CN206268818U - A kind of heat abstractor and the high-power LED lamp with the heat abstractor - Google Patents

A kind of heat abstractor and the high-power LED lamp with the heat abstractor Download PDF

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Publication number
CN206268818U
CN206268818U CN201621354118.5U CN201621354118U CN206268818U CN 206268818 U CN206268818 U CN 206268818U CN 201621354118 U CN201621354118 U CN 201621354118U CN 206268818 U CN206268818 U CN 206268818U
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China
Prior art keywords
heat
heat abstractor
temperature
heat pipe
radiating fin
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CN201621354118.5U
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Chinese (zh)
Inventor
李红传
谢曙
李俊荣
钱伟
骆永光
郑伟
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Dongguan Chunhua Hydrogen Energy Investment Partnership LP
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Chunming Heat Dissipation Technology Co ltd
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Abstract

The utility model discloses a kind of heat abstractor, including temperature-uniforming plate, heat pipe and radiating fin;The evaporation ends of the temperature-uniforming plate are used to be connected with electronic equipment or device, and the inner surface setting of the evaporation ends has capillary wick;The heat pipe is L-shaped, and to take hot junction, another side is radiating end, and the condensation end in contact for taking hot junction and the temperature-uniforming plate, the radiating end is intercalated in the radiating fin on one side of the L-shaped.The invention also discloses a kind of high-power LED lamp including above-mentioned heat abstractor.Using high-power LED lamp and heat abstractor that the utility model is provided, the heat-sinking capability of whole device is substantially increased, it is to avoid because the thermal stress of internal difference in temperature excessive generation produces destruction to LED chip.By the setting of heat pipe, the surface temperature of whole radiating fin can be improved, so as to further improve radiating efficiency.

Description

A kind of heat abstractor and the high-power LED lamp with the heat abstractor
Technical field
The utility model is related to electronic equipment and device cooling technique field, more specifically to a kind of heat abstractor, Further relate to a kind of high-power LED lamp including above-mentioned heat abstractor.
Background technology
Light emitting diode (LED) is referred to as forth generation green illumination light source, there is energy-saving and environmental protection, long lifespan, from And it is subject to the highest attention and research of international community.However, the electro-optical efficiency of LED only has 20~30%, remaining 70~ 80% electric energy is converted to heat in the form of heat energy, highly integrated additionally, due to LED lamp bead, therefore heat flow density is larger, such as Fruit in time can not exclude these heats, and the temperature of LED lamp bead will rise rapidly, and too high temperature will have a strong impact on LED Reliability, stability and service life.
The heat dissipating method of great power LED relies primarily on Section Bar Heat Sinks in the prior art, and traditional Section Bar Heat Sinks are simple It is less efficient by Natural Heat Convection, and Section Bar Heat Sinks cannot ensure the uniformity of LED chip internal temperature, cause LED Inside produces thermal stress, so that LED chip is destroyed.
In sum, how to efficiently solve that Section Bar Heat Sinks radiating efficiency is low, be difficult to meet high-power electronic device with The problems such as device radiating requirements, be current those skilled in the art's urgent problem.
Utility model content
In view of this, first purpose of the present utility model is to provide a kind of heat abstractor, the structure of the heat abstractor Design can efficiently solve Section Bar Heat Sinks and be difficult to meet high-power, high heat flux electronic equipment and device radiating requirements Problem, second purpose of the present utility model is to provide a kind of high-power LED lamp including above-mentioned heat abstractor.
In order to achieve the above object, the utility model provides following technical scheme:
A kind of heat abstractor, including temperature-uniforming plate, heat pipe and radiating fin;The evaporation ends of the temperature-uniforming plate are used to be set with electronics Standby or device connection, the inner surface setting of the evaporation ends has capillary wick;The heat pipe is L-shaped, and one side of the L-shaped is to take heat End, another side is radiating end, and the condensation end in contact for taking hot junction and the temperature-uniforming plate, the radiating end is intercalated in the radiating In fin.
Preferably, in above-mentioned heat abstractor, also including retainer ring, screwed hole is offered in the retainer ring, it is described to take heat End is arranged between the retainer ring and the condensation end, and the retainer ring and the condensation end mode connects for screw.
Preferably, in above-mentioned heat abstractor, also including end plate, offered on the end plate for connecting with the radiating fin The screwed hole for connecing, the top correspondence of the radiating fin offers screwed hole, and end plate thermal vias are further opened with the end plate.
Preferably, in above-mentioned heat abstractor, the outer surface of the condensation end offers heat pipe mounting groove, and the hot junction that takes is in Flat, it is described take hot junction laminating be installed in the heat pipe mounting groove, be provided with the heat pipe mounting groove for reduce connect Touch the thermal conductive silicon lipid layer of thermal resistance.
Preferably, in above-mentioned heat abstractor, the width of the heat pipe mounting groove is equal with the width for taking hot junction, described The length of heat pipe mounting groove and the equal length for taking hot junction.
Preferably, in above-mentioned heat abstractor, the radiating fin is to include that multiple fin monomers are distributed according to predetermined angle Fin module, the end of the radiating fin is curved, and fin thermal vias are offered on the radiating fin, and described dissipates The surface of hot fin is coated with water-thinned nanometer paint layer.
Preferably, in above-mentioned heat abstractor, the capillary wick is multiple dimensioned capillary wick, and at least partly capillary wick Top and the condensation end contacted inner surfaces.
Preferably, in above-mentioned heat abstractor, the evaporation ends have multiple inwardly projecting for heat abstractor installation Fixed column, offer screwed hole in the fixed column.
Preferably, in above-mentioned heat abstractor, the temperature-uniforming plate is provided with for vacuumizing the metal tube with fluid injection, the gold Category pipe is connected with the evaporation cavity.
The heat abstractor that the utility model is provided includes temperature-uniforming plate, heat pipe and radiating fin.Wherein, the evaporation ends of temperature-uniforming plate For being connected with electronic equipment with device, the inner surface setting of evaporation ends has capillary wick, and heat pipe is L-shaped, and one side of L-shaped is to take heat End, another side is radiating end, takes the condensation end in contact in hot junction and temperature-uniforming plate, and radiating end is intercalated in radiating fin.
Using the heat abstractor that the utility model is provided, the heat that electronic equipment is produced when being worked with device is first by equal Warm plate evaporation ends enter capillary wick, and the working medium inside capillary wick absorbs heat, and constantly evaporation forms steam, and enters into temperature-uniforming plate Condensation end be condensed into liquid, liquid is directly absorbed by capillary wick and is re-introduced into evaporation ends heat absorption evaporation.Meanwhile, heat pipe takes Hot junction constantly absorbs heat from condensation end, and takes away LED light source rapidly, and radiating fin is transferred heat in the radiating end of heat pipe Piece.The steam of inside heat pipe is condensed into liquid, and heat pipe is re-introduced under the driving of self gravitation and capillary force takes hot junction Heat being absorbed again and so constantly circulating work, radiating fin finally distributes heat to surrounding environment, realizes passive heat radiation. Radiating is coupled with heat pipe by temperature-uniforming plate, the heat-sinking capability of whole device is substantially increased.The temperature-uniforming plate for being inside provided with capillary wick can To ensure electronic equipment and device inside uniformity of temperature profile, it is to avoid because the thermal stress of the excessive generation of internal difference in temperature sets to electronics It is standby to produce destruction with device.By the setting of heat pipe, the surface temperature of whole radiating fin can be improved, so as to further improve Radiating efficiency.
Select excellent implementation method a kind of, capillary wick is multiple dimensioned capillary wick, and at least partly the top of capillary wick with Condensation end contacted inner surfaces.The multiple dimensioned capillary wick of evaporation ends inner surface setting, not only can effectively solve steam and overflow and liquid Contradictory problems between suction, and because capillary wick is directly contacted with the condensation end inner surface of temperature-uniforming plate, therefore can be rapid Liquid of the steam in condensation end condensation generation is absorbed, liquid return flow path and time is reduced, and then it is enough to ensure that evaporation ends have Liquid is supplemented, and heat transfer is constantly gone on.
In order to reach above-mentioned second purpose, the utility model additionally provides a kind of high-power LED lamp, and this is high-power LED lamp includes LED chip, glass lens, reflection shield, power supply and power pack;Also include upper any one described heat abstractor, The evaporation ends of heat abstractor are fixedly connected with the LED chip.Because above-mentioned heat abstractor has above-mentioned technique effect, have The high-power LED lamp of the heat abstractor should also have corresponding technique effect.
Brief description of the drawings
In order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art, below will be to embodiment Or the accompanying drawing to be used needed for description of the prior art is briefly described, it should be apparent that, drawings in the following description are only It is some embodiments of the present utility model, for those of ordinary skill in the art, is not paying the premise of creative work Under, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of configuration schematic diagram of specific embodiment of high-power LED lamp that the utility model is provided;
Fig. 2 is the enlarged diagram of temperature-uniforming plate evaporation cavity in Fig. 1;
Fig. 3 is temperature-uniforming plate evaporation cavity internal capillary core schematic diagram in Fig. 1;
Fig. 4 is the enlarged diagram of retainer ring in Fig. 1;
Fig. 5 is the enlarged diagram of radiating fin in Fig. 1;
Fig. 6 is the enlarged diagram of Fig. 1 end plates;
Fig. 7 is the high-power LED lamp assembly structure diagram of Fig. 1.
Marked in accompanying drawing as follows:
Temperature-uniforming plate 11, heat pipe 12, retainer ring 13, radiating fin 14, end plate 15;Reflection shield 2, power pack 3, screw 4;Heat pipe Mounting groove 111, condensation end 112, metal tube 113, screwed hole 114, capillary wick 115, fixed column 116;Limited impression 131, screw thread Hole 132;Fin module 141, brachypterism piece 1411, fin long 1412, arc portion 142, heat pipe installation cavity 143, fin radiating is logical Hole 144;End plate thermal vias 151, fixed part 152, screwed hole 153.
Specific embodiment
The utility model embodiment discloses a kind of heat abstractor, to improve the radiating efficiency of radiator, meet it is high-power, High heat flux electronic equipment and device radiating requirements.
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment for being obtained, belongs to the scope of the utility model protection.
Refer to Fig. 1-Fig. 7, Fig. 1 is quick-fried for a kind of specific embodiment of high-power LED lamp that the utility model is provided Fried structural representation;Fig. 2 is the enlarged diagram of temperature-uniforming plate evaporation cavity in Fig. 1;Fig. 3 is temperature-uniforming plate evaporation cavity inside hair in Fig. 1 Thin core schematic diagram;Fig. 4 is the enlarged diagram of retainer ring in Fig. 1;Fig. 5 is the enlarged diagram of radiating fin in Fig. 1;Fig. 6 is The enlarged diagram of radiating fin and heat pipe bottom in Fig. 5;Fig. 7 is the high-power LED lamp assembly structure diagram of Fig. 1.
In a kind of specific embodiment, the heat abstractor that the utility model is provided includes temperature-uniforming plate 11, heat pipe 12 and dissipates Hot fin 14.
Wherein, the evaporation ends of temperature-uniforming plate 11 are used to be connected with electronic equipment with device, and such as LED chip is attached to temperature-uniforming plate 11 and steams On originator outer surface, in order to reduce thermal contact resistance, one layer of uniform heat-conducting silicone grease can be applied in evaporation ends outer surface.Evaporation ends with it is cold Evaporation cavity between solidifying end 112 is generally closed cavity, is filled with working medium in it, condensation end 112, evaporation ends and temperature-uniforming plate 11 Be should be between the wall of side and be tightly connected.Specific condensation end 112, can be using scolding tin or argon arc welding between evaporation ends and evaporation cavity Mode is sealed.Condensation end 112 and evaporation ends are generally plate.The inner surface setting of evaporation ends has capillary wick 115, specifically Capillary wick 115 can be sintered on the inner surface of evaporation ends.
Heat pipe 12 is L-shaped, and to take hot junction, another side is radiating end, takes the condensation end in hot junction and temperature-uniforming plate 11 on one side of L-shaped 112 contacts, to carry out heat exchange, radiating end is intercalated in radiating fin 14.Heat pipe 12 is the pipe fitting of closed at both ends.Heat pipe 12 It is specifically as follows with temperature-uniforming plate 11 and is fixedly connected, for example, can conventional to be fixedly connected mode direct by welding etc. by the two Connection, it is also possible to be indirectly connected with the two by fixed component.Preferably, heat pipe 12 can be many chis with super hydrophilic characteristic Degree capillary wick heat pipe, therefore with more excellent heat conductivility.Heat pipe 12 its making material is red copper, and its liquid working substance can be with It is deionized water and the mixture of ethanol.
Radiating end is intercalated in radiating fin 14, refers to that it is at least partially disposed in radiating fin 14, as needed radiating fin Piece 14 can also be coated on outside the integral heat sink end beyond condensation end 112.It should be noted that intercalation herein both includes passing through Heat pipe installation cavity 143 is set on radiating fin 14, heat pipe 12 is inserted, it is also possible to by preset in the inside of radiating fin 14 Heat pipe 12, that is, by integrally formed integral structure.Preferably, take and can be vertically arranged between hot junction and radiating end, The angle that can also be set as needed therebetween is 80~90 ° etc..
Using the heat abstractor that the utility model is provided, the heat that electronic equipment is produced when being worked with device is first by equal The evaporation ends of warm plate 11 enter capillary wick 115, and the working medium inside capillary wick 115 absorbs heat, and constantly evaporation forms steam, and enters Condensation end 112 to temperature-uniforming plate 11 is condensed into liquid, and liquid is directly absorbed by capillary wick 115 and is re-introduced into evaporation ends heat absorption steaming Hair.Meanwhile, the hot junction that takes of heat pipe 12 constantly absorbs heat from condensation end 112, and takes away rapidly, heat pipe 12 radiating end by heat Amount passes to radiating fin 14.Steam inside heat pipe 12 is condensed into liquid, under the driving of self gravitation and capillary force again The hot junction that takes for entering into heat pipe 12 absorbs heat and so constantly circulates work again, and radiating fin 14 finally distributes heat to week Collarette border, realizes passive heat radiation.Radiating is coupled with heat pipe 12 by temperature-uniforming plate 11, the heat radiation energy of whole device is substantially increased Power.Inside being provided with the temperature-uniforming plate 11 of capillary wick 115 can ensure the electronic equipments such as LED chip and device inside uniformity of temperature profile, Avoid producing destruction to chip due to the thermal stress that chip internal excessive temperature differentials is produced.By the setting of heat pipe 12, not only expand The area of dissipation of whole device, can also improve the surface temperature of whole radiating fin 14, so as to further improve radiating effect Rate.Above-mentioned heat abstractor can be applied not only to great power LED cooling, can also be widely used in PC (CPU, GPU) and its The radiating of his electronic equipment and device.To sum up, the utility model is provided construction for heat radiating device is simple, small volume, lightweight, nothing Additional energy source need to be consumed, the cooling requirements of high-power, high heat flux electronic equipment and device can be met.
For the ease of the fixation of heat pipe 12, retainer ring 13 can be further set, screwed hole is offered in retainer ring 13, take Hot junction is arranged between retainer ring 13 and condensation end 112, and retainer ring 13 and the mode connects for screw of condensation end 112, that is, condensation end 112 outer surfaces offer screwed hole, and the depth of screwed hole is generally less than condensation end thickness.Retainer ring 13 is specifically as follows stainless steel Ring.Prefabricated multiple screwed holes 132 on the circumferencial direction of retainer ring 13, are specifically such as uniformly arranged eight screwed holes 132, by spiral shell With heat pipe 12 be fixedly connected temperature-uniforming plate 11 by silk 4.Preferably, the limited impression for raising up is opened up in the lower end of retainer ring 13 131, take hot junction and be correspondingly arranged in limited impression 131, and then limited impression 131 is blocked and takes hot junction.As needed, limited impression 131 radius is equal to or less than the radius of heat pipe 12.
Further, the outer surface of condensation end 112 offers heat pipe mounting groove 111, takes hot junction laminating and is installed on heat pipe peace In tankage 111.In heat pipe mounting groove 111 show that thermal conductive silicon lipid layer can be set, to reduce thermal contact resistance.It should be noted that Hot junction is taken to be installed in heat pipe mounting groove 111, and inwall that can be at least partly with heat pipe mounting groove 111 is fitted, and is also required The width of heat pipe mounting groove 111 is not less than the width for taking hot junction, and the length of heat pipe mounting groove 111 is not less than the length for taking hot junction Degree.Preferably, the width of heat pipe mounting groove 111 is equal with the width for taking hot junction, the length of heat pipe mounting groove 111 with take hot junction Equal length, so as to be effectively utilized space, structure is simpler compact, and the opposite heat tube 12 of heat pipe mounting groove 111 is played necessarily Spacing fixation.The depth of heat pipe mounting groove 111 is preferably not more than the thickness for taking hot junction.In order to increase the contact of the two Area, it is identical with the profile for taking hot junction that the inwall of heat pipe mounting groove 111 is preferable to provide.
Specifically, taking hot junction can be more than its diameter in flat, that is, its width.Especially by mach mode Flatten, and then hot junction will be taken and be placed in when in heat pipe mounting groove 111, increase the contact area for taking hot junction and heat pipe mounting groove 111, So as to improve heat conduction efficiency.Certainly, hot junction can will be also taken as needed is set to that section is rounded or other shapes.Due to equal The condensation end 112 of warm plate 11 also has excellent temperature consistency, therefore will take hot junction pressing and be coupled with temperature-uniforming plate 11, not only Increase the area for taking hot junction, it can also be ensured that each efficient operation of heat pipe 12.
In the respective embodiments described above, end plate 15 can also be included, is offered on end plate 15 for connecting with radiating fin 14 The screwed hole 153 for connecing, the top correspondence of radiating fin 14 offers screwed hole.The making material of end plate 15 should meet hardness it is strong, Stretch-proof, corrosion resistant feature, are specifically as follows ceramic material plate or stainless steel plate.According to the number of radiating fin 14, phase That answers opens up the screwed hole 153 of respective amount.
Further, end plate thermal vias 151 are offered on end plate 15, so as to improve the radiating efficiency of radiator.End plate Thermal vias 151 are specifically as follows fan-shaped pylone, and end plate thermal vias 151 typically set multiple, and uniformly divide on end plate 15 Cloth.For the ease of the installation of heat abstractor, can be with the prefabricated fixed part 112 being connected with power pack 3, fixed part on end plate 15 112 upper ends are provided with screwed hole, are attached by bolt.
Radiating fin 14, are specifically as follows multiple fin monomers and are distributed composition according to predetermined angle in the above-described embodiment Fin module 141.Preferably, multiple independent fin monomers, such as each two fin monomer forms a heat radiation module, each Arc portion 142 between independent fin monomer by preset thickness is connected.Each independent fin monomer can specifically be included Three brachypterism pieces 1411 and three fins long 1412, three brachypterism pieces 1411 are relative respectively with three ends of fin long 1412 to be set Put and be connected with central tube, central tube has the heat pipe installation cavity 143 for intercalation heat pipe 12.Whole heat radiation module can pass through The mode of extrusion forming is obtained.The big I specific with fin long 1412 of brachypterism piece 1411 is configured according to actual conditions, and Width of the width of brachypterism piece 1411 less than fin long 1412.
The height of radiating fin 14 can be equal to or more than the length of the radiating end of heat pipe 12.The making material of radiating fin 14 Material is specifically as follows lightweight, good heat conductivity, erosion-resisting modeling alclad.In order to improve the Radiant exothermicity of radiating fin 14, The radiance of fin surface can be increased by the way of anodic oxidation or surface spraying coating, it is preferred that use surface spraying The mode of coating improves the radiance of fin surface.Surface such as radiating fin 14 is coated with water-thinned nanometer paint layer.
In order to strengthen air flow, fin thermal vias 144 can be opened up in fin surface, it is right with air to improve fin Stream heat exchange amount.Shape and quantity of specific fin thermal vias 144 etc. can be configured according to actual conditions, not make specific herein Limit.
On the basis of the various embodiments described above, capillary wick 115 is specifically as follows multiple dimensioned capillary wick 115.Specifically, many chis Prepared by degree capillary wick 115 evaporates inner cavity surface in temperature-uniforming plate 11, and the array of multiple dimensioned capillary wick 115 is mainly added by the way of sintering Prepared by work, its design parameter can be controlled by designing sintering mold.In order to prepare multiple dimensioned capillary wick 115, sintered By adding pore creating material sodium carbonate in metal dust in journey, sodium carbonate can be decomposed completely in pyroprocess, therefore can be left The hole of different scale, forms multiple dimensioned capillary wick 115, is overflowed and liquid suction with meeting steam simultaneously.Preferably, in order to carry The imbibition ability of capillary wick high 115, can carry out thermal oxidation to capillary wick 115, so as to prepare with super hydrophilic characteristic Capillary wick 115.Above-mentioned metal dust is specifically as follows copper powder.
Further, the top of at least part of capillary wick 115 offsets with condensation end inner surface 112.Namely multiple dimensioned hair Thin core 115 can be contacted directly with condensation end inner surface 112, therefore it is cold to play the quick inner surface of absorption condensation end 112 Solidifying liquid, on the other hand also acts as the effect of support.
Specifically, the shape of capillary wick 115 can be taper, circular or square.Certainly, the shape of capillary wick 115 It is not limited thereto, it is also possible to be set to other suitable shapes.
Further, the capillary wick 115 of the inner surface of evaporation cavity 1 can also be foam metal capillary, such as foam copper, foam copper Thickness can be evaporation cavity depth, it is also possible to less than the depth of evaporation cavity;Can also be and be distributed along evaporation inner cavity surface Machining micro-channel capillary wick 115.
In the various embodiments described above, temperature-uniforming plate 11 can be provided with for vacuumizing the metal tube 113 with fluid injection, metal tube 113 connect with the evaporation cavity.Metal tube 113 is specifically as follows copper tube.Being provided for of metal tube 113 is taken out very to evaporation cavity Sky carries out fluid injection, therefore metal tube 113 should be with the wall of temperature-uniforming plate 11 and be tightly connected, to ensure the sealing of evaporation cavity Property.The specific side that it can be welded in temperature-uniforming plate 11.
Further, evaporation ends have multiple inwardly projecting fixed columns 116 for connecting miscellaneous part, fixed column Screwed hole is offered on 116, the depth of certain screwed hole should be less than the height of fixed column 116.Namely fixed column 116 is located at and steams In hair chamber, and then temperature-uniforming plate 11 can be connected with miscellaneous part by screw.
Further, condensation end 112 can also have multiple inwardly projecting fixed columns 116, be opened up in fixed column 116 There is screwed hole.Namely condensation end 112 has multiple fixed columns 116 protruded to evaporation cavity, by the setting of fixed column 116, It is easy to the connection of condensation end 112 and miscellaneous part.
Specifically, fixed column 116 can be highly equal with evaporation cavity to the projecting inward height of evaporation cavity, that is, fix Post 116 is connected between evaporation ends and condensation end 112, thus intensity is higher, is easy to play certain support work while connection With.Specifically can in the evaporation cavity of temperature-uniforming plate 11 prefabricated multiple fixed columns 116, wherein eight fixed columns 116 can be used for Reflection shield 2 is installed, reflection shield 2 is fixedly connected with temperature-uniforming plate 11 with eight screws 4 such as.Another eight fixed columns 116 can be used for Retainer ring 13 is connected with temperature-uniforming plate 11, retainer ring 13 is fixedly connected with temperature-uniforming plate 11 with eight screws 4 such as.
The manufacturing process of temperature-uniforming plate 11, can specifically include:(1) sintering mold is designed:Added with machine on one piece of graphite cake The mode of work carves the cylindrical hole that some are distributed at a certain distance, and is rinsed well with water, then is dried up with nitrogen;(2) copper is filled Powder:Copper powder of the last layer mixed with sodium carbonate is filled out in graphite mold surface, and is paved;(3) design processing red copper shell:By machine The form of processing or die sinking manufactures the evaporation cavity and condensation end 112 of temperature-uniforming plate 11, and its surface is deoiled, at polishing Reason, the red copper shell that will have been manufactured is tipped upside down on and is covered with the graphite jig of copper powder, and side pressure puts the thing with constant weight thereon Body, it is ensured that it is more firm that capillary wick 115 is sintered;(4) sinter:By process (3) ready graphite jig together with red copper shell High temperature sintering furnace is put into, and designs sintering procedure, then vacuumized again, then startup program, sintered after a period of time Finish, stove to be sintered is cooled to room temperature, take out red copper shell, you can the temperature-uniforming plate 11 for obtaining sintering multiple dimensioned capillary wick 115 evaporates Chamber;(5) encapsulation, leak detection, fluid injection:To sinter have the red copper shell of multiple dimensioned capillary wick 115 and prefabricated reeded condensation end 112 and Vacuumize and be connected and sealed by way of diffusion welding (DW) with the metal tube 113 of fluid injection, it is suppressed with stamper then, And in putting it into suds, if bubble-free is produced, prove that air-tightness is good.Then it is vacuumized with vavuum pump, one Fluid injection is carried out to it after the section time, fluid injection is finished and metal tube 113 is sealed, and the manufacturing process of whole temperature-uniforming plate 11 is finished.
Temperature-uniforming plate 11 its making material should meet big thermal conductivity factor, stretch-proof, corrosion resistant feature, can be copper, stainless Steel and its alloy, other materials for being suitable for making temperature-uniforming plate 11 are also included.The shape of temperature-uniforming plate 11 can be circular, side Shape, ellipse etc., other suitable shapes are also included.The size of specific temperature-uniforming plate 11 can be carried out according to specific needs Design, is not specifically limited herein.The liquid working substance of temperature-uniforming plate 11 can be deionized water and ethanol mixture or go from The mixture of sub- water and acetone, other working fluids for being suitable for temperature-uniforming plate 11 are also included within interior.
It should be noted that in the various embodiments described above, the quantity of heat pipe 12 and radiating fin 14 can be carried out as needed It is correspondingly arranged.For example, set eight heat pipes 12, intercalation in eight radiating fins 14, due to heat pipe 12 have stronger heat conduction Ability and the generation of internal phase transformation, therefore the temperature consistency of the surface temperature of whole radiating fin 14 can be ensured, so that greatly The big efficiency for improving radiating fin 14.It is corresponding to be provided with eight downward heat pipes installations on the surface of condensation end 112 of temperature-uniforming plate 11 Groove 111, heat pipe mounting groove 111 can make condensation end 112 when straight forming, it is also possible to the later stage by be machined Mode is obtained.Eight length of heat pipe mounting groove 111, width, depth are equal, between two neighboring heat pipe mounting groove 111 Angle is 45 °.Inside radiating fin 14, the surface temperature of whole radiating fin 14 can be improved by by radiating end intercalation, So as to improve radiating efficiency;By the distance between reasonable Arrangement radiating fin 14, heat-dissipating space can be effectively utilized, made whole Construction for heat radiating device is compacter, takes up room less.
Based on the heat abstractor provided in above-described embodiment, the utility model additionally provides a kind of high-power LED lamp, should High-power LED lamp includes LED chip, glass lens, reflection shield 2, power supply and power pack 3;Also include any of the above-described kind of radiating Device, the evaporation ends of heat abstractor are fixedly connected with the LED chip.Because the high-power LED lamp employs above-mentioned implementation Heat abstractor in example, so the beneficial effect of the high-power LED lamp refer to above-described embodiment.Specific high-powered LED lamp The other structures of tool refer to prior art, and here is omitted.
Because with heat pipe 12 be applied in combination temperature-uniforming plate 11 by the utility model, LED chip inside temperature is on the one hand ensure that Degree is uniformly distributed, and on the other hand can improve the surface temperature of whole radiating fin 14, so as to greatly improve whole heat abstractor Heat-sinking capability, then the utility model also can just make heat abstractor radiation processes realize efficiently, low cost and low energy consumption Operation operation, for solve restriction great power LED radiating provide a kind of preferable solution route.
Each embodiment is described by the way of progressive in this specification, and what each embodiment was stressed is and other The difference of embodiment, between each embodiment identical similar portion mutually referring to.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or new using this practicality Type.Various modifications to these embodiments will be apparent for those skilled in the art, determine herein The General Principle of justice can in other embodiments be realized in the case where spirit or scope of the present utility model are not departed from.Cause This, the utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein The most wide scope consistent with features of novelty.

Claims (10)

1. a kind of heat abstractor, it is characterised in that including temperature-uniforming plate, heat pipe and radiating fin;The evaporation ends of the temperature-uniforming plate are used It is connected in electronic equipment or device, the inner surface setting of the evaporation ends has capillary wick;The heat pipe is L-shaped, the L-shaped While to take hot junction, another side is radiating end, the condensation end in contact for taking hot junction and the temperature-uniforming plate, the radiating end intercalation In in the radiating fin.
2. heat abstractor according to claim 1, it is characterised in that also including retainer ring, offered in the retainer ring Screwed hole, the hot junction that takes is arranged between the retainer ring and the condensation end, and the retainer ring and the condensation end spiral shell Nail connection.
3. heat abstractor according to claim 1, it is characterised in that also including end plate, offered on the end plate for The screwed hole being connected with the radiating fin, the top correspondence of the radiating fin offers screwed hole, is also opened on the end plate It is provided with end plate thermal vias.
4. heat abstractor according to claim 1, it is characterised in that the outer surface of the condensation end offers heat pipe installation Groove, the hot junction that takes is described to take hot junction laminating and be installed in the heat pipe mounting groove in flat, is set in the heat pipe mounting groove It is equipped with the thermal conductive silicon lipid layer for reducing thermal contact resistance.
5. heat abstractor according to claim 4, it is characterised in that the width of the heat pipe mounting groove takes hot junction with described Width it is equal, the length of the heat pipe mounting groove and the equal length for taking hot junction.
6. heat abstractor according to claim 1, it is characterised in that the radiating fin be include multiple fin monomers by According to the fin module of predetermined angle distribution, the end of the radiating fin is curved, fin is offered on the radiating fin and is dissipated Heat through-hole, and the surface of the radiating fin is coated with water-thinned nanometer paint layer.
7. heat abstractor according to claim 1, it is characterised in that the capillary wick is multiple dimensioned capillary wick, and at least The top of the part capillary wick and the condensation end contacted inner surfaces.
8. heat abstractor according to claim 1, it is characterised in that the evaporation ends have multiple inwardly projecting for institute The fixed column of heat abstractor installation is stated, screwed hole is offered in the fixed column.
9. the heat abstractor according to claim any one of 1-8, it is characterised in that the temperature-uniforming plate is provided with true for taking out The metal tube of empty and fluid injection, the metal tube is connected with the evaporation cavity.
10. a kind of high-power LED lamp, including LED chip, glass lens, reflection shield, power supply and power pack;Characterized in that, Also include the heat abstractor as described in claim any one of 1-9, the evaporation ends of the heat abstractor are fixed with the LED chip Connection.
CN201621354118.5U 2016-12-09 2016-12-09 A kind of heat abstractor and the high-power LED lamp with the heat abstractor Active CN206268818U (en)

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CN108105601A (en) * 2018-02-05 2018-06-01 广东工业大学 A kind of radiator and the lamps and lanterns with the radiator
CN108506907A (en) * 2018-05-31 2018-09-07 广州市浩洋电子股份有限公司 A kind of high-efficiency heat pipe heat-exchange system
CN108626705A (en) * 2018-07-17 2018-10-09 安徽建筑大学 A kind of pulsating heat pipe lighting electronic cooler based on interfacial effect
CN109253416A (en) * 2018-10-12 2019-01-22 深圳益明光电技术有限公司 A kind of efficient easy cleaning LED bay light
CN109386761A (en) * 2017-08-09 2019-02-26 深圳市海洋王照明工程有限公司 LED platform lamp
CN111741646A (en) * 2020-05-26 2020-10-02 吴德坚 Novel integrated phase-change superconducting heat transfer super-efficient heat dissipation structure and product shell
CN114001336A (en) * 2021-11-24 2022-02-01 北京微焓科技有限公司 High-power heat source heat dissipation device and structure thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109386761A (en) * 2017-08-09 2019-02-26 深圳市海洋王照明工程有限公司 LED platform lamp
CN109386761B (en) * 2017-08-09 2021-04-16 深圳市海洋王照明工程有限公司 LED platform lamp
CN108105601A (en) * 2018-02-05 2018-06-01 广东工业大学 A kind of radiator and the lamps and lanterns with the radiator
CN108506907A (en) * 2018-05-31 2018-09-07 广州市浩洋电子股份有限公司 A kind of high-efficiency heat pipe heat-exchange system
CN108626705A (en) * 2018-07-17 2018-10-09 安徽建筑大学 A kind of pulsating heat pipe lighting electronic cooler based on interfacial effect
CN109253416A (en) * 2018-10-12 2019-01-22 深圳益明光电技术有限公司 A kind of efficient easy cleaning LED bay light
CN111741646A (en) * 2020-05-26 2020-10-02 吴德坚 Novel integrated phase-change superconducting heat transfer super-efficient heat dissipation structure and product shell
CN114001336A (en) * 2021-11-24 2022-02-01 北京微焓科技有限公司 High-power heat source heat dissipation device and structure thereof

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