CN210835956U

CN210835956U - Water cooling mechanism for CPU

Info

Publication number: CN210835956U
Application number: CN201922200088.2U
Authority: CN
Inventors: 龙银香; 李彦融; 黄耀章; 李恒
Original assignee: Guangdong Polytechnic of Water Resources and Electric Engineering Guangdong Water Resources and Electric Power Technical School
Current assignee: Guangdong Polytechnic of Water Resources and Electric Engineering Guangdong Water Resources and Electric Power Technical School
Priority date: 2019-12-10
Filing date: 2019-12-10
Publication date: 2020-06-23
Anticipated expiration: 2029-12-10

Abstract

The utility model discloses a water-cooling mechanism for CPU, including control box and first water tank, the inside fixedly connected with cooling tube that alternates of first water tank, the left end fixedly connected with second back flow of cooling tube, the first connecting pipe of right-hand member fixedly connected with of cooling tube, the right-hand member fixedly connected with second water tank of first connecting tube, the upper end fixedly connected with second connecting pipe of second water tank, the upper end fixedly connected with backwash pump of second connecting pipe, the first back flow pipe of upper end fixedly connected with of backwash pump, the common fixedly connected with heat-transfer device in upper end of first back flow pipe and second back flow, heat-transfer device's front end fixedly connected with auxiliary heat abstractor, control box and backwash pump electric connection. A water-cooling mechanism for CPU, whole device simple structure, easily equipment and installation have improved whole installation convenience and waterproof nature when having improved the cooling effect.

Description

Water cooling mechanism for CPU

Technical Field

The utility model relates to an electronic product heat dissipation technical field, in particular to a water-cooling mechanism for CPU.

Background

At present, a heat dissipation mechanism for a CPU chip in a computer mainly adopts a fan matched with heat dissipation fins to dissipate heat of the CPU chip, the heat dissipation effect is limited, the installation is troublesome, and blades of the fan easily enter dust to influence the rotation of the fan, further influence the heat dissipation effect, cause abnormal work of the CPU chip, slow operation, influence the working progress and even cause loss; although the water-cooling heat dissipation mechanism has better heat dissipation performance and good heat dissipation silencing performance, the water-cooling heat dissipation mechanism is inconvenient to install because the computer mainboard needs to be detached in the installation process, and the water-cooling heat dissipation mechanism has a plurality of joints with water leakage risks, so that the application of the water-cooling heat dissipation mechanism in the CPU heat dissipation is limited. Therefore, a novel water cooling mechanism for the CPU is provided.

Disclosure of Invention

The utility model discloses a main aim at provides a water-cooling mechanism for CPU can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a water-cooling mechanism for CPU, includes control box and first water tank, the inside fixedly connected with cooling tube that alternates of first water tank, the left end fixedly connected with second back flow of cooling tube, the first connecting pipe of right-hand member fixedly connected with of cooling tube, the right-hand member fixedly connected with second water tank of first connecting tube, the upper end fixedly connected with second connecting pipe of second water tank, the upper end fixedly connected with backwash pump of second connecting pipe, the first reflux pipe of upper end fixedly connected with of backwash pump, the common fixedly connected with heat abstractor in upper end of first reflux pipe and second back flow, heat abstractor's front end fixedly connected with auxiliary heat abstractor, the equal fixedly connected with inlet tube in front end upper portion and the front end lower part of first water tank, control box and backwash pump electric connection.

Preferably, the auxiliary heat dissipation device comprises an installation cover, a grid is fixedly installed at the front end of the installation cover, four connecting blocks distributed in an annular array are fixedly installed inside the installation cover, and two through grooves are formed in the lower end of the installation cover.

Preferably, the heat conducting device comprises a heat conducting plate, four fixed pipe seats distributed in an annular array are fixedly mounted in the middle of the front end of the heat conducting plate, the front end of the heat conducting plate is fixedly connected with a heat conducting pipe through the fixed pipe seats, and the left end and the right end of the heat conducting pipe are fixedly connected with the second return pipe and the first return pipe respectively.

Preferably, the front end of the heat conducting plate is in threaded connection with the rear end of the connecting block, and the lower end left part and the lower end right part of the heat conducting pipe penetrate through the through groove.

Preferably, the cooling pipe is obliquely installed inside the first water tank, the left side of the cooling pipe is higher than the right side of the cooling pipe, and waterproof gaskets are arranged at the joints of the first water tank and the cooling pipe.

Preferably, the rear end face of the heat conducting plate and the rear end face of the mounting cover are in the same horizontal plane, and the rear end of the heat conducting plate is fixedly connected with the CPU through heat conducting viscose.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses in, can absorb CPU produced heat in service through heat-conducting plate and heat pipe, can cool off through cooling tube and first water tank and absorbed thermal cooling water, through the backwash pump, first back flow pipe and second back flow can make whole cooling process continuous going on, the cooling water has advanced in the cooling tube and has advanced, the time that the cooling water stops in first water tank has been prolonged, the cooling effect is improved, whole device simple structure, easily equipment and installation, whole installation convenience and waterproof nature have been improved when having improved the cooling effect.

Drawings

Fig. 1 is a schematic diagram of an overall structure of a water cooling mechanism for a CPU according to the present invention;

fig. 2 is a schematic view of the overall structure of an auxiliary heat dissipation mechanism of a water cooling mechanism for a CPU according to the present invention;

fig. 3 is a schematic view of the overall structure of a heat conducting mechanism of a water cooling mechanism for a CPU according to the present invention;

fig. 4 is a schematic view of the connection between the auxiliary heat dissipation mechanism and the heat conduction mechanism of the water cooling mechanism for the CPU.

In the figure: 1. a control box; 2. a first water tank; 3. a first connecting pipe; 4. a second water tank; 5. a second connecting pipe; 6. a first return pipe; 7. a second return pipe; 8. an auxiliary heat sink; 9. a heat conducting device; 10. a reflux pump; 11. a cooling tube; 12. a water inlet pipe; 81. installing a cover; 82. a grid; 83. connecting blocks; 84. a through groove; 91. a heat conducting plate; 92. a pipe fixing seat; 93. a heat conducting pipe.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-4, a water cooling mechanism for a CPU, includes a control box 1 and a first water tank 2, a cooling pipe 11 fixedly connected to the inside of the first water tank 2 is inserted, a second return pipe 7 is fixedly connected to the left end of the cooling pipe 11, a first connecting pipe 3 is fixedly connected to the right end of the cooling pipe 11, a second water tank 4 is fixedly connected to the right end of the first connecting pipe 3, a second connecting pipe 5 is fixedly connected to the upper end of the second water tank 4, a return pump 10 is fixedly connected to the upper end of the second connecting pipe 5, a first return pipe 6 is fixedly connected to the upper end of the return pump 10, a heat conducting device 9 is fixedly connected to the upper ends of the first return pipe 6 and the second return pipe 7, an auxiliary heat dissipating device 8 is fixedly connected to the front end of the heat conducting device 9, water inlet pipes 12 are fixedly connected to the upper portion and the lower portion of the front end.

The auxiliary heat dissipation device 8 comprises an installation cover 81, a grid 82 is fixedly installed at the front end of the installation cover 81, the grid 82 plays a role in pouring air into the heat conduction device 9 for auxiliary cooling, four connecting blocks 83 distributed in an annular array are fixedly installed inside the installation cover 81, the connecting blocks 83 play a role in fixedly connecting the heat conduction plate 91 with the installation cover 81, and two through grooves 84 are formed in the lower end of the installation cover 81; the heat conducting device 9 comprises a heat conducting plate 91, the heat conducting plate 91 is fixedly connected with the CPU, the heat conducting plate 91 can absorb heat generated by the CPU in the using process and conduct the heat to a heat conducting pipe 93, four fixed pipe seats 92 distributed in an annular array are fixedly installed in the middle of the front end of the heat conducting plate 91, the front end of the heat conducting plate 91 is fixedly connected with the heat conducting pipe 93 through the fixed pipe seats 92, the heat conducting pipe 93 can absorb and take away the heat through cooling water in the heat conducting pipe 93 to achieve the effect of cooling the CPU, the left end and the right end of the heat conducting pipe 93 are respectively fixedly connected with the second return pipe 7 and the first return pipe 6, and water which has absorbed the heat in the heat conducting pipe 93 can flow into; the front end of the heat conducting plate 91 is in threaded connection with the rear end of the connecting block 83, and the left part and the right part of the lower end of the heat conducting pipe 93 penetrate through the through groove 84; the cooling pipe 11 is obliquely arranged in the first water tank 2, the left side of the cooling pipe 11 is higher than the right side of the cooling pipe, so that the stay time of cooling water in the cooling pipe 11 in the first water tank 2 can be prolonged, the cooling effect is improved, and waterproof gaskets are arranged at the joints of the first water tank 2 and the cooling pipe 11, so that the waterproofness of the device is improved; the rear end face of the heat conducting plate 91 and the rear end face of the mounting cover 81 are in the same horizontal plane, and the rear end of the heat conducting plate 91 is fixedly connected with the CPU through heat conducting viscose.

It should be noted that, the present invention is a water cooling mechanism for CPU, the auxiliary heat sink 8 and the heat conducting device 9 can be fixed on the CPU through the mounting cover 81, so as to improve the convenience of installation, during the use process, the user firstly fixes the heat conducting pipe 93 on the heat conducting plate 91 through the solid pipe seat 92, and fixedly connects the mounting cover 81 and the heat conducting plate 91 through the bolt and the connecting block 83, the right end of the cooling pipe 11 transversely passes through the first water tank 2 and is fixedly connected with the second water tank 4 through the first connecting pipe 3, the second water tank 4 is fixedly connected with the first return pipe 6 through the second connecting pipe 5 and the return pump 10, and then fixedly connects the left end of the heat conducting pipe 93 with the second return pipe 7, so as to form a closed water path, then opens the cover of the second water tank 4 and pours the cooling water into the second water tank 4, the return pump 10 is started to circulate the cooling water in the closed water path, then fill first water tank 2 through inlet tube 12 and then close inlet tube 12, whole device simple structure, the erection joint is convenient, has reduced the risk of leaking of whole device in the use.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A water-cooling mechanism for CPU, includes control box (1) and first water tank (2), its characterized in that: a cooling pipe (11) is fixedly connected to the inside of the first water tank (2) in an inserting manner, a second return pipe (7) is fixedly connected to the left end of the cooling pipe (11), a first connecting pipe (3) is fixedly connected to the right end of the cooling pipe (11), a second water tank (4) is fixedly connected to the right end of the first connecting pipe (3), a second connecting pipe (5) is fixedly connected to the upper end of the second water tank (4), a return pump (10) is fixedly connected to the upper end of the second connecting pipe (5), a first return pipe (6) is fixedly connected to the upper end of the return pump (10), a heat conducting device (9) is fixedly connected to the upper ends of the first return pipe (6) and the second return pipe (7) together, an auxiliary heat radiating device (8) is fixedly connected to the front end of the heat conducting device (9), and a water inlet pipe (12) is fixedly connected to the upper portion and the lower portion of, the control box (1) is electrically connected with the reflux pump (10).

2. The water cooling mechanism for a CPU as claimed in claim 1, wherein: the auxiliary heat dissipation device (8) comprises an installation cover (81), a grid (82) is fixedly installed at the front end of the installation cover (81), four connecting blocks (83) distributed in an annular array are fixedly installed inside the installation cover (81), and two through grooves (84) are formed in the lower end of the installation cover (81).

3. The water cooling mechanism for a CPU as claimed in claim 1, wherein: heat-conducting device (9) include heat-conducting plate (91), the front end middle part fixed mounting of heat-conducting plate (91) has solid tube socket (92) that four annular array distribute, the front end of heat-conducting plate (91) is through solid tube socket (92) fixedly connected with heat pipe (93), the left end and the right-hand member of heat pipe (93) respectively with second back flow pipe (7) and first back flow pipe (6) fixed connection.

4. The water cooling mechanism for a CPU as claimed in claim 3, wherein: the front end of the heat conducting plate (91) is in threaded connection with the rear end of the connecting block (83), and the left part and the right part of the lower end of the heat conducting plate (93) penetrate through the through groove (84).

5. The water cooling mechanism for a CPU as claimed in claim 1, wherein: the cooling pipe (11) is obliquely installed inside the first water tank (2), the left side of the cooling pipe (11) is higher than the right side of the cooling pipe, and waterproof gaskets are arranged at the joints of the first water tank (2) and the cooling pipe (11).

6. The water cooling mechanism for a CPU as claimed in claim 3, wherein: the rear end face of the heat conducting plate (91) and the rear end face of the mounting cover (81) are on the same horizontal plane, and the rear end of the heat conducting plate (91) is fixedly connected with the CPU through heat conducting viscose.