CN110017713A - Temperature-uniforming plate heat radiation module - Google Patents
Temperature-uniforming plate heat radiation module Download PDFInfo
- Publication number
- CN110017713A CN110017713A CN201810023364.XA CN201810023364A CN110017713A CN 110017713 A CN110017713 A CN 110017713A CN 201810023364 A CN201810023364 A CN 201810023364A CN 110017713 A CN110017713 A CN 110017713A
- Authority
- CN
- China
- Prior art keywords
- plate
- temperature
- uniforming
- uniforming plate
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F11/00—Arrangements for sealing leaky tubes and conduits
Abstract
The present invention provides a kind of temperature-uniforming plate heat radiation module, a cooling plate including a temperature-uniforming plate and on one surface of temperature-uniforming plate, and cooling plate includes a plate portion and half pipe portion, plate portion has a faying face and a cooling surface, it is amplexiformed with its faying face on temperature-uniforming plate in plate portion, and half pipe portion is then shaped on the cooling surface in plate portion, and half pipe portion is recessed by the faying face in plate portion and protrudes from cooling surface.Whereby, other than it can improve heat dissipation effect by half pipe portion, also can be by plate portion and temperature-uniforming plate contact of the face with face it is easy to manufacture with improve adaptation etc..
Description
Technical field
The present invention is related with a kind of radiating subassembly, especially a kind of to can be applied to such as the temperature-uniforming plate on water-cooled cooling system
Heat radiation module.
Background technique
Nowadays, heat dissipation is provided by coolant liquids such as such as water coolings, for now as computer etc. has the occasion institute of heater element
One of indispensable technological means, but often also derive the technical problems such as coolant liquid leakage and need to overcome.
And in previous water-cooled cooling system, it is anti-to connect setting such as rubber in the group of each element for more typical mode
Hydrosphere, to achieve the effect that waterproof is leaked by higher leakproofness；Secondly, then being reached by the sealings mode such as such as welding.
However, it is limited to the limitation such as contact area of each interelement, the previous component applied in water-cooled cooling system, though it can meet
Improve the demand of heat dissipation effect, but or have because that by water proof ring or can not weld and the factors such as be more not easy, and cause to cool down
Liquid is easy the problems such as leakage in use, while the also opposite fraction defective for being not easy and improving product in manufacture.
Summary of the invention
The main object of the present invention is to can provide a kind of temperature-uniforming plate heat radiation module, other than heat dissipation effect can be improved,
Also can further satisfaction water-cooled cooling system coolant liquid anti-leak result, to take into account, product is easy to manufacture and to improve its good
Rate, in use also can due to preferably closely sealed more stability.
In order to reach above-mentioned purpose, the present invention provides a kind of temperature-uniforming plate heat radiation module, including a temperature-uniforming plate and one cold
But plate；Wherein, there are two surfaces for temperature-uniforming plate tool, and cool down plate on a wherein surface for temperature-uniforming plate, and include a plate
Portion and half pipe portion, plate portion have a faying face and a cooling surface, and plate portion is amplexiformed with faying face on temperature-uniforming plate, and half pipe portion is then
It is shaped on the cooling surface in plate portion, and half pipe portion is recessed by the faying face in plate portion and protrudes from cooling surface.
Preferably, one of them described surface of the faying face with the temperature-uniforming plate in the plate portion is tied for face and amplexiforming for face
It closes.
Preferably, half pipe portion in the plate portion be in detour shape be distributed.
Preferably, a runner is formed between one of them of half pipe portion and the temperature-uniforming plate surface.
Preferably, the runner has a first port and a second port, and the first port is between the second port
Cooperate half pipe portion to extend in the cooling surface and is connected.
Preferably, the first port, second port are set to the same side, opposite side or the sides adjacent in the plate portion.
Preferably, the first port, be separately connected a pipe fitting in second port.
Preferably, which has one first plate body and one second plate body, and first plate body, the second plate body are stacked and set
And in forming an accommodating space to each other, the accommodating space is closed by first plate body, the second plate body and is in vacuum state.
Preferably, a wherein surface for the temperature-uniforming plate is formed in outside first plate body, and another surface then shape
At in outside second plate body.
Preferably, capillary structure is pasted with filled with working fluid and in the inner on wall in the accommodating space.
It whereby, also can be face and face by plate portion and temperature-uniforming plate other than it can improve heat dissipation effect by half pipe portion
It contacts and easy to manufacture and raising adaptation etc..
Detailed description of the invention
Fig. 1 is the perspective exploded view of first embodiment of the invention.
Fig. 2 is the Three-dimensional combination diagram of first embodiment of the invention.
Fig. 3 is the internal structure schematic diagram of first embodiment of the invention.
Fig. 4 is the use state diagram of first embodiment of the invention.
Fig. 5 is the perspective exploded view of second embodiment of the invention.
In figure:
Temperature-uniforming plate 1；First plate body 10；Surface 100；Surface 110；Second plate body 11；Accommodating space 12；Capillary structure 13；It is cold
But plate 2；Plate portion 20；Faying face 200；Cooling surface 201；Half pipe portion, 21 runner 210；First port 211；Second port
212；Pipe fitting 3；Pipeline 30.
Specific embodiment
The present invention will be further explained below with reference to the attached drawings and specific examples, so that those skilled in the art can be with
It better understands the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
Please refer to Fig. 1 and Fig. 2, the respectively perspective exploded view of first embodiment of the invention and three-dimensional combination signal
Figure.The present invention provides a kind of temperature-uniforming plate heat radiation module, can be applied to as on water-cooled cooling system, for water cooled heat radiating system
When coolant liquid in system passes through, can further it be cooled down by temperature-uniforming plate (Vapor Chamber) to coolant liquid.The temperature-uniforming plate
Heat radiation module includes a temperature-uniforming plate 1 and the cooling plate 2 that is laminated in the temperature-uniforming plate 1 and combines；Wherein:
The temperature-uniforming plate 1 have one first plate body 10 and one second plate body 11, and first plate body 10, the second plate body 11 be stacked set and
In being formed to each other, an accommodating space 12(is i.e. as shown in Figure 3), the accommodating space 12 is by the first plate body 10,11 envelope of the second plate body
It is in vacuum state after closing, and is pasted with filled with working fluid (figure omits) and on wall capillary structure 13 in the inner in the inner.Such as
Shown in Fig. 3, which mainly has there are two surface 100,110, wherein a surface 100 is formed in outside above-mentioned first plate body 10,
And another surface 110 is then formed in outside above-mentioned second plate body 11；Imply that when first plate body 10, the second plate body 11 be stacked set and
When constituting the temperature-uniforming plate 1, described two surfaces 100,110 as temperature-uniforming plate 1 is plate-like and has the two of maximum surface area
A surface 100,110.
The cooling plate 2 is stacked on above-mentioned temperature-uniforming plate 1, so as to the coolant liquid for being connected in aforementioned water-cooled cooling system
Pass through, so as to absorb the heat in coolant liquid by the temperature-uniforming plate 1, to reduce the temperature of coolant liquid.The cooling plate 2 includes
One plate portion 20 and half pipe portion 21, which has a faying face 200 and a cooling surface 201, and the plate portion 20 is with the combination
Face 200 is amplexiformed on the temperature-uniforming plate 1, and half pipe portion 21 is then shaped on the cooling surface 201 in the plate portion 20, and the semicanal
Portion 21 is recessed by the faying face 200 in the plate portion 20 and protrudes from the cooling surface 201 and constitutes the cooling plate 2.Wherein, this is cold
But plate 2 is amplexiformed with the faying face 200 in its plate portion 20 on a wherein surface 100 for the temperature-uniforming plate 1, and can be passed through and such as be welded
The heat such as connect and pass bonding mode and the cooling plate 2 is incorporated on the temperature-uniforming plate 1, and half pipe portion 21 can also the plate portion 20 pass through
Such as punching press mode and integrated molding person, to ensure that its flatness can make the cooling plate 2 and temperature-uniforming plate 1 by the plate portion 20
That makees face and face amplexiforms combination.
In more detail, half pipe portion 21 by the faying face 200 in the plate portion 20 after the recessed and surface of the temperature-uniforming plate 1
A runner 210 can be formed between 100, the runner 210 has a first port 211 and a second port 212, the first port
211 are connected to cooperating half pipe portion 21 to extend between the second port 212 in cooling surface 201, and half pipe portion 21 can have
Effect in the case where its 201 area of cooling surface in detour shape using being distributed thereon, so as to extension 210 length of runner.
Therefore temperature-uniforming plate heat radiation module of the present invention can be obtained by above-mentioned contexture.
Accordingly, as shown in figure 4, temperature-uniforming plate heat radiation module of the present invention can pass through such as components such as pipe fitting 3 and water cooled heat radiating
The pipeline 30 of system connects, and implies that after above-mentioned first port 211 is separately connected a pipe fitting 3 with second port 212, makes
The temperature-uniforming plate heat radiation module can be concatenated into a part in its circuit by the pipeline 30 of water-cooled cooling system.Therefore, water-cooled
After the coolant liquid of cooling system can enter half pipe portion 21 by the first port 211, pass through the samming in runner 210 in the inner
Plate 1 and achieve the effect that cooling, be finally connected in water-cooled cooling system by the second port 212 again and be used to radiate.
Furthermore as shown in figure 5, being the perspective exploded view of second embodiment of the invention.Wherein, the cooling plate 2
Half pipe portion 21 increases detour shape number in addition to its visual 201 area of cooling surface, to reach the effects of extending 210 length of runner and effect
Outside fruit, also the configuration of visual water-cooled cooling system and by above-mentioned first port 211, second port 212 be set to plate portion 20 it is same
Side (as shown in Figure 5) or opposite side (as shown in Figures 1 and 2), sides adjacent (figure omits) etc..
Therefore, temperature-uniforming plate heat radiation module through the invention, due to its plate portion 20 and temperature-uniforming plate 1 by the cooling plate 2
In conjunction with, and plate portion 20 and 1 surface of temperature-uniforming plate can the contact by face with face reach good sealing property so that one
Shape type can be easier on the surface 100 for being incorporated into temperature-uniforming plate 1 in half pipe portion 21 in the plate portion 20, to ensure to be formed by it
The leakproofness of runner 210 so that the coolant liquid to circulate in it will not leak, and then improves easiness and drop of the product in manufacture
Low fraction defective and stability in use etc., while the cooling surface 201 in the plate portion 20 also contributes to increasing heat dissipation area.
Embodiment described above is only to absolutely prove preferred embodiment that is of the invention and being lifted, protection model of the invention
It encloses without being limited thereto.Those skilled in the art's made equivalent substitute or transformation on the basis of the present invention, in the present invention
Protection scope within.Protection scope of the present invention is subject to claims.
Claims (10)
1. a kind of temperature-uniforming plate heat radiation module characterized by comprising
One temperature-uniforming plate, there are two surfaces for tool；And
One cooling plate, on one of them described surface of the temperature-uniforming plate, cooling plate includes a plate portion and half pipe portion,
The plate portion has a faying face and a cooling surface, which is amplexiformed on the temperature-uniforming plate with the faying face, and half pipe portion then one
It is body formed on the cooling surface in the plate portion, and half pipe portion is recessed by the faying face in the plate portion and protrudes from the cooling surface.
2. temperature-uniforming plate heat radiation module as described in claim 1, which is characterized in that its of the faying face in the plate portion and the temperature-uniforming plate
In surface be face and amplexiforming for face and combine.
3. temperature-uniforming plate heat radiation module as described in claim 1, which is characterized in that half pipe portion is in being in detour shape point in the plate portion
Cloth.
4. temperature-uniforming plate heat radiation module as described in claim 1, which is characterized in that one of them of half pipe portion and the temperature-uniforming plate
A runner is formed between the surface.
5. temperature-uniforming plate heat radiation module as claimed in claim 4, which is characterized in that the runner has a first port and one the
Two-port netwerk, and the first port is connected to cooperating half pipe portion to extend between the second port in the cooling surface.
6. temperature-uniforming plate heat radiation module as claimed in claim 5, which is characterized in that the first port, second port are set to the plate
The same side, opposite side or the sides adjacent in portion.
7. temperature-uniforming plate heat radiation module as claimed in claim 5, which is characterized in that connect respectively in the first port, second port
Connect a pipe fitting.
8. the temperature-uniforming plate heat radiation module as described in any one of claims 1 to 7, which is characterized in that the temperature-uniforming plate has one the
One plate body and one second plate body, and first plate body, the second plate body are stacked and set and in forming an accommodating space, the appearance to each other
It is closed between emptying by first plate body, the second plate body and is in vacuum state.
9. temperature-uniforming plate heat radiation module as claimed in claim 8, which is characterized in that a wherein surface for the temperature-uniforming plate is formed
In outside first plate body, and another surface is then formed in outside second plate body.
10. temperature-uniforming plate heat radiation module as claimed in claim 9, which is characterized in that in the accommodating space filled with working fluid,
And on wall it is pasted with capillary structure in the inner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810023364.XA CN110017713A (en) | 2018-01-10 | 2018-01-10 | Temperature-uniforming plate heat radiation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810023364.XA CN110017713A (en) | 2018-01-10 | 2018-01-10 | Temperature-uniforming plate heat radiation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110017713A true CN110017713A (en) | 2019-07-16 |
Family
ID=67188102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810023364.XA Pending CN110017713A (en) | 2018-01-10 | 2018-01-10 | Temperature-uniforming plate heat radiation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110017713A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115790209A (en) * | 2023-02-06 | 2023-03-14 | 中国核动力研究设计院 | Plate type high-performance cooling block providing uniform boundary and using method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204707386U (en) * | 2015-04-30 | 2015-10-14 | 讯凯国际股份有限公司 | Radiating subassembly, water cooled heat radiating assembly and cooling system |
| TWM526668U (en) * | 2016-03-03 | 2016-08-01 | sheng-zong Chen | Vapor chamber liquid cooling device |
| CN205584691U (en) * | 2016-03-17 | 2016-09-14 | 迈萪科技股份有限公司 | Heat radiation structure and contain water -cooled heat abstractor of this structure |
| CN207816066U (en) * | 2018-01-10 | 2018-09-04 | 迈萪科技股份有限公司 | Temperature-uniforming plate heat radiation module |
-
2018
- 2018-01-10 CN CN201810023364.XA patent/CN110017713A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204707386U (en) * | 2015-04-30 | 2015-10-14 | 讯凯国际股份有限公司 | Radiating subassembly, water cooled heat radiating assembly and cooling system |
| TWM526668U (en) * | 2016-03-03 | 2016-08-01 | sheng-zong Chen | Vapor chamber liquid cooling device |
| CN205584691U (en) * | 2016-03-17 | 2016-09-14 | 迈萪科技股份有限公司 | Heat radiation structure and contain water -cooled heat abstractor of this structure |
| CN207816066U (en) * | 2018-01-10 | 2018-09-04 | 迈萪科技股份有限公司 | Temperature-uniforming plate heat radiation module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115790209A (en) * | 2023-02-06 | 2023-03-14 | 中国核动力研究设计院 | Plate type high-performance cooling block providing uniform boundary and using method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101661912B (en) | Inverter power module for with distributed support for direct substrate cooling | |
| CN104735956A (en) | Sheet-type heat pipe | |
| TW201538915A (en) | Vapor chamber heat sink and method for making same | |
| CN106941769A (en) | A kind of good radiator structure part of combination property and its preparation technology | |
| CN105280582A (en) | Semiconductor device | |
| CN106887419B (en) | Steam cavity combined radiator and electronic device | |
| CN110017713A (en) | Temperature-uniforming plate heat radiation module | |
| CN207816066U (en) | Temperature-uniforming plate heat radiation module | |
| CN204442897U (en) | A kind of lightweight package alloy liquid cooling radiator structure | |
| CN105517415A (en) | Heat radiation structure and middle frame of mobile terminal, and mobile terminal | |
| CN104134637A (en) | Radiating structure for high-power logic chip PoP | |
| KR102256906B1 (en) | Cold plate assembly for electrical cabinet | |
| CN105810805B (en) | A kind of liquid cooling heat radiator | |
| CN206237722U (en) | A kind of good radiator structure part of combination property | |
| US20200221606A1 (en) | Method of manufacturing sus integral thin film plate type heat pipe for smartphone frame | |
| CN106643242B (en) | The vertical thermal conductive surface heat-pipe radiator of liquid-cooled | |
| CN205546396U (en) | A power amplification encapsulates subassembly for cell -phone | |
| CN103315623B (en) | Heat-preservation electric kettle | |
| CN206610802U (en) | Cooling body, power semiconductor units and cooling system | |
| CN207456249U (en) | Plume structure and gauge | |
| CN206805125U (en) | A kind of built-in cooling water pump type mobile phone projection device | |
| CN209706632U (en) | A kind of heat sink piece aperture support construction on automobile plate heat exchanger | |
| CN114390869A (en) | One-way heat transfer heat pipe with Y-shaped diversion table liquid absorption core and processing method thereof | |
| JP7087715B2 (en) | Power converter and cooling system | |
| CN106352725A (en) | Heat dissipation device capable of achieving integrated structural thermal control and processing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190716 |