CN104759627A - Method for manufacturing micro heat pipe by reducing copper oxide powder - Google Patents

Method for manufacturing micro heat pipe by reducing copper oxide powder Download PDF

Info

Publication number
CN104759627A
CN104759627A CN201410002957.XA CN201410002957A CN104759627A CN 104759627 A CN104759627 A CN 104759627A CN 201410002957 A CN201410002957 A CN 201410002957A CN 104759627 A CN104759627 A CN 104759627A
Authority
CN
China
Prior art keywords
heat pipe
copper
liquid
reduction
oxide powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410002957.XA
Other languages
Chinese (zh)
Other versions
CN104759627B (en
Inventor
施忠良
王虎
邱晨阳
施忠伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hangzhou Liangge Material Co ltd
Original Assignee
JIANGSU GEYE NEW MATERIAL TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGSU GEYE NEW MATERIAL TECHNOLOGY Co Ltd filed Critical JIANGSU GEYE NEW MATERIAL TECHNOLOGY Co Ltd
Priority to CN201410002957.XA priority Critical patent/CN104759627B/en
Publication of CN104759627A publication Critical patent/CN104759627A/en
Application granted granted Critical
Publication of CN104759627B publication Critical patent/CN104759627B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)

Abstract

The invention discloses a method for manufacturing a micro high-porosity sintered copper heat pipe by using millimeter, micron or nanometer copper oxide powder. The method is similar to that of a conventional sintered copper heat pipe; and the difference is that the method prepares the heat pipe with needed high-porosity sintered copper as a liquid absorbing wick by adding copper oxide powder or copper oxide powder containing particles of different sizes and carrying out the hydrogen reduction and the sintering treatment. The micro heat pipe is generally manufactured by directly sintering the copper powder; and the porosity of the sintered copper liquid absorbing wick is generally 40-50%. The obtained sintered copper porosity of the sintered copper heat pipe manufactured by using the millimeter, micron or nanometer copper oxide powder or the mixture thereof containing particles of different sizes reaches up to 60-80%; and the porosity can be designed as required. The method can increase the backflow speed of a liquid medium in the high-porosity sintered copper liquid absorbing wick, greatly reduce the heat resistance of the medium in the heat pipe in the liquid-steam phase change circulating process, and improve the radiating efficiency. The manufacturing method is simple, free of pollution in the production process, low in cost and suitable for industrial production.

Description

A kind of method being manufactured micro heat pipe by reduction-oxidation copper powder
Technical field
The present invention relates to the manufacture method that a kind of electronic component carries out quick heat radiating micro heat pipe, the sintered porous copper particularly having a high porosity by the manufacture of reduction-oxidation copper powder is the manufacture method of the micro heat pipe of liquid-sucking core.
Background technology
Electron Heat management is a key areas in semiconductor and electron trade, because heat management is exactly carry out effective thermal control to the running temperature of semiconductor electronic device, to ensure stability and the reliability of its work.Along with the development that the microelectric techniques such as IT, communication, LED and solar energy are advanced by leaps and bounds, semiconductor electronic component size enters sub-micron and nanometer scale from micron dimension.The degree integrated along with electronic device is more and more higher, the high density of the high frequency of electronic device, high speed and integrated circuit and volume are tending towards microminiaturization and the electronic component caloric value of unit volume and the energy consumption of one single chip are strengthened, the design of facility compact structure makes again heat radiation more difficult, thus high efficiency and heat radiation technical barrier in the urgent need to address.This problem is most important to the electronic devices and components on the portable electronic piece of high speed development and communication apparatus, electronic component, high-tension high-power electronic device and military equipment.The invention of hot pipe technique and development, for semiconductor and electronic radiation provide important solution and approach.
Hot pipe technique is the heat transfer element that one that George Ge Luofo (George Grover) of U.S. Los Alamos (Los Alamos) National Laboratory in 1963 invents is called " heat pipe ", it takes full advantage of the Rapid Thermal hereditary property of heat-conduction principle and refrigeration filling, be delivered to rapidly outside thermal source by the heat of thermal objects through heat pipe, its capacity of heat transmission exceedes the capacity of heat transmission of any known metal.
Why can heat pipe have the so good capacity of heat transmission? because the heat absorption of object, heat release are relative, every when having the temperature difference to exist, just must there is the phenomenon that heat is transmitted from high temperature to low temperature place.From three kinds of modes (radiation, convection current, conduction) of heat trnasfer, wherein heat transfer is the fastest.Heat pipe utilizes sweat cooling exactly, makes heat pipe two ends temperature difference very large, heat is conducted fast.General heat pipe is made up of shell, liquid-sucking core and end cap.Inside heat pipe is pumped into negative pressure state, is filled with suitable liquid medium, and this boiling point of liquid is low, easily volatilizees.Tube wall has liquid-sucking core, and it is made up of capillary-porous material.Heat pipe one end is fire end or evaporation ends, one end is condensation end in addition, when heat pipe one end is heated, liquid in capillary evaporates rapidly, and steam flows to other one end under small pressure differential, and releases heat, regelation becomes liquid, liquid flows back to evaporation ends along porous material by the effect of capillary force again, and so circulation is more than, and heat reaches other one end by heat pipe one end.This circulation is carried out fast, and heat can be come by conduction continuously.
Heat pipe is a kind of Novel heat transfer element with high heat conductivility, and it carrys out transferring heat by the evaporation and condensation of the liquid medium in Totally enclosed vacuum pipe, and it utilizes the fluid principles such as capillary action, plays good refrigeration.Have high thermal conductivity, good isothermal, cold and hot both sides heat transfer area can change arbitrarily, can the feature such as remotely transferring, temperature control.By the tube core close contact of the substrate of heat-pipe radiator and the device for high-power power electronic such as IGCT, IGBT, IGCT, can directly the heat of tube core be derived fast.
Liquid-sucking core is an important component part of heat pipe.The version of liquid-sucking core will directly have influence on the performance of heat pipe and heat exchange of heat pipe.In recent years along with the development of hot pipe technique, various countries researcher does a lot of work in liquid sucting core structure and theoretical research, and the tube core of a function admirable should have: the capillary pumped pressure that (1) is enough large, or less tube core effective aperture; (2) less liquid flowing resistance, namely has higher permeability; (3) good heat-transfer character, namely has little radial thermal resistance; (4) good process repeatability and reliability, manufacture simple, low price.
The sintered copper liquid-sucking core heat pipe made for generally directly adopting Micron-Sized Copper Powders Coated at present, the porosity of its sintered copper powder is roughly at 40-50%, and porosity is relatively low, and the thermal resistance that refluxes in cyclic process is relatively large.In order to solve the key issue that these two liquid-sucking cores exist, content of the present invention is proposed.
Summary of the invention
The present invention is directed to direct copper powder at present to carry out sintering as liquid-sucking core, have that porosity is low affects liquid medium phase transformation circulation rate and relative increase condensation end liquid backflow resistance, propose to adopt cupric oxide powder or sinter to carry out reduction after the mixing of the cupric oxide powder of varying particle size, the sintered porous copper that can be made into high porosity is the heat pipe of liquid-sucking core.Compared with the sintered copper heat pipe made with existing copper powder, replace after copper powder through cupric oxide powder, after reduction sintering, the porosity of sintered copper can up to 60-80%, also there is significant change in pore size and particulate interspaces, liquid medium is made to produce stronger capillary attraction, phase transition process and liquid-vapour cycle speed is impelled to accelerate, particularly greatly accelerate the back-flow velocity of gas after condensation end changes liquid phase into, reduce the thermal resistance of condensed liquid medium back flow, improve radiating efficiency, effectively solve quick heat radiating problem needed for golf calorific value electronic component.
Accompanying drawing explanation
Fig. 1 is the schematic diagram (having the support shuttering of through-hole structure) that copper pipe is placed in the porous ceramics template of through hole
Fig. 2 is the structure after stainless steel or ceramic intermediolateral column are put into, and cupric oxide powder will inject its gap and jolt ramming (the high porosity sintered copper tubular construction sketch be made up of cupric oxide powder)
Detailed description of the invention
The diameter 4 of normal miniature heat pipe, 5,6,8,10,16mm, according to the thickness requirement of liquid-sucking core, select different-diameter stainless steel or aluminium oxide ceramics intermediolateral column respectively, copper pipe cutting and cleaning-drying after, be placed on the support shuttering shown in Fig. 1, template adopts the porous ceramic plate of perforate, if the cordierite, mullite etc. of porous is as template.
According to the thickness of last required high porosity sintered copper, add the quantity of cupric oxide powder needed for determining, the amount of the cupric oxide powder needed for accurate weighing, inject cupric oxide powder in the hole between copper pipe and stainless steel or aluminium oxide ceramics intermediolateral column and carry out vibration ramming.Wherein cupric oxide powder can form by following two kinds:
(i) cupric oxide powder can be the micron order cupric oxide powder composition of similar particle size
(ii) cupric oxide powder also can be made up of the mixed-powder of millimeter, micron and nanoscale different grain size size
Add above-mentioned powder according to Fig. 2 structure, after vibration ramming, pushed in reduction furnace, the abundant prepurging of stove nitrogen, ensure follow-up safety when passing into hydrogen-nitrogen mixture gas.Reducing atmosphere hydrogen nitrogen mixed gas, in gaseous mixture, the content of hydrogen can between 10%-75%.Usually, when temperature is more than 500 DEG C, hydrogen nitrogen mixed gas is passed into.Reduction temperature is between 850 DEG C to 1050 DEG C, and the recovery time, at 20 minutes to 2 hours, cools to room temperature (practical operation be less than or equal to 80 DEG C can take out) with the furnace after reduction.The sintered copper of the high porosity needed for preparation is that the thickness of liquid-sucking core carries out regulation and control from 0.15 millimeter to 1.5 millimeters.
Then conventional heat pipe encapsulation and heat dispersion test process is entered.First whether be take out intermediolateral column, detect the high hole sintered copper position in heat pipe after copper oxide reduction and meet the demands, because due to Action of Gravity Field in the reduction process of cupric oxide powder, the height of the sintered copper of actual high porosity has a small amount of decline.After detection meets the demands, carry out the friction seam under the protective atmosphere of lower end.Upper end is follow-up carry out drawing necking down after, carry out vacuum pumping liquid injection, then encapsulate seam.The number of reservoir quantity is the amount calculating required liquid medium according to the amount of the porosity of high porosity sintered copper.This completes the manufacture process of the round shape height hole sintered copper heat pipe sintered through high temperature reduction by cupric oxide powder.
The operations such as the Bending Deformation needed for follow-up manufacture method are similar with the Bending Deformation of normal sintering copper heat pipe.
The invention provides one by millimeter, micron, nano oxidized copper powder through reduction sintering process, the Porous Cu of obtained high porosity sintering is the manufacturing method of thermotube of liquid-sucking core, its Qmax(heat radiation power after measured) improve and the thermal resistance of liquid backflow obviously decline, phase transformation circulation rate is accelerated, and meets the quick heat radiating requirement needed for electronic equipment.Preparation method of the present invention is simple, easy to operate, and equipment is simple, and production process is pollution-free, and good product quality (product purity high, structure-controllable), production efficiency is high, and production cost is low, is applicable to suitability for industrialized production.
instantiation
Below describe instantiation of the present invention in detail, utilize the reduction of cupric oxide powder to sinter, preparing 0.5 millimeters thick high porosity sintered copper is the heat pipe of liquid-sucking core.
(1) according to selected diameter be 6 or 8 millimeters, wall thickness is the copper pipe of 0.3 millimeter,
(2) after cleaning-drying, insert porous cordierite template, ensure perpendicular positioning, then put into stainless steel or aluminium oxide ceramics intermediolateral column according to locate mode;
(3) diameter is selected to be the cupric oxide powder of 50-60 microns, require to calculate according to heat pipe length and sintered copper thickness etc., the quantity of the cupric oxide powder needed for weighing, by said method, injects copper pipe and stainless steel intermediolateral column gap and vibration ramming by the cupric oxide powder of aequum.
I) after injecting cupric oxide powder, usually in pine dress, through vibration ramming
Ii) to inject after cupric oxide powder after vibration ramming, adopt 3-5 air pressure compacting
(4) carry out thermomechanical aging in the reduction sintering furnace proceeding to hydrogen nitrogen mixed gas atmosphere, hydrogen nitrogen mixing ratio is 75 ~ 10%(hydrogen): (25-90%(nitrogen), firing rate was 15-20 DEG C/minute, to 950 DEG C of insulations 1 hour;
(5) then conveniently heat pipe carries out welding, vacuumizes that to have prepared the sintered porous copper of high porosity with water filling method for packing be liquid-sucking core heat pipe:
I) through the jolt ramming of pine dress, the reduction sintering under hydrogen nitrogen reducing atmosphere keeps 1 hour at 950 DEG C, and stove is chilled to room temperature, and its analysis of porosity reaches 70-72%;
Ii) the copper oxide particle through the jolt ramming of pine dress suitably pressurizes, and pressure is 3-5 atmospheric pressure, and it adopts same thermo-mechanical treatment process, and its porosity reaches 65-67%.
Follow-up encapsulation fluid injection forming process is with identical above, also similar as the heat pipe of liquid-sucking core with normal sintering copper.Reservoir quantity needs to calculate according to the amount of the sintered copper of high hole.
Obtained above-mentioned two kinds of high porosity sintered coppers are the round shape heat pipe of liquid-sucking core, and the sintered copper carrying out sintering with direct copper powder is compared with the heat pipe of liquid-sucking core, and Qmax improves obviously after tested.Show that high porosity sintered copper prepared by reductive copper oxide is that the heat pipe of liquid-sucking core has high efficiency and heat radiation effect.

Claims (6)

1. the sintering of the reduction by cupric oxide powder prepares the method that high porosity sintered copper is the micro heat pipe of liquid-sucking core, be characterized in the Mixed adjustment particulate interspaces of the cupric oxide powder that can utilize cupric oxide powder particulate interspaces and utilize different grain size size, the porosity of the sintered porous copper formed after controlling required copper oxide reduction and pore size, utilize the capillarity of high porosity and varying aperture generation to realize the Rapid Circulation of heat pipe medium phase transition process, greatly reduce the thermal resistance in the liquid quick backflow process of medium after condensation end of heat pipe turns liquid by vapour, improve radiating efficiency.
2. reduction-oxidation copper powder as claimed in claim 1 prepares the method that high porosity sintered copper is the micro heat pipe of liquid-sucking core, and its preparation process comprises: (1) copper pipe cleaning-drying; (2) be placed in die clamper location and put into intermediolateral column, then injecting cupric oxide powder and jolt ramming; (3) reduction sintering; (4) one end welding, one end necking down process; (5) vacuumize water filling and encapsulate; (6) round shape properties of hot pipe detects; (7) bending and deformation is shaping; (8) radiating effect analysis detects.
3. reduction-oxidation copper powder as claimed in claim 1 prepares the method that high porosity sintered copper is the micro heat pipe of liquid-sucking core, it is characterized in that the porosity of the sintering structure Porous Cu that cupric oxide powder is formed after reduction sintering can up to 60-80%, be much higher than directly with the heat pipe of copper powder sintering preparation, its sintered copper is the scope of porosity at 40-50% of liquid-sucking core.
4. reduction-oxidation copper powder as claimed in claim 1 prepares the method that high porosity sintered copper is the micro heat pipe of liquid-sucking core, it is characterized in that the cupric oxide powder mixing of variable grain size, define pore size alterable and the adjustment of high porosity sintering structure Porous Cu, capillarity is clearly in hole to make medium, accelerate the circulation rate after the phase transformation of medium, greatly reduce the thermal resistance during quick backflow process of medium after the condensation end of heat pipe is converted into liquid, improve radiating efficiency.
5. reduction-oxidation copper powder as claimed in claim 2 prepares the preparation process that high porosity sintered copper is the micro heat pipe of liquid-sucking core, the preparation of its reduction sintering adopts hydrogen-nitrogen mixture gas, hydrogen: nitrogen ratio is (75%-10%): (25%-90%) (hydrogen: nitrogen is than the ratio for during 75%:25% being constituents), it is utilize nitrogen to adjust H-N ratio example that the ratio of hydrogen declines, in above-mentioned scope, all meet reduction sintering and quality atmosphere requirements.
6. cupric oxide powder reduction sintering as claimed in claim 2 prepares the preparation process that high porosity sintered copper is the micro heat pipe of liquid-sucking core, the temperature of its reduction sintering all meets the temperature range of reduction sintering at 850 DEG C to 1050 DEG C, reduction sintering time was at 20 minutes to 2 hours, sintered porous copper thickness according to prepared high porosity regulates from 0.15 millimeter to 1.5 millimeters, according to above-mentioned time range, when thickness is thin, reduction sintering time suitably shortens, when thickness is thick, reduction sintering time proper extension.
CN201410002957.XA 2014-01-03 2014-01-03 A kind of method that micro heat pipe is manufactured by reduction-oxidation copper powder Active CN104759627B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410002957.XA CN104759627B (en) 2014-01-03 2014-01-03 A kind of method that micro heat pipe is manufactured by reduction-oxidation copper powder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410002957.XA CN104759627B (en) 2014-01-03 2014-01-03 A kind of method that micro heat pipe is manufactured by reduction-oxidation copper powder

Publications (2)

Publication Number Publication Date
CN104759627A true CN104759627A (en) 2015-07-08
CN104759627B CN104759627B (en) 2017-08-29

Family

ID=53641902

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410002957.XA Active CN104759627B (en) 2014-01-03 2014-01-03 A kind of method that micro heat pipe is manufactured by reduction-oxidation copper powder

Country Status (1)

Country Link
CN (1) CN104759627B (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106180745A (en) * 2016-08-31 2016-12-07 昆山德泰新材料科技有限公司 A kind of foam copper powder and preparation method thereof
CN107543441A (en) * 2017-08-31 2018-01-05 华南理工大学 A kind of fiber sintering formula heat pipe manufacturing process core pipe positioning and extraction method
CN110004314A (en) * 2018-05-25 2019-07-12 中国科学院金属研究所 A kind of preparation method of the metallic copper containing three-dimensional porous structure
CN110160385A (en) * 2019-01-31 2019-08-23 江苏集萃先进金属材料研究所有限公司 A kind of capillary structure and its manufacturing method of the sintering of heat-transferring assembly inner cryogenic
CN110319724A (en) * 2019-07-03 2019-10-11 江西华度电子新材料有限公司 A method of restoring liquid-sucking core capillary performance
CN110757021A (en) * 2019-09-23 2020-02-07 深圳市鸿富诚屏蔽材料有限公司 Manufacturing method of temperature-uniforming plate
CN111238276A (en) * 2018-11-28 2020-06-05 南京舒宜汇科学仪器有限公司 Method for preparing liquid absorption core by pressure sintering method
CN112719263A (en) * 2020-12-30 2021-04-30 北京有研粉末新材料研究院有限公司 Method for preparing heat pipe liquid absorption core material
CN113245543A (en) * 2021-07-15 2021-08-13 江苏集萃先进金属材料研究所有限公司 Copper powder, preparation method thereof and capillary core prepared from copper powder
CN113280667A (en) * 2021-05-12 2021-08-20 Oppo广东移动通信有限公司 Liquid absorption core, temperature-uniforming plate, manufacturing method and electronic equipment
CN113295029A (en) * 2020-02-21 2021-08-24 日本电产株式会社 Heat conducting member and method for manufacturing same
CN113399669A (en) * 2020-03-17 2021-09-17 永源科技材料股份有限公司 Capillary structure
WO2022040152A1 (en) * 2020-08-17 2022-02-24 Nuscale Power, Llc Heat pipes including composite wicking structures, and associated methods of manufacture
CN115156553A (en) * 2022-08-05 2022-10-11 江苏亚威创科源激光装备有限公司 Closed-cell foam steel and laser additive manufacturing technology preparation method thereof
TWI781431B (en) * 2019-09-03 2022-10-21 大陸商廣州力及熱管理科技有限公司 A metal oxide paste for making wick structure of vapor chamber device
US11710577B2 (en) 2019-10-15 2023-07-25 Nuscale Power, Llc Nuclear reactors having liquid metal alloy fuels and/or moderators
US11728053B2 (en) 2019-10-15 2023-08-15 Nuscale Power, Llc Heat pipe networks for heat removal, such as heat removal from nuclear reactors, and associated systems and methods
US12062462B2 (en) 2020-08-17 2024-08-13 Nuscale Power, Llc Thermal power conversion systems including heat pipes and photovoltaic cells

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1138374A (en) * 1993-12-27 1996-12-18 日立化成工业株式会社 Heat transfer member and manufacturing method
JP2003155503A (en) * 2001-11-15 2003-05-30 Mitsubishi Materials Corp Method for manufacturing porous metal
CN1627031A (en) * 2003-12-13 2005-06-15 鸿富锦精密工业(深圳)有限公司 Heat-pipe and preparation method
CN1737485A (en) * 2005-09-08 2006-02-22 嘉善华昇电子热传科技有限公司 Small heat pipe and manufacturing method
US20060198753A1 (en) * 2005-03-04 2006-09-07 Chu-Wan Hong Method of manufacturing wick structure for heat pipe

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1138374A (en) * 1993-12-27 1996-12-18 日立化成工业株式会社 Heat transfer member and manufacturing method
JP2003155503A (en) * 2001-11-15 2003-05-30 Mitsubishi Materials Corp Method for manufacturing porous metal
CN1627031A (en) * 2003-12-13 2005-06-15 鸿富锦精密工业(深圳)有限公司 Heat-pipe and preparation method
US20060198753A1 (en) * 2005-03-04 2006-09-07 Chu-Wan Hong Method of manufacturing wick structure for heat pipe
CN1737485A (en) * 2005-09-08 2006-02-22 嘉善华昇电子热传科技有限公司 Small heat pipe and manufacturing method

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018041032A1 (en) * 2016-08-31 2018-03-08 昆山德泰新材料科技有限公司 Copper foam powder and manufacturing method thereof
CN106180745B (en) * 2016-08-31 2018-07-27 昆山德泰新材料科技有限公司 A kind of foam copper powder and preparation method thereof
CN106180745A (en) * 2016-08-31 2016-12-07 昆山德泰新材料科技有限公司 A kind of foam copper powder and preparation method thereof
CN107543441A (en) * 2017-08-31 2018-01-05 华南理工大学 A kind of fiber sintering formula heat pipe manufacturing process core pipe positioning and extraction method
CN110004314A (en) * 2018-05-25 2019-07-12 中国科学院金属研究所 A kind of preparation method of the metallic copper containing three-dimensional porous structure
CN111238276A (en) * 2018-11-28 2020-06-05 南京舒宜汇科学仪器有限公司 Method for preparing liquid absorption core by pressure sintering method
CN111238276B (en) * 2018-11-28 2021-04-16 南京舒宜汇科学仪器有限公司 Method for preparing liquid absorption core by pressure sintering method
CN110160385B (en) * 2019-01-31 2021-04-27 江苏集萃先进金属材料研究所有限公司 Capillary structure sintered at low temperature in heat transfer component and manufacturing method thereof
CN110160385A (en) * 2019-01-31 2019-08-23 江苏集萃先进金属材料研究所有限公司 A kind of capillary structure and its manufacturing method of the sintering of heat-transferring assembly inner cryogenic
CN110319724A (en) * 2019-07-03 2019-10-11 江西华度电子新材料有限公司 A method of restoring liquid-sucking core capillary performance
TWI781431B (en) * 2019-09-03 2022-10-21 大陸商廣州力及熱管理科技有限公司 A metal oxide paste for making wick structure of vapor chamber device
CN110757021A (en) * 2019-09-23 2020-02-07 深圳市鸿富诚屏蔽材料有限公司 Manufacturing method of temperature-uniforming plate
US11728053B2 (en) 2019-10-15 2023-08-15 Nuscale Power, Llc Heat pipe networks for heat removal, such as heat removal from nuclear reactors, and associated systems and methods
US11710577B2 (en) 2019-10-15 2023-07-25 Nuscale Power, Llc Nuclear reactors having liquid metal alloy fuels and/or moderators
CN113295029A (en) * 2020-02-21 2021-08-24 日本电产株式会社 Heat conducting member and method for manufacturing same
CN113399669A (en) * 2020-03-17 2021-09-17 永源科技材料股份有限公司 Capillary structure
US12062462B2 (en) 2020-08-17 2024-08-13 Nuscale Power, Llc Thermal power conversion systems including heat pipes and photovoltaic cells
WO2022040152A1 (en) * 2020-08-17 2022-02-24 Nuscale Power, Llc Heat pipes including composite wicking structures, and associated methods of manufacture
CN112719263A (en) * 2020-12-30 2021-04-30 北京有研粉末新材料研究院有限公司 Method for preparing heat pipe liquid absorption core material
CN113280667A (en) * 2021-05-12 2021-08-20 Oppo广东移动通信有限公司 Liquid absorption core, temperature-uniforming plate, manufacturing method and electronic equipment
CN113245543A (en) * 2021-07-15 2021-08-13 江苏集萃先进金属材料研究所有限公司 Copper powder, preparation method thereof and capillary core prepared from copper powder
CN115156553A (en) * 2022-08-05 2022-10-11 江苏亚威创科源激光装备有限公司 Closed-cell foam steel and laser additive manufacturing technology preparation method thereof

Also Published As

Publication number Publication date
CN104759627B (en) 2017-08-29

Similar Documents

Publication Publication Date Title
CN104759627A (en) Method for manufacturing micro heat pipe by reducing copper oxide powder
CN104776740A (en) Method for preparing high-efficiency micro heat tube by combining copper powder with copper oxide powder
Zeng et al. Experimental investigation on thermal performance of aluminum vapor chamber using micro-grooved wick with reentrant cavity array
Jouhara et al. Heat pipe based systems-Advances and applications
Tang et al. Thermal performance enhancement of an ultra-thin flattened heat pipe with multiple wick structure
Chen et al. Experimental investigation of loop heat pipe with flat evaporator using biporous wick
CN201374890Y (en) Flat-plate heat pipe and heat abstractor formed by integrated design thereof with porous medium
CN203454874U (en) Anti-gravity loop heat pipe
Li et al. Experimental investigation on the sintered wick of the anti-gravity loop-shaped heat pipe
CN104896983A (en) Manufacturing method of soaking plate with ultrathin foam silver as liquid absorbing core
Shi et al. Influence of filling ratio and working fluid thermal properties on starting up and heat transferring performance of closed loop plate oscillating heat pipe with parallel channels
CN104792205A (en) Manufacturing method of hierarchical-structured foamy copper soaking plate with combinational design
Vasiliev et al. Heat transfer enhancement in mini channels with micro/nano particles deposited on a heat-loaded wall
CN103256841B (en) A kind of energy storage heat abstractor
CN103165547A (en) Microgroove group composite phase change radiator
CN112719263A (en) Method for preparing heat pipe liquid absorption core material
Zhuang et al. Experimental investigation on a novel composite heat pipe with phase change materials coated on the adiabatic section
Meng et al. Experimental study on the heat transfer performance of a vapour chamber with porous wick structures printed via metallic additive manufacturing
Ling et al. Operational characteristics of loop heat pipes with porous copper fiber sintered sheet as wick
Jun et al. Effect of subcooling on pool boiling of water from sintered copper microporous coating at different orientations
Çiftçi et al. Enhancement of thermal performance of the air-to-air heat pipe heat exchanger (AAHX) with aluminate spinel-based binary hybrid nanofluids
Zeng et al. Effect of powder size on capillary and two-phase heat transfer performance for porous interconnected microchannel nets as enhanced wick for two-phase heat transfer devices
Xu et al. Heat transfer performance of novel high temperature flat heat pipe (HTFHP) with heating power and inclination angles
Ünvar et al. Improvement of heat pipe solar collector thermal efficiency using Al2O3/Water and TiO2/Water nanofluids
CN105509522A (en) Manufacturing method of sintered copper powder and high-porosity copper foam composited heat pipe

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
EXSB Decision made by sipo to initiate substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20220622

Address after: 311231 No. 389, Hongxing Road, Xiaoshan robot Town, economic and Technological Development Zone, Xiaoshan District, Hangzhou City, Zhejiang Province

Patentee after: Hangzhou Liangge Material Co.,Ltd.

Address before: 212300 Chuangye Park, Shuangyi Road, Danyang Development Zone, Zhenjiang City, Jiangsu Province

Patentee before: JIANGSU GREEN NEW MATERIAL SCIENCE & TECHNOLOGY CO.,LTD.

TR01 Transfer of patent right