CN104792205A - Manufacturing method of hierarchical-structured foamy copper soaking plate with combinational design - Google Patents
Manufacturing method of hierarchical-structured foamy copper soaking plate with combinational design Download PDFInfo
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- CN104792205A CN104792205A CN201410022375.8A CN201410022375A CN104792205A CN 104792205 A CN104792205 A CN 104792205A CN 201410022375 A CN201410022375 A CN 201410022375A CN 104792205 A CN104792205 A CN 104792205A
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- foam copper
- soaking plate
- copper
- support column
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Abstract
The invention discloses a manufacturing method of a hierarchical-structured foamy copper soaking plate with a combinational design. According to working principles of a soaking plate, a liquid absorbing core is combined by hierarchical-structured foamy coppers with different porosities according to design requirements; and then, the soaking plate is manufactured by high-temperature sintering under a reductive atmosphere, welding, vacuumizing, liquid injection and packing. A middle steam cavity also adopts a cylindrical hierarchical-structured foamy copper with a needed thickness as a support column, so that the quick flowing of a gas/liquid-phase medium is guaranteed, the phase change circulating speed is quickened, and the radiating efficiency is improved. The hierarchical-structured foamy copper soaking plate with the combinational design is high in radiating efficiency, suitable for manufacturing an ultrathin structure, light in weight, high in manufacturing precision and suitable for industrial production. The manufacturing method satisfies the requirements of high heat conductivity and miniaturization of such semiconductor electronic devices and equipment as high-heat current density computer chips, high-energy electronic chips, photoelectric chips or radio frequency chips.
Description
Technical field
The present invention relates to a kind of manufacture method of soaking plate, belong to semiconductor electronic component field, is that the Combination Design of the hierarchy construction foam copper by adopting different porosities is as the soaking plate of liquid-sucking core and method for making thereof.
Background technology
The high density of the high frequency of semi-conductor electronic device, high speed and integrated circuit and volume are tending towards microminiaturization and the electronic component caloric value of unit volume and the energy consumption of one single chip are strengthened, the design of facility compact structure makes again heat radiation more difficult, and therefore people constantly seek the device of high efficiency and heat radiation to meet semiconductor and the electronic radiation requirement of development always.The design of management device and research and development restrict the fast development of semiconductor and electronic device always, and this problem is most important to Grand Equipments such as the electronic devices and components on the portable electronic piece of high speed development and communication apparatus, electronic component, high-tension high-power electronic device and military project and Aero-Space.The research and development of heat radiation module are built nearly ten years and application makes semi-conductor electronic device be rapidly developed by heat pipe and soaking plate.
Semi-conductor electronic device soaking plate (Vapor Chamber) is the vacuum cavity of an inwall tool micro-structural, when heat by heat source to evaporating area time, liquid phase medium inside cavity can in the environment of rough vacuum, start liquid-phase vaporization occurs, absorb heat energy and rapid spatial expansion, and be progressively full of whole vapor chamber, the medium of gas phase is quickly through vapor chamber, just phenomenon of condensing is there is when being transmitted to a colder region, changing by solution-air discharges at latent heat of phase change, liquid phase medium after condensation can by the capillarity of micro-structural on inwall again quick backflow to the evaporation ends of thermal source, this process will be carried out in cavity in circulation again and again, the course of work of soaking plate that Here it is.Because the micro-structural of medium liquid-sucking core when evaporating has very strong capillary force, so the work of soaking plate is not by the impact of gravity, what also claim in its antigravity characteristic and application process is non-directional.Soaking plate has the advantages such as expansion thermal resistance low, uniform heat flux, heat rapid diffusion, lightweight and noiselessness, among being paid attention to and continually developing.
Current common soaking plate be processed by deformation microchannel configuration, braiding copper mesh structure or sintered copper powder structure respectively as liquid-sucking core to manufacture the capillary structure of soaking plate.Then on copper sheet/plate, the microchannels difficulty with capillarity is processed large, its capillarity of copper mesh structure of braiding does not comply with one's wishes again, sintered copper powder structure is difficult to again to control the quality of last sintering, thus product fraction defective and manufacturing expense is higher and effect is as one wishes not to the utmost.And the hierarchy construction foam copper that Jiangsu Ge Ye new material Science and Technology Ltd. produces all can overcome the shortcoming of above-mentioned three kinds of capillary structures, there is the various performance requirement of the characteristic sum meeting soaking plate liquid-sucking core.Therefore, the present invention is the hierarchy construction foam copper that utilizes Jiangsu Ge Ye new material Science and Technology Ltd. the to produce soaking plate as liquid-sucking core, in conjunction with the characteristics of heat transfer of soaking plate, proposes the manufacture method of the hierarchy construction foam copper soaking plate of design capable of being combined.
Summary of the invention
For the soaking plate Problems existing of current groove structure, braiding copper mesh structure and sintered copper powder structure, the present invention proposes a kind of according to soaking plate application characteristic and architectural feature, the i.e. flowing difference of evaporation ends region and other partially liq media, the hierarchy construction foam copper of different porosities is utilized to carry out the preparation method of the soaking plate combined as liquid-sucking core, this hierarchy construction foam copper has good capillary attraction, can realize liquid medium phase transformation and Rapid Circulation, and heat radiation power is higher and properties of product uniformity is good.The foam copper of this hierarchy construction is produced by Jiangsu Ge Ye new material Science and Technology Ltd., and pore size scope is controlled between 300 nanometers are to 1 millimeter, and porosity can be selected within the scope of 40%-95% according to designing requirement.Concrete method for designing: the liquid-sucking core of soaking plate inner chamber all adopts hierarchy construction foam copper and foam copper post, the part of the evaporation ends that is wherein heated, adopt the hierarchy construction foam copper of low porosity, its porosity can be selected at 40-75%; Other parts adopt the hierarchy construction foam copper of high porosity, and porosity is 60-95%; Pore size scope is from 300 nanometers to 1 millimeter; Its thickness generally selects same thickness, selects between 0.1 millimeter to 3 millimeters according to designing requirement, but also can be heated evaporation ends and the close but not identical thickness of other parts selection according to designing requirement.
The hierarchy construction foam copper of a kind of design capable of being combined of the present invention is the manufacture method of liquid-sucking core soaking plate, and the micro-structural of its hierarchy construction foam copper as shown in Figure 1, can find out that the structure in its hole and pore size are different, i.e. hierarchy construction architectural feature.The internal structure schematic diagram that the foam copper of different porosities is the soaking plate of liquid-sucking core Combination Design according to the situation of thermal source respectively as shown in Fig. 2,3 and 4, as shown in Figure 5, the key step that the hierarchy construction foam copper soaking plate of concrete design capable of being combined manufactures is as follows for the middle support column formwork structure of its vapor chamber:
(1) template processing and cleaning: according to designing requirement, employings material is that the copper coin of red copper (fine copper) or Copper Foil are processed into upper cover plate and lower shoe according to designing requirement, and to its surface after processing through cleaning and drying and processing;
(2) processing of foam copper and support column: different porosities hierarchy construction foam copper is carried out Combination Design according to soaking plate heat transfer feature, mould is adopted to carry out Punching Technology in conjunction with the position in upper cover plate and lower shoe inner-cavity structure and size requirements, and the hierarchy construction foam copper cylinder of Punching Technology design thickness is as middle support column (thickness requires generally to be more than or equal to 0.8 millimeter according to vapor chamber usually), the quantity of this support copper post is according to soaking plate inner-cavity structure and size layout, usually every root support column is spaced apart 10-12 millimeter, the diameter of support column may be selected to be the foam copper of 3 to 8 mm in sizes,
(3) assembling between foam copper with template: hierarchy construction foam copper identical or close for different porosities thickness is required to insert in designed upper cover plate and lower shoe according to combining structure; And the Stainless Molding Board controlling support column layout structure is placed in above base plate and foam copper, foam copper support column is inserted the corresponding position of template, Stainless Molding Board also plays certain pressure effect to the foam copper of lower shoe, ensures sinter bonded effect;
(4) high temperature reduction sintering processes: the maximum temperature that high temperature reduction is arranged usually can 850
oc-1050
ochoose between C, the sintered heat insulating time was chosen in 2 hours at 30 minutes, and object realizes the hierarchy construction foam copper of different porosities and the effective sinter bonded between upper cover plate and lower shoe and between foam copper and foam copper support column.The selection principle of actual temp and time can according to foam copper and between upper cover plate and lower shoe bond strength determine, if need bond strength large, then the high length relative to temperature retention time of selective temperature;
(5) welding assembly: the copper silver soldering that surrounding jointing edge (except vacuum pumping liquid injection mouth) carries out under vacuum or protective atmosphere, according to the mould of welding or fixture requirement, connects or Diffusion Welding by the upper cover plate sintered the hierarchy construction foam copper of different porosities and lower shoe;
(6) encapsulate: according to vacuum level requirements, to vacuumize, fluid injection and encapsulation;
(7) performance test and inspection: the test and check carrying out the hot propertys such as heat radiation power Qmax and thermal resistance after encapsulation, guarantees the quality of soaking plate;
The primary structure composition of the hierarchy construction foam copper soaking plate of design capable of being combined of the present invention is as shown in Fig. 2,3 and 4:
1. shell structure, it comprises copper coin that material is fine copper or the upper cover plate that Copper Foil is processed into and lower shoe, then the foam copper material of different porosities and support column sintering are passed through solder bond in corresponding position, and form the chamber structure that has the sealing of vapor chamber;
2. the capillary structure of liquid-sucking core part and supporting construction, by the hierarchy construction foam copper of different porosities, and by the diffusion bond under high temperature reducing atmospheres together, in conjunction with good, in liquid-sucking core between the foam copper of different porosities and bolster in conjunction with good;
3. liquid medium, such as deionized water, alcohol, ethanol and ethers, its addition is to be filled in the amount of the hole in capillary structure and support column arrangement for theoretical recommendation.
Therefore soaking plate inside of the present invention be by the foam copper of the hierarchy construction of different porosities between be combined to form, upper cover plate and the combination between lower shoe inner surface and foam copper are good diffusion bond.Because support column also uses the foam copper of capillary structure, play good backflow effect, after the conversion of medium vapour-liquid, the reflowing result of liquid phase is obvious, improves radiating effect.
The structure employing diameter of support column is the cylindrical arrangement of 3-8 millimeter, and other templates also can be adopted if square structure is as support, and object reaches the resultant effect supporting and reflux.
Accompanying drawing explanation
Fig. 1 is the micro-structural stereoscan photograph of hierarchy construction foam copper
The soaking plate internal structure Combination Design schematic diagram of Fig. 2 to be single heat source foam copper be liquid-sucking core
The soaking plate internal structure Combination Design of Fig. 3 to be multi-heat source (such as 4 thermals source, but thermal source is apart from close) with foam copper be liquid-sucking core
The soaking plate internal structure Combination Design of Fig. 4 to be multi-heat source (such as 4 thermals source, but thermal source distance is relatively far away) with foam copper be liquid-sucking core
Fig. 5 is the formwork structure schematic diagram of middle support column in soaking plate
Fig. 6 is with a kind of soaking plate of foam copper for liquid-sucking core being of a size of the Combination Design of 100x100 millimeter, and its gross thickness is the single heat source soaking plate internal structure schematic diagram of 3 millimeters
instantiation: a kind of size is the foam copper of 100x100 millimeter is the soaking plate of liquid-sucking core, and gross thickness is 3 millimeters, and the thermal source that is heated is the soaking plate internal combination structure of single heat source, and thermal source and evaporation ends size are 30x30 millimeter.Upper cover plate and lower shoe adopt thickness to be the fine copper plate of 0.6mm and 1.0mm respectively, are as shown in Figure 6 through compression molding, punching press or to be machined to chamber height be 1.4mm, and the position of reserved vacuum pumping liquid injection is used for follow-up fluid injection encapsulation.The thickness of the foam copper material selection Jiangsu Ge Ye new material Science and Technology Ltd. production of different porosities is the hierarchy construction foam copper of 0.2mm, but porosity is respectively 85% and 60% combined structure design.Wherein thermal source evaporation ends area size is 30x30mm, so the material of upper cover plate adopts porosity to be 85%, and the position of the thermal source evaporation ends part of lower shoe adopts porosity to be the foam copper of 60%, except the extra-regional part of thermal source evaporation ends adopts the foam copper of 85% equally.The thickness that middle support column also adopts Jiangsu Ge Ye new material Science and Technology Ltd. to produce is the hierarchy construction Porous Cu of 1.0mm, and make cylinder (as shown in Figure 6) upper cover plate of Φ 5mm, lower shoe and middle support column by High temperature diffusion mode sinter bonded by punching press, as shown in Figure 6.Between upper cover plate and lower shoe, combine in High temperature diffusion mode, graphite jig is adopted to compress upper cover plate and lower shoe, edge juncture is made to divide good face contact, in diffusion in vacuum stove, realize upper cover plate, lower shoe and support column (foam copper) combine, forming a height is 1.0mm steam inner chamber.The thermal creep stress of diffusion bond is 980 DEG C, and pressure is 5MPa, and keeps this temperature and pressure lower 1 hour.
After above-mentioned example completes, carry out resistance to pressure and air tightness test by liquid injection pipe, all reach the Eligibility requirements of complete welded seal, and then carry out next step vacuumize, fluid injection encapsulation, soaking plate inside vacuumizes, and its vacuum is evacuated to 10
-4-10
-5torr.Then, weighing by the appropriate deionized water of liquid injection pipe filling according to calculating, in soaking plate inner chamber, then involution, completing whole encapsulation preparation process, and carrying out the hot property quality testing of corresponding soaking plate.
Claims (5)
1. the manufacture method of the hierarchy construction foam copper soaking plate of a design capable of being combined, according to soaking plate application operating mode, at evaporation ends or the title source part of being heated, adopt the hierarchy construction foam copper sintering of low porosity on base plate, the inner chamber of upper cover plate and lower shoe be heated extra-regional other parts of evaporator section adopt the foam copper of high porosity and sintering on upper cover plate and base plate, support column also adopts the foam copper of hierarchy construction, and according to corresponding dimensional requirement layout and combination, then assembly welding, through vacuumizing, fluid injection, makes soaking plate after encapsulation.
2. the manufacture method of the hierarchy construction foam copper soaking plate of a kind of design capable of being combined as claimed in claim 1, its preparation process comprises: the processing of (1) template and cleaning: according to soaking plate application requirement, machined or according to the upper cover plate of mould structure punch process fine copper and lower shoe, needs through cleaning and dry process after processing; (2) processing of foam copper and support column: the requirement that the hierarchy construction foam copper of different porosities is applied according to soaking plate, in conjunction with inner-cavity structure feature by mould structure Punching Technology, and the hierarchy construction foam copper cylinder of Punching Technology desired thickness is as middle support column; (3) assembling between foam copper and template: the hierarchy construction foam copper of different aperture is inserted in corresponding upper cover plate and lower shoe; And being placed in above base plate and foam copper according to the Stainless Molding Board of support column layout structure, foam copper support column is inserted the corresponding position of template, wherein this Stainless Molding Board also plays certain pressure effect to the foam copper of lower shoe, ensures sinter bonded effect; (4) high temperature reduction sintering processes: the maximum temperature that high temperature reduction is arranged is 850
oc-1050
ochoose between C, the sintered heat insulating time was chosen in 2 hours at 30 minutes, object realizes foam copper and sinter bonded between upper cover plate and lower shoe and between foam copper and foam copper support column, the selection principle of actual temp and time can be determined according to required bond strength, required bond strength is large, then can the high length relative to the time of selective temperature; (5) welding assembly: upper cover plate and lower shoe are according to designing requirement, and the copper silver soldering carried out except vacuum pumping liquid injection mouth under vacuum or protective atmosphere connects or Diffusion Welding by surrounding jointing edge; (6) encapsulate: according to vacuum level requirements, carry out vacuumizing, fluid injection and encapsulation; (7) performance test and inspection: the test and check carrying out the hot propertys such as heat radiation power Qmax and thermal resistance after encapsulation, ensures the quality of soaking plate.
3. the manufacture method of the hierarchy construction foam copper soaking plate of a kind of design capable of being combined as claimed in claim 1, the liquid-sucking core of this soaking plate inner chamber all adopts different porosities hierarchy construction foam copper and foam copper post, wherein to be heated the part of evaporation ends, adopt the hierarchy construction foam copper of low porosity, its porosity can be selected at 40-75%; Other parts adopt the hierarchy construction foam copper of high porosity, and porosity is 60-95%; Pore size scope in 300 nanometers to 1000 microns (namely 1 millimeters); General selection same thickness, selects by designing requirement between 0.1 millimeter to 3 millimeters, but also can be heated evaporation ends and the close but not identical thickness of other parts selection according to designing requirement.
4. the manufacture method of the hierarchy construction foam copper soaking plate of a kind of design capable of being combined as claimed in claim 1, it is characterized in that the vapor chamber between the upper cover plate after foam copper sintering and lower shoe generally adopts thickness to be more than or equal to the columned or square hierarchy construction foam copper support column of 0.8 millimeter, the quantity of this support copper post is at interval of 10-12 millimeter one support column according to soaking plate inner-cavity structure layout, the diameter of support column may be selected to be the foam copper copper post of 3 to 8 mm in sizes, and other block structures also can be selected as middle support column.
5. high temperature reduction sintering processes as claimed in claim 2, its reduction adopts hydrogen-nitrogen mixture gas, H-N ratio example is (75%-10%): (25%-90%) (being the ratio of constituents when the ratio of hydrogen nitrogen is 75%:25%), the ratio adjustment of hydrogen can utilize nitrogen, all meets the quality requirement of reduction sintering within the scope of above-mentioned hydrogen-nitrogen mixture gas.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105385568A (en) * | 2015-12-24 | 2016-03-09 | 中国人民解放军军事医学科学院卫生装备研究所 | Gas bath capillary tube type micro nucleic acid amplification device |
| CN106152847A (en) * | 2016-07-28 | 2016-11-23 | 苏州聚力电机有限公司 | The capillary structure configuration structure of a kind of soaking plate and collocation method thereof |
| CN106225537A (en) * | 2016-07-28 | 2016-12-14 | 苏州聚力电机有限公司 | The capillary structure configuration structure of soaking plate and collocation method thereof |
| CN108457132A (en) * | 2018-04-10 | 2018-08-28 | 浙江舒康科技有限公司 | Aluminium ammonia heat pipe paper mould hot-pressing drying mold and drying means |
| CN110035642A (en) * | 2019-05-21 | 2019-07-19 | 广东工业大学 | A kind of liquid-cooled heat-conducting block and water-cooling type radiator |
| CN112693636A (en) * | 2020-12-28 | 2021-04-23 | 上海卫星工程研究所 | Light-weight thermal control device for satellite and manufacturing method thereof |
| CN113758327A (en) * | 2021-08-13 | 2021-12-07 | 中南大学 | Composite VC radiator containing copper/diamond sintered liquid absorption cores and preparation method thereof |
| CN114083841A (en) * | 2021-12-16 | 2022-02-25 | 成都四威高科技产业园有限公司 | High-thermal-conductivity graphite film temperature-equalizing plate and preparation method thereof |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105385568A (en) * | 2015-12-24 | 2016-03-09 | 中国人民解放军军事医学科学院卫生装备研究所 | Gas bath capillary tube type micro nucleic acid amplification device |
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| CN106225537A (en) * | 2016-07-28 | 2016-12-14 | 苏州聚力电机有限公司 | The capillary structure configuration structure of soaking plate and collocation method thereof |
| CN108457132A (en) * | 2018-04-10 | 2018-08-28 | 浙江舒康科技有限公司 | Aluminium ammonia heat pipe paper mould hot-pressing drying mold and drying means |
| CN110035642A (en) * | 2019-05-21 | 2019-07-19 | 广东工业大学 | A kind of liquid-cooled heat-conducting block and water-cooling type radiator |
| CN112693636A (en) * | 2020-12-28 | 2021-04-23 | 上海卫星工程研究所 | Light-weight thermal control device for satellite and manufacturing method thereof |
| CN113758327A (en) * | 2021-08-13 | 2021-12-07 | 中南大学 | Composite VC radiator containing copper/diamond sintered liquid absorption cores and preparation method thereof |
| CN114083841A (en) * | 2021-12-16 | 2022-02-25 | 成都四威高科技产业园有限公司 | High-thermal-conductivity graphite film temperature-equalizing plate and preparation method thereof |
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Effective date of registration: 20220622 Address after: 311231 No. 389, Hongxing Road, Xiaoshan robot Town, economic and Technological Development Zone, Xiaoshan District, Hangzhou City, Zhejiang Province Patentee after: Hangzhou Liangge Material Co.,Ltd. Address before: 212300 Chuangye Park, Shuangyi Road, Danyang Development Zone, Zhenjiang City, Jiangsu Province Patentee before: JIANGSU GREEN NEW MATERIAL SCIENCE & TECHNOLOGY CO.,LTD. |