CN115135094A - Electronic device - Google Patents

Abstract

The utility model discloses an electronic equipment, including center, shield cover, heat source module and heat abstractor. Wherein, the middle frame comprises a first surface; the shielding cover is arranged at an interval with the first surface and is provided with a shielding cavity; the heat source module is arranged between the first surface and the shielding case, the heat source module comprises a circuit board arranged on the first surface and a first heat source part arranged on the circuit board, and the first heat source part is arranged in the shielding cavity; the heat dissipation device is used for dissipating heat of the shielding case and/or the heat source module. The electronic equipment has good heat dissipation efficiency, and can reduce or avoid the occurrence of local overheating phenomenon.

Description

Electronic device

Technical Field

The present disclosure relates to the field of electronic technologies, and in particular, to an electronic device.

Background

At present, electronic devices such as mobile phones, tablet computers, wearable devices, distance measuring devices, scanning devices and the like have become essential scientific and technological products in the life, study and entertainment processes of people. With the development of electronic devices, the core number of CPUs (Central Processing units) used by the electronic devices is increased, and the performance of the electronic devices is increasingly enhanced, so that the electronic devices generate more and more heat. Especially in recent years the temperature rise experience has become an important consideration for consumers to buy electronic devices.

However, in the related heat dissipation technical solution of the electronic device, the problem of local overheating of the electronic device caused by untimely heat dissipation still exists.

Disclosure of Invention

The present disclosure provides an electronic device having a good heat dissipation efficiency, which can reduce or avoid the occurrence of local overheating.

The technical scheme is as follows:

according to an embodiment of the present disclosure, an electronic device is provided, which includes a middle frame, a shielding cover, a heat source module, and a heat dissipation apparatus; the middle frame comprises a first surface; the shielding cover is arranged at an interval with the first surface and is provided with a shielding cavity; the heat source module is arranged between the first surface and the shielding case, and comprises a circuit board arranged on the first surface and a first heat source component arranged on the circuit board, and the first heat source component is arranged in the shielding cavity; the heat dissipation device is used for dissipating heat of the shielding case and/or the heat source module.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

when the electronic equipment disclosed is used, the first heat source component is fixedly arranged in the shielding cavity, and the heat dissipation device can be fully utilized to dissipate heat of the shielding cover and/or the heat source module, so that the electronic equipment disclosed also can ensure the heat dissipation efficiency while having a better shielding effect, and further can avoid the local overheating phenomenon of the first heat source component in the shielding cavity, and is favorable for improving the operation stability and the reliability. In addition, the heat source module is arranged on the middle frame, so that the area of the middle frame can be fully utilized for heat dissipation, and the heat dissipation efficiency can be further improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

Brief description of the drawingsthe accompanying drawings, which form a part of the disclosure, are included to provide a further understanding of the disclosure, and the exemplary embodiments and descriptions thereof are provided to explain the disclosure and not to limit the disclosure.

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a mobile terminal shown in an embodiment.

Fig. 2 is a schematic front view of the middle frame shown in fig. 1.

Fig. 3 is an exploded view of a portion of the structure of the mobile terminal shown in fig. 1.

Fig. 4 is a side view of the shielding module of the electronic device shown in fig. 3.

Fig. 5 is a schematic side view of a shielding module in an electronic device according to another embodiment.

Fig. 6 is a partial cross-sectional view of a shielding module in an electronic device according to another embodiment.

Fig. 7 is a partial cross-sectional schematic view of a shielding module in an electronic device according to another embodiment.

Fig. 8 is a schematic top view of a passive heat dissipation structure according to an embodiment.

Fig. 9 is a rear view of the structure of the middle frame heat dissipation module shown in fig. 2.

Fig. 10 is an exploded view of the heat dissipation module of the middle frame shown in fig. 9.

Fig. 11 is a schematic view of a partial structure of the middle frame heat dissipation module shown in fig. 10.

Fig. 12 is an enlarged schematic view of a shown in fig. 11.

Fig. 13 is a schematic diagram illustrating a heat dissipation state of the middle frame heat dissipation module shown in fig. 11.

Fig. 14 is an enlarged schematic view of B shown in fig. 13.

Fig. 15 is a schematic structural diagram of another embodiment of the middle frame heat dissipation module shown in fig. 9.

Fig. 16 is a partial structural view of a middle frame heat dissipation module according to another embodiment.

Description of reference numerals:

10. a middle frame; 11. a first side; 12. a second face; 13. a cooling section; 14. a battery mounting portion; 15. a loop pipe groove; 16. mounting grooves; 20. a shield case; 21. a shielding cavity; 30. a heat source module; 31. a circuit board; 32. a first heat source member; 33. a second heat source member; 40. a heat sink; 100. a vapor chamber; 110. a first heat radiation body; 120. a second heat sink; 130. connecting the heat radiation body; 140. a heat dissipation space; 150. a heat conducting layer; 200. a heat dissipating device; 210. a heat radiation fan; 220. a passive heat dissipation structure; 221. a heat conductor; 222. heat dissipation fins; 230. a semiconductor refrigerating member; 300. a heat dissipation layer; 400. a loop heat pipe; 410. an evaporator; 411. a fluid infusion end; 412. an air outlet end; 413. an evaporation section; 414. a liquid storage cavity; 420. a piping unit; 421. a first delivery pipe; 422. a second delivery pipe; 423. a condenser tube; 424. a liquid supplementing branch; 425. an air outlet branch; 430. an anti-reflux structure; 432. a Tesla valve structure; 500. a working fluid; 600. a sealing cover; 700. a thermally conductive adhesive layer; 50. a protective cover; 51. and (4) a vent hole.

Detailed Description

For the purpose of making the purpose, technical solutions and advantages of the present disclosure more apparent, the present disclosure will be described in further detail below with reference to the accompanying drawings and detailed description. It should be understood that the detailed description and specific examples, while indicating the scope of the disclosure, are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein in the description of the disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure.

For convenience of understanding, technical terms involved in the embodiments of the present disclosure are explained and described below.

The Vapor Chamber (VC) has a vacuum Chamber with a fine structure, and has a good heat dissipation function, and the material of the Vapor Chamber includes, but is not limited to, copper, stainless steel, titanium alloy, and the like.

The heat radiation fan includes a micro turbo fan or an axial fan, etc.

Semiconductor refrigeration devices (Thermal Electric Cooler, TEL for short) are also known as peltier refrigeration devices.

The Thermal Interface Material (TEL) has good Thermal conductivity, and its specific implementation modes include but are not limited to Thermal silicone grease, Thermal adhesive, Thermal gasket, etc.

The Loop Heat Pipe (Loop Heat Pipe, abbreviated as LHP in English) has good Heat dissipation function.

And the passive heat dissipation structure is provided with sheet-shaped heat dissipation teeth and/or heat dissipation fins.

The resistor-capacitor element is a general term for resistor-capacitor elements.

At present, electronic devices such as mobile phones, tablet computers, wearable devices, distance measuring devices, scanning devices and the like have become essential scientific and technological products in the life, study and entertainment processes of people. With the development of electronic devices, the core number of CPUs (Central Processing units) used by the electronic devices is increased, and the performance of the electronic devices is increasingly enhanced, so that the electronic devices generate more and more heat, and the heat dissipation performance of the electronic devices is challenged more and more. Especially in recent years the temperature rise experience has become an important consideration for consumers to buy electronic devices. Meanwhile, the better the heat dissipation performance is, the more balanced the heat dissipation is, the more attractive the consumer can purchase, so that the heat dissipation efficiency of the electronic equipment is improved, the local overheating is avoided, and the problem that the industry attaches more and more importance is solved.

However, in the related heat dissipation technical scheme of the electronic device, the phenomenon of untimely heat dissipation is easily caused, and the heat dissipation efficiency is difficult to improve. And the heat dissipation is not timely, can lead to the local overheat of electronic equipment, influences the operating performance of electronic equipment easily, even the phenomenon of halting appears.

Based on this, the present disclosure provides an electronic device, which can improve heat dissipation efficiency, avoid the occurrence of local overheating phenomenon, so as to ensure the operation performance of the electronic device, and facilitate improving the reliability of the electronic device.

The technical scheme of the disclosure is further explained by combining the specific structural drawings.

Fig. 1 to 4 are structural diagrams of an electronic device and an electronic device shown in an embodiment. Fig. 1 is a schematic structural diagram of a mobile terminal shown in an embodiment. Fig. 2 is an exploded view of a portion of the structure of the mobile terminal shown in fig. 1. Fig. 3 is a schematic front view of the middle frame shown in fig. 2. Fig. 4 is a side view of the shielding module of the electronic device shown in fig. 3.

An embodiment of the present disclosure provides an electronic device, which may be: cell-phone, panel computer, electronic reader, notebook computer, mobile device, wearable equipment, range finding equipment, scanning device etc. it includes center 10, shield cover 20, heat source module 30 and heat abstractor 40.

Wherein, the middle frame 10 comprises a first surface 11; the shielding cover 20 and the first surface 11 are arranged at intervals, and the shielding cover 20 is provided with a shielding cavity 21; the heat source module 30 is disposed between the first surface 11 and the shielding case 20, the heat source module 30 includes a circuit board 31 disposed on the first surface 11 and a first heat source component 32 disposed on the circuit board 31, and the first heat source component 32 is disposed in the shielding cavity 21; the heat sink 40 is used for dissipating heat of the shield case 20 and/or the heat source module 30.

When the electronic equipment disclosed herein is used, the first heat source component 32 is fixedly arranged in the shielding cavity 21, and the heat dissipation device 40 can be fully utilized to dissipate heat of the shielding case 20 and/or the heat source module 30, so that the electronic equipment disclosed herein can ensure the heat dissipation efficiency while having a better shielding effect, and further can avoid the local overheating phenomenon of the first heat source component 32 in the shielding cavity 21, which is beneficial to improving the operation stability and reliability. In addition, the heat source module 30 is disposed on the middle frame 10, so that the area of the middle frame 10 can be fully utilized for heat dissipation, which is beneficial to further improving the heat dissipation efficiency.

In the embodiment of the present disclosure, the middle frame 10 may be a frame structure of an electronic device, and besides the vapor chamber 100 and the heat source module 30 may be integrated, some or all of the components of the electronic device may be directly or indirectly disposed on the middle frame 10 to assemble the electronic device.

Alternatively, the bezel 10 may be disposed inside the electronic device, and the edge of the bezel 10 may be designed to be a part of the housing of the electronic device. The edge of the middle frame 10 may serve to protect the electronic device when serving as a housing of the electronic device.

Alternatively, the middle frame 10 may have a flat or plane-like structure, and thus, two side surfaces of the middle frame 10, which may be referred to as a front surface and a rear surface of the middle frame 10, or one side surface and the other side surface of the middle frame 10, may be visually distinguished. In the inside of center 10, can carry out part fretwork as required to set up other components and parts in the electronic equipment.

Alternatively, part or all of the middle frame 10 may be made of a metal or an alloy material (e.g., an aluminum alloy). Of course, the material of the middle frame 10 may be other materials, and this is not particularly limited in the embodiments of the present disclosure.

In some embodiments, the heat sink 40 includes a vapor chamber 100, the vapor chamber 100 in thermally conductive engagement with the first heat source component 32. Thus, the soaking plate 100 can improve the heat dissipation efficiency and the heat conduction efficiency of the shielding case 20, so that the first heat source part 32 can dissipate heat to prevent the overheating phenomenon from occurring at the shielding case 20.

On the basis of any of the above embodiments, in an embodiment, the vapor chamber 100 further includes a phase-change working medium. Therefore, the phase change working medium can be selected according to actual needs to meet the heat dissipation requirements of different electronic equipment and obtain better cost performance.

On the basis of any of the above embodiments, in an embodiment, the boiling point of the phase-change working medium is 20 ℃ to 90 ℃. Thus, the soaking plate 100 has good heat-conducting performance and heat-dissipating performance at the operating temperature of 10-45 ℃ of the electronic equipment. And then can in time carry out the heat mediation with the heat that heat source module 30 produced through vapor chamber 100 to utilize the motion of the inside phase transition working medium of vapor chamber in time to reduce the heat or transmit to the position that the temperature is lower, make the inside heat dissipation of electronic equipment even.

The phase-change working medium includes but is not limited to formaldehyde, methanol, ethanol or a mixture of the formaldehyde, the methanol and the ethanol and pure water.

In addition, the start-up temperature of the soaking plate 100 may be more desirably adjusted. For example, the starting temperature of the vapor chamber 100 is lowered by adjusting the vacuum degree in the chamber of the vapor chamber 100 and/or using phase-change working media with different boiling points, so as to achieve the equilibrium state of sufficient gas-liquid phase change in advance.

In some embodiments, the vapor chamber 100 includes a first heat sink 110, a connecting heat sink 130, and a second heat sink 120 in heat conduction fit with the first heat source part 32, the first heat sink 110 is fixedly disposed on the first surface 11, the second heat sink 120 is connected to the first heat sink 110 through the connecting heat sink 130, and the second heat sink 120 and the first heat sink 110 are disposed at an interval to form a heat dissipation space 140 for accommodating the heat source module 30. Therefore, the soaking plate 100 is bent by the connecting radiator 130 to form the first radiator 110 and the second radiator 120 which are oppositely arranged to form the radiating space 140, the first radiator 110 is arranged on the middle frame 10, the radiating efficiency of the middle frame 10 can be improved, the heat source module 30 can be fixedly arranged in the radiating space 140 through the middle frame 10, and then the first radiator 110 and the second radiator 120 can be fully utilized and the connecting radiator 130 can be used for radiating the heat source module 30, so that the radiating efficiency of the electronic equipment is high, the local overheating phenomenon of the heat source module 30 can be avoided, and the running stability of the electronic equipment can be further ensured.

On the basis of the above embodiments, in an embodiment, at least part of the connection heat radiator 130 has flexibility. Thus, the second heat sink 120 is conveniently bent over the first heat sink 110 to form the heat dissipation space 140.

Alternatively, in another embodiment, the soaking plate 100 is a flexible soaking cold plate. Thus, the first heat sink 110, the second heat sink 120 and the connecting heat sink 130 can be integrally formed and manufactured, so that the second heat sink 120 can be conveniently bent over the first heat sink 110 to form the heat dissipation space 140, and the heat transfer path can be shortened to reduce the thermal conduction resistance.

In addition, the soaking plate 100 is integrally formed, which is advantageous for improving reliability.

On the basis of any of the above embodiments, in an embodiment, the phase-change working medium is disposed in at least one of the first heat dissipation body 110, the second heat dissipation body 120, or the connecting heat dissipation body 130. Therefore, the electronic equipment can be selected according to actual needs to meet the heat dissipation requirements of the electronic equipment, and better cost performance is obtained.

Optionally, the phase change working medium is disposed in the first heat dissipation body 110, the second heat dissipation body 120, and the connection heat dissipation body 130. Thus, the heat dissipation of the vapor chamber 100 is more uniform, which is favorable for further avoiding the local overheating of the electronic device caused by the heat generated by the heat source module 30.

Besides the soaking plate, the heat dissipation device can be integrated with other heat dissipation devices. Fig. 5 to 7 are schematic structural diagrams of a shielding module in an electronic device shown in some embodiments. Fig. 5 is a schematic side view of a shielding module according to another embodiment. Fig. 6 is a partial cross-sectional schematic view of a shielding module according to another embodiment. Fig. 7 is a partial cross-sectional view of a shielding module according to another embodiment. Fig. 8 is a schematic top view of a passive heat dissipation structure 220 according to an embodiment.

In some embodiments, the heat dissipation device 40 further includes a heat dissipation device 200, the heat dissipation device 200 is disposed outside the shielding can 20, and the heat dissipation device 200 is used for actively dissipating heat from the vapor chamber 100. Thus, the heat spreader 200 can be used to actively dissipate heat from the vapor chamber 100, so as to further improve the heat dissipation efficiency of the shield case 20 and prevent overheating at the shield case 20. Meanwhile, the heat dissipation of the heat source module 30 is more uniform by the cooperation of the middle frame 10 and the heat dissipation device 200, which is beneficial to further avoiding local overheating.

In some embodiments, the vapor chamber 100 is a sidewall of the shielded cavity 21.

The specific implementation of the heat dissipation device 200 may be various:

as shown in fig. 6, in one embodiment, the heat dissipating device 200 includes a heat dissipating fan 210, and the heat dissipating fan 210 is disposed toward the soaking plate 100. Thus, the disturbing airflow can be generated by the heat dissipation fan 210, so that the heat dissipation of the shielding case 20 can be further realized to be uniform, and the overheating phenomenon at the shielding case 20 can be avoided. In addition, if interact with the outside gas, with the leading-in electronic equipment of outside cold gas in, cool down electronic equipment, can further improve electronic equipment's radiating efficiency.

The heat dissipation fan 210 may be disposed in the electronic device, or may be detachably disposed in the electronic device, which is not limited herein.

Or in another embodiment, the heat dissipation device comprises a semiconductor refrigeration piece, and the semiconductor refrigeration piece is used for actively dissipating heat of the soaking plate. Therefore, the semiconductor refrigerating piece is used as an active heat radiating element, the heat transmitted by the soaking plate is actively absorbed through the heat absorbing part, the heat radiating performance of the soaking plate is improved, the temperature in the shielding cavity is reduced, the overheating phenomenon at the shielding cover 20 is avoided, and the reliability of the electronic equipment can be further improved.

Or, in another embodiment, the heat dissipation device includes a heat dissipation fan and a semiconductor cooling member, a heat absorption portion (not labeled) of the semiconductor cooling member is in heat conduction fit with the soaking plate, and the heat dissipation fan is disposed toward a heat release portion (not labeled) of the semiconductor cooling member. Therefore, the heat absorption part of the semiconductor refrigeration piece is used for actively absorbing away the heat of the soaking plate, and the heat dissipation performance of the soaking plate is improved. Meanwhile, the cooling fan can actively supply air to the semiconductor refrigeration piece or form negative pressure, so that the air flowing speed outside the shielding cover is increased, the heat dissipation is accelerated, the temperature in the shielding cavity 21 is further reduced, and the overheating phenomenon at the shielding cover 20 is avoided.

In addition, the heat dissipation device 200 may be integrated with a passive heat dissipation structure 220 in addition to an active heat dissipation component.

As shown in fig. 6, in an embodiment, the heat dissipation device 200 includes a heat dissipation fan 210 and a passive heat dissipation structure 220, the passive heat dissipation structure 220 is fixed on the vapor chamber 100, and the heat dissipation fan 210 is disposed on the passive heat dissipation structure 220. Thus, the passive heat dissipation structure 220 absorbs the heat of the vapor chamber 100, thereby accelerating the heat dissipation of the vapor chamber 100. Meanwhile, the heat dissipation fan 210 may generate a turbulent airflow to improve the heat dissipation efficiency of the passive heat dissipation structure 220, so that the heat dissipation efficiency of the electronic device is high and the heat dissipation is uniform.

Alternatively, referring to fig. 7, in another embodiment, the heat dissipating device 200 includes a passive heat dissipating structure 220 and a semiconductor cooling member 230, the heat absorbing portion of the semiconductor cooling member 230 is in heat-conducting engagement with the soaking plate 100, and the passive heat dissipating structure 220 is disposed on the heat releasing portion of the semiconductor cooling member 230. Thus, the semiconductor cooling element 230 is used as an active heat dissipation element to actively absorb the heat transmitted from the vapor chamber 100 through the heat absorption portion, and actively transfer the heat energy to the passive heat dissipation structure 220 through the heat dissipation portion for heat dissipation, so as to improve the heat dissipation efficiency and avoid the overheating at the shielding case 20.

Alternatively, as shown in fig. 7, in another embodiment, the heat dissipating device 200 includes a passive heat dissipating structure 220, a heat dissipating fan 210 and a semiconductor cooling device 230, the heat absorbing portion vapor chamber 100 of the semiconductor cooling device 230 is in heat conduction fit, the passive heat dissipating structure 220 is disposed on the heat dissipating portion of the semiconductor cooling device 230, and the heat dissipating fan 210 is disposed on the passive heat dissipating structure 220. In this way, the semiconductor cooling device 230 is used as an active heat dissipation element to actively absorb the heat transmitted from the vapor chamber 100 through the heat absorption portion, and actively transmit the heat energy to the passive heat dissipation structure 220 through the heat dissipation portion for heat dissipation. Furthermore, the heat dissipation fan 210 can generate a disturbed airflow to improve the heat dissipation efficiency of the passive heat dissipation structure 220, so that the heat dissipation efficiency of the electronic device is high, the heat dissipation is uniform, and the overheating phenomenon at the shielding case 20 is avoided.

The heat dissipation fan 210 or the heat dissipation fan 210 and the passive heat dissipation structure 220 can be detachably disposed in the electronic device,

in some embodiments, the electronic device further comprises a protective cover 50 cooperating with the middle frame 10 to form a protective space, and at least a portion of the heat dissipation device 200 is detachably connected to the protective cover 50. As such, when the heat dissipating device 200 includes the heat dissipating fan 210, the heat dissipating fan 210 may be detachably disposed on the protective cover 50.

In some embodiments, when the electronic device is a mobile terminal, the protective cover 50 is a rear cover.

In addition to any of the above embodiments of the protecting cover 50, in one embodiment, the protecting cover 50 is provided with a vent hole 51 communicating with the protecting space. Thus, when the electronic device can meet the heat dissipation requirement by using the semiconductor cooling element 230, the heat dissipation fan 210 can be detached, thereby reducing the loss. When the semiconductor cooling element 230 cannot meet the heat dissipation requirement, the heat dissipation fan 210 may be externally connected to an external power source and installed in the electronic device, and the external air is sent into the electronic device through the vent hole 51, so as to improve the heat dissipation efficiency of the electronic device.

Optionally, the electronic device is a smart television, and in any implementation of the cooling fan 210, the cooling fan 210 is detachably disposed on the rear cover. Therefore, the heat dissipation fan 210 can be selectively installed according to the intelligent television models corresponding to different specifications of the central processing unit, so that the production cost is reduced, meanwhile, the heat dissipation performance is prevented from being wasted, and the energy consumption is reduced.

Optionally, the protective cover 50 is provided with a waterproof, breathable membrane (not shown) covering the vent hole 51. Therefore, the waterproof performance and/or the dustproof performance of the electronic equipment are/is improved while the heat exchange efficiency can be ensured by utilizing the waterproof breathable film.

In some embodiments, the vents 51 include inlet holes as well as outlet holes. Thus, the heat dissipation fan 210 is matched with the air inlet hole and the air outlet hole, so that a directional flowing air flow can be formed in the protection space, and the heat dissipation efficiency is further improved.

In some embodiments, the passive heat dissipation structure 220 includes a heat conductor 221 and heat dissipation fins 222, the heat dissipation fins 222 are disposed on an outer surface of the heat conductor 221 in a covering manner, the heat conductor 221 transmits heat generated by the heat source module 30 to the heat dissipation fins 222, and further transmits the heat to the outside air through the heat dissipation fins 222, so as to enhance the heat dissipation effect. For example, the heat conducting body 221 and the heat dissipating fins 222 are separate components, and for example, the passive heat dissipating structure 220 is integrally formed by casting to enhance mechanical performance.

The passive heat dissipation structure 220 is made of aluminum alloy. For example, the specific surface area of the heat dissipation fins 222 is 4 to 10 times the specific surface area of the heat conductor 221, and for example, the specific surface area of the heat dissipation fins 222 is 6.8 times the specific surface area of the heat conductor 221.

When the heat dissipation fan 210 is combined with the passive heat dissipation structure 220, the heat dissipation fan 210 is disposed outside the heat conductor 221, the heat dissipation fin 222 includes a plurality of fins, a heat dissipation flow channel is formed between two adjacent fins, and the heat dissipation flow channel is used for guiding an air flow generated by the heat dissipation fan 210, which is beneficial to improving heat dissipation efficiency.

Of course, in other embodiments, the semiconductor cooling device 230 may also be disposed on other components, such as the heat source module 30, and the heat absorbing portion thereof is used to actively absorb the heat of the heat source module 30, and the heat dissipating portion thereof is used to transfer the heat to the soaking plate, so as to improve the heat dissipating efficiency of the electronic device.

In order to further improve the heat dissipation efficiency of the shielding can 20, in some embodiments, the heat dissipation device 40 further includes a heat dissipation layer 300, and the heat dissipation layer 300 is disposed on the outer sidewalls of the shielding can 20 and the soaking plate 100.

The heat dissipation layer 300 includes, but is not limited to, a graphene coating.

In the embodiment of the present disclosure, the heat source module 30 refers to a device that radiates more heat in the electronic equipment, and includes at least one heat source component, i.e., a heat generating element.

In an exemplary embodiment, the heat source module 30 further includes a second heat source component 33, the second heat source component 33 is disposed on the other side of the circuit board 31 relative to the first heat source component 32, and the second heat source component 33 is in heat-conducting fit with the middle frame 10. In this way, the middle frame 10 can also be used for dissipating heat of the second heat source component 33, so that the heat source module 30 can be fully dissipated, and local overheating of the electronic equipment caused by untimely heat dissipation of the heat source module 30 can be avoided.

In the practical application process, the heat radiated by the components is generally positively correlated with the power consumption of the components, and the larger the power consumption of the components is, the larger the heat radiated by the components is. Accordingly, the heat source component in the present disclosure may be a device in an electronic apparatus, where power consumption exceeds M% of overall power consumption, and M may be 20, 30, 40, and so on.

Alternatively, the heat source part may include a central processing unit, a processing device integrating processing and storage functions, a power supply part (e.g., a battery), and the like.

In an exemplary embodiment, the first heat source part 32 is a Central Processing Unit (CPU), and the second heat source part 33 is a resistance-capacitance part, and is respectively disposed on two surfaces of the circuit board 31. The CPU is disposed in the shielding chamber 21 and is in heat-conduction fit with the soaking plate 100, and the container resistance member is in heat-conduction fit with the middle frame 10.

Optionally, the cpu is fixed on the soaking plate 100 through the heat conductive layer 150. The heat conduction layer 150 can be disposed between the cpu and the soaking plate 100 in various manners, such as being formed by adhering, painting, or spraying, or the formed heat conduction layer 150 can be clamped between the cpu and the soaking plate 100 by a fixed connection manner.

In an exemplary example, the heat conductive layer 150 has elasticity and is pressed between the cpu and the heat spreader 100. Thus, the heat conducting layer 150 can fully fill the gap between the central processing unit and the soaking plate 100, increase the contact area, and improve the heat dissipation efficiency of the heat conducting central processing unit. In addition, the heat conduction layer 150 has elasticity, and can play a role in buffering, can protect central processing unit.

In some examples, the heat conductive layer 150 is one of heat conductive gel such as heat conductive silicone, heat conductive rubber, and the like.

Similarly, the container resistance component can also be in heat conduction with the middle frame 10 through the heat conduction layer 150. In this way, the heat can be dissipated by making full use of the center frame 10.

Of course, the heat source component may be other components, and this is not particularly limited in the embodiments of the present disclosure.

In addition, in some embodiments, the heat conduction layer 150 with elasticity may be disposed between the independent adjacent components to improve the heat conduction effect between the adjacent components, and the heat conduction layer 150 is utilized to increase the heat dissipation efficiency.

The heat conduction layer 150 may be disposed between the middle frame 10 and the first heat sink 110, and/or between the second heat sink 120 and the heat dissipation device 200, and/or between the first heat sink 110 and the heat source module 30, and so on.

In order to further improve the heat dissipation efficiency and the heat dissipation effect of the electronic device, the heat dissipation efficiency of the middle frame 10 can be further improved, so that the components directly or indirectly arranged on the middle frame 10 have a good heat dissipation environment.

As shown in fig. 9 and 14, in some embodiments, a structure of the heat dissipation module of the middle frame 10 is schematically illustrated. Fig. 9 is a rear view of the heat dissipation module of the middle frame 10 shown in fig. 2. Fig. 10 is an exploded view of the heat dissipation module of the middle frame 10 shown in fig. 9. Fig. 11 is a partial structural view of the heat dissipation module of the middle frame 10 shown in fig. 10. Fig. 12 is an enlarged schematic view of a shown in fig. 11. Fig. 13 is a schematic diagram illustrating a heat dissipation state of the heat dissipation module of the middle frame 10 shown in fig. 11. Fig. 14 is an enlarged schematic view of B shown in fig. 13.

In some embodiments, the middle frame 10 further includes a cooling portion 13 and a second side 12 disposed opposite to the first side 11, and the heat dissipation device further includes a loop heat pipe 400 and a working fluid 500; the loop heat pipe 400 is disposed on the second surface 12, the loop heat pipe 400 includes an evaporator 410 and a pipe unit 420, the evaporator 410 is disposed opposite to the second heat source component 33, the evaporator 410 includes a fluid infusion end 411 and an air outlet end 412, one end of the pipe unit 420 is communicated with the fluid infusion end 411, the other end is communicated with the air outlet end 412, and a part of the pipe unit 420 is in heat conduction fit with the cooling portion 13; the working fluid 500 is disposed in the loop heat pipe 400, and the working fluid 500 in a liquid state can be converted into a gas state by the evaporator 410, and the working fluid 500 in the gas state can flow into the pipeline unit 420 through the gas outlet 412; the working fluid 500 in the gaseous state can be re-liquefied in the pipe unit 420 and fed into the fluid infusion port 411.

In this way, the loop heat pipe 400 is integrated into the middle frame 10, the evaporator 410 absorbs heat of the second heat source component 33 to actively dissipate heat of the heat source module 30, and then the loop heat pipe 420 transfers heat to the cooling unit 13, so that the space of the middle frame 10 can be fully utilized to dissipate heat, and thus the heat dissipation performance of the middle frame 10 can be improved, which is convenient for improving the heat dissipation efficiency of components integrated into the middle frame 10, especially the heat source module 30 which is easy to generate heat.

In some embodiments, the first side 11 is a front side of the middle frame 10, and the second side 12 is a back side of the middle frame 10.

The "cooling unit 13" generally refers to a position where the temperature of the heat source module 30 rises slowly, that is, a position where the internal temperature of the electronic device is lower than the temperature of the "heat source module 30" during the use of the electronic device.

Alternatively, a back surface region corresponding to a battery compartment and a small plate region, etc., which is distant from the "second heat source member 33", may be provided as the cooling portion 13 to accelerate liquefaction of the working fluid 500.

It should be noted that the "working fluid 500" includes, but is not limited to, a cooling liquid (such as water, etc.) and other fluids that can be applied to the loop heat pipe 400, and a boiling point of the "working fluid 500" can be adjusted according to actual needs, and is not limited herein.

Such as the working fluid 500, including but not limited to formaldehyde, methanol, ethanol, or a mixture thereof with pure water.

It should be noted that "evaporator 410" includes a capillary wick and other structures, and the specific structure thereof includes, but is not limited to, other structures of evaporator 410 that can be applied to loop heat pipe 400.

In some embodiments, when the electronic device of the present disclosure is used, the heat source module 30 generates heat due to operation, and the evaporator 410 can actively absorb the heat transferred by the heat source module 30 through the middle frame 10, so that the liquid working fluid 500 in the evaporator 410 absorbs heat to evaporate, consumes heat energy, and flows to the cooling portion 13 through the pipeline unit 420 due to volume expansion. In this process, the gaseous working fluid 500 transfers heat to the middle frame 10, and can release a large amount of heat to be condensed into liquid when flowing through the cooling portion 13, and the liquefied working fluid 500 flows back to the fluid infusion end 411 under the capillary force driving action of the capillary wick in the evaporator 410. And the liquid in the compensation chamber is evaporated again by the evaporator 410 and continues to absorb heat. Thus, an evaporation-condensation cycle is formed, the circulation of the working fluid 500 is driven by the capillary pressure generated by the capillary wick of the evaporator 410, the flow direction of the working fluid 500 is regular and the flow rate is fast, and the heat dissipation can be accelerated. And then can further utilize center 10 to initiatively cool down the heat of heat source module 30 to carry out remote transportation and the row with the heat to cooling part 13 such as battery compartment and platelet, make full use of center 10's size dispels the heat, promoted electronic equipment's radiating efficiency greatly.

The heat dissipation device disclosed by the invention realizes the core capacity improvement of large heat transfer capacity and long heat transfer distance on the premise of not increasing the stacking thickness of the traditional middle frame 10 and the whole machine, and combines the distribution of heat source parts and non-heat source parts (namely the cooling part 13) to fully utilize the area of the whole middle frame 10 to carry out high-efficiency heat dissipation.

In some embodiments, at least a portion of loop heat pipe 400 is embedded in middle frame 10. Therefore, the thickness space of the middle frame 10 can be fully utilized to integrate the loop heat pipe 400, i.e., the contact area can be increased, the heat dissipation efficiency can be further improved, and the protruded thickness size of the heat dissipation structure can be actively reduced. Furthermore, the heat dissipation device can adapt to the light and thin design requirement of electronic equipment, so that the electronic equipment can be designed to be more light and thin, has good heat dissipation performance and can improve the product competitiveness.

As shown in fig. 4, in some embodiments, the middle frame 10 and the cooling portion 13 are disposed at both sides of the battery mounting portion 14 with a space therebetween. In this way, the heat can be sufficiently dissipated by separating the middle frame 10 and the cooling portion 13. While allowing heat to be dissipated from the battery mounting portion 14 when flowing through the battery mounting portion 14.

For example, the electronic apparatus of the present disclosure may integrate the central processor as the heat source module 30 onto a main board, and have the main board disposed at one end of the battery, and a small board or a charge control board or the like placed at the other end of the battery. When the battery is not charged and the electronic device is used and the cpu is heated, the loop heat pipe 400 is used to dissipate heat, and the heat dissipation layer 300 of the battery and the heat dissipation layer 300 of the charge control board are used to accelerate heat dissipation due to the heat generated by the battery and the charge control board, thereby further improving heat dissipation efficiency. When the battery is charged, the loop heat pipe 400 may be used to dissipate heat.

As shown in fig. 2 and 9, in some embodiments, at least a part of the evaporator 410 coincides with at least a part of the second heat source element 33 in a projection plane of the front view direction of the middle frame 10. In this way, the second heat source member 33 is attached to the middle frame 10. When the electronic device is used, the second heat source part 33 can radiate heat by using the middle frame 10, and simultaneously, heat energy of the second heat source part is enabled to be transmitted to the evaporator 410 only by the thickness dimension distance of the middle frame 10, so that the heat absorption efficiency of the evaporator 410 is improved, the working fluid 500 is heated and vaporized, the second heat source part 33 is quickly radiated, and the radiating efficiency is further accelerated.

In addition to any of the above embodiments, as shown in fig. 10 to 11, in some embodiments, the middle frame 10 is provided with a loop pipe slot 15, and the heat dissipation device further includes a sealing cover 600 covering the loop pipe slot 15 and forming at least a part of the loop heat pipe 400. Therefore, the loop pipe groove 15 is directly formed on the middle frame 10, and the sealing cover 600 is covered, so that at least part of the loop pipeline can be formed by fully utilizing the thickness dimension of the middle frame 10. Such as at least a portion of at least one of line unit 420 or reservoir 414.

The loop pipe groove 15 may be formed by stamping, etching, laser engraving, turning, or the like.

In some embodiments, the loop pipe bath 15 is an etch bath. Therefore, by using the etching technique, more loop heat pipes 400 can be formed on the middle frame 10, such as the pipe unit 420, the liquid storage cavity 414, the evaporator 410, the one-way valve, and the like, and the thickness dimension of the middle frame 10 is fully utilized to accommodate more loop heat pipes 400, which is beneficial to the ultra-light and thin design of the electronic device. Meanwhile, a more accurate loop heat pipe 400 structure can be obtained, and the reliability of the heat dissipation device is improved.

In one example, the loop pipe grooves 15 are etch grooves including capillary grooves. Loop heat pipe 400 is formed by loop pipe groove 15 and sealing cover 600. Thus, the evaporator 410 can be directly formed on the middle frame 10 by etching, thereby simplifying the assembly process and improving the production efficiency of the heat dissipation device.

Optionally, in some embodiments, the sealing cover 600 is welded to the middle frame 10. So, utilize the welded seal technique for sealed lid 600 and center 10 sealed fixed reliable, the two laminating is inseparabler, is favorable to reducing the ascending size of center in thickness direction.

In addition to any of the above embodiments, as shown in fig. 9 or fig. 15, in some embodiments, the loop heat pipe 400 is flat. Therefore, the size of the middle frame 10 in the width direction and/or the length direction can be fully utilized to form the fluid channel, the size of the middle frame in the thickness direction is further reduced, and the electronic device can be made thinner and lighter. Meanwhile, the contact area between the two can be increased, so that the working fluid 500 can absorb and dissipate heat better.

Optionally, the maximum thickness of loop heat pipe 400 is less than or equal to 0.5 mm. In this way, the electronic device can be adapted to ultra-light slim designs, or more space is provided for other components. For example, a larger battery can be accommodated by using the space, and the cruising ability of the electronic apparatus can be improved.

Optionally, the maximum thickness of loop heat pipe 400 is less than or equal to 0.4 mm.

The thickness of loop heat pipe 400 includes, but is not limited to, 0.5mm, 0.45mm, 0.4mm, 0.35mm, 0.3mm, and the like.

In some embodiments, the evaporator 410 includes an evaporation portion 413, the evaporation portion 413 covers the middle frame 10 in a projection plane of the front view direction of the middle frame 10, and an area of the evaporation portion 413 is 1.5 times to 2 times an area of the middle frame 10. Thus, the evaporation part 413 can sufficiently dissipate heat of the heat source component, so that the heat of the heat source component is uniformly and sufficiently dissipated, and the heat source component is prevented from being locally overheated.

Optionally, the evaporation section 413 comprises a wick.

Based on any of the above embodiments, as shown in fig. 11 and 13, in some embodiments, the pipeline unit 420 includes a first delivery pipe 421, a second delivery pipe 422, and a condensation pipe 423 in heat-conducting fit with the cooling portion 13, where the condensation pipe 423 includes a cold end and a hot end, the cold end is communicated with the fluid infusion end 411 through the first delivery pipe 421, and the hot end is communicated with the air outlet end 412 through the second delivery pipe 422. By providing the condensation pipe 423 in this manner, a winding condensation path can be formed, and heat dissipation by the cooling unit 13 can be fully utilized. Meanwhile, the condensation pipe 423 is matched with the evaporator 410 through the first delivery pipe 421 and the second delivery pipe 422, so that the circulation switching and the orderly flow of the liquid working fluid 500 and the gaseous working fluid 500 are realized, and the heat dissipation reliability of the loop heat pipe 400 is higher.

In addition to any of the above embodiments, in some embodiments, the inner diameter of the second delivery pipe 422 is larger than the inner diameter of the first delivery pipe 421. In this way, after the liquid working fluid 500 is vaporized, the liquid working fluid can rapidly flow into the second delivery pipe 422 (airflow flowing from positive pressure to negative pressure is easy to generate), and the liquid working fluid is delivered to the condensation pipe 423 for cooling, which is beneficial for the gaseous working fluid 500 to push the liquid working fluid 500 to circularly flow.

Optionally, the inner diameter of the second delivery pipe 422 is equal to 1 or 1.5 or 2 times the inner diameter of the first delivery pipe 421, etc.

In addition to any of the above embodiments, in some embodiments, at least part of the condensation pipe 423 overlaps at least part of the cooling portion 13 in a projection plane of the front view direction of the middle frame 10. In this way, the heat radiation distance can be reduced as much as possible, and the gas in the condensation pipe 423 can be cooled by the low temperature of the cooling unit 13.

In addition to any of the above embodiments, as shown in fig. 11 and 12, in some embodiments, the loop heat pipe 400 further includes a backflow preventing structure 430, and the backflow preventing structure 430 is disposed on the middle frame 10, so that the working fluid 500 passes through one end of the pipe unit 420 and flows into the evaporator 410 through the backflow preventing structure 430. In this way, the backflow preventing structure 430 enables the working fluid 500 to stably circulate in the designed direction, so as to ensure the stability and reliability of the operation of the loop heat pipe 400.

The anti-backflow structure 430 includes, but is not limited to, a one-way valve, etc.

Optionally, the anti-reflux mechanism is a tesla valve structure 432.

As shown in fig. 12 and 14, in some embodiments, the loop heat pipe 400 further includes a tesla valve structure 432, and the tesla valve structure 432 is disposed on the middle frame 10, so that the working fluid 500 passes through one end of the pipe unit 420 and flows into the evaporator 410 through the tesla valve structure 432. Due to the characteristics that the tesla valve has small forward flow resistance and great reverse flow resistance, the tesla valve structure 432 is applied to the loop heat pipe 400, so that low-resistance backflow of the liquid working fluid 500 can be realized, the liquid working fluid 500 in the evaporator 410 is prevented from flowing reversely, the working fluid 500 in the evaporator 410 is ensured to flow in a one-way manner at low resistance, a driving force is generated, and the stable circulation of the loop heat pipe 400 is ensured.

Alternatively, the output area of the tesla valve structure 432 is generally designed to be equal or approximately equal to the input area of the capillary wick of the evaporator 410.

Based on any of the above embodiments, in some embodiments, the evaporator 410 includes an evaporation portion 413 disposed between the fluid infusion end 411 and the air outlet end 412, and the tesla valve structure 432 is disposed between the fluid infusion end 411 and the evaporation portion 413, so that the working fluid 500 flows into the evaporation portion 413 through the tesla valve structure 432. Thus, the evaporator 410 and the tesla valve structure 432 are coupled together, which is beneficial to the super-pulsation design, so that the loop heat pipe 400 is in an ultra-thin flat plate shape, and the overall thickness is less than 0.5 mm. Meanwhile, the evaporators 410 after the structure integration can be flexibly arranged, namely, a plurality of evaporators 410 can be correspondingly arranged according to positions of a plurality of heat sources on the electronic equipment, turbulence can be effectively prevented by utilizing the Tesla valve structure 432 among the evaporators 410, so that the evaporators 410 can stably run, the modularized assembly is convenient, and the production efficiency of the heat dissipation device is favorably improved.

In addition to the above embodiments, as shown in fig. 13 and 14, in some embodiments, the evaporator 410 includes a liquid storage cavity 414, the liquid storage cavity 414 is disposed between the liquid replenishing end 411 and the evaporation portion 413, and the tesla valve structure 432 is disposed in the liquid storage cavity 414. Thus, the tesla valve structure 432 is disposed in the liquid storage cavity 414, so as to prevent the liquid working fluid 500 from flowing out of the evaporator 410, and further facilitate to maintain the liquid working fluid 500 in the liquid storage cavity 414, so that the evaporation portion 413 can obtain the liquid working fluid 500 in time to continuously generate the driving force. Meanwhile, when the electronic device is not used, the liquid storage chamber 414 can store the liquid working fluid 500 for the evaporation portion 413 to evaporate.

In addition to any of the above-mentioned embodiments of the evaporation part 413, as shown in fig. 12 and 14, in some embodiments, at least two tesla valve structures 432 are arranged in parallel between the fluid replenishing end 411 and the evaporation part 413. As such, the ability to one-way divert of the tesla valve structure 432 of the present disclosure is enhanced by the use of at least two tesla valve parallel structures.

Optionally, the tesla valve structures 432 have a width less than 1mm, a height less than 0.5mm, and a spacing between two adjacent tesla valve structures 432 less than 1.5 mm.

As shown in fig. 15, in some embodiments, the middle frame 10 is provided with a mounting groove 16 adapted to the loop heat pipe 400, and at least a portion of the loop heat pipe 400 is embedded in the middle frame 10 through the mounting groove 16. In this way, the installation groove 16 is utilized to accommodate at least part of the loop heat pipe 400, so that the loop heat pipe 400 can be embedded in the middle frame 10 to reduce the thickness dimension of the middle frame.

On the basis of the above embodiments, in some embodiments, the middle frame further includes a heat conductive adhesive layer 700, and at least a portion of the loop heat pipe 400 is fixed in the installation groove 16 through the heat conductive adhesive layer 700. Like this, can place loop heat pipe 400 on mounting groove 16 tentatively earlier, reuse heat conduction adhesive linkage 700 to fix, can enough improve the two heat conduction efficiency, easily carry out the equipment of the two again.

The loop heat pipe 400 has a long heat transfer distance and strong antigravity capability, and can solve the problem that the traditional heat pipe is limited by the use direction and length. In addition, the loop heat pipe 400 of the present disclosure separates the vapor channel and the liquid channel, and the vapor and the liquid are respectively transmitted in the respective pipelines (e.g., the vapor flows in the first delivery pipe 421, and the liquid flows in the second delivery pipe 422), so that the occurrence of the mutual carrying phenomenon is avoided, and the heat dissipation reliability is high; and the installation of the loop heat pipe 400 becomes flexible and convenient, and is not limited by the orientation and distance between the heat source and the heat sink.

Based on any of the above embodiments, as shown in fig. 16, in some embodiments, the evaporators 410 include more than two evaporators 410, two adjacent evaporators 410 are disposed at the middle frame 10 at intervals, the pipeline unit 420 includes a liquid supplementing branch 424 and a gas outlet branch 425 corresponding to the evaporators 410 one by one, the liquid supplementing branch 424 is communicated with the corresponding liquid supplementing end 411, and the gas outlet branch 425 is communicated with the corresponding gas outlet end 412. Thus, the heat dissipation device 40 of the present disclosure can actively dissipate heat of different heat source components on the electronic device, thereby further improving heat dissipation efficiency.

By combining the tesla valve structure 432 or the backflow prevention structure 430, each evaporator 410 has a unidirectional flow characteristic, so that when the thermal load difference is large, the circulation power of each evaporator 410 can be stably improved, and the stable operation performance of the parallel evaporator 410 structure can be improved.

In addition to any of the above embodiments, in some embodiments, the larger the vapor generation rate between two adjacent evaporators 410, the larger the inner tube diameter of the corresponding liquid replenishing branch 424 and/or the inner tube diameter of the gas outlet branch 425. Thus, the working fluid 500 can be reasonably distributed, so that the compensation of the liquid working fluid 500 between the evaporators 410 is smooth and sufficient, and the reliability and stability of the heat dissipation device 40 of the present disclosure during heat dissipation can be improved.

It should be noted that the "middle frame 10" may be a "part of the middle frame 10", that is, the "middle frame 10" and "other parts of the middle frame 10, such as the cooling portion 13", are manufactured by integral molding; or a separate member that can be separated from other parts of the middle frame 10, such as the cooling portion 13, i.e., the middle frame 10 can be manufactured separately and then combined with other parts of the middle frame 10, such as the cooling portion 13, to form a whole.

Equivalently, the "body" and the "certain part" can be parts of the corresponding "component", i.e., the "body" and the "certain part" are integrally manufactured with other parts of the "component"; the "part" can be made separately from the "other part" and then combined with the "other part" into a whole. The expressions "a certain part" and "a certain part" in the present disclosure are only one embodiment, and are not intended to limit the scope of the present disclosure for convenience of reading, and should be construed as equivalents of the present disclosure as long as the features are included and the effects are the same.

It should be noted that the tesla valve structure 432 may be one of the parts of the evaporator 410, that is, assembled with the other components of the evaporator 410 to form a module, and then assembled in a modular manner; or may be separate from the "other components of the evaporator 410" and may be separately installed, i.e., may be integrated with the "other components of the evaporator 410" in the present apparatus.

Equivalently, the components included in the "heat dissipation device 200", "loop heat pipe", and "electronic device" of the present disclosure can also be flexibly combined, i.e., can be produced in a modularized manner according to the actual situation, and can be modularly assembled as an independent module; the modules may be assembled separately, and one module may be constructed in the present apparatus. The division of the above-mentioned components in the present disclosure is only one embodiment, which is convenient for reading and not limiting the scope of protection of the present disclosure, and the technical solutions equivalent to the present disclosure should be understood as if they are included and the functions are the same.

In the description of the present disclosure, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present disclosure and to simplify the description, but are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the present disclosure.

Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include at least one of the feature. In the description of the present disclosure, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise.

In the present disclosure, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present disclosure can be understood by those of ordinary skill in the art as appropriate.

In the present disclosure, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to," "disposed on," "secured to," or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples only show several embodiments of the present disclosure, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by one skilled in the art without departing from the spirit of the disclosure, and these changes and modifications are all within the scope of the disclosure.

Claims (20)

1. An electronic device, comprising:

a middle frame comprising a first face;

the shielding cover is arranged at an interval with the first surface and is provided with a shielding cavity;

the heat source module is arranged between the first surface and the shielding case, and comprises a circuit board arranged on the first surface and a first heat source part arranged on the circuit board, and the first heat source part is arranged in the shielding cavity; and

and the heat dissipation device is used for dissipating heat of the shielding cover and/or the heat source module.

2. The electronic device of claim 1, wherein the heat dissipation device comprises a heat spreader plate in thermally conductive engagement with the first heat source component.

3. The electronic device of claim 2, wherein a phase change working medium is disposed in the vapor chamber.

4. The electronic device of claim 3, wherein the phase change working medium has a boiling point of 20 ℃ to 90 ℃.

5. The electronic device of claim 2, wherein the heat dissipation device further comprises a heat dissipation device disposed outside the shielding can for actively dissipating heat from the heat spreader.

6. The electronic apparatus according to claim 5, wherein the heat dissipating device includes a heat dissipating fan disposed toward the heat equalizing plate;

or the heat dissipation device comprises a semiconductor refrigeration piece, and the semiconductor refrigeration piece is used for actively dissipating heat of the soaking plate;

or, the heat abstractor includes radiator fan and semiconductor refrigeration piece, the heat absorption portion of semiconductor refrigeration piece with soaking plate heat-conduction fit, radiator fan orientation the heat release portion setting of semiconductor refrigeration piece.

7. The electronic device of claim 5, wherein the heat dissipation device comprises a heat dissipation fan and a passive heat dissipation structure, the passive heat dissipation structure is fixedly disposed on the vapor chamber, and the heat dissipation fan is disposed on the passive heat dissipation structure;

or the heat dissipation device comprises a passive heat dissipation structure and a semiconductor refrigeration piece, wherein a heat absorption part of the semiconductor refrigeration piece is in heat conduction fit with the soaking plate, and the passive heat dissipation structure is arranged on a heat release part of the semiconductor refrigeration piece;

or, the heat dissipation device includes passive heat radiation structure, radiator fan and semiconductor refrigeration piece, the heat absorption portion of semiconductor refrigeration piece with soaking plate heat-conduction fit, passive heat radiation structure set up in the heat release portion of semiconductor refrigeration piece, radiator fan set up in passive heat radiation structure is last.

8. The electronic device of claim 5, further comprising a cover cooperating with the bezel to form a protective space, wherein at least a portion of the heat dissipation device is detachably connected to the cover.

9. The electronic device of claim 8, wherein the protective cover is provided with a vent hole communicating with the protective space.

10. The electronic device according to claim 9, wherein the protective cover is provided with a waterproof breathable membrane that covers the vent hole.

11. The electronic device of claim 2, wherein the vapor chamber comprises a first heat sink, a connecting heat sink, and a second heat sink thermally coupled to the first heat source, the first heat sink is fixed to the first surface, the second heat sink is connected to the first heat sink through the connecting heat sink, and the second heat sink and the first heat sink are arranged at an interval relative to each other to form a heat dissipation space for accommodating the heat source module.

12. The electronic device according to any one of claims 2 to 11, wherein the heat source module further includes a second heat source member provided on the other surface of the circuit board with respect to the first heat source member, the second heat source member being in heat-conductive engagement with the first surface.

13. The electronic apparatus according to claim 12, wherein the heat spreader further comprises a heat conductive layer interposed between the second heat source member and the first face.

14. The electronic apparatus according to claim 12, wherein the middle frame further includes a cooling portion and a second face disposed opposite to the first face; the heat dissipating device further includes:

the loop heat pipe is arranged on the second surface and comprises an evaporator and a pipeline unit, the evaporator and the second heat source component are arranged oppositely, the evaporator comprises a liquid supplementing end and a gas outlet end, one end of the pipeline unit is communicated with the liquid supplementing end, the other end of the pipeline unit is communicated with the gas outlet end, and part of the pipeline unit is in heat conduction fit with the cooling part; and

the working fluid is arranged in the loop heat pipe, the working fluid in a liquid state can be converted into a gas state by the evaporator, and the working fluid in the gas state can flow into the pipeline unit through the gas outlet end; the working fluid in the gaseous state can be re-liquefied in the pipeline unit and sent to the fluid infusion end.

15. The electronic device according to claim 14, wherein the pipeline unit includes a first delivery pipe, a second delivery pipe, and a condensation pipe in heat-conducting fit with the cooling portion, the condensation pipe includes a cold end and a hot end, the cold end is communicated with the fluid infusion end through the first delivery pipe, and the hot end is communicated with the air outlet end through the second delivery pipe.

16. The electronic apparatus of claim 14, wherein the loop heat pipe further comprises a backflow prevention structure provided to the middle frame so that the working fluid passes through one end of the pipe unit and flows into the evaporator through the backflow prevention structure.

17. The electronic device of claim 14, wherein the loop heat pipe further comprises a tesla valve structure disposed at the middle frame such that the working fluid passes through one end of the piping unit and flows into the evaporator through the tesla valve structure.

18. The electronic device of claim 17, wherein the evaporator comprises an evaporation portion disposed between the fluid infusion end and the gas outlet end, and the tesla valve structure is disposed between the fluid infusion end and the evaporation portion such that the working fluid flows into the evaporation portion through the tesla valve structure.

19. The electronic device of claim 18, wherein the evaporator comprises a liquid storage cavity disposed between the fluid replacement end and the evaporation portion, the tesla valve structure disposed within the liquid storage cavity; and/or at least two Tesla valve structures are arranged between the liquid supplementing end and the evaporation part in parallel.

20. The electronic apparatus according to claim 12, wherein the first heat source member is a cpu, and the second heat source member is a resistance-capacitance member.

Images