CN204555768U

CN204555768U - Temperature-uniforming plate

Info

Publication number: CN204555768U
Application number: CN201420795145.0U
Authority: CN
Inventors: 秦文隆
Original assignee: Individual
Current assignee: Individual
Priority date: 2014-09-18
Filing date: 2014-12-16
Publication date: 2015-08-12
Anticipated expiration: 2024-12-16

Abstract

The utility model relates to a kind of temperature-uniforming plate, includes the housing that the good metal of a pair heat conduction is formed, the inner face of described housing having crisscross groove, by sealing described housing, then through vacuumizing and injecting working fluid, and forming temperature-uniforming plate.The utility model operationally forms more significant capillarity by this groove, to accelerate the diffusion of temperature, has more high efficiency even temperature effect.

Description

Temperature-uniforming plate

Technical field

The utility model belongs to temperature uniforming heat radiation technical field, refers to a kind of temperature-uniforming plate especially.

Background technology

The heat radiation of conventional electronic component mostly adopts metal fin, or uses in conjunction with modes such as heat pipe, cooling chip, radiator fans, generally have that radiating effect is not good, radiating rate not rapidly, complicated, the high in cost of production shortcoming of radiating module structure.

And this technology of heat pipe was just born in the LosAlamos National Laboratory being arranged in the U.S. as far back as 1963.Its inventor is G.M.Grover.Heat pipe belongs to a kind of heat transfer element, and it takes full advantage of the Rapid Thermal hereditary property of heat-conduction principle and refrigeration filling, is delivered to rapidly outside thermal source by the heat of thermal objects by heat pipe, and its capacity of heat transmission is considerably beyond the capacity of heat transmission of any known metal.Hot pipe technique was widely used in the industry such as space flight, military project always in the past, was introduced into radiator manufacturing industry still thing in recent years.Why does hot pipe technique have high-performance so? this problem we will from thermodynamic (al) angle, the heat absorption of object, heat release are relative, every when having temperature difference to exist, and just must occur the phenomenon that heat is transmitted from high temperature to low temperature place.Heat trnasfer has 3 kinds of modes: radiation, convection current, conduction, wherein heat transfer is the fastest.Heat pipe utilizes sweat cooling exactly, makes heat pipe two ends temperature difference very little, heat is conducted fast.Common heat pipe is all made up of shell, liquid-sucking core and end cap.Preparation method is that inside heat pipe is pumped into negative pressure state, is then filled with suitable liquid, and this boiling point of liquid is very low, easily volatilizees.Tube wall has liquid-sucking core, is made up of capillary-porous material.Heat pipe one end is evaporation ends, and one end is condensation end in addition.When heat pipe one section is heated, the liquid in capillary evaporates rapidly, and steam flows to other one end under small pressure differential, and releases heat, regelation becomes liquid.Liquid flows back to evaporator section along porous material by the effect of capillary force again, and so circulation is more than.Heat reaches other one end by heat pipe one end, and this circulation is carried out fast, and heat can be come by conduction continuously.But the efficiency of existing finned radiator on heat conduction is not good, cannot transient absorption amount of heat be its shortcoming, how to carry out improving heat radiation efficiency in conjunction with heat pipe and finned radiator, be the invention having temperature-uniforming plate.Expansion hot plate as plate in No. M255446, TaiWan, China patent (patent announcement data on the 11st reference in 01 month in 2005), it mainly includes the good housing of a pair heat conduction, this has opening to housing side, there is in it pillar of right quantity, and be formed with gas channel, this housing inner edge sinters the powder bed having the heat conduction of one deck porous good, and pass through lidstock, enclosure interior is made to form most tubular conduits of interlocking, and through injecting working fluid and vacuumizing, make this metal powder layer be adsorbed with working fluid, and form plate expansion hot plate.

From above explanation, conventional temperature-uniforming plate is in two housings or sinter the powder that has thermal conductivity good or arrange the good wire netting of thermal conductivity, although all have the usefulness expanding hot samming, but now for the electronic component of 4G machine room, it may in moment because large discharge produces moment high heat, the structure of conventional temperature-uniforming plate, the speed of its thermal diffusion samming is quick not, electronic component will be caused overheated and damage, how improving the speed that temperature-uniforming plate expands hot samming, is the difficult problem for industry urgently overcomes.

Utility model content

In view of this, the purpose of this utility model is to provide a kind of temperature-uniforming plate.

In order to reach above-mentioned object, the utility model provides a kind of temperature-uniforming plate, includes the housing that the good metal of a pair heat conduction is formed, the inner face of described housing has crisscross groove, by sealing described housing, then through vacuumizing and injecting working fluid, and form temperature-uniforming plate.

Preferably, wherein said enclosure interior has a working space, and this crisscross groove is located on the working space inner face of described enclosure interior.

Preferably, have most heating columns in the working space of wherein said enclosure interior, described heating column links described housing.

Preferably, wherein said heating column is the multiple hole structure that the good material of heat conduction is formed, and by this multiple hole structure absorption working fluid.

Preferably, the material that wherein said heat conduction is good is copper.

Temperature-uniforming plate provided by the utility model, it operationally forms more significant capillarity by this groove, to accelerate the diffusion of temperature, has more high efficiency even temperature effect; And this heating column is the multiple hole structure that the good material of heat conduction is formed, by the adsorbable working fluid of the heating column of this multiple hole structure.

Accompanying drawing explanation

Fig. 1 is the three-dimensional exploded view of the utility model embodiment;

Fig. 2 is the group sectional elevation of the utility model embodiment;

Fig. 3 is the group sectional elevation of Fig. 1 embodiment;

Fig. 4 is the three-dimensional exploded view of another embodiment of the utility model;

Fig. 5 is the group sectional elevation of Fig. 4 embodiment.

[main element symbol description]

Housing-1; Working space-10; Passage-11; Groove-12;

Heating column-2.

Detailed description of the invention

In order to reach above-mentioned purpose of the present utility model, below enumerate an embodiment, and coordinate accompanying drawing illustrate as after.

First, refer to, Fig. 1 is the three-dimensional exploded view of the utility model embodiment, and Fig. 2 is the group sectional elevation of the utility model embodiment, as seen from the figure the utility model temperature-uniforming plate, mainly include the housing 1 that the good metal of a pair heat conduction is formed, this is inner to housing 1, inner face has crisscross groove 12, by sealing this to housing 1, again through vacuumizing and injecting working fluid, and form temperature-uniforming plate.The utility model to the inner face of housing 1 inside having crisscross groove 12, so operationally can form more significant capillarity by this, to accelerate the diffusion of temperature, has more fast, more high efficiency even temperature effect.

Refer to shown in Fig. 3, the utility model this to housing 1 inside, there is a working space 10, this crisscross groove 12 is located at this on the inner face of the working space 10 of housing 1 inside.

Housing 1 of the present utility model, its inner face heat conduction good powder can also sinter a porous structure layer (prior art figure does not show), expands hot samming efficiency to increase.

Referring again to, Fig. 4 is the three-dimensional exploded view of another embodiment of the utility model, and Fig. 5 is the group sectional elevation of Fig. 4 embodiment, as seen from the figure, the utility model has suitably most individual heating column 2 and links the housing 1 of upper and lower side in this working space 10 had housing 1 inside, make housing 1 inside form most the passages 11 interlocked, expand hot samming efficiency to increase.

Heating column 2 of the present utility model is the multiple hole structure that the good powder (such as copper powder) of heat conduction is formed, working fluid is adsorbed by the heating column 2 of this multiple hole structure, operationally there is better capillarity, to accelerate the diffusion of temperature, there is more high efficiency even temperature effect.

The above; be only preferred embodiment of the present utility model; not thereby scope of patent protection of the present utility model being limited, therefore the equivalent structure change of such as using the utility model description and accompanying drawing to do and modification, ought to be included in scope of patent protection of the present utility model.

Claims

1. a temperature-uniforming plate, is characterized in that, includes the housing that the good metal of a pair heat conduction is formed, the inner face of described housing having crisscross groove, by sealing described housing, then through vacuumizing and injecting working fluid, and forming temperature-uniforming plate.

2. temperature-uniforming plate as claimed in claim 1, it is characterized in that, described enclosure interior has a working space, and this crisscross groove is located on the working space inner face of described enclosure interior.

3. temperature-uniforming plate as claimed in claim 2, is characterized in that, have most heating columns in the working space of described enclosure interior, described heating column links described housing.

4. temperature-uniforming plate as claimed in claim 3, is characterized in that, described heating column is the multiple hole structure that the good material of heat conduction is formed, and by this multiple hole structure absorption working fluid.

5. temperature-uniforming plate as claimed in claim 4, is characterized in that, the good material of described heat conduction is copper.