CN203814117U - Heat conduction pad and mainboard - Google Patents
Heat conduction pad and mainboard Download PDFInfo
- Publication number
- CN203814117U CN203814117U CN201420194170.3U CN201420194170U CN203814117U CN 203814117 U CN203814117 U CN 203814117U CN 201420194170 U CN201420194170 U CN 201420194170U CN 203814117 U CN203814117 U CN 203814117U
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- CN
- China
- Prior art keywords
- heat
- around
- central
- face
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 45
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000741 silica gel Substances 0.000 claims description 10
- 229910002027 silica gel Inorganic materials 0.000 claims description 10
- 230000004308 accommodation Effects 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Abstract
The utility model provides a heat conduction pad and a mainboard. The heat conduction pad is used for connecting with a heating chip thermally, the heating chip is in an inversed-T shape and is provided with a central heating surface and a surrounding heating surface, wherein the central surface is surrounded by the surrounding heating surface. The heat conduction pad includes a central heat conduction part and a surrounding heat conduction part, wherein the central heat conduction part comprises a central top surface and a central contact surface, the central top surface and the central contact surface are located at two opposite sides of the central heat conduction part, and the central contact surface is contacted with the central heating surface; the central heat conduction part is surrounded by the surrounding heat conduction part, the surrounding heat conduction part comprises a surrounding top surface and a surrounding contact surface, the surrounding top surface and the surrounding contact surface are located at two opposite sides of the surrounding heat conduction part, and the surrounding contact surface is contacted with the surrounding heating surface; and the central top surface is coplanar to the surrounding top surface, the central top surface has a first thickness in relative to the central contact surface, and the surrounding top surface has a second thickness in relative to the surrounding contact surface, and the second thickness is larger than the first thickness. With the heat conduction pad and the mainboard, the heat radiation problem of a high-power heating chip is solved.
Description
Technical field
The utility model relates to a kind of heat conductive pad and mainboard (motherboard), and is particularly related to a kind of heat conductive pad and mainboard that is applicable to convex shape euthermic chip.
Background technology
The packing forms of euthermic chip mostly is FCBGA(crystal covering type BGA Package technique now), its feature is that its euthermic chip central authorities are highly higher, highly lower around.Central authorities are about 1～2mm with difference of height around.During due to assembling, the housing that heat conductive pad contacts has level altitude.If while wanting to paste heat conductive pad above euthermic chip, only can coordinate the central authorities of euthermic chip or a thickness of highly selecting heat conductive pad wherein around.
If coordinate euthermic chip central authorities highly to paste fritter heat conductive pad, can significantly reduce the area that euthermic chip conducts heat, make hot transfer efficiency not good.If coordinate euthermic chip outer ring height to paste heat conductive pad, heat conductive pad is blocked up can produce assembling interference problem.
Therefore, need to provide a kind of heat conductive pad and mainboard to solve the problems referred to above.
Utility model content
Therefore one of the purpose of this utility model is to provide a kind of heat conductive pad, this heat conductive pad is in order to hot connection one euthermic chip, this euthermic chip is convex shape, and there is a central heating face and heating face around, around heating face is around this central authorities' heating face, and this heat conductive pad comprises: an a central conductive and heat-conducting part around; This central conductive comprises a central end face and a central contact-making surface, and this central authorities' end face and this central authorities' contact-making surface lay respectively at the two opposite sides of this central conductive, and this central authorities' contact-making surface contacts with this central authorities' heating face; Around heat-conducting part is around this central conductive, around heat-conducting part comprises a contact-making surface around end face and around, around end face lays respectively at this two opposite sides of heat-conducting part around with contact-making surface around, and around contact-making surface contacts with each other with heating face around; Wherein this central authorities' end face and end face copline around, this central authorities' end face relatively this central authorities' contact-making surface has one first thickness, around end face compare should around contact-making surface there is one second thickness, and this second thickness is greater than this first thickness.
According to an execution mode of the present utility model, central conductive and around heat-conducting part are respectively two silica gel members.
According to an execution mode of the present utility model, central conductive and the silica gel member that around heat-conducting part is formed in one.
According to an execution mode of the present utility model, the rectangle that is combined as of central conductive and heat-conducting part around, around heat-conducting part is three-back-shaped.
The utility model also provides a kind of mainboard, comprises circuit board, euthermic chip, heat conductive pad and heat-conducting seat.Euthermic chip is arranged at circuit board.Euthermic chip is convex shape, and has central heating face and the face that generates heat around.The face that around generates heat is around central authorities' face that generates heat.Euthermic chip is between circuit board and heat conductive pad.Heat-conducting seat is locked in circuit board.Heat conductive pad is hot to be connected between heat-conducting seat and euthermic chip.
The utility model also provides a kind of mainboard, and this mainboard comprises: a circuit board; One euthermic chip, this euthermic chip is arranged at this circuit board, and this euthermic chip is convex shape, and has a central heating face and heating face around, and around heating face is around this central authorities' heating face; One heat conductive pad, this heat conductive pad is in order to this euthermic chip of hot connection, this heat conductive pad comprises: a central conductive, this central conductive comprises a central end face and a central contact-making surface, this central authorities' end face and this central authorities' contact-making surface lay respectively at the two opposite sides of this central conductive, and this central authorities' contact-making surface contacts with this central authorities' heating face; And heat-conducting part around, around heat-conducting part is around this central conductive, around heat-conducting part comprises around an end face and a contact-making surface around, and around end face lays respectively at this two opposite sides of heat-conducting part around with contact-making surface around, around contact-making surface with should around heating face contact with each other; Wherein this central authorities' end face and around end face copline, this central authorities' end face relatively this central authorities' contact-making surface has one first thickness, around end face compare should around contact-making surface there is one second thickness, and this second thickness is greater than this first thickness, wherein this euthermic chip is between this circuit board and this heat conductive pad; And a heat-conducting seat, this heat-conducting seat is locked in this circuit board, and wherein this heat conductive pad is hot is connected between this heat-conducting seat and this euthermic chip.
According to an execution mode of the present utility model, mainboard comprises housing, is arranged at circuit board.Housing has accommodation space, and euthermic chip and heat conductive pad are placed in accommodation space.Housing comprises upper cover, and upper cover contacts central end face and end face around.
According to an execution mode of the present utility model, mainboard comprises conducting strip, hot being connected between upper cover and heat-conducting seat.Conducting strip is made up of elastic heat conducting material.
According to an execution mode of the present utility model, central conductive and around heat-conducting part are respectively two silica gel members.
According to an execution mode of the present utility model, central conductive and the silica gel member that around heat-conducting part is formed in one.
According to an execution mode of the present utility model, the rectangle that is combined as of central conductive and heat-conducting part around, around heat-conducting part is three-back-shaped.
In sum, if euthermic chip is convex shape, heat conductive pad of the present utility model can conduct to heat-conducting seat by the heat of euthermic chip effectively.Heat conductive pad comprises central conductive and heat-conducting part around, respectively in order to conduct central authorities' heating face of euthermic chip and the heat of the face manufacturing of generating heat around.The central end face of central conductive and around surrounding's end face copline of heat-conducting part, be namely positioned at same level, and therefore heat conductive pad can entirely engage with the heat-transfer device of top.Heat conductive pad of the present utility model can be fabricated to respectively two members to reduce manufacturing cost.Also can be fabricated to a member to reduce assembly program.Confirm through experiment test, compare traditional heat conductive pad, heat conductive pad energy effective temperature-reducing of the present utility model nearly more than 5 degree, therefore can effectively solve the heat dissipation problem of the euthermic chip of thermal power occurred frequently.
Brief description of the drawings
Fig. 1 illustrates the decomposing schematic representation according to the heat conductive pad of an execution mode of the present utility model, heat-conducting seat and euthermic chip.
Fig. 2 illustrates the superimposed schematic diagram of heat conductive pad, heat-conducting seat and euthermic chip in Fig. 1.
Fig. 3 illustrates the decomposing schematic representation of heat conductive pad, heat-conducting seat and the euthermic chip of another execution mode of the present utility model.
Fig. 4 illustrates the superimposed schematic diagram of heat conductive pad, heat-conducting seat and the euthermic chip of another execution mode of the present utility model.
Fig. 5 illustrates the decomposing schematic representation of the mainboard of an execution mode of the present utility model.
Primary clustering symbol description:
100,100', 100'' heat conductive pad 220 heat-conducting seats
110 central conductive 230 housings
112 central end face 232 accommodation spaces
114 central contact-making surface 234 upper covers
Heat-conducting part 236 enclosure walls around 120
End face 240 conducting strips around 122
Contact-making surface 300 euthermic chips around 124
The central heating face of 130 exterior wall heat-conducting part 310
132 peripheral end faces 320 heating face around
200 mainboard d1 the first thickness
210 circuit board d2 the second thickness
Embodiment
Below will and describe in detail with accompanying drawing spirit of the present utility model will clearly be described, those of ordinary skill under any in technical field is being understood after preferred embodiments of the present utility model, should be by the technology of the utility model institute teaching, change and modification, it does not depart from spirit of the present utility model and scope.
For euthermic chip outstanding in the middle of solving is in the time installing heat conductive pad, have the problem of interference or area coverage deficiency, the utility model provides a kind of heat conductive pad, uses effective this problem of improving.Ask for an interview Fig. 1 and Fig. 2.Fig. 1 illustrates the decomposing schematic representation according to the heat conductive pad 100 of an execution mode of the present utility model, heat-conducting seat 220 and euthermic chip 300.Fig. 2 illustrates the superimposed schematic diagram of heat conductive pad 100, heat-conducting seat 220 and euthermic chip 300 in Fig. 1.Heat conductive pad 100 of the present utility model is in order to hot connection euthermic chip 300.Euthermic chip 300 is convex shape, and has central heating face 310 and the face 320 that generates heat around, and the face 320 that around generates heat is around central authorities' heating face 310.
Heat conductive pad 100 comprises central conductive 110 and heat-conducting part 120 around.In the present embodiment, central conductive 110 is respectively two silica gel members with heat-conducting part 120 around.Heat conductive pad 100 is fabricated to respectively to two members, can reduces manufacturing cost.Central conductive 110 comprises central end face 112 and central contact-making surface 114, lays respectively at the two opposite sides of central conductive 110.Central authorities' contact-making surface 114 contacts with central heating face 310.Around heat-conducting part 120 is around central conductive 110.Around heat-conducting part 120 comprises around end face 122 and around contact-making surface 124, lays respectively at the two opposite sides of heat-conducting part 120 around.Around contact-making surface 124 contacts with each other with the face 320 that around generates heat.In other words, central conductive 110 and around heat-conducting part 120, respectively in order to conduct central authorities' heating face 310 of euthermic chip 300 and the heat of face 320 manufacturings of generating heat around.
Central authorities' end face 112 and around end face 122 coplines, be namely positioned at same level, and therefore heat conductive pad 100 can entirely engage with the heat-transfer device of top.Central authorities' end face 112 relatively central contact-making surface 114 has the first thickness d 1, and around end face 122 is compared contact-making surface 124 around and had the second thickness d 2, and the second thickness d 2 is greater than the first thickness d 1, and therefore heat conductive pad 100 can adapt to the shape of euthermic chip 300.In other words,, for the euthermic chip 300 of convex shape, heat conductive pad 100 of the present utility model can conduct to heat-conducting seat 220 by the heat of euthermic chip 300 effectively.Confirm through experiment test, compare traditional heat conductive pad, heat conductive pad 100 energy effective temperature-reducings of the present utility model nearly more than 5 degree, therefore can effectively solve the heat dissipation problem of the euthermic chip 300 of thermal power occurred frequently.
According to another execution mode of the present utility model, heat conductive pad of the present utility model also can be fabricated to a member to reduce assembly program.Fig. 3 illustrates the decomposing schematic representation of heat conductive pad 100', heat-conducting seat 220 and the euthermic chip 300 of another execution mode of the present utility model.Heat conductive pad 100' is in order to hot connection euthermic chip 300.Euthermic chip 300 is convex shape, and has central heating face 310 and the face 320 that generates heat around.Face 320 generate heat around around central authorities' heating face 310.
Heat conductive pad 100' comprises central conductive 110' and heat-conducting part 120' around, and around heat-conducting part 120' is around connecting central conductive 110'.In the present embodiment, central conductive 110' and silica gel member that around heat-conducting part 120' is formed in one.Heat conductive pad 100' is fabricated to respectively to a member, can reduces assembly program.Central conductive 110' comprises central end face 112' and central contact-making surface 114', lays respectively at the two opposite sides of central conductive 110'.The contact-making surface 114' of central authorities contacts with central heating face 310.Around heat-conducting part 120' is around central conductive 110'.Around heat-conducting part 120' comprises around end face 122' and around contact-making surface 124', lays respectively at the two opposite sides of heat-conducting part 120' around.Around contact-making surface 124' contacts with each other with the face 320 that around generates heat.In other words, central conductive 110' and around heat-conducting part 120' respectively in order to conduct the central authorities heatings face 310 of euthermic chip 300 and the heat of face 320 manufacturings of generating heat around.
The end face 112' of central authorities is connected and copline with end face 122' around, is namely positioned at same level, and therefore heat conductive pad 100' can entirely engage with the heat-transfer device of top.The end face 112' relatively central contact-making surface 114' of central authorities has the first thickness d 1, and around end face 122' compares contact-making surface 124' around and has the second thickness d 2, and the second thickness d 2 is greater than the first thickness d 1, and therefore heat conductive pad 100' can adapt to the shape of euthermic chip 300.In other words,, for the euthermic chip 300 of convex shape, heat conductive pad 100' of the present utility model can conduct to heat-conducting seat 220 by the heat of euthermic chip 300 effectively.
Fig. 4 illustrates the superimposed schematic diagram of heat conductive pad 100'', heat-conducting seat 220 and the euthermic chip 300 of another execution mode of the present utility model.In the present embodiment.Heat conductive pad 100'' comprises exterior wall heat-conducting part 130.Exterior wall heat-conducting part 130 is around connecting heat-conducting part 120 around, in order to contact with the side of euthermic chip 300.The heat of euthermic chip 300 sides by exterior wall heat-conducting part 130 be sent to peripheral end face 132 with and improve area of dissipation.In practice, the side of euthermic chip 300 also has suitable caloric requirement conduction.
Fig. 5 illustrates the decomposing schematic representation of the mainboard 200 of an execution mode of the present utility model.The utility model also provides a kind of mainboard 200, comprises circuit board 210, euthermic chip 300, heat conductive pad 100 and heat-conducting seat 220.Euthermic chip 300 is arranged at circuit board 210.Euthermic chip 300 is convex shape, and has central heating face 310 and the face 320 that generates heat around.Face 320 generate heat around around central authorities' heating face 310.Euthermic chip 300 is between circuit board 210 and heat conductive pad 100.Heat-conducting seat 220 is locked in circuit board 210.Heat conductive pad 100 is hot to be connected between heat-conducting seat 220 and euthermic chip 300.In the present embodiment, the rectangle that is combined as of the central conductive of heat conductive pad 100 110 and heat-conducting part 120 around, around heat-conducting part 120 is three-back-shaped.
Mainboard 200 comprises housing 230, is arranged at circuit board 210.Housing 230 has accommodation space 232, and euthermic chip 300 is placed in accommodation space 232 with heat conductive pad 100.Housing 230 comprises upper cover 234 and enclosure wall 236.Mainboard 200 comprises conducting strip 240, hot being connected between upper cover 234 and heat-conducting seat 220.Conducting strip 240 is made up of elastic heat conducting material, therefore can adapt to the structure of heat-conducting seat 220 bottom surfaces and conduct heat to heat-conducting seat 220.The central end face 112 of upper cover 234 thermal contact conductance pads 100 and around end face 122.Enclosure wall 236 supports upper cover 234 and the weight from heat-conducting seat 220, makes heat radiation chip not damaged by pressure by the weight of heat-conducting seat 220.Housing 230 is that metal forms, and therefore the capacity of heat transmission is good, and can effectively prevent other assemblies on Electromagnetic Interference circuit board 210 that euthermic chip 300 produces.
In sum, if euthermic chip is convex shape, heat conductive pad of the present utility model can conduct to heat-conducting seat by the heat of euthermic chip effectively.Heat conductive pad comprises central conductive and heat-conducting part around, respectively in order to conduct central authorities' heating face of euthermic chip and the heat of the face manufacturing of generating heat around.The central end face of central conductive and around surrounding's end face copline of heat-conducting part, be namely positioned at same level, and therefore heat conductive pad can entirely engage with the heat-transfer device of top.Heat conductive pad of the present utility model can be fabricated to respectively two members to reduce manufacturing cost.Also can be fabricated to a member to reduce assembly program.Confirm through experiment test, compare traditional heat conductive pad, heat conductive pad energy effective temperature-reducing of the present utility model nearly more than 5 degree, therefore can effectively solve the heat dissipation problem of the euthermic chip of thermal power occurred frequently.
Claims (10)
1. a heat conductive pad, this heat conductive pad is in order to hot connection one euthermic chip, and this euthermic chip is convex shape, and has a central heating face and heating face around, and around heating face, around this central authorities' heating face, is characterized in that, and this heat conductive pad comprises:
One central conductive, this central conductive comprises a central end face and a central contact-making surface, and this central authorities' end face and this central authorities' contact-making surface lay respectively at the two opposite sides of this central conductive, and this central authorities' contact-making surface contacts with this central authorities' heating face; And
Heat-conducting part around one, around heat-conducting part is around this central conductive, around heat-conducting part comprises around an end face and a contact-making surface around, and around end face lays respectively at this two opposite sides of heat-conducting part around with contact-making surface around, around contact-making surface with should around heating face contact with each other;
Wherein this central authorities' end face and end face copline around, this central authorities' end face relatively this central authorities' contact-making surface has one first thickness, around end face compare should around contact-making surface there is one second thickness, and this second thickness is greater than this first thickness.
2. heat conductive pad as claimed in claim 1, is characterized in that, this central conductive is respectively two silica gel members with being somebody's turn to do heat-conducting part around.
3. heat conductive pad as claimed in claim 1, is characterized in that, this central conductive and the silica gel member that around heat-conducting part is formed in one.
4. heat conductive pad as claimed in claim 1, is characterized in that, the rectangle that is combined as of this central conductive and heat-conducting part around, and around heat-conducting part is three-back-shaped.
5. a mainboard, this mainboard comprises:
One circuit board; And
One euthermic chip, this euthermic chip is arranged at this circuit board, and this euthermic chip is convex shape, and has a central heating face and heating face around, and around heating face is around this central authorities' heating face;
It is characterized in that, this mainboard also comprises a heat conductive pad as claimed in claim 1, and wherein this euthermic chip is between this circuit board and this heat conductive pad; And
One heat-conducting seat, this heat-conducting seat is locked in this circuit board, and wherein this heat conductive pad is hot is connected between this heat-conducting seat and this euthermic chip.
6. mainboard as claimed in claim 5, it is characterized in that, this mainboard also comprises a housing, this housing is arranged at this circuit board, this housing has an accommodation space, this euthermic chip and this heat conductive pad are placed in this accommodation space, and this housing comprises a upper cover, and this upper cover contacts this central authorities' end face and is somebody's turn to do end face around.
7. mainboard as claimed in claim 6, is characterized in that, this mainboard also comprises a conducting strip, and this conducting strip is hot to be connected between this upper cover and this heat-conducting seat, and this conducting strip is elastic heat conducting material conducting strip.
8. mainboard as claimed in claim 5, is characterized in that, this central conductive is respectively two silica gel members with being somebody's turn to do heat-conducting part around.
9. mainboard as claimed in claim 5, is characterized in that, this central conductive and the silica gel member that around heat-conducting part is formed in one.
10. mainboard as claimed in claim 5, is characterized in that, the rectangle that is combined as of this central conductive and heat-conducting part around, and around heat-conducting part is three-back-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420194170.3U CN203814117U (en) | 2014-04-21 | 2014-04-21 | Heat conduction pad and mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420194170.3U CN203814117U (en) | 2014-04-21 | 2014-04-21 | Heat conduction pad and mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203814117U true CN203814117U (en) | 2014-09-03 |
Family
ID=51452804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420194170.3U Expired - Lifetime CN203814117U (en) | 2014-04-21 | 2014-04-21 | Heat conduction pad and mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203814117U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764302A (en) * | 2014-12-18 | 2016-07-13 | 中兴通讯股份有限公司 | Heat conduction pad, radiator and heat dissipation assembly |
| WO2018058746A1 (en) * | 2016-09-27 | 2018-04-05 | 深圳市大疆创新科技有限公司 | Heat dissipation structure, electronic device, pan-tilt device and aircraft |
-
2014
- 2014-04-21 CN CN201420194170.3U patent/CN203814117U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764302A (en) * | 2014-12-18 | 2016-07-13 | 中兴通讯股份有限公司 | Heat conduction pad, radiator and heat dissipation assembly |
| CN105764302B (en) * | 2014-12-18 | 2019-12-13 | 中兴通讯股份有限公司 | heat conduction pad, radiator and radiating assembly |
| WO2018058746A1 (en) * | 2016-09-27 | 2018-04-05 | 深圳市大疆创新科技有限公司 | Heat dissipation structure, electronic device, pan-tilt device and aircraft |
| CN109479384A (en) * | 2016-09-27 | 2019-03-15 | 深圳市大疆创新科技有限公司 | Radiator structure, electronic device, holder and aircraft |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140903 |