CN111541001A - Integrated tile active phased-array antenna - Google Patents
Integrated tile active phased-array antenna Download PDFInfo
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- CN111541001A CN111541001A CN202010649428.4A CN202010649428A CN111541001A CN 111541001 A CN111541001 A CN 111541001A CN 202010649428 A CN202010649428 A CN 202010649428A CN 111541001 A CN111541001 A CN 111541001A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
Abstract
The invention discloses an integrated tile active phased-array antenna, which comprises an array antenna layer, a heat dissipation cavity, a radio frequency layer, a rotation layer, a power supply and control layer and a cover plate layer, wherein a plurality of first slots are formed in one side, close to the rotation layer, of the radio frequency layer, a first radio frequency chip is arranged in each first slot, a plurality of second slots are formed in one side, close to the rotation layer, of the power supply and control layer, and a second radio frequency chip is arranged in each second slot; a control device is arranged on one side of the power supply and control layer, which is close to the cover plate layer, and is used for power supply and signal control; the rotary layer plays roles of radio frequency signal transition and radio frequency isolation; the array antenna layer is electrically connected with the radio frequency layer at high frequency through a first radio frequency connecting structure arranged on the heat dissipation cavity; the radio frequency layer is electrically connected with the power supply and the control layer at high frequency through a second radio frequency connecting structure arranged on the transition layer; the cover plate layer is electrically connected with the power supply and the control layer. The antenna of the invention realizes the integrated design of multi-channel, multi-polarization or multi-frequency and other functions and high integration, and has small integral volume, light weight and thin thickness.
Description
Technical Field
The invention relates to the field of communication, in particular to an integrated tile active phased array antenna.
Background
The phased array antenna is a key core component of the phased array radar/communication system, directly determines the performance of the whole phased array radar/communication system, and occupies a large proportion in the aspects of the cost, the volume, the weight and the power consumption of the whole system. The architecture of the active phased array antenna can be roughly divided into a brick type and a tile type according to the circuit assembly mode. The brick type active phased array antenna is simple in design, convenient to install, good in heat dissipation capacity, heavy in weight and large in size, and development and application of the active phased array antenna are limited to a certain extent. The tile active phased array antenna is high in integration level, generally adopts a laminated structure, can greatly reduce the size and the weight compared with a brick structure, and can greatly reduce the cost of the phased array antenna and expand the application space of the active phased array antenna by improving the chip integration level and optimizing the link design.
Present tile active phased array antenna framework, for brick formula structure, the integrated level has the promotion of great degree, but its inside each subsystem still relatively is more independent, carries out the connection of radio frequency and low frequency through multiple connector or perpendicular interconnect structure, and this kind of mode has reduced tile formula structure to a certain extent in cost and volumetric advantage. In addition, the existing tile-type architecture mainly considers the application of low channel density, single frequency and single polarization, and cannot meet the high-density integration requirements of multiple frequencies, multiple polarizations and multiple functions.
When needing multichannel, multi-functional high integration such as multipolarity or multifrequency and while during operation, brick formula structure is often chooseed to current scheme, be when tile formula structure high density is integrated on the one hand, the passageway interval reduces at double, can't realize the multichannel on current tile active phased array antenna framework, multi-functional while high integration such as multipolarity or multifrequency, no space can be placed, it just can realize to need to set up more laminated structure, but the range upon range of interconnection between the multiple different functional layers needs occupy certain space, the scheme of conventional connector can't satisfy, on the other hand brick formula structure heat dissipation capacity is big, and easy design, but under more complicated application scene and miniaturized trend, can't satisfy the real demand.
For example, patent document CN106207492A "high-density integrated tile-type active phased array antenna architecture" proposes a new tile-type antenna architecture, which has the advantages of small size, light weight, high integration level, low cost, etc., but is only applicable to phased array antennas with single function, and there is no related application description related to high power in the patent.
As the integrated structure proposed in CN106229276A, "an LTCC substrate-based BGA integrated package device", has a certain innovation in the integration level, but because of LTCC substrate packaging, the heat dissipation capability is limited, the situation of high heat density is not considered, and the rework performance is poor, so that the cost of the active phased array antenna cannot be randomly replaced and repaired under the condition that the cost of the current active phased array antenna is not reduced to the level similar to that of electronic products such as a mobile phone, and the cost is wasted.
With the gradual complication of application scenes, the layout structure of the traditional tile-type phased array antenna cannot meet the practical requirements of multi-channel, multi-polarization, multi-frequency and other multifunctional integration at the same time, the heat dissipation capability of the antenna is also restricted by high integration miniaturization, and the application of the antenna is limited in the application scenes with high heat density.
Disclosure of Invention
The invention aims to: to the problem that exists, provide an integration tile active phased array antenna to solve brick formula and current tile formula phased array antenna and can't realize multi-functional high density integrated problems such as multichannel, multipolarization or multifrequency simultaneously.
The technical scheme adopted by the invention is as follows:
an integrated tile active phased-array antenna comprises an array antenna layer, a heat dissipation cavity, a radio frequency layer, a rotary layer, a power supply and control layer and a cover plate layer, wherein the array antenna layer, the heat dissipation cavity, the radio frequency layer, the rotary layer, the power supply and control layer and the cover plate layer are arranged layer by layer; the cover plate layer seals the opening of the heat dissipation cavity, and the radio frequency layer, the rotary layer, the power supply and the control layer are all arranged in the heat dissipation cavity.
A plurality of first slots are formed in one side, close to the rotating layer, of the radio frequency layer, and at least a first radio frequency chip is arranged in each first slot.
A plurality of second slots are formed in one side, close to the rotating layer, of the power supply and control layer, and at least a second radio frequency chip is arranged in each second slot; and one side of the power supply and control layer, which is close to the cover plate layer, is provided with a control device for controlling the power supply and signals.
The transition layer is used for radio frequency signal transition and radio frequency isolation between the radio frequency layer and the power supply and control layer.
The array antenna layer is electrically connected with the radio frequency layer through a first radio frequency connecting structure arranged on the heat dissipation cavity; the radio frequency layer is electrically connected with the power supply and the control layer through a second radio frequency connecting structure arranged on the switching layer; the cover plate layer is electrically connected with the power supply and control layer.
The active phased array antenna structure with the structure is based on a multilayer laminated structure of different functional layers of tiles, and multifunctional high-integration integrated design such as multi-channel, multi-polarization or multi-frequency is achieved. When the heat dissipation effect of the heat dissipation cavity is good enough, the high-power bearing capacity of the radio frequency chip can be improved, and therefore high-power output of the antenna is achieved. In addition, the mutually separated (not fixedly connected) hierarchical structure is convenient for direct installation and disassembly, and the reworkability is greatly improved.
Furthermore, a third slot is formed on the two sides of the rotary layer corresponding to each first slot and/or each second slot.
The third slot reserves more space for connecting wires (gold wires) corresponding to electronic devices such as a radio frequency chip and the like, and can effectively prevent mutual damage or short circuit.
Further, a connector pin and a radio frequency connector are arranged on the cover plate layer; a connector socket is also arranged on the power supply and control layer; the radio frequency connector is electrically connected with the power supply and the control layer, and the connector contact pin is interconnected with the connector socket. The radio frequency connector vertically interconnects an external excitation signal and a radio frequency signal in the module, and the connector pin connects an internal power supply and a control signal of the module with an external signal.
Furthermore, a plurality of unit antennas are arranged on one side, away from the heat dissipation cavity, of the array antenna layer in an array mode, and radio frequency feeds which correspond to the unit antennas in a one-to-one mode are arranged through the array antenna layer and correspond to the unit antennas. The radio frequency feed is well connected with the unit antenna, no external wire is exposed, and direct installation is convenient.
Furthermore, the first radio frequency structure and the second radio frequency structure are both fuzz button transition structures. The fuzz button transition structure can realize direct perpendicular interconnection between the multi-functional layers such as tile formula multichannel, multipolarity or multifrequency to further improve the multi-functional integration level of tile structure high density, and make antenna assembly and dismantlement very simple.
Furthermore, a heat dissipation structure is arranged in the layer of the heat dissipation cavity.
Further, the heat dissipation structure in the heat dissipation cavity is a first micro channel. The heat dissipation design of the micro-channel is convenient for high-density integration of multi-channel, multi-frequency or multi-polarization phased array antennas, and can improve the heat dissipation capacity of the antennas, so that the output power is improved.
Furthermore, metal copper columns are respectively arranged corresponding to the first radio frequency chips and/or the second radio frequency chips, the metal copper columns are respectively contacted with the first radio frequency chips and/or the second radio frequency chips, and the metal copper columns conduct heat to the heat dissipation cavity through the heat dissipation sub-layer.
Or a second micro-channel or heat-conducting silicone grease is arranged in the radio frequency layer and/or the power supply and control layer.
The copper column or the micro channel is designed to radiate the radio frequency chip, so that the power bearing capacity of the radio frequency chip is improved, and the output power of the antenna is improved.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. compared with the structural design of the traditional brick-type or existing tile-type phased array antenna, the antenna framework realizes the integrated design of multi-channel, multi-polarization or multi-frequency and other functions and high integration, and has small integral volume, light weight and thin thickness.
2. The phased array antenna adopts a stacking interconnection mode, adopts a fuzz button transition structure to carry out interlayer interconnection, is convenient to assemble and disassemble, does not need to scrap the whole part due to local reasons, and has high repairability.
3. The phased array antenna reduces the use of radio frequency connectors such as SMP (symmetrical multi processing) and the like, further greatly reduces the material cost and the production period on the basis of a tile structure, and quickens the development progress of phased array antenna products.
4. The micro-channel heat dissipation structure designed by the invention can quickly exchange the heat of the antenna module with the outside, thereby greatly improving the power bearing capacity of the system, enabling the antenna to have higher output power and further increasing the application range of the tile active phased array antenna. Particularly, the heat dissipation layer of the invention adopts a cavity structure, and the heat dissipation layer is in contact with other layers through the structure of the heat dissipation layer, so that the heat conduction is realized quickly, and the structure enables the heat dissipation layer to have a larger heat dissipation surface (exposed area), so that the whole antenna framework has higher heat dissipation efficiency.
5. The heat dissipation cavity body is matched with the cover plate layer to play a role in sealing under the condition of playing a role in heat dissipation.
Drawings
The invention will now be described, by way of example, with reference to the accompanying drawings, in which:
fig. 1 is a hierarchical structure diagram of a tile active phased array antenna.
Fig. 2 is an overall structural view of the tile active phased array antenna.
In the figure, 11 unit antennas, 12 array antenna layer substrates, 13 rf feeds, 21 cavity plates, 22 first microchannels, 23 first fuzz button transition structures, 31 rf layer substrates, 32 first rf chips, 33 first chip capacitors, 41 transition layer substrates, 42 second fuzz button transition structures, 51 power supply and control layer substrates, 52 control devices, 53 connector sockets, 54 second rf chips, 55 second chip capacitors, 61 cover plates, 62 connector pins, and 63 rf connectors.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
Any feature disclosed in this specification (including any accompanying claims, abstract) may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
Example one
The embodiment discloses an integrated tile active phased-array antenna, as shown in fig. 1, the integrated tile active phased-array antenna comprises an array antenna layer 1, a heat dissipation cavity 2, a radio frequency layer 3, a rotary layer 4, a power supply and control layer 5 and a cover plate layer 6, and all the layers are arranged layer by layer. The heat dissipation cavity 2 is provided with a cavity structure, the radio frequency layer 3, the rotation layer 4 and the power supply and control layer 5 are sequentially arranged in the cavity structure, and the cover plate layer 6 seals an opening of the heat dissipation cavity 2.
As shown in fig. 2, a plurality of first slots are formed in the rf layer 3 near the rotation layer 4, and at least a first rf chip 32 is disposed in the first slots. Of course, electronic devices such as the first chip capacitor 33 may be provided, which are matched and interconnected by gold wires.
The power supply and control layer 5 has a plurality of second slots on one side of the rotation layer 4, and at least a second rf chip 54 is disposed in the second slots. Of course, electronic devices such as the second chip capacitor 55 can be provided, and the electronic devices are interconnected through gold wires. The power supply and control layer 5 is provided with a control device 52 on the side of the cover plate layer 6 for power supply and signal control.
The switching layer 4 is used for radio frequency isolation between the radio frequency layer 3 and the power and control layer 5. The isolation effect can be increased by pasting wave-absorbing materials or arranging shielding layers and the like.
A first radio frequency connecting structure is arranged on the heat dissipation cavity 2, a second radio frequency conversion stage structure is arranged on the conversion stage 4, and the array antenna layer 1 is electrically connected with the radio frequency layer 3 through the first radio frequency connecting structure arranged on the heat dissipation cavity 2; the radio frequency layer 3 is electrically connected with the power supply and the control layer 5 through a second radio frequency connecting structure arranged on the rotary layer 4. The cover plate layer 6 is electrically connected to the power supply and control layer 5. The electrical connections between the cover layer 6 and the power and control layer 5 include high frequency radio frequency signal connections and low frequency power and control signal connections.
The active phased array antenna framework with the structure is based on the multilayer laminated structure of different functional layers of the tiles, so that the integrated design of multi-function high integration such as multi-channel, multi-polarization or multi-frequency is realized, and the high-density multi-function integrated high integration of the tile structure is solved. The structures of all layers are not fixedly connected, the assembly and the disassembly are convenient, the reworkability is greatly improved, the scrapping of the whole part due to local reasons is not needed in the production link, and the yield is improved.
Example two
As shown in fig. 1, the present embodiment discloses an integrated tile active phased array antenna, which includes an array antenna layer 1, a heat dissipation cavity 2, a radio frequency layer 3, a rotation layer 4, a power supply and control layer 5, and a cover plate layer 6, which are arranged layer by layer. The radio frequency layer 3, the rotation layer 4 and the power supply and control layer 5 are sequentially arranged in the heat dissipation cavity 2, the cover plate layer 6 seals an opening of the heat dissipation cavity 2, and the array antenna layer 1 is vertically connected to the bottom of the heat dissipation cavity 2.
As shown in fig. 2, the array antenna layer 1 includes an array antenna layer substrate 12, the array antenna layer substrate 12 is a multi-layer high frequency conforming plate, the surface of the substrate, which is far away from the heat dissipation cavity 2, is provided with unit antennas 11 having radiation characteristics in an array manner, a plurality of radio frequency feeds 13 are provided through the array antenna layer substrate 12, and each radio frequency feed 13 corresponds to each unit antenna 11 one to one. The element antenna 11 is electrically connected to the heat dissipation chamber 2 by a corresponding radio frequency feed 13.
The heat dissipation cavity 2 comprises a cavity plate 21, and first fuzz button transition structures 23 are arranged on the cavity plate 21 corresponding to the radio frequency feeds 13. Each unit antenna 11 is connected with the first fuzz button transition structure 23 of the heat dissipation cavity 2 through the radio frequency feed 13. The first micro flow channel 22 (i.e., the heat dissipation structure) is disposed in the heat dissipation cavity to realize rapid heat conduction of the micro system. The traditional single-frequency single-polarization phased array antenna has fewer connectors and has a flow channel design with redundant space for heat dissipation; however, for multi-channel, multi-frequency or multi-polarization phased array antennas, the space is very limited, and therefore, the micro-channel design is a better choice. Therefore, the power bearing capacity of the active phased array antenna can be greatly improved, and the output power is higher.
The radio frequency layer 3 is directly contacted and interconnected with the first fuzz button transition structure 23. The radio frequency layer 3 comprises a radio frequency layer substrate 31, and the radio frequency layer substrate 31 is an LTCC or high-frequency composite board; the surface of the rf layer substrate 31 near the rotation stage 4 is provided with a plurality of first step-shaped slots (i.e., first slots), and the first step-shaped slots are provided with a first rf chip 32, a first chip capacitor 33, and a peripheral circuit, which are interconnected by a gold wire. The first rf chip 32 is not limited to a single receiving chip, a single transmitting chip, a transceiver multi-function chip, and an SoC chip, which are different in form, function, integration degree, process, and package form. The radio frequency layer substrate 31 is internally provided with radio frequency routing. In one embodiment, a radio frequency PAD is arranged on the surface of the radio frequency layer substrate 31 close to the side of the array antenna layer 1, corresponding to the position of each first fuzz button transition structure 23, and the radio frequency PAD is directly contacted and interconnected with the first fuzz button transition structures 23; the radio frequency layer substrate 31 is also provided with a radio frequency PAD on the side close to the rotation stage 4, and the radio frequency PAD is directly contacted and interconnected with the second fuzz button 42.
The power supply and control layer 5 includes a power supply and control layer substrate 51, the power supply and control layer substrate 51 is a high frequency composite board or PCB, the surface of the side of the power supply and control layer substrate 51 close to the turning stage 4 is provided with a plurality of second step-shaped slots (i.e. second slots), and the second step-shaped slots are internally provided with a second radio frequency chip 54, a second chip capacitor 55 and peripheral circuits which are interconnected through gold wires. The other surface (i.e., the surface closer to the cover plate layer 6) is provided with a control device 52 and a connector receptacle 53. The control device 52 implements power conversion or control signal conversion. In the power supply and control layer 5, radio frequency wirings and control wirings are provided. The second rf chip 54 may have different size, frequency, and process parameters from the first rf chip 32, and the second chip capacitor 55 may have different size, frequency, and process parameters from the first chip capacitor 33, so that the rf chips with different functions may be arranged in a limited space to realize the integration of the multifunctional active phased array antenna.
The transition layer 4 is arranged between the radio frequency layer 3 and the power supply and control layer 5 and plays a role of radio frequency isolation. The rotary layer 4 comprises a rotary layer substrate 41, a plurality of second fuzz button transition structures 42 are arranged through the rotary layer substrate 41, and the radio frequency layer 3 is connected with the power supply and control layer 5 in a radio frequency mode through the second fuzz button transition structures 42. The second fuzz button transition structure 42 and the first fuzz button transition structure 23 can have different parameters such as size, structural form, material and the like. Preferably, the turning layer substrate 41 is provided with slots (i.e. third slots) at two sides corresponding to the first stepped slots and/or the second stepped slots, so as to prevent the rf layer 3 and/or the power source from colliding with the wires of the control layer 5 or from short-circuiting. Wave-absorbing materials can be adhered to the slots of the rotating-layer substrate 41, or a shielding sublayer is arranged in the rotating-layer substrate 41, so as to further improve the radio frequency isolation effect. During production, an isolation structure is further disposed in the transition layer substrate 41 to improve interlayer isolation or inter-channel isolation.
The cover layer 6 includes a cover plate 61, and connector pins 62 are provided on the cover plate 61 corresponding to the connector sockets 53 to connect the module internal power and control signals with external signals. The cover plate 61 is provided with a radio frequency connector 63, the radio frequency connector 63 is connected to the power supply and control layer 5 in a radio frequency mode, and the radio frequency connector 63 vertically interconnects an external excitation signal and a radio frequency signal in a module (namely, the phased array antenna of the design). The cover plate 61 can be laser welded to the heat dissipation cavity to achieve sealing.
In consideration of the requirement for high power of the antenna in practical application, heat dissipation sublayers are arranged in the radio frequency layer 3 and the power supply and control layer 5, for example, an LTCC or a high frequency composite board is selected for the substrate of the radio frequency layer 3, and a copper foil sublayer or a heat conduction silicone grease is arranged in the substrate when the high frequency composite board or a PCB is selected for the substrate of the power supply and control layer. The copper columns are disposed at positions corresponding to the first rf chip 32 and the second rf chip 54, and two ends of each copper column respectively contact the corresponding rf chip and the corresponding heat dissipation sub-layer, so as to transfer heat of the rf chip to the heat dissipation cavity 2 through the heat dissipation sub-layer for heat dissipation. Alternatively, a second microchannel is designed in the rf layer 3 and the power and control layer 5 to conduct heat rapidly to the rf chip and the like.
EXAMPLE III
As shown in fig. 1, the present embodiment discloses an integrated tile active phased array antenna, which includes an array antenna layer 1, a heat dissipation cavity 2, a radio frequency layer 3, a rotation layer 4, a power supply and control layer 5, and a cover plate layer 6. As shown in fig. 2, in the array antenna layer 1, an array of element antennas 11 with radiation characteristics is disposed on the multilayer high-frequency composite board 12, and the element antennas 11 are connected to the first fuzz button transition structure 23 of the heat dissipation cavity 2 through a radio frequency feed 13 inside the array antenna layer 1. The radio frequency layer 3 is an LTCC or high-frequency composite board, a radio frequency wiring is arranged inside the LTCC or high-frequency composite board, a radio frequency PAD is arranged at one end, close to the heat dissipation cavity 2, of the radio frequency layer, and the radio frequency PAD is directly contacted and interconnected with the first hair button transition structure 23. The radio frequency layer 3 is provided with a first step-shaped slot, and a first radio frequency chip 32, a first chip capacitor 33 and other devices are arranged in the slot and are interconnected through gold wires. One end of the radio frequency layer 3 close to the rotary layer 4 is also provided with a radio frequency PAD, and the radio frequency PAD is connected with the power supply and the control layer 5 through a second fuzz button transition structure 42 in the rotary layer 4. The rotary layer 4 is provided with an isolation structure and a slot to improve the interlayer isolation or the channel isolation. A second stepped slot is formed in one surface, close to the rotary layer 4, of the control layer 5, a second radio frequency chip 54, a second chip capacitor 55 and other devices are arranged in the slot and are interconnected through gold wires, and a control device 52 and a connector socket 53 are arranged on the other side of the control layer; the control layer 5 is internally provided with a radio frequency wire and a control wire. Measures such as laser sealing and welding can be achieved for the cover plate layer 6 and the heat dissipation cavity 2, the overall airtight characteristic is guaranteed, the connector pin 62 and the radio frequency connector 63 are arranged on the cover plate layer 6, internal and external interconnection of the micro-system is achieved, the connector pin 62 corresponds to the connector socket 53, and the radio frequency connector 63 is connected to the power supply and the control layer 5 in a radio frequency mode. The heat dissipation cavity 2 is provided with a second micro channel 22, so that the heat of the micro system can be rapidly conducted.
The array antenna layer 1 takes the form of a patch antenna, and is formed of a plurality of element antennas 11 in a uniform or non-uniform array. The whole array antenna layer 1 is formed by laminating a high-frequency plate through a compounding process, and the inside of the whole array antenna layer comprises a radio frequency radiation surface structure, a radio frequency feed 13 and other radio frequency structures. The array antenna layer 1 and the heat dissipation cavity 2 can be directly installed through a screw assembling, bonding or welding process. The array antenna layer 1 and the heat dissipation cavity 2 are vertically interconnected by using a contact radio frequency, so that the assembly precision is required to be ensured as much as possible during assembly, and alignment installation can be performed by using pins and the like.
In order to ensure high-power heat dissipation, a metal copper column or a second microchannel should be arranged in the radio frequency layer 3 on the premise of ensuring the radio frequency performance. The metal copper column or the second microchannel conducts heat to the heat dissipation cavity through a heat dissipation sublayer (such as heat conduction silicone grease) arranged in the layer. The rf chip 32 is not limited to a single receiving chip, a single transmitting chip, a transceiver multifunctional chip, and an SoC chip, which are chips with different forms, different functions, different integration degrees, different processes, and different packaging forms. The rotary layer 4 is provided with a second fuzz button transition structure 42, and the second fuzz button transition structure 42 and the first fuzz button transition structure 23 can be different in size, structural form, material and other parameters. The upper and lower sides of the turning layer 4 are provided with grooves corresponding to the radio frequency chips, so that the radio frequency layer 3 or the gold wires of the power supply and the control layer 5 can be prevented from being damaged or short-circuited, and wave-absorbing materials and the like can be pasted to increase the isolation between the radio frequency layer 3 and the power supply and the control layer 5. A shielding layer may be provided in the transition layer 4 to increase isolation. The power supply and control layer 5 is provided with a second radio frequency chip 54, a second chip capacitor 55 and other devices, and the interconnection is realized through gold wires. The second RF chip 54 may have different size, frequency, process parameters, etc. from the first RF chip 32, and the second chip capacitor 55 may have different size, frequency, process parameters, etc. from the first chip capacitor 33. The control device 52 provided on the power supply and control layer 5 performs power supply conversion or control signal conversion. In order to ensure high-power heat dissipation, the power supply and control layer 5 should be provided with a metal copper column or a second microchannel under the premise of ensuring radio frequency performance, heat can be conducted to the heat dissipation cavity 2 from the metal copper column, the second microchannel or a high-heat device by using heat-conducting silicone grease for heat dissipation, and the heat-conducting silicone grease can be coated in the layer. A connector socket 53 is provided on the power and control layer 5 to interconnect with a connector pin 62 on the cover sheet layer 6. And a radio frequency connector is arranged on the cover plate layer 6 and vertically interconnects an external excitation signal and a radio frequency signal in the module. A low frequency connector pin 62 is provided on the cover plate layer 6 to connect the module internal power and control signals with external signals.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed.
Claims (9)
1. An integrated tile active phased-array antenna is characterized by comprising an array antenna layer (1), a heat dissipation cavity (2), a radio frequency layer (3), a rotary layer (4), a power supply and control layer (5) and a cover plate layer (6), wherein the array antenna layer, the heat dissipation cavity, the radio frequency layer and the rotary layer are arranged layer by layer; the cover plate layer (6) seals an opening of the heat dissipation cavity (2), and the radio frequency layer (3), the rotary layer (4) and the power supply and control layer (5) are all arranged in the heat dissipation cavity (2);
a plurality of first slots are formed in one side, close to the rotating layer (4), of the radio frequency layer (3), and at least a first radio frequency chip (32) is arranged in each first slot;
a plurality of second slots are formed in one side, close to the rotating layer (4), of the power supply and control layer (5), and at least a second radio frequency chip (54) is arranged in each second slot; a control device (52) is arranged on one side, close to the cover plate layer (6), of the power supply and control layer (5) and is used for power supply and signal control;
the transition layer (4) is used for radio frequency signal transition and radio frequency isolation between the radio frequency layer (3) and the power supply and control layer (5);
the array antenna layer (1) is electrically connected with the radio frequency layer (3) through a first radio frequency connecting structure arranged on the heat dissipation cavity (2); the radio frequency layer (3) is electrically connected with the power supply and the control layer (5) through a second radio frequency connecting structure arranged on the transfer layer (4); the cover plate layer (6) is electrically connected with the power supply and control layer (5).
2. The integrated tile active phased array antenna as claimed in claim 1, wherein a third slot is provided on both sides of said rotation layer (4) corresponding to each of the first slot and/or the second slot.
3. The integrated tile active phased array antenna of claim 1, wherein connector pins (62) and radio frequency connectors (63) are provided on the cover plate layer (6); the power supply and control layer (5) is also provided with a connector socket (53); the radio frequency connector (63) is electrically connected with the power supply and control layer (5), and the connector pin (62) is interconnected with the connector socket (53).
4. The integrated tile active phased array antenna according to claim 1, characterized in that a plurality of unit antennas (11) are arranged in an array on the side of the array antenna layer (1) away from the heat dissipation cavity (2), and radio frequency feeds (13) corresponding to the unit antennas (11) are arranged through the array antenna layer (1) in a one-to-one correspondence.
5. The integrated tile active phased array antenna of claim 1, wherein the first and second radio frequency structures are each a fuzz button transition structure.
6. The integrated tile active phased array antenna according to claim 1, characterized in that a heat dissipation structure is provided within the layers of the heat dissipation cavity (2).
7. The integrated tile active phased array antenna of claim 6, wherein the heat dissipation structure within the heat dissipation cavity (2) is a first microchannel (22).
8. The integrated tile active phased array antenna according to claim 1, wherein corresponding to each of the first radio frequency chips (32) and/or the second radio frequency chips (54), a metal copper pillar is provided, each of the metal copper pillars being in contact with each of the first radio frequency chips (32) and/or the second radio frequency chips (54), respectively, the metal copper pillars conducting heat to a heat dissipation cavity (2) through a heat dissipation sublayer.
9. The integrated tile active phased array antenna according to claim 1, characterized in that a second microchannel or thermally conductive silicone is provided in the radio frequency layer (3) and/or the power and control layer (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN112003003A (en) * | 2020-08-27 | 2020-11-27 | 成都天锐星通科技有限公司 | Phased array antenna structure and electronic device |
| CN112003631A (en) * | 2020-08-28 | 2020-11-27 | 成都天锐星通科技有限公司 | Transceiver assembly and electronic device |
| CN112216944A (en) * | 2020-12-14 | 2021-01-12 | 成都雷电微力科技股份有限公司 | Liquid cooling heat radiation structure and array structure of high-power tile type active phased array |
| CN112271448A (en) * | 2020-09-25 | 2021-01-26 | 北京空间飞行器总体设计部 | Phased array antenna of tile formula layering framework |
| CN112996329A (en) * | 2021-04-29 | 2021-06-18 | 成都天锐星通科技有限公司 | Phased array antenna |
| CN112994760A (en) * | 2021-04-26 | 2021-06-18 | 成都雷电微晶科技有限公司 | Multi-beam tile type TR (transmitter-receiver) component with high integration degree |
| CN113067191A (en) * | 2021-03-19 | 2021-07-02 | 成都雷电微晶科技有限公司 | Tile type module power supply switching structure |
| CN113271118A (en) * | 2021-07-20 | 2021-08-17 | 成都雷电微力科技股份有限公司 | Dual-frequency dual-polarization TR module |
| CN113299610A (en) * | 2021-05-21 | 2021-08-24 | 中国电子科技集团公司第二十九研究所 | High-reliability packaging structure and packaging method for microwave part cover plate |
| CN113437464A (en) * | 2021-08-27 | 2021-09-24 | 成都雷电微晶科技有限公司 | Double-waveguide/multi-waveguide channel structure working in W waveband and TR module |
| CN113451732A (en) * | 2021-08-30 | 2021-09-28 | 成都雷电微力科技股份有限公司 | Novel airtight tile formula phased array antenna |
| CN114337720A (en) * | 2022-03-11 | 2022-04-12 | 成都雷电微力科技股份有限公司 | Phased array antenna radio frequency front end assembly and system |
| CN117497532A (en) * | 2024-01-02 | 2024-02-02 | 成都雷电微力科技股份有限公司 | AIP three-dimensional stacking TR airtight packaging assembly |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112003003A (en) * | 2020-08-27 | 2020-11-27 | 成都天锐星通科技有限公司 | Phased array antenna structure and electronic device |
| CN112003631A (en) * | 2020-08-28 | 2020-11-27 | 成都天锐星通科技有限公司 | Transceiver assembly and electronic device |
| CN112271448A (en) * | 2020-09-25 | 2021-01-26 | 北京空间飞行器总体设计部 | Phased array antenna of tile formula layering framework |
| CN112216944A (en) * | 2020-12-14 | 2021-01-12 | 成都雷电微力科技股份有限公司 | Liquid cooling heat radiation structure and array structure of high-power tile type active phased array |
| CN113067191B (en) * | 2021-03-19 | 2022-03-01 | 成都雷电微晶科技有限公司 | Tile type module power supply switching structure |
| CN113067191A (en) * | 2021-03-19 | 2021-07-02 | 成都雷电微晶科技有限公司 | Tile type module power supply switching structure |
| CN112994760A (en) * | 2021-04-26 | 2021-06-18 | 成都雷电微晶科技有限公司 | Multi-beam tile type TR (transmitter-receiver) component with high integration degree |
| CN112996329A (en) * | 2021-04-29 | 2021-06-18 | 成都天锐星通科技有限公司 | Phased array antenna |
| CN113299610A (en) * | 2021-05-21 | 2021-08-24 | 中国电子科技集团公司第二十九研究所 | High-reliability packaging structure and packaging method for microwave part cover plate |
| CN113271118A (en) * | 2021-07-20 | 2021-08-17 | 成都雷电微力科技股份有限公司 | Dual-frequency dual-polarization TR module |
| CN113437464A (en) * | 2021-08-27 | 2021-09-24 | 成都雷电微晶科技有限公司 | Double-waveguide/multi-waveguide channel structure working in W waveband and TR module |
| CN113451732A (en) * | 2021-08-30 | 2021-09-28 | 成都雷电微力科技股份有限公司 | Novel airtight tile formula phased array antenna |
| CN113451732B (en) * | 2021-08-30 | 2021-11-23 | 成都雷电微力科技股份有限公司 | Novel airtight tile formula phased array antenna |
| CN114337720A (en) * | 2022-03-11 | 2022-04-12 | 成都雷电微力科技股份有限公司 | Phased array antenna radio frequency front end assembly and system |
| CN117497532A (en) * | 2024-01-02 | 2024-02-02 | 成都雷电微力科技股份有限公司 | AIP three-dimensional stacking TR airtight packaging assembly |
| CN117497532B (en) * | 2024-01-02 | 2024-04-09 | 成都雷电微力科技股份有限公司 | AIP three-dimensional stacking TR airtight packaging assembly |
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