CN105307452A - Manufacturing method of ultra-thin soaking plate employing heat sink materials as bottom plate - Google Patents
Manufacturing method of ultra-thin soaking plate employing heat sink materials as bottom plate Download PDFInfo
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- CN105307452A CN105307452A CN201410308535.5A CN201410308535A CN105307452A CN 105307452 A CN105307452 A CN 105307452A CN 201410308535 A CN201410308535 A CN 201410308535A CN 105307452 A CN105307452 A CN 105307452A
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Abstract
The invention discloses a manufacturing method of an ultra-thin soaking plate employing ultrathin foamy copper as a wick, heat sink materials such as molybdenum-copper or tungsten-copper alloy as a bottom plate and an oxygen-free copper cover plate through processes of high-temperature sintering, copper silver or silver welding, packaged injection and the like. According to the method, integrated fabrication of the heat sink materials with high thermal conductivity and low expansion, such as the molybdenum-copper or tungsten-copper alloy and a conventional soaking plate is achieved; the ultrathin soaking plate which is 0.3mm to 2.0mm in thickness is manufactured; the ultrathin soaking plate is directly used for cooling chips of high-power or power electronic devices of a thyristor, an IGBT, an IGCT and the like; matching of thermal expansion coefficients of electronic components of the chips and the like and base materials of the heat sink materials is ensured; efficient and rapid heat conduction and cooling characteristics are achieved; the thermal resistance is reduced; the reliability of a system is improved; the method is convenient to manufacture, simple in equipment, free of pollution in a production process and suitable for bulk industrial production; and the structure of the manufactured soaking plate is a flexible structure which is thinned to about 0.3mm, and meets the requirements of uniform temperature, small thermal resistance and rapid and efficient cooling.
Description
Technical field
The present invention relates to a kind of manufacture method of soaking plate, one of feature of this soaking plate is that its base plate adopts heat sink material as molybdenum copper or tungsten-copper alloy etc., achieves the integrated of heat sink material and soaking plate; Two of feature adopts ultra-thin foam copper, the internal structure layout of soaking plate such as the position of vapor chamber and structure resided in the same Rotating fields of liquid-sucking core simultaneously, prepare the soaking plate of superthin structure.
Background technology
Heat management is directly connected to stability and the reliability of semi-conductor electronic device and Grand Equipments work, carry out the design of soaking plate, manufacture and application in conjunction with device cooling requirements at present progressively to be paid attention to, because soaking plate has the advantages such as expansion thermal resistance low, uniform heat flux, heat rapid diffusion, lightweight and noiselessness, the effective thermal control of operating temperature to semi-conductor electronic device and equipment can be realized.
Soaking plate (VaporChamber) is the high vacuum cavity that an inwall has microstructure, its structure be as shown in Figure 1 by the capillary structure material in liquid-sucking core, copper post, upper and lower cover plates and up and down copper cover plate be combined into through sintering and welding (Diffusion Welding or copper silver soldering connect), then by vacuumizing, the operation such as fluid injection and encapsulation obtains.During application, when heat by the chip heat source of semiconductor to the evaporating area of soaking plate time, liquid phase medium inside cavity can in condition of high vacuum degree environment, start liquid-phase vaporization occurs, absorb heat energy and rapid spatial expansion, and be progressively full of whole vapor chamber, the medium of gas phase is quickly through vapor chamber, just phenomenon of condensing is there is when being transmitted to a colder region, change by solution-air and discharge latent heat of phase change, liquid phase medium after condensation can by the capillarity of micro-structural on inwall again quick backflow to the evaporation ends of thermal source, this process will be carried out in cavity in circulation again and again, the course of work of soaking plate that Here it is.Because in soaking plate, the micro-structural of liquid-sucking core has very strong capillary force, liquid medium relies on capillarity to be adsorbed in liquid-sucking core, is not subject to the impact of gravity when soaking plate work, and what also claim in its antigravity characteristic and application process is non-directional.The efficient radiating efficiency fast of soaking plate and power, the uniform advantage such as heat flux, noiselessness, more and more come into one's own and constantly researched and developed.In addition, due to semi-conductor electronic device particularly portable electronic device constantly to small-sized, attractive in appearance, efficient future development, the future development of soaking plate equally constantly ultra-thin, efficient and high reliability.
It is the cut-away view of conventional soaking plate shown in Fig. 1, soaking plate is made up of five-layer structure usually, and lower shoe+capillary wick material+vapor chamber+capillary wick material+upper cover plate, wherein the thickness of vapor chamber designs usually needs to be not less than 0.8mm, add the thickness of various material, the thickness of such soaking plate is generally greater than 3 millimeters for now.How to realize the further reduction of soaking plate thickness and the continuous minimizing of weight, all constantly propose new requirement to design and preparation, the present invention proposes the method for solution from the inside liquid-sucking core materials and structures of soaking plate.
It is the regular connection process of the thermals source such as chip and soaking plate shown in Fig. 2, first thermal source such as chip adopts mount technology to realize MULTILAYER COMPOSITE by heat-conducting glue etc. with heat sink material usually, then heat sink material is combined to soaking plate and corresponding heat radiation module thereof by heat-conducting glue or welding method again, and practical structures forms by five layers: composite bed (employing mount technology)+heat sink material+heat-conducting glue (or weld layer)+soaking plate and the modules thereof such as thermal source (as chip)+heat-conducting glue.This shows and reduce the vital demand that thermal resistance is the cooling heat sources such as chip.Because add articulamentum, also result in the increase of structural change, physical dimension and weight, relatively reduce the reliability of device.Because many one decks connect, the possibility of inefficacy just how once may be contacted.Therefore the present invention also proposes the method for solution from the material of soaking plate and structure two aspect.
Summary of the invention
Current semiconductor chip is particularly if the chip of the device for high-power power electronic such as thyristor, IGBT, IGCT is because very responsive to the thermal stress of variations in temperature generation, usual need design in conjunction with mount technology and heat sink material integrated, this heat sink material needs to have good heat conductivility, and thermal coefficient of expansion is close with corresponding chip, when varying with temperature like this, the thermal stress produced is little, guarantees its trouble free service and reliability.If using the face of heat sink material as soaking plate, just at least reduce the thermal resistance that two-layer integrated technique produces, one is the thermal resistance of heat sink material itself, and two is thermal resistances of the weld layer that is connected with soaking plate of heat sink material or heat-conducting glue.So just can reduce heat sink material and be connected to two operations on soaking plate and corresponding module thereof by welding or heat-conducting glue, reach heat conduction rapidly and efficiently and heat radiation object.In order to meet cooling requirements, reduce the reliability that thermal resistance and raising chip and heat radiation module combine, propose the present invention to set about from the preparation material aspect of soaking plate, by heat sink material as the face making soaking plate, so just at least reduce two-layer thermal resistance, one is the thermal resistance of heat sink material itself, and two is thermal resistances of the weld layer that is connected with soaking plate of heat sink material or heat-conducting glue.
Namely according to designing requirement, adopt upper cover plate to be anaerobic fine copper the sheathing material of ultra-thin soaking plate, lower shoe adopts molybdenum-copper or tungsten-copper alloy to replace anaerobic fine copper usually used.Because molybdenum-copper and tungsten-copper alloy have good physical property, as requirements such as high thermal conductivity, heat resistance and low thermal coefficient of expansions, also there is good mechanical property as high elastic modulus, the heat sink application of powerful integrated circuit and microwave device can be met.With the face of this heat sink ultra-thin sheet material as soaking plate, just can realize heat sink material and the integration of conventional soaking plate, greatly reduce the thermal resistance of whole heat radiation module, improve reliability.Another side then selects ultra-thin no-oxygen copper plate, is convenient to the connection between fin.
It two is set about from the internal structure of soaking plate, and usual soaking plate Inner Constitution is by five-layer structure, and the ultra-thin foam copper that the present invention adopts Jiangsu Ge Ye new material Science and Technology Ltd. to produce is as liquid-sucking core.This liquid-sucking core porosity can be selected within the scope of 40-95%, and aperture structure is hierarchy construction, and its magnitude range is in hundreds of nanometer to hundreds of micrometer range, and thickness >=0.1 millimeter, this material itself has good capillary properties.Internal structure can be adjusted, make three-decker into, be i.e. upper cover plate and lower shoe, add the middle ultra-thin foam copper of hierarchy construction.Vapor chamber wherein by design, can be resided in the same Rotating fields of liquid-sucking core.Namely according to the heat source positions such as chip and design feature, structural design is carried out to the ultra-thin foam copper for soaking plate liquid-sucking core, meet the space requirement of required vapor chamber.By corresponding mould, ultra-thin foam copper is carried out die-cut after design, various shape or structure can be processed into according to designing requirement, petal and M shape as shown in Figure 3, namely its corresponding thermal source evaporating area and vapor chamber are realized by the structural design of ultra-thin foam copper.
This soaking plate a kind ofly to be formed by manufacture technics such as structural design, high temperature sintering, welding and encapsulation fluid injections by ultra-thin foam copper and ultra-thin molybdenum copper or tungsten-copper alloy, achieve ultra-thin soaking plate heat sink material and soaking plate are integrated, greatly can reduce the integrated thermal resistance of the required heat radiation of components and parts, meet semiconductor electronic component heat conduction rapidly and efficiently and radiating requirements.In addition this soaking plate have also been changed the topology layout of conventional soaking plate inside, in conjunction with the size of evaporating area residing for thermal source, position and quantity, ultra-thin foam copper structure is designed, and the position of vapor chamber and structure are resided in the same Rotating fields of liquid-sucking core, guarantee the superthin structure of soaking plate.
Accompanying drawing explanation
The structural representation of the conventional soaking plate of Fig. 1, i.e. lower shoe+capillary wick material+vapor chamber+capillary wick material+upper cover plate
The schematic diagram that the thermals source such as Fig. 2 chip are combined with conventional heat sink material and soaking plate
The formwork structure design diagram of ultra-thin foam copper in the ultra-thin soaking plate of Fig. 3
The structural representation that the ultra-thin foam copper of Fig. 4 is liquid-sucking core, heat sink material is the ultra-thin soaking plate of lower shoe
The ultra-thin foam copper that Fig. 5 is of a size of 80*80*0.6mm is the structural representation of the ultra-thin soaking plate of liquid-sucking core
instantiation
example one, is of a size of the manufacture of the ultra-thin soaking plate of square structure molybdenum copper of 80*80*0.6mm
Preparation size is the ultra-thin soaking plate that the square structure of 80*80*0.6mm has that molybdenum copper that heat sink material and soaking plate be integrated is base plate concurrently, and concrete steps are as follows:
(1) design of soaking plate and the preparation of component materials: base plate molybdenum-copper plate size is 80*80mm, and thickness is 0.2mm, and upper cover plate is fine copper, is 0.2mm, and size is after suitable deformation, and the deformation degree of depth is 0.2mm, is of a size of 80*80mm.The thickness of ultra-thin foam copper is 0.22mm, and porosity is 82%.Because ultra-thin foam copper is easily out of shape, through suitable pressure, it will can be deformed to 0.20mm, and now porosity is about 80.2%, and object guarantees that the upper cover plate of copper can fully contact with the lower shoe of molybdenum copper and weld together;
(2) preparation of soaking plate liquid-sucking core: liquid-sucking core adopts ultra-thin foam copper, thickness is 0.22mm, porosity is 82%, the middle part of soaking plate is positioned at according to the position of chip, size is 20*20mm, the structure of liquid-sucking core is designed to " M shape ", in detail as shown in Figure 5, and the formwork structure needed for becoming through diel Punching Technology;
(3) cleaning and combination: by the upper cover plate oxygen-free copper sheet material after processing and lower shoe molybdenum-copper plate through cleaning, after drying, with die-cut after ultra-thin foam copper form assembly, at its edge surrounding (comprising the reserved capillary pure copper tube for vacuum pumping liquid injection) evenly coated copper silver solder, guarantee effect and the quality of welding;
(4) high temperature sintering with weld: above-mentioned ready soaking plate sub-assembly is placed in graphite jig, this graphite jig is used to guarantee that the soaking plate prepared is smooth, additional gravity is adopted in sintering and welding under follow-up 800 DEG C of high-temperature hydrogen reduction atmosphere, temperature retention time is 30 minutes, realizes the good sinter bonded between soaking plate sub-assembly and welding effect;
(5) leak detection test: need after welding to carry out leak detection test to surrounding welding quality, guarantee that surrounding welding is good;
(6) vacuumize, fluid injection, encapsulation and secondary degasification and solder up: after leak detection, the capillary of soaking plate is fixed on and vacuumizes, on the fixture of fluid injection and encapsulation, carries out vacuumizing, fluid injection and encapsulation; Vacuum degree is 10-30Pa, the soaking plate after encapsulation is suitably heated, reaches the object of secondary degasification, then carries out welding and sealing to encapsulation mouth, guarantees the quality of solder up;
(7) aging and thermal performance test: ultra-thin soaking plate aging test temperature is decided to be 200 DEG C, completed burn-in test through 6 hours 200 DEG C of insulations; After burn-in test, the hot property of carrying out soaking plate measures, and mainly tests Qmax, the temperature difference and thermal resistance, completes the manufacture of whole soaking plate after mensuration;
(8) preservative treatment: ultra-thin soaking plate carries out the surface anticorrosion process of electronickelling.
Embodiment
The implementation method of the ultra-thin soaking plate that a kind of heat sink material of being made up by techniques such as structural design, high temperature sintering, welding, encapsulation fluid injections of ultra-thin foam copper and ultra-thin molybdenum copper or tungsten-copper alloy and conventional soaking plate are integrated and concrete steps as follows, point two aspects: is the upper cover plate of soaking plate and the selection of lower shoe and design; Two is designs of the inner liquid-sucking core of soaking plate and structure thereof, as shown in Figure 4.
One is selection and the design of soaking plate upper cover plate and lower shoe:
(1) upper cover plate, usually adopt anaerobic fine copper, through a small amount of punching press deformation, deformation quantity is the thickness of added foam copper;
(2) lower shoe, adopts heat sink material as molybdenum-copper or tungsten-copper alloy, the heat sink material sheet material that general employing is ultra-thin.
Two is the inner liquid-sucking core of soaking plate and structural design thereof:
The liquid-sucking core of soaking plate inside will design according to the heat source positions such as chip, quantity and size, become the ultra-thin foam copper template of individual layer through Punching Technology, and the vapor chamber wherein by design, can be resided in the same Rotating fields of liquid-sucking core.Adopt the ultra-thin foam copper of Jiangsu Ge Ye new material Science and Technology Ltd. production as liquid-sucking core.This liquid-sucking core porosity can be selected within the scope of 40-95%, and aperture structure is hierarchy construction, and its magnitude range is in hundreds of nanometer to hundreds of micrometer range, and thickness >=0.1 millimeter, this material itself has good capillary properties.
Specific embodiments is as follows:
(1) design of soaking plate: soaking plate carries out designing according to the size specific requirement of the thermals source such as chip usually.Therefore according to the quantity of chip, size and heat radiation power requirement, structure and the size of soaking plate is provided;
(2) preparation of soaking plate component materials: according to structure and the size of soaking plate, prepares each parts that corresponding soaking plate manufactures: ultra-thin foam copper, molybdenum copper or tungsten-copper alloy sheet material, oxygen-free copper (fine copper) sheet material;
(3) preparation of soaking plate modular construction: by upper cover plate oxygen-free copper sheet material according to the structure of soaking plate, carry out a small amount of punch process, its deformation quantity equals the thickness a little less than ultra-thin foam copper;
(4) preparation of soaking plate liquid-sucking core: the ultra-thin foam copper as liquid-sucking core will according to soaking plate designing requirement, the formwork structure needed for becoming through mould Punching Technology.
(5) clean: by the upper cover plate oxygen-free copper sheet material after processing and lower shoe molybdenum copper or tungsten-copper alloy plate for subsequent use after cleaning, drying;
(6) combine: according to the designing requirement of soaking plate, after lower shoe molybdenum copper or tungsten-copper alloy plate, ultra-thin foam copper template, the combination of oxygen-free copper upper cover plate, at its edge surrounding (comprising the reserved capillary pure copper tube for vacuum pumping liquid injection) evenly coated copper silver or silver solder, guarantee the quality that subsequent high temperature welds;
(7) graphite jig is placed in: be placed in graphite jig by above-mentioned ready soaking plate sub-assembly, this graphite jig is used to guarantee that the soaking plate prepared is smooth, gravity or external force can be adopted in subsequent high temperature sintering and welding, realize the good combination between soaking plate sub-assembly and welding effect;
(8) high temperature sintering with weld: under high-temperature vacuum or hydrogen reduction atmosphere, carry out the copper silver of ultra-thin foam copper and the high temperature sintering between upper cover plate and lower shoe and upper cover plate and lower shoe periphery or welding of silver solder, wherein heating-up temperature is 780-810 DEG C, and temperature retention time is 10 points to 60 minutes;
(9) leak detection test: need after welding to carry out leak detection test, guarantee surrounding welding quality;
(10) vacuumize, fluid injection encapsulation: after leak detection, the capillary of soaking plate is fixed on and vacuumizes, on the fixture of fluid injection and encapsulation, carries out vacuumizing, fluid injection and encapsulation;
(11) secondary degasification and solder up: the soaking plate after above-mentioned encapsulation is carried out secondary degasification, then carries out solder up, guarantees the quality of solder up;
(12) burn-in test: according to the situation of soaking plate liquid-sucking core, determines aging test temperature and time, and typical temperature is set as 180 DEG C or 200 DEG C, through the burn-in test of a few hours to 24 hour;
(13) thermal performance test: after burn-in test, the hot property of carrying out soaking plate measures, and the mainly mensuration of Qmax, the temperature difference and thermal resistance, completes the manufacture of whole soaking plate after mensuration.
(14) preservative treatment: soaking plate also needs the surface anticorrosion process carrying out electronickelling or chromium etc. usually.
Claims (8)
1. the invention discloses one with ultra-thin foam copper for liquid-sucking core, heat sink material is that base plate and anaerobic fine copper cover plate connect and encapsulate the manufacture method of the ultra-thin soaking plate of fluid injection by high temperature sintering, copper silver or silver soldering.
2. the method achieve the heat sink material of the molybdenum-copper of high-thermal-conductivity low-expansibility or tungsten-copper alloy sheet material and conventional being made into one of soaking plate, superthin structure soaking plate can be made.
3. ultra-thin foam copper as claimed in claim 1 is the manufacture method of the ultra-thin soaking plate of liquid-sucking core, the structure of its ultra-thin foam copper is hierarchy construction, there is good capillary properties, porosity can be selected between 40-95%, pore size in 300nm to 300-500 micrometer range, thickness >=0.1 millimeter.
4. ultra-thin foam copper as claimed in claim 2 is used for ultra-thin soaking plate, the easy cutting of its structure, is die-cut into the various template structures such as petal, M shape, meets structural design and the application requirement of soaking plate liquid-sucking core.
5. the manufacture method of ultra-thin soaking plate as claimed in claim 1, the base plate of this ultra-thin soaking plate adopts high-thermal-conductivity low-expansibility as heat sink materials such as molybdenum copper or tungsten-copper alloys, be upper cover plate with anaerobic fine copper, realize heat sink material and conventional being made into one of soaking plate, reduce the thermal resistance during system integration.
6. ultra-thin soaking plate manufacture method as claimed in claim 4, ultra-thin foam copper is as liquid-sucking core, adopt the sinter bonded under high-temperature vacuum or hydrogen reduction atmosphere with the combination of anaerobic fine copper upper cover plate and heat sink material lower shoe, temperature range can be selected at 700-1000 DEG C.
7. ultra-thin foam copper as claimed in claim 1 is the manufacture method of the ultra-thin soaking plate of liquid-sucking core, the welding temperature of copper silver or silver-colored series solder is adopted between its lower shoe heat sink material and upper cover plate oxygen-free copper, can select at 700-1000 DEG C, temperature retention time was at 10 minutes to 60 minutes.
8. as claimed in claim 4, the thickness of heat sink material can adopt >=0.05 millimeter, the thickness of ultra-thin foam copper can adopt >=0.1 millimeter, thickness >=0.15 millimeter of oxygen-free copper cover plate, in conjunction with above-mentioned parameter, determine according to the upper cover plate thickness of ultra-thin foam copper thickness, copper and molybdenum-copper or tungsten-copper alloy sheet metal thickness, the most minimal thickness of the soaking plate that can be made into is 0.3 millimeter, increase the thickness of heat sink material, foam copper and oxygen-free copper cover plate respectively, the soaking plate made, thickness can be thick in 2.0 millimeters.
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| CN107068846A (en) * | 2017-03-29 | 2017-08-18 | 华南理工大学 | A kind of LED phase-change heats substrate and preparation method thereof |
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| CN107543440A (en) * | 2017-09-09 | 2018-01-05 | 中微冷却技术（深圳）有限公司 | The manufacture method and temperature-uniforming plate of temperature-uniforming plate |
| CN107809055A (en) * | 2017-12-14 | 2018-03-16 | 长春理工大学 | A kind of high-power semiconductor laser chip welding and assembling method |
| CN109297328A (en) * | 2018-07-20 | 2019-02-01 | 昆山长运电子工业有限公司 | The manufacturing method of irregular temperature-uniforming plate |
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| CN107809055A (en) * | 2017-12-14 | 2018-03-16 | 长春理工大学 | A kind of high-power semiconductor laser chip welding and assembling method |
| CN109297328A (en) * | 2018-07-20 | 2019-02-01 | 昆山长运电子工业有限公司 | The manufacturing method of irregular temperature-uniforming plate |
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