CN204442897U - A kind of lightweight package alloy liquid cooling radiator structure - Google Patents
A kind of lightweight package alloy liquid cooling radiator structure Download PDFInfo
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- CN204442897U CN204442897U CN201520169498.4U CN201520169498U CN204442897U CN 204442897 U CN204442897 U CN 204442897U CN 201520169498 U CN201520169498 U CN 201520169498U CN 204442897 U CN204442897 U CN 204442897U
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Abstract
The utility model provides a kind of lightweight package alloy liquid cooling radiator structure, this structure comprises runner cell body, base plate, liquid cooling joint and power chip, the upper weld base plate of described runner cell body, hydraulic seal chamber is formed between runner cell body and base plate, described liquid cooling joint is provided with two, an import department being welded on runner cell body, an exit being welded on runner cell body, described power chip is welded on base plate.The utility model solves the difficult problem based on the microwave components high efficiency and heat radiation of high power semi-conductor, hot coupling, lightweight package, after applying this structure, the radiating efficiency of power chip is compared and is not adopted fluid channel encapsulation to improve 60%, and weight can alleviate 10%, and reliability can improve 30%.
Description
Technical field
The utility model relates to microelectronics field of radiating, especially relates to a kind of lightweight package alloy liquid cooling radiator structure.
Background technology
Along with the development of frequency microwave technology, people are more and more higher for miniaturized, integrated, the light-weighted requirement of radio frequency microwave circuit module, but one of the factor restricting its development is exactly heat dissipation problem.
Heat radiation at present for radio frequency microwave circuit module generally adopts forced air cooling, also some are had to be adopt flow channel for liquids to dispel the heat, liquid cooling design is compeled as Chinese patent CN201410185846.7 discloses a kind of Double-side hot source strength being applied to Connectors for Active Phased Array Radar of new generation integration TR assembly, NC milling is carried out to monoblock aluminium alloy plate 3A21 blank both sides, form two cavitys, middle is the cold drawing of both sides all with thermal source, radio frequency component and Switching Power Supply electronics device are directly installed on cold drawing respectively, cold drawing is liquid-cooled cold drawing, employing forces liquid-cooling heat radiation, liquid cooling runner is chosen immediately below thermal source, runner adopts the square structure being easy to process, and be snakelike trend, cooling fluid path cover plate adopts electron-bombardment welding, whole welding process completes under vacuum conditions, cold drawing coolant connection adopts self sealss snap joint.But this Double-side hot source strength is compeled liquid cooling design and also be there are some shortcomings: 1, radiating efficiency is not very high; 2, complicated structure, production difficulty is large; 3, weight ratio is larger.
Utility model content
The purpose of this utility model is: for prior art Problems existing, a kind of lightweight package alloy liquid cooling radiator structure is provided, this structure adopts the technology such as silicon aluminum alloy material, microchannel radiator structure, encapsulating structure design, and emphasis solves high power semi-conductor high efficiency and heat radiation, heat coupling, lightweight package problem.
The purpose of this utility model is achieved through the following technical solutions:
A kind of lightweight package alloy liquid cooling radiator structure, it is characterized in that, this structure comprises runner cell body, base plate, liquid cooling joint and power chip, the upper weld base plate of described runner cell body, form hydraulic seal chamber between runner cell body and base plate, described liquid cooling joint is provided with two, an import department being welded on runner cell body, an exit being welded on runner cell body, described power chip is welded on base plate.
Preferably, described runner cell body is the runner cell body that silicon aluminum alloy material is made, and described base plate is the base plate that silicon aluminum alloy material is made, and described liquid cooling joint is the liquid cooling joint that silicon aluminum alloy material is made.
Preferably, described runner cell body there is flow channel for liquids by numerical control mill processes.
Preferably, described runner cell body with adopt golden germanium welding procedure to carry out hydraulic seal between base plate to weld.
Preferably, described liquid cooling joint is welded by golden germanium technique with between runner cell body.
Preferably, described power chip welds with adopting golden tin-welding process between base plate.
Compared with prior art, the utility model solves the difficult problem based on the microwave components high efficiency and heat radiation of high power semi-conductor, hot coupling, lightweight package, after applying this structure, the radiating efficiency of power chip is compared and is not adopted fluid channel encapsulation to improve 60%, weight can alleviate 10%, and reliability can improve 30%.
Accompanying drawing explanation
Fig. 1 is flow path groove body structure schematic diagram;
Fig. 2 is base arrangement schematic diagram;
Fig. 3 is overall structure schematic diagram of the present utility model.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Embodiment
The utility model provides a kind of lightweight package alloy liquid cooling radiator structure, and as shown in Figure 1, Figure 2 shown in Fig. 3, this structure forms primarily of runner cell body 1, base plate 2, liquid cooling joint 3,5 and power chip 4.The runner cell body that runner cell body 1 adopts silicon aluminum alloy material to make, the base plate that base plate 2 adopts silicon aluminum alloy material to make, the liquid cooling joint that liquid cooling joint 3,5 adopts silicon aluminum alloy material to make.Runner cell body 1 can need to carry out flow channel for liquids 11 according to module heat dissipating design, and be processed by numerical control mill technique.
The top of runner cell body 1 adopts golden germanium welding procedure to weld with base plate 2, forms hydraulic seal chamber between runner cell body 1 and base plate 2.Liquid cooling joint is provided with two, and one is welded on import 12 place of runner cell body 1 by golden germanium technique, and one is welded on outlet 13 place of runner cell body 1 by golden germanium technique.Power chip 4 by golden tin-welding process welding on a base plate 2.
Structure of the present utility model can meet high efficiency and heat radiation and the requirement of heat coupling of high-power RF chip.And this structure adopts silicon aluminum alloy material (AlSi) just to make runner cell body, base plate and two flow path structure, quality is lighter.What the utility model adopted is that the welding of golden germanium realizes watertight, can carry out under general environment.Flow channel for liquids can need to carry out structural design according to module heat dissipating, and by numerical control mill processes on runner cell body.Runner cell body, base plate adopt golden germanium welding procedure to carry out hydraulic seal welding.The welding of same employing gold germanium is by liquid cooling weld at runner cell body correspondence position, and the input and output as liquid cooling fluid connect.Last high-power chip adopts golden tin-welding process, is welded on base plate and realizes high efficiency and heat radiation.
Work flow of the present utility model is as follows:
(1) according to cooling requirements design flow channel for liquids;
(2) according to the flow channel for liquids designed, machining is carried out to silica-alumina material;
(3) utilize ultrasonic cleaning runner cell body 1, base plate 2, liquid cooling joint 3,5, golden Sillim germanium solder sheet;
(4) in infrared chain-conveyer furnace, adopt golden germanium solder to weld runner cell body 1, base plate 2, liquid cooling joint 3,5;
(5) logical liquid carries out watertight detection;
(6) gold-tin alloy bonding power chip 4 is adopted in a vacuum furnace;
(7) X-RAY is adopted to detect welding cavity.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; it should be pointed out that all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (6)
1. a lightweight package alloy liquid cooling radiator structure, it is characterized in that, this structure comprises runner cell body, base plate, liquid cooling joint and power chip, the upper weld base plate of described runner cell body, form hydraulic seal chamber between runner cell body and base plate, described liquid cooling joint is provided with two, an import department being welded on runner cell body, an exit being welded on runner cell body, described power chip is welded on base plate.
2. a kind of lightweight package alloy liquid cooling radiator structure according to claim 1, it is characterized in that, described runner cell body is the runner cell body that silicon aluminum alloy material is made, and described base plate is the base plate that silicon aluminum alloy material is made, and described liquid cooling joint is the liquid cooling joint that silicon aluminum alloy material is made.
3. a kind of lightweight package alloy liquid cooling radiator structure according to claim 1, is characterized in that described runner cell body has flow channel for liquids by numerical control mill processes.
4. a kind of lightweight package alloy liquid cooling radiator structure according to claim 1, is characterized in that, described runner cell body with adopt golden germanium welding procedure to carry out hydraulic seal between base plate to weld.
5. a kind of lightweight package alloy liquid cooling radiator structure according to claim 1, it is characterized in that, described liquid cooling joint is welded by golden germanium technique with between runner cell body.
6. a kind of lightweight package alloy liquid cooling radiator structure according to claim 1, it is characterized in that, described power chip welds with adopting golden tin-welding process between base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520169498.4U CN204442897U (en) | 2015-03-25 | 2015-03-25 | A kind of lightweight package alloy liquid cooling radiator structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520169498.4U CN204442897U (en) | 2015-03-25 | 2015-03-25 | A kind of lightweight package alloy liquid cooling radiator structure |
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| CN204442897U true CN204442897U (en) | 2015-07-01 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793689A (en) * | 2015-12-22 | 2017-05-31 | 中国电子科技集团公司第二十研究所 | A kind of high power component blindmate box body based on microchannel radiating |
| CN111541001A (en) * | 2020-07-08 | 2020-08-14 | 成都雷电微力科技股份有限公司 | Integrated tile active phased-array antenna |
| CN113329588A (en) * | 2021-08-02 | 2021-08-31 | 电子科技大学 | Tool for testing replaceable runner assembly of liquid cooling heat dissipation capacity |
| CN114243252A (en) * | 2021-12-14 | 2022-03-25 | 中国电子科技集团公司第二十九研究所 | Tile type TR assembly integrated with liquid cooling runner |
| CN114256175A (en) * | 2021-12-07 | 2022-03-29 | 中国电子科技集团公司第二十九研究所 | Tile type TR (transmitter-receiver) component embedded in micro-channel and preparation method thereof |
-
2015
- 2015-03-25 CN CN201520169498.4U patent/CN204442897U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793689A (en) * | 2015-12-22 | 2017-05-31 | 中国电子科技集团公司第二十研究所 | A kind of high power component blindmate box body based on microchannel radiating |
| CN111541001A (en) * | 2020-07-08 | 2020-08-14 | 成都雷电微力科技股份有限公司 | Integrated tile active phased-array antenna |
| CN111541001B (en) * | 2020-07-08 | 2020-09-29 | 成都雷电微力科技股份有限公司 | Integrated tile active phased-array antenna |
| CN113329588A (en) * | 2021-08-02 | 2021-08-31 | 电子科技大学 | Tool for testing replaceable runner assembly of liquid cooling heat dissipation capacity |
| CN114256175A (en) * | 2021-12-07 | 2022-03-29 | 中国电子科技集团公司第二十九研究所 | Tile type TR (transmitter-receiver) component embedded in micro-channel and preparation method thereof |
| CN114256175B (en) * | 2021-12-07 | 2023-09-01 | 中国电子科技集团公司第二十九研究所 | Tile type TR (transmitter-receiver) component embedded in micro-channel and preparation method thereof |
| CN114243252A (en) * | 2021-12-14 | 2022-03-25 | 中国电子科技集团公司第二十九研究所 | Tile type TR assembly integrated with liquid cooling runner |
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