CN106793685A - A kind of composite heat dissipation device - Google Patents
A kind of composite heat dissipation device Download PDFInfo
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- CN106793685A CN106793685A CN201611130226.9A CN201611130226A CN106793685A CN 106793685 A CN106793685 A CN 106793685A CN 201611130226 A CN201611130226 A CN 201611130226A CN 106793685 A CN106793685 A CN 106793685A
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- phase
- change material
- plate
- capillary wick
- composite
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/003—Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of composite heat dissipation device, including flat-plate heat pipe and some sandwich phase-change material composite plates；The evaporation ends of flat-plate heat pipe are used to take heat from heater element, the condensation end of flat-plate heat pipe is connected with the base portion of sandwich phase-change material composite plate, evaporation ends inwall is provided with porous capillary wick layer, bionical capillary wick is provided with capillary wick layer, sandwich phase-change material composite plate has closing inner chamber, phase-change material is provided with inner chamber, the side wall of inner chamber is metallic plate.Using the composite heat dissipation device that the present invention is provided, being provided with the flat-plate heat pipe of capillary wick has good uniform temperature, and phase-change material inhibits temperature crest, it is ensured that the normal work of whole electronic equipment.Meanwhile, the integrated design of flat-plate heat pipe and sandwich phase-change material composite plate, eliminate classic flat-plate heat pipe and it is heat sink between thermal contact resistance.To sum up, the composite heat dissipation device uniform temperature of present invention offer is more preferable, heat-sinking capability is stronger, security is more secure, processing is simple.
Description
Technical field
The present invention relates to technical field of heat dissipation, more specifically to a kind of composite heat dissipation device.
Background technology
With the development of industrial electronic and semiconductor science and technology, great-power electronic and optics (such as LED), power electric
Pond, computer CPU/GPU (hereinafter referred to as electronic equipment) etc. constantly towards miniaturization, integrated direction development, cause unit to be held
Quantity of heat production in product rapidly increases, local heat flux density's sharp increase, heat flux distribution are uneven etc., and phenomenon occurs, if heat is not
Can discharge in time and electronic equipment be heated it is uneven, will to the stability of electronic equipment, reliability and life-span produce significant impact.
It is traditional it is simple reached its heat transport limitation using metallic plate and the radiating mode of Air Forced Convection cooling, heat dissipation problem into
It is restriction one of high-power electronic device and semiconductor technology, the Main Bottleneck of industry development.
Flat-plate heat pipe, as a kind of efficient phase change heat-transfer device, with heat transfer temperature difference it is small, heat transfer property is high, small volume, weight
The advantages of measuring light, excellent uniform temperature, it has also become one of ideal element of high heat flux electronic equipment dissipating heat.Flat-plate heat pipe is made
It is a part for heat abstractor, it is typically heat sink with fin to separate, when being applied in combination with fin is heat sink by smearing heat conduction
Cream and the heat sink base in contact of fin, therefore there is larger thermal contact resistance；Secondly, if the power of electronic equipment occurs larger change
Change (such as overclocking), temperature can also occur big change, it will fatigue, or even the use for destroying electronic equipment are produced to electronic equipment
Function；Again, the function (such as fan failure) once the cooling system of forced air convection heat exchange is lost the job, electronics sets
Standby temperature will rise rapidly, ultimately result in and burn.
In sum, how to efficiently solve heat abstractor and be difficult to meet the radiating requirements of electronic equipment and cause electronic equipment
The problems such as easy scaling loss, be current those skilled in the art's urgent problem.
The content of the invention
In view of this, it is an object of the invention to provide a kind of composite heat dissipation device, the structure of the composite heat dissipation device sets
Meter can efficiently solve heat abstractor and be difficult to meet the radiating requirements of electronic equipment and cause the problem of the easy scaling loss of electronic equipment.
In order to achieve the above object, the present invention provides following technical scheme：
A kind of composite heat dissipation device, including flat-plate heat pipe and some sandwich phase-change material composite plates；The flat-plate heat pipe
Evaporation ends are used to take heat from heater element, and the condensation end of the flat-plate heat pipe connects with the base portion of the sandwich phase-change material composite plate
Connect, the evaporation ends are provided with porous capillary wick layer, and bionical capillary wick is provided with the porous capillary wick layer
Core, the sandwich phase-change material composite plate has closing inner chamber, and phase-change material, the side wall of the inner chamber are provided with the inner chamber
It is metallic plate.
Preferably, in above-mentioned composite heat dissipation device, including the described sandwich phase-change material composite plate that multiple is set up in parallel, and
There is the gap of default spacing between the two neighboring sandwich phase-change material composite plate.
Preferably, in above-mentioned composite heat dissipation device, it is characterised in that the condensation end is formed in one with the metallic plate
Structure, the evaporation ends and the condensation end are tightly connected and the flat board are formed between the evaporation ends and the condensation end
The working medium cavity volume of heat pipe.
Preferably, in above-mentioned composite heat dissipation device, it is characterised in that the evaporation ends of the flat-plate heat pipe are provided with semiconductor
Cooling piece.
Preferably, in above-mentioned composite heat dissipation device, top and the condensation end of the bionical capillary wick offset.
Preferably, in above-mentioned composite heat dissipation device, the porous capillary wick layer is equal with the bionical capillary wick
It is the super hydrophilic capillary wick being prepared from through thermal oxide or hydrogen peroxide oxidation, or by adding what pore creating material was prepared from
The multiple dimensioned super hydrophilic capillary wick of hole.
Preferably, in above-mentioned composite heat dissipation device, the porous capillary wick layer is with the bionical capillary wick
Powder sintered capillary wick, silk screen, foam metal or mechanical micro-machined conduit.
Preferably, in above-mentioned composite heat dissipation device, the phase-change material is phase transformation material of the fusing point between 40 DEG C -80 DEG C
Material.
Preferably, in above-mentioned composite heat dissipation device, the phase-change material is to be added with expanded graphite powder, copper powder or aluminium powder
To improve the composite of thermal conductivity.
Preferably, in above-mentioned composite heat dissipation device, the phase-change material is single phase-change material, composite phase-change material, nothing
Machine phase-change material, organic phase change material or microcapsules.
The composite heat dissipation device that the present invention is provided includes flat-plate heat pipe and some sandwich phase-change material composite plates.Wherein, put down
The evaporation ends of plate heat pipe are used to take heat from heater element, the base of the condensation end of flat-plate heat pipe and sandwich phase-change material composite plate
Portion connects, and transfers heat to sandwich phase-change material composite plate.Evaporation ends are provided with porous capillary wick layer, capillary wick
Bionical capillary wick is provided with layer.Sandwich phase-change material composite plate has inner chamber, and phase-change material is provided with its inner chamber, interior
The side wall in chamber is distributed for metallic plate with by heat.
Using the present invention provide composite heat dissipation device when, when electronic equipment high power or oepration at full load, can produce
Substantial amounts of heat, heat enters flat-plate heat pipe evaporation ends and porous capillary wick layer by the mode of heat transfer, when it reaches
During uniform temperature, the liquid inside porous capillary wick layer can be vaporized, and the steam after vaporization is from porous capillary liquid-sucking core
Escaped inside layer, and reach condensation end and be condensed into liquid, these liquid are in the presence of capillary attraction along bionical capillary wick
Core arrives again at porous capillary wick layer, and is allocated inside it, flows to phase transformation generation area, meets liquid evaporation institute
The liquid supply of needs, so that complete circulation is formed, due to the presence of porous capillary wick layer and bionical capillary wick,
The circulation of liquid is passive, it is not necessary to extraneous power, and can be worked under antigravity.And bionical capillary wick by
In there is hole of different sizes, therefore can solve steam and overflow and the contradictory problems between liquid suction, because greatly
Beneficial to the effusion of steam, aperture is beneficial to the suction of liquid, so that flat-plate heat pipe shows optimal performance in hole.
Meanwhile, the evaporation ends of flat-plate heat pipe absorb the heat of heater element, the heat that the steam in it discharges in condensation end
Sandwich phase-change material composite plate is transmitted to again, therefore the temperature of whole sandwich phase-change material composite plate gradually rises, sandwich phase transformation material
There is heat convection in material composite plate, most heat is scattered in surrounding environment at last, realizes heat sinking function with the air of surrounding again.Due to
The presence of phase-change material can increase thermal inertia, and it can absorb heat, so as to electronics can be protected to set to a certain extent
It is standby, it is thus possible to mitigate electronic equipment heat fatigue when powder consumption of electronic equipment is varied widely.On the other hand, heater element is worked as
When power consumption increases suddenly (such as overclocking) or active cooling system breaks down (such as fan failure), heater element
Temperature can rise rapidly, when temperature reaches the fusing point of the phase-change material in sandwich phase-change material composite plate inner chamber, phase-change material
Amount of heat can be absorbed to be stored in the form of latent heat, so that the rapid drop in temperature of whole electronic equipment, it is suppressed that temperature
Degree crest, and then ensure that the normal work of whole electronic equipment.Meanwhile, the one of flat-plate heat pipe and sandwich phase-change material composite plate
Bodyization design, eliminate classic flat-plate heat pipe and it is heat sink between thermal contact resistance.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
A kind of configuration schematic diagram of specific embodiment of composite heat dissipation device that Fig. 1 is provided for the present invention；
Fig. 2 is the cross section structure schematic diagram of the composite heat dissipation device confined state shown in Fig. 1；
Fig. 3 is the mplifying structure schematic diagram of porous capillary wick layer and bionical capillary wick in Fig. 1；
Fig. 4 is the mould cross-sectional view for being molded structure shown in Fig. 3；
Fig. 5 is the overlooking the structure diagram of mould shown in Fig. 4.
Marked in accompanying drawing as follows：
1st, evaporation ends；2nd, porous capillary wick layer；3rd, bionical capillary wick；4th, working medium cavity volume；5th, liquid injection pipe；6th, it is cold
Solidifying end；7th, sandwich phase-change material composite plate；71st, metallic plate；72nd, phase-change material；73rd, sealing-plug；74th, cavity is reserved.
Specific embodiment
The embodiment of the invention discloses a kind of composite heat dissipation device, to meet the radiating requirements of electronic equipment, it is to avoid electronics
The scaling loss of equipment.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Refer to Fig. 1-Fig. 5, a kind of detonation configuration of specific embodiment of composite heat dissipation device that Fig. 1 is provided for the present invention
Schematic diagram；Fig. 2 is the cross section structure schematic diagram of the composite heat dissipation device confined state shown in Fig. 1；Fig. 3 is porous capillary in Fig. 1
The mplifying structure schematic diagram of wick layer and bionical capillary wick；Fig. 4 is the mould section knot for being molded structure shown in Fig. 3
Structure schematic diagram；Fig. 5 is the overlooking the structure diagram of mould shown in Fig. 4.
In a kind of specific embodiment, the composite heat dissipation device that the present invention is provided includes flat-plate heat pipe and some sandwich phases
Become Material cladding plate 7.
Wherein, the evaporation ends 1 of flat-plate heat pipe are used to take heat by heater element, the condensation end 6 of flat-plate heat pipe with it is sandwich
The base portion connection of phase-change material composite plate 7.The liquid working substance of flat-plate heat pipe is taking hot junction absorption heat of vaporization, in condensation end condensation
Fall, and transfer heat to the sandwich phase-change material composite plate 7 being connected with condensation end 6.The profile of specific flat-plate heat pipe can be with
It is circular, oval, square, rhombus etc., its making material can be copper, aluminium, stainless steel and its alloy.The liquid of flat-plate heat pipe
Working medium can be specifically water, ethanol, acetone, organic working medium and its mixture etc..The evaporation ends 1 of flat-plate heat pipe and condensation end 6
Periphery is packaged, it is ensured that its air-tightness.Liquid injection pipe 5 can be set on flat-plate heat pipe, and then the liquid working substance of heat pipe passes through note
Liquid pipe 5 is injected in it and is encapsulated.
Sandwich phase-change material composite plate 7 has inner chamber, and phase-change material 72 is provided with its inner chamber, and the side wall of inner chamber is metal
Plate 71 is distributed with by heat.Namely sandwich phase-change material composite plate 7 includes relative metallic plate 71, is phase between metallic plate 71
Become material 72.Certainly, the inner chamber of sandwich phase-change material composite plate 7 should be sealed internal chamber, specifically can be by sealing structure by gold
Belong to the two ends sealing of plate 71, the concrete form of sealing structure can be not construed as limiting.Can also be prepared by integral forming process
Top closure, the structure of metallic plate 71 with inner chamber.
Metallic plate 71 is specifically as follows copper coin, aluminium sheet, stainless steel plate and alloy sheets, and its thickness can be according to specific with height
Need to design.It should be noted that sandwich phase-change material composite plate 7 should also include it is square, circular or rhombus with interior
The fin coupled structure in chamber, i.e., prefabricated hollow is used to store phase-change material 72 inside fin, and corresponding internal cavities can be
Square, circular, rhombus or other variously-shaped cavitys.
Evaporation ends 1 are provided with porous capillary wick layer 2, and bionical capillary wick is provided with porous capillary wick layer 2
Core 3.Porous capillary wick layer 2 and bionical capillary wick 3 are namely set in the working medium cavity volume 4 of flat-plate heat pipe.It is porous
The inwall that capillary wick layer 2 can fit in evaporation ends 1 is set, and bionical capillary wick 3 is further set thereon, bionical
Capillary wick 3 has hole of different sizes, and specific bionical capillary wick 3 preferably could be arranged to multiple column knots
Structure, and be uniformly distributed in the upper surface of porous capillary wick layer 2.
Using the present invention provide composite heat dissipation device when, when electronic equipment high power or oepration at full load, can produce
Substantial amounts of heat, heat enters flat-plate heat pipe evaporation ends 1 and porous capillary wick layer 2 by the mode of heat transfer, when it reaches
During to uniform temperature, the liquid inside porous capillary wick layer 2 can be vaporized, and the steam after vaporization is from porous capillary imbibition
Escaped inside sandwich layer 2, and reach condensation end and be condensed into liquid, these liquid are inhaled in the presence of capillary attraction along bionical capillary
Wick-containing 3 arrives again at porous capillary wick layer 2, and is allocated inside it, flows to phase transformation generation area, meets liquid steaming
Liquid supply required for hair, so that complete circulation is formed, due to porous capillary wick layer 2 and bionical capillary wick 3
Presence, the circulation of liquid is passive, it is not necessary to extraneous power, and can be worked under antigravity.And bionical capillary
Due to there is hole of different sizes in liquid-sucking core, therefore the contradiction that can solve between steam spilling and liquid backflow is asked
Topic, because macropore is beneficial to the effusion of steam, aperture is beneficial to the backflow of liquid, so that flat-plate heat pipe shows optimal performance.
Meanwhile, the evaporation ends of flat-plate heat pipe absorb the heat of heater element, the heat that the steam in it discharges in condensation end
Sandwich phase-change material composite plate 7 is transmitted to again, therefore the temperature of whole sandwich phase-change material composite plate 7 gradually rises, sandwich phase transformation
There is heat convection in Material cladding plate 7, most heat is scattered in surrounding environment at last, realizes heat sinking function with the air of surrounding again.
Because the presence of phase-change material can increase thermal inertia, it can absorb heat, so as to can protect electricity to a certain extent
Sub- equipment, it is thus possible to mitigate electronic equipment heat fatigue when powder consumption of electronic equipment is varied widely.On the other hand, heating is worked as
When element power consumption increases suddenly (such as overclocking) or active cooling system breaks down (such as fan failure), heating unit
The temperature of part can rise rapidly, when temperature reaches the fusing point of the phase-change material 72 in the sandwich inner chamber of phase-change material composite plate 7, phase
Change material 72 can absorb amount of heat and be stored in the form of latent heat, so that the rapid drop in temperature of whole electronic equipment,
Temperature crest is inhibited, and then ensure that the normal work of whole electronic equipment.And flat-plate heat pipe and sandwich phase-change material are compound
The integrated design of plate 7, eliminate classic flat-plate heat pipe and it is heat sink between thermal contact resistance.
Preferably, the top of metallic plate 71 is sealed by sealing-plug 73, and base portion is tightly connected with condensation end 6, phase-change material
72 contact with condensation end 6.Thus process more convenient, and phase-change material 72 is contacted with condensation end 6, can directly with condensation end 6
Heat exchange is carried out, radiating efficiency is improved.Certainly, the base portion of metallic plate 71 can also be first passed through metal base plate etc. as needed
Sealed, metal base plate be connected with the condensation end 6 of flat-plate heat pipe again then, carried out heat exchange, relative heat exchange efficiency compared with
It is low.Above-mentioned sandwich phase-change material composite plate 7 can specifically be made by the steps：
S1：Go out the integrated metallic plate 71 of all round closure but middle reserved cavity 74 by die casting and molding；
S2：Phase-change material 72 is put into reserved cavity, it is considered to which volume when melting of phase-change material 72 can become
Change, therefore reserve some reserved cavity 74, then sealed the upper end open of metallic plate 71 with sealing-plug 73.
The processing of sandwich phase-change material composite plate 7 can also be carried out by following another kind method as needed：
S1：The phase-change material 72 for preparing shaping is fitted in into surrounding to leave on the sheet metal of flanging；
S2：Another piece of sheet metal is pressed on phase-change material 72, and sealing welding is carried out to two pieces of sheet metals；
S3：Soldering sealing-plug 73 to be done seals upper port.Certainly, sandwich phase-change material composite plate of the invention
7 preparation method is not limited to above two method, and other should also be included without prejudice to the preparation method of its principle, essence.
It is possible to further include multiple sandwich phase-change material composite plates 7 being set up in parallel, and two neighboring sandwich phase transformation
There is the gap of default spacing between Material cladding plate 7.Gap for air circulation, for heat convection.It is sandwich by multiple
Phase-change material composite plate 7 is radiated jointly, has been obviously improved radiating efficiency.While two neighboring sandwich phase-change material composite plate
The gap of default spacing is provided between 7, so that heat can effectively by the two side of each sandwich phase-change material composite plate 7
Distribute, good heat dissipation effect.
The structure specifically, condensation end 6 and metallic plate 71 can be formed in one, evaporation ends 1 are tightly connected simultaneously with condensation end 6
The working medium cavity volume 4 of flat-plate heat pipe is formed between evaporation ends 1 and condensation end 6.Namely condensation end 6 and metallic plate 71 are integral type
Structure, thus metallic plate 71 is high with the bonding strength of condensation end 6, good airproof performance between the two.Meanwhile, it is easy to composite heat dissipation device whole
The preparation of body, without the operation of follow-up the two connection, is effectively saved the production time.The evaporation ends 1 of flat-plate heat pipe and condensation end 6
It is tightly connected, and the working medium cavity volume 4 for setting working medium formed therein that.Certainly, as needed can also be using welding etc. often
With condensation end 6 be fixedly connected metallic plate 71 by the mode that is fixedly connected of rule.
In the various embodiments described above, in order to improve radiating efficiency, semiconductor system can be set in the evaporation ends 1 of flat-plate heat pipe
Cold.The structure of specific semiconductor chilling plate refer to prior art, and here is omitted.
On the basis of the various embodiments described above, top and the condensation end 6 of bionical capillary wick 3 offset.Thus bionical hair
Thin liquid-sucking core 3 can be contacted directly with flat-plate heat pipe condensation end 6, on the one hand can greatly shorten the path of liquid working substance backflow with
Time, reduction flow resistance, on the other hand can play a part of support, while the radial guiding heat energy of heat pipe can also be strengthened
Power.
Further, porous capillary wick layer 2 is through thermal oxide or hydrogen peroxide with bionical capillary wick 3
The super hydrophilic capillary wick that oxidation is prepared from, or by adding the super hydrophilic capillary of multiple dimensioned hole that pore creating material is prepared from
Core.Multiple dimensioned capillary wick overflows and liquid suction due to there is hole of different sizes, therefore can solve steam
Between contradictory problems because macropore beneficial to steam effusion, aperture beneficial to liquid suction so that flat-plate heat pipe shows
Optimal performance.
Specifically, porous capillary wick layer 2 and the type of bionical capillary wick 3 can be powder sintered, silk screen, bubble
Foam metal, mechanical micro-machined conduit etc..Powder sintered capillary wick its agglomerated material can be copper powder, nickel powder etc..Powder
The sintering processing for sintering capillary wick can be the shape along wall sintering, or evaporation ends and condensation end directly contact
Formula.
Preferably, the porous capillary wick layer 2 of flat-plate heat pipe is prepared with bionical capillary wick 3 by way of sintering
On the evaporation ends 1 of flat-plate heat pipe.Such as it is sintered on the evaporation ends 1 of flat-plate heat pipe by mould.Refer to Fig. 4 and Fig. 5, Fig. 4
It is the mould cross-sectional view for being molded structure shown in Fig. 3；Fig. 5 is the overlooking the structure diagram of mould shown in Fig. 4.It is logical
The porous capillary wick layer 2 for crossing mould sintering preparation is not only solid and reliable with bionical capillary wick 3, and can in high volume give birth to
Produce, it is easy to which industrialization makes, reduce production cost.
Fig. 3 is the mplifying structure schematic diagram of porous capillary wick layer 2 and bionical capillary wick 3 in Fig. 1.It is specifically made
Standby process can include：Using mould as shown in Figure 4 and Figure 5, before sintering, its surface impurity is washed away with distilled water, then
It is placed on drying in oven；Then mould is taken out from baking oven, is cooled to room temperature, copper powder is sprawled in die surface；Then will
The flat-plate heat pipe evaporation ends 1 polished gently are placed on mould in advance, and with constant weight and the bloom of surfacing is pressed in it
Top, then carbon dust is filled in the surrounding of evaporation ends 1, it is oxidized with copper powder in preventing sintering process；Last set program：With certain
Heating rate heats the regular hour to preset temperature, then is incubated a period of time, and program is automatically switched off afterwards.Treat that program setting is good
Afterwards, by populated copper powder and it is placed with the mould of copper coin and is put into high-temperature atmosphere sintering furnace, close valve, open extraction valve, uses vacuum
Pumping vacuum is closed afterwards for a period of time, then is opened charge valve and be filled with the nitrogen protection gas of certain volume, closes charging valve, is opened
Dynamic heat button.After treating that whole sintering process terminates, mould is taken out, its removing surface is clean, take out copper coin, you can obtain
Bottom as shown in Figure 3 is distributed with the capillary wick structure of certain amount cylindrical structural.As needed, the shape of capillary wick
Shape can also be square, oval, rhombus, taper.
On the basis of the various embodiments described above, phase-change material 72 preferably can be phase of the fusing point between 40 DEG C -80 DEG C
Become material 72.For a certain composite heat dissipation device, can be according to the phase-change material 72 of its Object Selection suitable fusion points that radiate.
Preferably, the melting range of phase-change material 72 can be with 50 DEG C, 60 DEG C, 70 DEG C etc..The state of phase-change material 72 can be solid-state, liquid
State, can also be solidliquid mixture, be selected with specific reference to needs.
Specifically, the species of phase-change material 72 can for single-phase become material, composite phase-change material, inorganic phase-changing material,
Organic phase change material or microcapsules, or can also be the mixture of above-mentioned all kinds of phase-change materials 72, or foam metal and phase
Become the complex of material 72.According to the difference of the application of heat abstractor, i.e. heater element, different phase transformation materials can be selected
Material 72, to obtain optimal radiating effect.
In order to strengthen the thermal conductivity of phase-change material 72, adjuvant can be added in phase-change material 72.For example can be in phase transformation
Add the strong metal dust of the capacity of heat transmission or non-metal powder to strengthen the capacity of heat transmission of phase-change material 72, metal in the inside of material 72
Powder such as copper powder or aluminium powder, non-metal powder such as expanded graphite powder etc..Namely phase-change material 72 can be to be added with expansion
Graphite powder, copper powder or aluminium powder are improving the composite of thermal conductivity.Certainly, adjuvant is not limited to mentioned component, other
Adjuvant suitable for increasing thermal conductivity can also be used.
Above-mentioned detailed description is directed to illustrating for possible embodiments of the present invention, and the device can also include low-voltage alternating-current
Or the fan such as DC fan, small volume, lightweight efficient radiating apparatus are integrally formed.Because the present invention is prepared for multiple dimensioned imitating
Raw capillary wick, therefore the heat transfer property of flat-plate heat pipe is greatly improved, so as to ensure that whole flat-plate heat pipe condensation end 6 has
Preferably equal temperature characteristics, greatly improve the radiating efficiency of whole device, and then the present invention also can just make the radiating of heat abstractor
Process realizes the operation operation of efficient, low cost and low energy consumption, for the radiating for solving restriction high-power electronic component is provided
A kind of preferable solution route.
In sum, the composite heat dissipation device that the present invention is provided has that uniform temperature is more preferable, heat-sinking capability is stronger, security more
The advantages of added with ensureing, processing space that is simple, reducing traditional heat-dissipating device, can efficiently solve high-power/high heat flux
Electronics and optics (such as LED), electrokinetic cell, computer CPU/GPU heat dissipation technology problems；In addition can also be in electronic equipment
The cooling system that power consumption changes (such as overclocking) or forced air convection exchanges heat is lost the job, and (for example there is event to function in fan
Barrier) when, the quick temperature crest crossed heat, suppress electronic equipment for absorbing electronic equipment generation is played, protect electronic equipment not
That is damaged acts on.
Each embodiment is described by the way of progressive in this specification, and what each embodiment was stressed is and other
The difference of embodiment, between each embodiment identical similar portion mutually referring to.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or uses the present invention.
Various modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, the present invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The scope most wide for causing.
Claims (10)
1. a kind of composite heat dissipation device, it is characterised in that including flat-plate heat pipe and some sandwich phase-change material composite plates；It is described flat
The evaporation ends of plate heat pipe are used to take heat, the condensation end of the flat-plate heat pipe and the sandwich phase-change material composite plate from heater element
Base portion connection, the evaporation ends are provided with porous capillary wick layer, are provided with the porous capillary wick layer bionical
Capillary wick, the sandwich phase-change material composite plate has closing inner chamber, and phase-change material is provided with the inner chamber, described interior
The side wall in chamber is metallic plate.
2. composite heat dissipation device according to claim 1, it is characterised in that including the described sandwich phase that multiple is set up in parallel
Become the gap between Material cladding plate, and the two neighboring sandwich phase-change material composite plate with default spacing.
3. composite heat dissipation device according to claim 1, it is characterised in that the condensation end is integrated with the metallic plate
Molding structure, the evaporation ends and the condensation end are tightly connected and are formed between the evaporation ends and the condensation end described
The working medium cavity volume of flat-plate heat pipe.
4. composite heat dissipation device according to claim 1, it is characterised in that the evaporation ends of the flat-plate heat pipe are provided with half
Conductor cooling piece.
5. the composite heat dissipation device according to claim any one of 1-4, it is characterised in that the bionical capillary wick
Top offsets with the condensation end.
6. composite heat dissipation device according to claim 5, it is characterised in that the porous capillary wick layer is imitative with described
Raw capillary wick is the super hydrophilic capillary wick being prepared from through thermal oxide or hydrogen peroxide oxidation, or is made by addition
The super hydrophilic capillary wick of multiple dimensioned hole that hole agent is prepared from.
7. composite heat dissipation device according to claim 5, it is characterised in that the porous capillary wick layer is imitative with described
Raw capillary wick is powder sintered capillary wick, silk screen, foam metal or mechanical micro-machined conduit.
8. the composite heat dissipation device according to claim any one of 1-4, it is characterised in that the phase-change material exists for fusing point
Phase-change material between 40 DEG C -80 DEG C.
9. composite heat dissipation device according to claim 8, it is characterised in that the phase-change material is to be added with expanded graphite
Powder, copper powder or aluminium powder are improving the composite of thermal conductivity.
10. composite heat dissipation device according to claim 8, it is characterised in that the phase-change material be single phase-change material,
Composite phase-change material, inorganic phase-changing material, organic phase change material or microcapsules.
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| CN201611130226.9A CN106793685A (en) | 2016-12-09 | 2016-12-09 | A kind of composite heat dissipation device |
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| CN201611130226.9A CN106793685A (en) | 2016-12-09 | 2016-12-09 | A kind of composite heat dissipation device |
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| CN201611130226.9A Pending CN106793685A (en) | 2016-12-09 | 2016-12-09 | A kind of composite heat dissipation device |
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| CN110131692A (en) * | 2019-06-04 | 2019-08-16 | 中国科学院工程热物理研究所 | There is back the LED phase-change heat radiating device of fluid column |
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| CN111006528B (en) * | 2019-12-05 | 2021-09-14 | 广州大学 | Flat heat pipe |
| CN111006528A (en) * | 2019-12-05 | 2020-04-14 | 广州大学 | Flat heat pipe |
| CN111076591A (en) * | 2019-12-25 | 2020-04-28 | 大连理工大学 | Flat heat pipe with multiple evaporation surfaces sharing condensation cavity for cooling cell stack |
| CN111174615A (en) * | 2020-01-08 | 2020-05-19 | 厦门大学 | Surface energy gradient bionic liquid suction core and application |
| CN111397418A (en) * | 2020-02-24 | 2020-07-10 | 南京六九零二科技有限公司 | Three-dimensional steam cavity type phase-change heat storage device |
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