among the evaporators 410 is smooth and sufficient, and the reliability and stability of the heat dissipation of the middle frame assembly 10 of the present disclosure are improved.

It should be noted that the "heat source installation portion" may be a part of the middle frame body, that is, the "heat source installation portion" and the "other parts of the middle frame body, such as the cooling portion", are manufactured by integral molding; or an independent component which can be separated from other parts of the middle frame body such as the cooling part, namely the heat source mounting part can be manufactured independently and then combined with other parts of the middle frame body such as the cooling part into a whole.

Equivalently, the "body" and the "certain part" can be parts of the corresponding "component", i.e., the "body" and the "certain part" are integrally manufactured with other parts of the "component"; the "part" can be made separately from the "other part" and then combined with the "other part" into a whole. The expression "a certain body" or "a certain portion" in the present disclosure is only one example, and is not intended to limit the scope of the present disclosure, so long as the above features are included and the same function is understood to be equivalent to the present disclosure.

It should be noted that the "tesla valve structure" may be one of the parts of the "evaporator" module, that is, assembled with the "other components of the evaporator" into one module, and then assembled modularly; or can be relatively independent from other components of the evaporator and can be respectively installed, namely the evaporator and other components of the evaporator can form a whole in the device.

Equivalently, the components included in the "heat dissipation device", "middle frame assembly", and "electronic device" of the present disclosure can also be flexibly combined, i.e., can be produced in a modularized manner according to the actual situation, and can be modularly assembled as an independent module; it is also possible to carry out the assembly separately, in the present device forming a module. The division of the above components in the present disclosure is only one of the embodiments, which is convenient for reading, and is not a limitation to the scope of protection of the present disclosure, as long as the above components are included and the function is the same, it should be understood that the technical solutions of the present disclosure are equivalent.

In the description of the present disclosure, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present disclosure and to simplify the description, but are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the present disclosure.

Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include at least one of the feature. In the description of the present disclosure, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise.

In the present disclosure, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integral with; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present disclosure can be understood as a specific case by a person of ordinary skill in the art.

In the present disclosure, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to," "disposed on," "secured to," or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples only show several embodiments of the present disclosure, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by one skilled in the art without departing from the spirit of the disclosure, and these changes and modifications are all within the scope of the disclosure.

Claims

1. A center frame assembly, comprising:

the middle frame body comprises a first surface; and

the vapor chamber comprises a first heat dissipation piece, a second heat dissipation piece and a third heat dissipation piece, wherein the first heat dissipation piece is fixedly arranged on the first surface, the first heat dissipation piece is provided with a heat source installation part facing the second heat dissipation piece, the second heat dissipation piece passes through the third heat dissipation piece and the first heat dissipation piece are connected, and the second heat dissipation piece can be arranged at intervals relative to the first heat dissipation piece to form a heat dissipation space.

2. The middle frame assembly according to claim 1, wherein at least a portion of said third heat dissipation element is flexible.

3. The middle frame assembly of claim 1, wherein the heat spreader plate is a flexible heat spreader cold plate.

4. The middle frame assembly according to claim 1, wherein the heat spreader further comprises a phase change working medium disposed within at least one of the first heat sink, the second heat sink, or the third heat sink.

5. The center frame assembly of claim 4, wherein the phase change working medium has a boiling point of 20 ℃ to 90 ℃.

6. The center frame assembly according to claim 1, further comprising a heat dissipation device disposed outside the heat dissipation space for actively dissipating heat from the second heat dissipation member.

7. The center frame assembly according to claim 6, wherein the heat dissipation device includes a heat dissipation fan disposed toward the second heat dissipation member;

or the heat radiating device comprises a semiconductor refrigerating element arranged on the second heat radiating element, and the semiconductor refrigerating element comprises a heat absorbing part in heat conduction fit with the second heat radiating element;

or, the heat dissipation device comprises a heat dissipation fan and a semiconductor refrigeration piece arranged on the second heat dissipation piece, the semiconductor refrigeration piece comprises a heat dissipation part and a heat absorption part in heat conduction fit with the second heat dissipation piece, and the heat dissipation fan faces the heat dissipation part.

8. The middle frame assembly according to claim 6, wherein the heat dissipation device comprises a heat dissipation fan and a passive heat dissipation structure, the passive heat dissipation structure is fixedly disposed on the second heat dissipation member, and the heat dissipation fan is disposed on the passive heat dissipation structure;

or the heat radiating device comprises a passive heat radiating structure and a semiconductor refrigerating element arranged on the second heat radiating element, the semiconductor refrigerating element comprises a heat radiating part and a heat absorbing part in heat conduction fit with the second heat radiating element, the heat radiating part is in heat conduction fit with the heat absorbing part, and the passive heat radiating structure is arranged on the heat radiating part;

or, the heat dissipation device comprises a passive heat dissipation structure, a heat dissipation fan and a semiconductor refrigeration piece arranged on the second heat dissipation piece, the semiconductor refrigeration piece comprises a heat dissipation part and a heat absorption part in heat conduction fit with the second heat dissipation piece, the heat dissipation part is in heat conduction fit with the heat absorption part, the passive heat dissipation structure is arranged on the heat dissipation part, and the heat dissipation fan is arranged on the passive heat dissipation structure.

9. The middle frame assembly according to any one of claims 1 to 8, wherein said middle frame body further comprises a cooling portion and a second face disposed opposite to said first face; the middle frame assembly further comprises:

the loop heat pipe is arranged on the second surface and comprises an evaporator and a pipeline unit, the evaporator is arranged opposite to the heat source installation part, the evaporator comprises a liquid supplementing end and a gas outlet end, one end of the pipeline unit is communicated with the liquid supplementing end, the other end of the pipeline unit is communicated with the gas outlet end, and part of the pipeline unit is in heat conduction fit with the cooling part; and

the working fluid is arranged in the loop heat pipe, the working fluid in a liquid state can be converted into a gas state by the evaporator, and the working fluid in the gas state can flow into the pipeline unit through the gas outlet end; the working fluid in the gaseous state can be re-liquefied in the pipeline unit and sent to the fluid replacement end.

10. The middle frame assembly according to claim 9, wherein the pipe unit includes a first pipe, a second pipe, and a condenser pipe in heat-conducting engagement with the cooling portion, the condenser pipe includes a cold end and a hot end, the cold end is communicated with the fluid infusion end through the first pipe, and the hot end is communicated with the air outlet end through the second pipe.

11. The middle frame assembly according to claim 9, wherein the loop heat pipe further includes a backflow prevention structure provided to the middle frame body such that the working fluid passes through one end of the pipe unit and flows into the evaporator through the backflow prevention structure.

12. The center frame assembly according to claim 11, wherein the loop heat pipe further includes a tesla valve structure provided to the center frame body so that the working fluid passes through one end of the piping unit and flows into the evaporator through the tesla valve structure.

13. The center frame assembly of claim 12, wherein the evaporator includes an evaporation portion disposed between the fluid infusion end and the air outlet end, the tesla valve structure being disposed between the fluid infusion end and the evaporation portion such that the working fluid flows into the evaporation portion through the tesla valve structure.

14. The center frame assembly of claim 13, wherein the evaporator includes a fluid reservoir disposed between the fluid refill end and the evaporation portion, the tesla valve structure disposed within the fluid reservoir; and/or at least two Tesla valve structures are arranged between the liquid supplementing end and the evaporation part in parallel.

15. An electronic apparatus, comprising a heat source module and the middle frame assembly according to any one of claims 1 to 14, wherein the heat source module is fixed to the first heat dissipation member by the heat source mounting portion.

16. The electronic apparatus according to claim 15, further comprising a heat conduction member interposed between the heat source module and the first heat dissipation member.

17. The electronic device according to claim 15, wherein the heat source module includes a circuit board and a heat source member provided to the circuit board.

18. The electronic device of any one of claims 15-17, further comprising a cover cooperating with the bezel body to form a protective space, wherein the bezel assembly further comprises a heat dissipation device, and at least a portion of the heat dissipation device is detachably connected to the cover.