TWM526668U - Vapor chamber liquid cooling device - Google Patents
Vapor chamber liquid cooling device Download PDFInfo
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- TWM526668U TWM526668U TW105202913U TW105202913U TWM526668U TW M526668 U TWM526668 U TW M526668U TW 105202913 U TW105202913 U TW 105202913U TW 105202913 U TW105202913 U TW 105202913U TW M526668 U TWM526668 U TW M526668U
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Description
本創作係與散熱裝置有關,特別是指結合了蒸汽腔(Vapor Chamber)以及液冷結構的一種蒸汽腔液冷裝置。This creation is related to the heat sink, especially a steam chamber liquid cooling device that combines a Vapor Chamber and a liquid-cooled structure.
習知之蒸汽腔(又稱為均溫板)與水冷結構的組合,例如我國公告第M500919號專利,其揭露了一均溫板與一罩殼結合的技術,藉由該罩殼來罩設於該均溫板而形成水冷腔,該案主要是在均溫板的表面延伸複數的導熱柱,而使得導熱柱伸入至水冷腔,藉以增加該均溫板與該水冷腔內的水的接觸面積,達到更佳的散熱效果。A combination of a conventional steam chamber (also referred to as a temperature equalizing plate) and a water-cooled structure, such as the Chinese Patent No. M500919, which discloses a technique in which a temperature equalizing plate and a casing are combined, and the casing is covered by the casing. The temperature equalizing plate forms a water-cooling chamber, and the main purpose is to extend a plurality of heat conducting columns on the surface of the temperature equalizing plate, so that the heat conducting column extends into the water cooling chamber, thereby increasing the contact between the temperature equalizing plate and the water in the water cooling chamber. Area for better heat dissipation.
然而,該件專利之水冷腔僅有一入水口以及一出水口,並沒有導流的設計,在使用時會使得位於該水冷腔內的水無法有效的與該均溫板的表面完全的接觸,而在還沒來得及完整接觸之前就由該出水口流出,因此,此種設計之效果仍有待改進。However, the patented water-cooling chamber has only one water inlet and one water outlet, and has no diversion design. When used, the water in the water-cooling chamber cannot effectively contact the surface of the temperature-regulating plate. The outlet is discharged before the complete contact has been made, so the effect of this design remains to be improved.
此外,前述專利所揭露的均溫板結構中,其導熱柱內部的毛細結構高於該均溫板內的毛細結構,因此,在使用時水冷腔通入水之後,會使得該等導熱柱內部的蒸汽凝結成液體,並經由該等導熱柱內的毛細結構流經該均溫板的上板底部之毛細結構,再經由側邊的毛細結構迴流至該均溫板下板的毛細結構,這樣的迴流路徑過長,此會降低該均溫板內的均溫效果,整體表現即因而降低。In addition, in the temperature equalizing plate structure disclosed in the foregoing patent, the capillary structure inside the heat conducting column is higher than the capillary structure in the temperature equalizing plate, and therefore, after the water cooling chamber is in use, the inside of the heat conducting column is made after use. The steam condenses into a liquid, and flows through the capillary structure in the heat conducting column through the capillary structure of the bottom plate of the upper temperature plate, and then returns to the capillary structure of the lower plate of the temperature equalizing plate via the capillary structure on the side. The return path is too long, which reduces the uniform temperature effect in the temperature equalization plate, and the overall performance is thus reduced.
本創作之主要目的乃在於提供一種蒸汽腔液冷裝置,其可使得液體被導流,而與蒸汽腔進行最完整的接觸,達到最佳的散熱效果。The main purpose of the present invention is to provide a steam chamber liquid cooling device which allows the liquid to be diverted and the most complete contact with the steam chamber for optimum heat dissipation.
本創作之再一目的則在於提供一種蒸汽腔液冷裝置,其可使得蒸汽腔內部的部分毛細結構相接觸,進而縮短作動液的迴流路徑,藉以提高均溫效果。A further object of the present invention is to provide a vapor chamber liquid cooling device which can contact a part of the capillary structure inside the steam chamber, thereby shortening the return flow path of the actuating liquid, thereby improving the temperature equalization effect.
緣是,依據本創作所提供之一種蒸汽腔液冷裝置,包含有:一蒸汽腔(Vapor Chamber),係由一第一板與一第二板以邊緣相互密封結合而形成,該第一板與該第二板之間形成一第一腔室,一第一毛細材係設於該第一板之板面且位於該第一腔室中,一第二毛細材係設於該第二板之板面且位於該第一腔室中,一工作液係填入該第一腔室內,一除氣管係設於該第一板;以及一第三板,以其邊緣密封結合於該第二板之邊緣而蓋設於該第二板,該第三板係設有一入口以及一出口,該入口及該出口均穿過該第三板;其中該第二板向該第一板的方向凹陷而形成具有預定長度的一溝槽,該溝槽係位於該第二板與該第三板之間,且該溝槽具有兩端,一端對應於該入口,而另一端對應於該出口,用以供液體由該入口進入,流經該溝槽,再由該出口流出;該第二板設置該溝槽之另一面則對應該溝槽之位置形成了一凸垣,該凸垣即位於該第一腔室內。The invention relates to a steam chamber liquid cooling device provided by the present invention, comprising: a Vapor Chamber formed by sealing a first plate and a second plate with an edge sealed to each other, the first plate Forming a first chamber with the second plate, a first capillary material is disposed on the plate surface of the first plate and located in the first chamber, and a second capillary material is disposed on the second plate a plate surface and located in the first chamber, a working fluid is filled in the first chamber, a degassing tube is attached to the first plate; and a third plate is sealed to the second portion by an edge thereof The edge of the plate is disposed on the second plate, the third plate is provided with an inlet and an outlet, and the inlet and the outlet pass through the third plate; wherein the second plate is recessed toward the first plate Forming a groove having a predetermined length, the groove being located between the second plate and the third plate, and the groove has two ends, one end corresponding to the inlet and the other end corresponding to the outlet, For the liquid to enter from the inlet, flow through the groove, and then flow out through the outlet; the second plate is provided with the groove Side of the position of the trenches is formed to be a convex wall, i.e. the protruding wall of the first chamber is located.
藉此,可由該入口注入液體,並使得該液體被該溝槽所導流,再由該出口流出,進而使液體與該蒸汽腔進行完整的接觸,達到最佳的散熱效果。Thereby, the liquid can be injected from the inlet, and the liquid is guided by the groove, and then flows out from the outlet, thereby bringing the liquid into complete contact with the steam chamber to achieve an optimal heat dissipation effect.
為了詳細說明本創作之技術特點所在,茲舉以下之較佳實施例並配合圖式說明如後,其中:In order to explain in detail the technical features of the present invention, the following preferred embodiments are described below with reference to the following:
如第1圖至第6圖所示,本創作第一較佳實施例所提供之一種蒸汽腔液冷裝置10,主要由一蒸汽腔11、以及一第三板21所組成,其中:As shown in FIG. 1 to FIG. 6 , a steam chamber liquid cooling device 10 according to the first preferred embodiment of the present invention is mainly composed of a steam chamber 11 and a third plate 21, wherein:
該蒸汽腔(Vapor Chamber)11,係由一第一板12與一第二板15以邊緣相互密封結合而形成,該第一板12與該第二板15之間形成一第一腔室19,一第一毛細材13係設於該第一板12之板面且位於該第一腔室19中,一第二毛細材16係設於該第二板15之板面且位於該第一腔室19中,一工作液(圖中未示)係填入該第一腔室19內,一除氣管18係設於該第一板12。其中,該工作液由於呈液體狀且被吸附於該第一毛細材13與該第二毛細材16中,圖式上難以表示出來,且工作液亦屬極為習知之元件,因此容不於圖式中表示之。該第一毛細材13及該第二毛細材16在實施上可為銅粉燒結或織網。The Vapor Chamber 11 is formed by sealing a first plate 12 and a second plate 15 with an edge therebetween. A first chamber 19 is formed between the first plate 12 and the second plate 15. A first capillary 13 is disposed on the surface of the first plate 12 and located in the first chamber 19, and a second capillary 16 is disposed on the surface of the second plate 15 and located at the first In the chamber 19, a working fluid (not shown) is filled in the first chamber 19, and a degassing tube 18 is attached to the first plate 12. Wherein, the working fluid is liquid and adsorbed in the first capillary 13 and the second capillary 16, which is difficult to express in the drawing, and the working fluid is also a well-known component, so it is not suitable for the drawing. Expressed in the formula. The first capillary 13 and the second capillary 16 may be copper powder sintered or woven mesh.
該第三板21,以其邊緣密封結合於該第二板15之邊緣而蓋設於該第二板15,該第三板21係設有一入口22以及一出口24,該入口22及該出口24均穿過該第三板21。The third plate 21 is sealed on the edge of the second plate 15 and is attached to the second plate 15. The third plate 21 is provided with an inlet 22 and an outlet 24, the inlet 22 and the outlet. 24 passes through the third plate 21.
其中,該第二板15向該第一板12的方向凹陷而形成具有預定長度的一溝槽17,該溝槽17係位於該第二板15與該第三板21之間,且該溝槽17具有兩端,一端對應於該入口22,而另一端對應於該出口24,用以供一液體291由該入口22進入,流經該溝槽17,再由該出口24流出。該第二板15設置該溝槽17之另一面則對應該溝槽17的位置形成了一凸垣171,該凸垣171即位於該第一腔室19內。The second plate 15 is recessed in the direction of the first plate 12 to form a groove 17 having a predetermined length, and the groove 17 is located between the second plate 15 and the third plate 21, and the groove The trough 17 has two ends, one end corresponding to the inlet 22 and the other end corresponding to the outlet 24 for allowing a liquid 291 to enter from the inlet 22, flow through the groove 17, and then exit the outlet 24. The second plate 15 is disposed on the other side of the groove 17 to form a tenon 171 corresponding to the position of the groove 17, and the tenon 171 is located in the first chamber 19.
於本第一實施例中,該第三板21係與該第二板15接觸,且位於該凸垣171頂部的該第二毛細材16係與該第一毛細材13相接觸,藉此可使得該工作液得以在該第一毛細材13及該第二毛細材16之間迴流。再者,該第二毛細材16係伏貼於該第二板15之表面,而隨著該凸垣171之起伏而設置。此外,該溝槽17在設計上,雖可呈一直線而仍有導流而與該蒸汽腔11產生較多接觸的效果,然而,較佳的方式則是設置成為彎折形狀,於本第一實施例中則以呈多個U形一正一反相連延伸而成,這樣的設置方式可以將該液體291導流而與該蒸汽腔11產生最多最完整的接觸,而產生最佳的散熱效果。又,該第一板12係由周圍向該第二板15延伸一立壁121,並以該立壁121之周緣做為該第一板12之邊緣而結合於該第二板15之邊緣,該溝槽17係與該第一板12之立壁121相隔一預定距離。In the first embodiment, the third plate 21 is in contact with the second plate 15 , and the second capillary 16 located at the top of the tenon 171 is in contact with the first capillary 13 . The working fluid is allowed to flow back between the first capillary 13 and the second capillary 16. Furthermore, the second capillary material 16 is attached to the surface of the second plate 15 and is disposed along with the undulation of the tenon 171. In addition, the groove 17 is designed to be in a straight line and has a flow guiding effect to generate more contact with the vapor chamber 11. However, the preferred method is to provide a bent shape. In the embodiment, the plurality of U-shaped, positive-and-reversely connected extensions are formed. The arrangement can guide the liquid 291 to generate the most complete contact with the vapor chamber 11, thereby producing an optimal heat dissipation effect. . Moreover, the first plate 12 extends from the periphery to the second plate 15 by a vertical wall 121, and is joined to the edge of the second plate 15 by the periphery of the vertical wall 121 as the edge of the first plate 12, the groove The groove 17 is spaced apart from the vertical wall 121 of the first plate 12 by a predetermined distance.
以上說明了本第一實施例的架構,接下來說明本第一實施例的操作狀態。The architecture of the first embodiment has been described above, and the operational state of the first embodiment will be described next.
請再參閱第2圖及第7圖,在操作時,係將該第一板12之表面貼設於一待散熱物99(例如電腦的中央處理器),並使該入口22及該出口24分別連接一管體29。接著,藉由該等管體29來對該入口22通入該液體291,以及由該出口24將該液體291導出,這個液體291可以是水或油或其他液體物質,而以高比熱之液體為最佳。這樣的操作,藉由該蒸汽腔11的快速均溫效果,可以將該待散熱物99所產生的熱能快速的擴散至該蒸汽腔11的全部表面,也就是可以擴散至該第二板15的全部表面(包含該溝槽17之壁面以及底部),進而,該液體291由該入口22進入後,沿著該溝槽17流動的過程,即會流經該第二板15的大部分區域,而完整的吸收該第二板15的熱能,進而在由該出口24流出後,將熱能帶出。藉此可以達到將帶出的熱能予以最大化的效果,此種散熱效果即明顯優於前述之先前技術。Please refer to FIG. 2 and FIG. 7 again. In operation, the surface of the first board 12 is attached to a heat sink 99 (for example, a central processing unit of a computer), and the inlet 22 and the outlet 24 are provided. A tube body 29 is connected to each other. Next, the inlet 22 is introduced into the liquid 291 by the tubes 29, and the liquid 291 is led out by the outlet 24. The liquid 291 may be water or oil or other liquid substance, and the liquid is heated at a high specific heat. For the best. In such an operation, the thermal energy generated by the heat sink 99 can be quickly diffused to the entire surface of the vapor chamber 11 by the rapid temperature equalization effect of the vapor chamber 11, that is, it can be diffused to the second plate 15. The entire surface (including the wall surface and the bottom of the groove 17), and further, after the liquid 291 enters through the inlet 22, the process of flowing along the groove 17 flows through most of the area of the second plate 15. The heat energy of the second plate 15 is completely absorbed, and after being discharged from the outlet 24, the heat energy is taken out. Thereby, the effect of maximizing the heat energy to be taken out can be achieved, and the heat dissipation effect is significantly superior to the prior art described above.
此外,藉由位於該凸垣171頂部的該第二毛細材16係與該第一毛細材13相接觸,藉此可縮短作動液的迴流路徑,進而提高均溫效果。Further, the second capillary material 16 located at the top of the tenon 171 is in contact with the first capillary material 13, whereby the return flow path of the actuating liquid can be shortened, thereby improving the temperature equalization effect.
請再參閱第8圖,本創作第二較佳實施例所提供之一種蒸汽腔液冷裝置30,主要概同於前揭第一實施例,不同之處在於:Referring to FIG. 8, a steam chamber liquid cooling device 30 according to a second preferred embodiment of the present invention is mainly similar to the first embodiment disclosed above, except that:
該第三板41係由周圍向該第二板35延伸一立壁411,並以該立壁411之周緣做為該第三板41之邊緣而結合於該第二板35之邊緣,該第三板41之板身係與該第二板35相隔預定距離,藉此,該第三板41與該第二板35之間的空間可以容納更多的該液體491。雖然這樣的架構下可以容納更多的該液體491,但由於該溝槽37的兩端是分別對應該入口42及該出口44,因此仍然可以發揮導流的效果。此外,這樣的架構下,該第二板35的板面也與該液體491接觸,進而增加了整體的接觸面積,使得散熱效果更佳。The third plate 41 extends from the periphery to the second plate 35 by a vertical wall 411, and is joined to the edge of the second plate 35 by the periphery of the vertical wall 411 as the edge of the third plate 41. The third plate The plate body of 41 is spaced apart from the second plate 35 by a predetermined distance, whereby the space between the third plate 41 and the second plate 35 can accommodate more of the liquid 491. Although such a liquid 491 can accommodate more of the liquid 491, since the two ends of the groove 37 correspond to the inlet 42 and the outlet 44, respectively, the effect of the flow can still be exerted. In addition, under such a structure, the surface of the second plate 35 is also in contact with the liquid 491, thereby increasing the overall contact area, so that the heat dissipation effect is better.
此外,位於該凸垣371頂部的該第二毛細材36與該第一毛細材33相隔預定距離;且該第一毛細材33與該第二毛細材36之間係以一或複數連接毛細材34相連接,該連接毛細材34在數量上以複數較佳,但單一個連接毛細材34亦足以提供工作液迴流的效果。如此一來,本第二實施例的該第一腔室39在空間上即較前述第一實施例的第一腔室19要來得大,藉此可符合較大空間需求的狀況,在整體體積的設計上可以更有彈性。In addition, the second capillary material 36 located at the top of the tenon 371 is spaced apart from the first capillary material 33 by a predetermined distance; and the first capillary material 33 and the second capillary material 36 are connected with one or more capillary materials. The 34-phase connection, the connection of the capillary material 34 is preferably plural in number, but the single connection of the capillary material 34 is also sufficient to provide the effect of working fluid reflux. In this way, the first chamber 39 of the second embodiment is larger in space than the first chamber 19 of the first embodiment, thereby meeting the situation of a large space requirement, in the overall volume. The design can be more flexible.
本第二實施例之其餘結構及所能達成的功效均概同於前揭第一實施例,容不贅述。The remaining structure of the second embodiment and the achievable functions are the same as those of the first embodiment, and are not described here.
請再參閱第9圖,本創作第三較佳實施例所提供之一種蒸汽腔液冷裝置50,主要概同於前揭第一實施例,不同之處在於:Referring to FIG. 9, a steam chamber liquid cooling device 50 according to a third preferred embodiment of the present invention is mainly similar to the first embodiment disclosed above, except that:
該溝槽57係有部分的深度與其他部分不同,亦即該凸垣571係有部分的高度與其他部分不同;位於該凸垣571頂部的該第二毛細材56,係以局部與該第一毛細材53相接觸,而有局部與該第一毛細材53隔預定距離。The groove 57 is partially different in depth from the other portions, that is, the height of the portion of the tenon 571 is different from the other portions; the second capillary 56 located at the top of the tenon 571 is partially and partially A capillary material 53 is in contact with each other and is partially spaced apart from the first capillary material 53 by a predetermined distance.
藉此,該溝槽57的深度不一的結構仍能提供對該液體691的導流效果,然而,該凸垣571的高度不一的結構卻可以不僅提供該第一毛細材53與該第二毛細材56接觸的效果,同時又能提供該第一毛細材53與該第二毛細材56之間局部隔開而提供蒸汽通過的空間的效果。雖然本第三實施例的該第一毛細材53與該第二毛細材56接觸位置不如第一實施例那麼多,但仍是較前述習知技術來得更多,而仍具有短於該習知技術的迴流路徑而令作動液迴流速度較快的效果。Thereby, the structure of the groove 57 having different depths can still provide the flow guiding effect on the liquid 691. However, the structure of the height of the tenon 571 can provide not only the first capillary 53 but also the first The effect of the contact of the second capillary material 56, while at the same time providing the space between the first capillary material 53 and the second capillary material 56 to provide a space through which the steam passes. Although the first capillary material 53 of the third embodiment is not in contact with the second capillary material 56 as much as the first embodiment, it is still more than the prior art, and still has a shorter than the conventional one. The return flow path of the technology makes the liquid reflux speed faster.
本第三實施例之其餘結構及所能達成的功效均概同於前揭第一實施例,容不贅述。The remaining structure of the third embodiment and the achievable functions are the same as those of the first embodiment, and are not described here.
10‧‧‧蒸汽腔液冷裝置
11‧‧‧蒸汽腔
12‧‧‧第一板
121‧‧‧立壁
13‧‧‧第一毛細材
15‧‧‧第二板
16‧‧‧第二毛細材
17‧‧‧溝槽
171‧‧‧凸垣
18‧‧‧除氣管
19‧‧‧第一腔室
21‧‧‧第三板
22‧‧‧入口
24‧‧‧出口
29‧‧‧管體
291‧‧‧液體
30‧‧‧蒸汽腔液冷裝置
33‧‧‧第一毛細材
34‧‧‧連接毛細材
35‧‧‧第二板
36‧‧‧第二毛細材
37‧‧‧溝槽
371‧‧‧垣部
39‧‧‧第一腔室
41‧‧‧第三板
411‧‧‧立壁
42‧‧‧入口
44‧‧‧出口
491‧‧‧液體
50‧‧‧蒸汽腔液冷裝置
53‧‧‧第一毛細材
56‧‧‧第二毛細材
57‧‧‧溝槽
571‧‧‧凸垣
691‧‧‧液體
99‧‧‧待散熱物10‧‧‧Steam chamber liquid cooling device
11‧‧‧Steam chamber
12‧‧‧ first board
121‧‧‧立立
13‧‧‧First capillary
15‧‧‧ second board
16‧‧‧Second capillary
17‧‧‧ trench
171‧‧‧ convex
18‧‧‧Degassing tube
19‧‧‧ first chamber
21‧‧‧ third board
22‧‧‧ Entrance
24‧‧‧Export
29‧‧‧Body
291‧‧‧Liquid
30‧‧‧Steam chamber liquid cooling device
33‧‧‧First capillary
34‧‧‧Connecting capillary
35‧‧‧ second board
36‧‧‧Second capillary
37‧‧‧ trench
371‧‧‧垣
39‧‧‧First chamber
41‧‧‧ third board
411‧‧‧ 立立
42‧‧‧ entrance
44‧‧‧Export
491‧‧‧Liquid
50‧‧‧Steam chamber liquid cooling device
53‧‧‧First capillary
56‧‧‧Second capillary
57‧‧‧ trench
571‧‧‧垣
691‧‧‧Liquid
99‧‧‧heat radiator
第1圖係本創作第一較佳實施例之立體圖。 第2圖係本創作第一較佳實施例之爆炸圖。 第3圖係本創作第一較佳實施例之另一爆炸圖,顯示底視的狀態。 第4圖係本創作第一較佳實施例之俯視圖。 第5圖係沿第4圖中5-5剖線之剖視圖。 第6圖係沿第4圖中6-6剖線之剖視圖。 第7圖係本創作第一較佳實施例之動作示意圖。 第8圖係本創作第二較佳實施例之剖視示意圖。 第9圖係本創作第三較佳實施例之剖視示意圖。Figure 1 is a perspective view of a first preferred embodiment of the present invention. Figure 2 is an exploded view of the first preferred embodiment of the present invention. Figure 3 is another exploded view of the first preferred embodiment of the present invention showing the state of the bottom view. Figure 4 is a plan view of a first preferred embodiment of the present invention. Fig. 5 is a cross-sectional view taken along line 5-5 of Fig. 4. Fig. 6 is a cross-sectional view taken along line 6-6 of Fig. 4. Figure 7 is a schematic view showing the action of the first preferred embodiment of the present invention. Figure 8 is a schematic cross-sectional view showing a second preferred embodiment of the present invention. Figure 9 is a schematic cross-sectional view showing a third preferred embodiment of the present invention.
10‧‧‧蒸汽腔液冷裝置 10‧‧‧Steam chamber liquid cooling device
11‧‧‧蒸汽腔 11‧‧‧Steam chamber
12‧‧‧第一板 12‧‧‧ first board
121‧‧‧立壁 121‧‧‧立立
13‧‧‧第一毛細材 13‧‧‧First capillary
15‧‧‧第二板 15‧‧‧ second board
16‧‧‧第二毛細材 16‧‧‧Second capillary
17‧‧‧溝槽 17‧‧‧ trench
18‧‧‧除氣管 18‧‧‧Degassing tube
21‧‧‧第三板 21‧‧‧ third board
22‧‧‧入口 22‧‧‧ Entrance
24‧‧‧出口 24‧‧‧Export
29‧‧‧管體 29‧‧‧Body
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW105202913U TWM526668U (en) | 2016-03-03 | 2016-03-03 | Vapor chamber liquid cooling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105202913U TWM526668U (en) | 2016-03-03 | 2016-03-03 | Vapor chamber liquid cooling device |
Publications (1)
Publication Number | Publication Date |
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TWM526668U true TWM526668U (en) | 2016-08-01 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW105202913U TWM526668U (en) | 2016-03-03 | 2016-03-03 | Vapor chamber liquid cooling device |
Country Status (1)
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TW (1) | TWM526668U (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106197109A (en) * | 2016-08-19 | 2016-12-07 | 广州华钻电子科技有限公司 | A kind of liquid cold temperature-uniforming plate composite heating radiator |
CN106793685A (en) * | 2016-12-09 | 2017-05-31 | 淳铭散热科技股份有限公司 | A kind of composite heat dissipation device |
CN110017713A (en) * | 2018-01-10 | 2019-07-16 | 迈萪科技股份有限公司 | Temperature-uniforming plate heat radiation module |
CN111397418A (en) * | 2020-02-24 | 2020-07-10 | 南京六九零二科技有限公司 | Three-dimensional steam cavity type phase-change heat storage device |
TWI786674B (en) * | 2021-06-09 | 2022-12-11 | 英業達股份有限公司 | Electronic device and heat dissipation assembly |
-
2016
- 2016-03-03 TW TW105202913U patent/TWM526668U/en not_active IP Right Cessation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106197109A (en) * | 2016-08-19 | 2016-12-07 | 广州华钻电子科技有限公司 | A kind of liquid cold temperature-uniforming plate composite heating radiator |
CN106793685A (en) * | 2016-12-09 | 2017-05-31 | 淳铭散热科技股份有限公司 | A kind of composite heat dissipation device |
CN110017713A (en) * | 2018-01-10 | 2019-07-16 | 迈萪科技股份有限公司 | Temperature-uniforming plate heat radiation module |
CN111397418A (en) * | 2020-02-24 | 2020-07-10 | 南京六九零二科技有限公司 | Three-dimensional steam cavity type phase-change heat storage device |
TWI786674B (en) * | 2021-06-09 | 2022-12-11 | 英業達股份有限公司 | Electronic device and heat dissipation assembly |
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