CN113329588A - Tool for testing replaceable runner assembly of liquid cooling heat dissipation capacity - Google Patents
Tool for testing replaceable runner assembly of liquid cooling heat dissipation capacity Download PDFInfo
- Publication number
- CN113329588A CN113329588A CN202110348625.7A CN202110348625A CN113329588A CN 113329588 A CN113329588 A CN 113329588A CN 202110348625 A CN202110348625 A CN 202110348625A CN 113329588 A CN113329588 A CN 113329588A
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- Prior art keywords
- flow channel
- liquid
- inlet
- upper cover
- design according
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
Abstract
A tool for testing a replaceable flow channel assembly of a liquid cooling heat dissipation capacity comprises an upper cover plate, a chassis, a flow channel inlet, a flow channel outlet and a rubber gasket.
Description
Technical Field
The invention relates to the field of machinery and heat transfer, and particularly provides a tool for testing a replaceable flow channel assembly of liquid cooling heat dissipation capacity.
Background
The heat dissipation design for emerging high-power electronic devices is one of the important issues in the development of electronic equipment in recent years, the current method mainly used for forcibly dissipating heat of key components of large-scale equipment is mainly liquid cooling, and in order to improve the liquid cooling efficiency, a cooling device is often required to be finely designed, so that a flow channel design specially used for heat dissipation and cooling appears.
At present, the market is provided with few flow channels which are specially processed, and the traditional common liquid cooling can not meet the requirement under the condition that the thermal power of electronic equipment is increased day by day. However, other heat dissipation technologies are not mature, and in order to efficiently utilize the heat capacity of liquid in liquid cooling, a special cooling design needs to be performed for high-power heat sources with different thermal characteristics. In actual conditions, due to different working conditions, the theoretical design and the actual thermal environment are different, so that the design is often required to be improved. In order to save the test cost and facilitate the test, a modularized experimental device is needed.
Disclosure of Invention
In order to solve the problems, the invention provides a tool for testing a replaceable flow channel assembly of liquid cooling heat dissipation capacity, which is used for comparing and testing heat dissipation effects of different flow channels aiming at the same heat source.
In order to ensure the heat transmission efficiency, the key part of the invention adopts metal materials with higher heat conductivity, such as iron, aluminum, copper and the like, so as to ensure the heat transmission rate, ensure the stable integral structure and be difficult to overheat and damage.
The design method adopted by the invention is as follows: according to the principle of heat transfer science, the runner part is divided into an upper cover plate (102), a sealing rubber gasket (103), a bottom plate (104), a runner inlet (301), a runner (302) and a runner outlet (303), all the parts are independently designed and can be respectively processed and assembled into a whole, and the runner part can be used for experimental tests. The present invention encompasses the basic structure of each of the above components without including the specialized structure in which it is specifically designed.
The upper cover plate (102) should be made of metal material with high thermal conductivity, such as red copper, brass, aluminum, etc. The upper surface of the upper cover plate (102) is provided with a special groove which comprises a sensor inserting groove (401) and a heat source installing groove (402). The edge distance between the sensor insertion groove (401) and the heat source installation groove (402) is required to be as small as possible, but the overall mechanical structure strength is not required to be influenced. The upper cover plate (102) should also have corresponding mounting means or clamps, not shown in the schematic drawing.
The sealing rubber gasket (103) is a device for tightly connecting the upper cover plate (102) and the bottom plate (104), so that liquid leakage is avoided after the experimental device is installed, the heat of the upper cover plate is prevented from being dissipated by the bottom plate (104), the heat can be fully transmitted out from the flow channel (302), and the experimental effect is ensured.
The flow channel inlet (301) is a liquid flow channel means having a special internal structure as shown in fig. 5. The flow channel is usually provided with a plurality of liquid inlets, and the flow rates of different inlets are possibly inconsistent, so that the internal structure of the flow channel inlet (301) needs to be specially designed, and the internal structure of the flow channel inlet which is specially designed is not included in the patent. The flow channel inlet (301) has one or more liquid inlets (501) and one or more liquid outlets (502), wherein the liquid outlets (502) cooperate with the inlet (601) of the flow channel (302).
The flow passage (302) is a liquid flow passage with a special internal structure, and the patent does not include the specially designed liquid flow passage structure. The basic structure of the flow channel (302) is shown in fig. 6. The flow channel (302) is provided with a liquid inflow inlet (601) and a corresponding outlet so as to achieve the purpose of liquid flow.
The flow channel outlet (303) is a means for recovering the liquid and discharging it, as shown in fig. 7.
The runner inlet (301), the runner (302) and the runner outlet (303) are arranged in the bottom plate (104), wherein the bottom plate (104) is designed to be matched with the structural dimensions of the runner inlet (301), the runner (302) and the runner outlet (303) tightly. The bottom plate (104) is provided with a specially designed flow channel placing groove (802) and an interface (801) communicated with an external pipeline. The base plate (104) should also have corresponding mounting means or clamps, not shown in the schematic.
Drawings
FIG. 1 is a schematic representation of the use of the present invention.
Fig. 2 is an assembled external view of the present invention.
Fig. 3 is a schematic view of the present invention with the upper cover plate (102) and the sealing rubber pad (103) removed after assembly.
Fig. 4 is a schematic view of the structure of the upper cover plate of the present invention.
Fig. 5 is a schematic view of the structure of the flow channel inlet of the present invention.
FIG. 6 is a schematic view of the flow channel structure of the present invention.
Fig. 7 is a schematic view of the outlet structure of the flow channel of the present invention.
Fig. 8 is a schematic view of the structure of the base plate of the present invention.
Shown in the figure: 101-a heat source device; 102-an upper cover plate; 103-sealing the rubber gasket; 104-a backplane; 301-flow channel entrance; 302-a flow channel; 303-a flow channel outlet; 401-sensor insertion groove; 402-heat source installation grooves; 501-flow channel inlet liquid inlet; 502-flow channel inlet liquid outlet; 601-flow channel liquid inlet; 801-floor plumbing interface; 802-flow channel placement groove.
Detailed description of the preferred embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and examples, but the scope of the present invention is not limited to the examples described below.
The heat source device (101) is purchased from the market or designed by self, and a heat source mounting groove (402) of the upper cover plate (102) is designed according to the shape of a hot surface and a mounting method; meanwhile, the position and the shape of the sensor insertion groove (401) of the upper cover plate (102) are designed according to the used test instrument. In the present embodiment, the shape of the hot surface of the heat source used is 50mm × 50mm, and the edge has rounded corners R5 mm. In order to ensure the installation effect, the heat source installation groove (402) of the upper cover plate (102) is designed to be 50mm multiplied by 50mm, the edge of the upper cover plate is provided with a rounding R2mm, and the air of the rounding part of the edge is used for ensuring that the heat conducting medium coated when the heat source device (101) is installed can seep out.
The runner inlet (301) and the runner outlet (303) used in the embodiment are both isosceles trapezoids, wherein the included angle between the inclined side of the trapezoid and the lower bottom is an acute angle of 60 degrees, the lower bottom is 50mm long, and the upper bottom is 5mm long. The flow channel (302) used in this embodiment is square with a side length of 50 mm. The flow channel (302) and the flow channel inlet (301) used in this embodiment have a specially designed flow channel structure inside, which is not within the scope of the present invention. The thickness of the flow channel (302) and the flow channel inlet (301) and the flow channel outlet (303) used in this embodiment example is 7mm, wherein the thickness of the liquid channel part is 5mm, and the upper and lower walls are 1 mm.
Designing the bottom plate (104) according to the shape and size of the flow channel (302), the flow channel inlet (301) and the flow channel outlet (303), as shown in fig. 8; placing the runner (302) and the runner inlet (301) and outlet (303) in the bottom plate (104), as shown in fig. 3; installing the sealing rubber gasket (103) and the upper cover plate (102) as shown in figure 2; the heat source device (101) was mounted on the flow channel experimental apparatus as shown in fig. 1. After the test, the tightness is tested, and the test is correct, so that the test of the related heat dissipation flow channel can be carried out.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (8)
1. The utility model provides a frock for testing liquid cooling heat-sinking capability's removable runner subassembly which characterized in that: the testing device is split into an upper cover plate, a sealing rubber mat, a bottom plate, a flow channel inlet, a flow channel and a flow channel outlet by using a modular design, and all parts are independently designed.
2. The upper cover plate design of claim 1, having a customized recess comprising a sensor receiving slot, a heat source mounting slot.
3. A flow channel inlet design according to claim 1, having one or more liquid inlets and one or more liquid outlets.
4. A flow channel design according to claim 1 with liquid inlets and corresponding outlets for liquid flow purposes, the liquid inlets of which are adapted to the liquid outlets of a flow channel inlet design according to claim 3.
5. A flow channel outlet design according to claim 1 for liquid recovery and discharge, having one or more liquid inlets and one or more liquid outlets. The liquid inlet of which cooperates with the liquid outlet of a flow channel design according to claim 4.
6. A floor design according to claims 1-5, with flow channel receiving slots for close fitting with the flow channel inlet, flow channel outlet and interfaces for connection to external piping.
7. The sealing rubber gasket of claim 1-6, which seals and blocks the heat transfer between the upper cover plate and the bottom plate.
8. An assembly of parts according to claims 1-7, for comparative experimental testing of different flow paths for the same heat source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110348625.7A CN113329588A (en) | 2021-08-02 | 2021-08-02 | Tool for testing replaceable runner assembly of liquid cooling heat dissipation capacity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110348625.7A CN113329588A (en) | 2021-08-02 | 2021-08-02 | Tool for testing replaceable runner assembly of liquid cooling heat dissipation capacity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113329588A true CN113329588A (en) | 2021-08-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110348625.7A Pending CN113329588A (en) | 2021-08-02 | 2021-08-02 | Tool for testing replaceable runner assembly of liquid cooling heat dissipation capacity |
Country Status (1)
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| CN (1) | CN113329588A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1051169A (en) * | 1996-08-06 | 1998-02-20 | Advantest Corp | Semiconductor device mounting heat generating element |
| US20100032147A1 (en) * | 2008-08-08 | 2010-02-11 | Mikros Manufacturing, Inc. | Heat exchanger having winding micro-channels |
| CN103413007A (en) * | 2013-08-28 | 2013-11-27 | 电子科技大学 | Optimization design method for semiconductor cooling module |
| CN204442897U (en) * | 2015-03-25 | 2015-07-01 | 中国电子科技集团公司第二十九研究所 | A kind of lightweight package alloy liquid cooling radiator structure |
| CN105658030A (en) * | 2016-01-11 | 2016-06-08 | 中国电子科技集团公司第十研究所 | Corrosion-resistant modular integrated frame |
| CN206024381U (en) * | 2016-08-22 | 2017-03-15 | 阳光电源股份有限公司 | Radiating liquid cooling apparatus and the power electronic equipment with the radiating liquid cooling apparatus |
| CN109219305A (en) * | 2017-06-29 | 2019-01-15 | 中航光电科技股份有限公司 | A kind of Liquid cooling chasis and its plug-in unit |
-
2021
- 2021-08-02 CN CN202110348625.7A patent/CN113329588A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1051169A (en) * | 1996-08-06 | 1998-02-20 | Advantest Corp | Semiconductor device mounting heat generating element |
| US20100032147A1 (en) * | 2008-08-08 | 2010-02-11 | Mikros Manufacturing, Inc. | Heat exchanger having winding micro-channels |
| CN103413007A (en) * | 2013-08-28 | 2013-11-27 | 电子科技大学 | Optimization design method for semiconductor cooling module |
| CN204442897U (en) * | 2015-03-25 | 2015-07-01 | 中国电子科技集团公司第二十九研究所 | A kind of lightweight package alloy liquid cooling radiator structure |
| CN105658030A (en) * | 2016-01-11 | 2016-06-08 | 中国电子科技集团公司第十研究所 | Corrosion-resistant modular integrated frame |
| CN206024381U (en) * | 2016-08-22 | 2017-03-15 | 阳光电源股份有限公司 | Radiating liquid cooling apparatus and the power electronic equipment with the radiating liquid cooling apparatus |
| CN109219305A (en) * | 2017-06-29 | 2019-01-15 | 中航光电科技股份有限公司 | A kind of Liquid cooling chasis and its plug-in unit |
Non-Patent Citations (1)
| Title |
|---|
| 王广平: "均温热沉的液冷循环系统设计", 《中国优秀硕士学位论文全文数据库工程科技Ⅱ辑》 * |
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Application publication date: 20210831 |
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