TWM526668U - Vapor chamber liquid cooling device - Google Patents

Description

Steam chamber liquid cooling device

This creation is related to the heat sink, especially a steam chamber liquid cooling device that combines a Vapor Chamber and a liquid-cooled structure.

A combination of a conventional steam chamber (also referred to as a temperature equalizing plate) and a water-cooled structure, such as the Chinese Patent No. M500919, which discloses a technique in which a temperature equalizing plate and a casing are combined, and the casing is covered by the casing. The temperature equalizing plate forms a water-cooling chamber, and the main purpose is to extend a plurality of heat conducting columns on the surface of the temperature equalizing plate, so that the heat conducting column extends into the water cooling chamber, thereby increasing the contact between the temperature equalizing plate and the water in the water cooling chamber. Area for better heat dissipation.

However, the patented water-cooling chamber has only one water inlet and one water outlet, and has no diversion design. When used, the water in the water-cooling chamber cannot effectively contact the surface of the temperature-regulating plate. The outlet is discharged before the complete contact has been made, so the effect of this design remains to be improved.

In addition, in the temperature equalizing plate structure disclosed in the foregoing patent, the capillary structure inside the heat conducting column is higher than the capillary structure in the temperature equalizing plate, and therefore, after the water cooling chamber is in use, the inside of the heat conducting column is made after use. The steam condenses into a liquid, and flows through the capillary structure in the heat conducting column through the capillary structure of the bottom plate of the upper temperature plate, and then returns to the capillary structure of the lower plate of the temperature equalizing plate via the capillary structure on the side. The return path is too long, which reduces the uniform temperature effect in the temperature equalization plate, and the overall performance is thus reduced.

The main purpose of the present invention is to provide a steam chamber liquid cooling device which allows the liquid to be diverted and the most complete contact with the steam chamber for optimum heat dissipation.

A further object of the present invention is to provide a vapor chamber liquid cooling device which can contact a part of the capillary structure inside the steam chamber, thereby shortening the return flow path of the actuating liquid, thereby improving the temperature equalization effect.

The invention relates to a steam chamber liquid cooling device provided by the present invention, comprising: a Vapor Chamber formed by sealing a first plate and a second plate with an edge sealed to each other, the first plate Forming a first chamber with the second plate, a first capillary material is disposed on the plate surface of the first plate and located in the first chamber, and a second capillary material is disposed on the second plate a plate surface and located in the first chamber, a working fluid is filled in the first chamber, a degassing tube is attached to the first plate; and a third plate is sealed to the second portion by an edge thereof The edge of the plate is disposed on the second plate, the third plate is provided with an inlet and an outlet, and the inlet and the outlet pass through the third plate; wherein the second plate is recessed toward the first plate Forming a groove having a predetermined length, the groove being located between the second plate and the third plate, and the groove has two ends, one end corresponding to the inlet and the other end corresponding to the outlet, For the liquid to enter from the inlet, flow through the groove, and then flow out through the outlet; the second plate is provided with the groove Side of the position of the trenches is formed to be a convex wall, i.e. the protruding wall of the first chamber is located.

Thereby, the liquid can be injected from the inlet, and the liquid is guided by the groove, and then flows out from the outlet, thereby bringing the liquid into complete contact with the steam chamber to achieve an optimal heat dissipation effect.

In order to explain in detail the technical features of the present invention, the following preferred embodiments are described below with reference to the following:

As shown in FIG. 1 to FIG. 6 , a steam chamber liquid cooling device 10 according to the first preferred embodiment of the present invention is mainly composed of a steam chamber 11 and a third plate 21, wherein:

The Vapor Chamber 11 is formed by sealing a first plate 12 and a second plate 15 with an edge therebetween. A first chamber 19 is formed between the first plate 12 and the second plate 15. A first capillary 13 is disposed on the surface of the first plate 12 and located in the first chamber 19, and a second capillary 16 is disposed on the surface of the second plate 15 and located at the first In the chamber 19, a working fluid (not shown) is filled in the first chamber 19, and a degassing tube 18 is attached to the first plate 12. Wherein, the working fluid is liquid and adsorbed in the first capillary 13 and the second capillary 16, which is difficult to express in the drawing, and the working fluid is also a well-known component, so it is not suitable for the drawing. Expressed in the formula. The first capillary 13 and the second capillary 16 may be copper powder sintered or woven mesh.

The third plate 21 is sealed on the edge of the second plate 15 and is attached to the second plate 15. The third plate 21 is provided with an inlet 22 and an outlet 24, the inlet 22 and the outlet. 24 passes through the third plate 21.

The second plate 15 is recessed in the direction of the first plate 12 to form a groove 17 having a predetermined length, and the groove 17 is located between the second plate 15 and the third plate 21, and the groove The trough 17 has two ends, one end corresponding to the inlet 22 and the other end corresponding to the outlet 24 for allowing a liquid 291 to enter from the inlet 22, flow through the groove 17, and then exit the outlet 24. The second plate 15 is disposed on the other side of the groove 17 to form a tenon 171 corresponding to the position of the groove 17, and the tenon 171 is located in the first chamber 19.

In the first embodiment, the third plate 21 is in contact with the second plate 15 , and the second capillary 16 located at the top of the tenon 171 is in contact with the first capillary 13 . The working fluid is allowed to flow back between the first capillary 13 and the second capillary 16. Furthermore, the second capillary material 16 is attached to the surface of the second plate 15 and is disposed along with the undulation of the tenon 171. In addition, the groove 17 is designed to be in a straight line and has a flow guiding effect to generate more contact with the vapor chamber 11. However, the preferred method is to provide a bent shape. In the embodiment, the plurality of U-shaped, positive-and-reversely connected extensions are formed. The arrangement can guide the liquid 291 to generate the most complete contact with the vapor chamber 11, thereby producing an optimal heat dissipation effect. . Moreover, the first plate 12 extends from the periphery to the second plate 15 by a vertical wall 121, and is joined to the edge of the second plate 15 by the periphery of the vertical wall 121 as the edge of the first plate 12, the groove The groove 17 is spaced apart from the vertical wall 121 of the first plate 12 by a predetermined distance.

The architecture of the first embodiment has been described above, and the operational state of the first embodiment will be described next.

Please refer to FIG. 2 and FIG. 7 again. In operation, the surface of the first board 12 is attached to a heat sink 99 (for example, a central processing unit of a computer), and the inlet 22 and the outlet 24 are provided. A tube body 29 is connected to each other. Next, the inlet 22 is introduced into the liquid 291 by the tubes 29, and the liquid 291 is led out by the outlet 24. The liquid 291 may be water or oil or other liquid substance, and the liquid is heated at a high specific heat. For the best. In such an operation, the thermal energy generated by the heat sink 99 can be quickly diffused to the entire surface of the vapor chamber 11 by the rapid temperature equalization effect of the vapor chamber 11, that is, it can be diffused to the second plate 15. The entire surface (including the wall surface and the bottom of the groove 17), and further, after the liquid 291 enters through the inlet 22, the process of flowing along the groove 17 flows through most of the area of the second plate 15. The heat energy of the second plate 15 is completely absorbed, and after being discharged from the outlet 24, the heat energy is taken out. Thereby, the effect of maximizing the heat energy to be taken out can be achieved, and the heat dissipation effect is significantly superior to the prior art described above.

Further, the second capillary material 16 located at the top of the tenon 171 is in contact with the first capillary material 13, whereby the return flow path of the actuating liquid can be shortened, thereby improving the temperature equalization effect.

Referring to FIG. 8, a steam chamber liquid cooling device 30 according to a second preferred embodiment of the present invention is mainly similar to the first embodiment disclosed above, except that:

The third plate 41 extends from the periphery to the second plate 35 by a vertical wall 411, and is joined to the edge of the second plate 35 by the periphery of the vertical wall 411 as the edge of the third plate 41. The third plate The plate body of 41 is spaced apart from the second plate 35 by a predetermined distance, whereby the space between the third plate 41 and the second plate 35 can accommodate more of the liquid 491. Although such a liquid 491 can accommodate more of the liquid 491, since the two ends of the groove 37 correspond to the inlet 42 and the outlet 44, respectively, the effect of the flow can still be exerted. In addition, under such a structure, the surface of the second plate 35 is also in contact with the liquid 491, thereby increasing the overall contact area, so that the heat dissipation effect is better.

In addition, the second capillary material 36 located at the top of the tenon 371 is spaced apart from the first capillary material 33 by a predetermined distance; and the first capillary material 33 and the second capillary material 36 are connected with one or more capillary materials. The 34-phase connection, the connection of the capillary material 34 is preferably plural in number, but the single connection of the capillary material 34 is also sufficient to provide the effect of working fluid reflux. In this way, the first chamber 39 of the second embodiment is larger in space than the first chamber 19 of the first embodiment, thereby meeting the situation of a large space requirement, in the overall volume. The design can be more flexible.

The remaining structure of the second embodiment and the achievable functions are the same as those of the first embodiment, and are not described here.

Referring to FIG. 9, a steam chamber liquid cooling device 50 according to a third preferred embodiment of the present invention is mainly similar to the first embodiment disclosed above, except that:

The groove 57 is partially different in depth from the other portions, that is, the height of the portion of the tenon 571 is different from the other portions; the second capillary 56 located at the top of the tenon 571 is partially and partially A capillary material 53 is in contact with each other and is partially spaced apart from the first capillary material 53 by a predetermined distance.

Thereby, the structure of the groove 57 having different depths can still provide the flow guiding effect on the liquid 691. However, the structure of the height of the tenon 571 can provide not only the first capillary 53 but also the first The effect of the contact of the second capillary material 56, while at the same time providing the space between the first capillary material 53 and the second capillary material 56 to provide a space through which the steam passes. Although the first capillary material 53 of the third embodiment is not in contact with the second capillary material 56 as much as the first embodiment, it is still more than the prior art, and still has a shorter than the conventional one. The return flow path of the technology makes the liquid reflux speed faster.

The remaining structure of the third embodiment and the achievable functions are the same as those of the first embodiment, and are not described here.

10‧‧‧Steam chamber liquid cooling device
11‧‧‧Steam chamber
12‧‧‧ first board
121‧‧‧立立
13‧‧‧First capillary
15‧‧‧ second board
16‧‧‧Second capillary
17‧‧‧ trench
171‧‧‧ convex
18‧‧‧Degassing tube
19‧‧‧ first chamber
21‧‧‧ third board
22‧‧‧ Entrance
24‧‧‧Export
29‧‧‧Body
291‧‧‧Liquid
30‧‧‧Steam chamber liquid cooling device
33‧‧‧First capillary
34‧‧‧Connecting capillary
35‧‧‧ second board
36‧‧‧Second capillary
37‧‧‧ trench
371‧‧‧垣
39‧‧‧First chamber
41‧‧‧ third board
411‧‧‧ 立立
42‧‧‧ entrance
44‧‧‧Export
491‧‧‧Liquid
50‧‧‧Steam chamber liquid cooling device
53‧‧‧First capillary
56‧‧‧Second capillary
57‧‧‧ trench
571‧‧‧垣
691‧‧‧Liquid
99‧‧‧heat radiator

Figure 1 is a perspective view of a first preferred embodiment of the present invention. Figure 2 is an exploded view of the first preferred embodiment of the present invention. Figure 3 is another exploded view of the first preferred embodiment of the present invention showing the state of the bottom view. Figure 4 is a plan view of a first preferred embodiment of the present invention. Fig. 5 is a cross-sectional view taken along line 5-5 of Fig. 4. Fig. 6 is a cross-sectional view taken along line 6-6 of Fig. 4. Figure 7 is a schematic view showing the action of the first preferred embodiment of the present invention. Figure 8 is a schematic cross-sectional view showing a second preferred embodiment of the present invention. Figure 9 is a schematic cross-sectional view showing a third preferred embodiment of the present invention.

10‧‧‧Steam chamber liquid cooling device

11‧‧‧Steam chamber

12‧‧‧ first board

121‧‧‧立立

13‧‧‧First capillary

15‧‧‧ second board

16‧‧‧Second capillary

17‧‧‧ trench

18‧‧‧Degassing tube

21‧‧‧ third board

22‧‧‧ Entrance

24‧‧‧Export

29‧‧‧Body

Claims (10)

A steam chamber liquid cooling device comprises: a Vapor Chamber formed by sealing a first plate and a second plate with an edge therebetween, and forming a gap between the first plate and the second plate a first capillary, a first capillary material is disposed on the surface of the first plate and located in the first cavity, and a second capillary material is disposed on the surface of the second plate and located in the first cavity a working fluid is filled in the first chamber, a degassing tube is attached to the first plate, and a third plate is sealed to the edge of the second plate by an edge thereof and is attached to the first a second plate having an inlet and an outlet, the inlet and the outlet passing through the third plate; wherein the second plate is recessed toward the first plate to form a predetermined length a groove between the second plate and the third plate, and the groove has two ends, one end corresponding to the inlet and the other end corresponding to the outlet for supplying liquid from the inlet Entering, flowing through the groove, and then flowing out through the outlet; the second plate is disposed on the other side of the groove corresponding to The location of the groove forms a tenon that is located within the first chamber. A steam chamber liquid cooling device according to claim 1, wherein the third plate is in contact with the second plate. According to the steam chamber liquid cooling device of claim 1, wherein: the third plate extends from the periphery to the second plate, and is joined to the edge of the third plate by the periphery of the vertical wall. The edge of the second plate, the plate body of the third plate is spaced apart from the second plate by a predetermined distance. A steam chamber liquid cooling device according to claim 1, wherein the second capillary material located at the top of the tenon is in contact with the first capillary material. A steam chamber liquid cooling device according to claim 1, wherein the second capillary material is attached to the surface of the second plate and is disposed along with the undulation of the tenon. The steam chamber liquid cooling device according to claim 1, wherein: the second capillary material located at the top of the tenon is spaced apart from the first capillary material by a predetermined distance; and the first capillary material and the second capillary material The materials are joined by at least one connecting capillary. According to the steam chamber liquid cooling device of claim 1, wherein the groove has a partial depth different from the other portions, that is, the height of the portion of the tenon is different from the other portions; the top portion of the tenon is located at the top of the tenon The second capillary material is partially in contact with the first capillary material and partially spaced apart from the first capillary material by a predetermined distance. A steam chamber liquid cooling device according to claim 1, wherein the groove has a bent shape. The steam chamber liquid cooling device according to claim 8 , wherein the groove is in the shape of a plurality of U-shaped, positive-and-reversely connected extensions. The steam chamber liquid cooling device according to claim 1, wherein: the first plate extends from the periphery to the second plate, and the peripheral wall of the vertical wall is joined to the edge of the first plate. The edge of the second plate is spaced apart from the vertical wall of the first plate by a predetermined distance.