CN213582055U

CN213582055U - Computer water cooling plant

Info

Publication number: CN213582055U
Application number: CN202022816725.1U
Authority: CN
Inventors: 曹敏清
Original assignee: Individual
Current assignee: Guangdong Zhirong Information Technology Co.,Ltd.
Priority date: 2020-11-30
Filing date: 2020-11-30
Publication date: 2021-06-29
Anticipated expiration: 2030-11-30

Abstract

The utility model discloses a computer water cooling plant relates to computer accessories technical field, including the mainframe box, CPU and display card are installed to the inner wall of mainframe box, the water tank is installed at the top of magnet board, one side of water tank is provided with first water supply connector, one side of first water supply connector is provided with first inlet tube, first booster pump is installed to one side of first inlet tube, the sealed cowling is connected to the output of first inlet tube, one side of sealed cowling is provided with the thin copper board, one side of thin copper board is provided with heat conduction silica gel layer, heat dissipation coil pipe is installed to the inner wall of thin copper board, the heat preservation is installed to the inner wall of sealed cowling, one side of sealed cowling is connected with first outlet pipe, the one end of first outlet pipe is connected with first refrigeration head. The utility model discloses the effectual installation procedure of having solved complicacy, the refrigeration effect is not good, has improved a large amount of times of user and has increased user's use interest.

Description

Computer water cooling plant

Technical Field

The utility model relates to a computer fittings technical field specifically is a computer water cooling plant.

Background

With the performance of computer systems gradually increasing, the heat generated by electronic components such as CPUs, display cards and the like due to operation is inevitably increased, and in order to solve the problem of heat generation, a heat dissipation system is usually used to dissipate heat quickly, so as to prevent the electronic components from being overheated and reducing their life or being damaged. The existing heat dissipation systems mainly include a wind cooling heat dissipation system and a water cooling heat dissipation system, wherein the water cooling heat dissipation system has been largely applied to the heat dissipation of the CPU due to its remarkable heat dissipation performance and low noise, and has become one of the important development trends of computer cooling systems.

However, the existing water-cooling heat dissipation device has some disadvantages: at first, the existing device is too cumbersome to install, dismantle and clean, a host computer needs to be completely removed when some devices are installed and disassembled, time and energy are wasted, and although the structure of the device is complex, the heat dissipation effect of a CPU and a display card is poor, so that the use experience of a user is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a: the problem that the installation and the removal are too cumbersome when washing, the host computer needs to be completely removed when some devices are installed and disassembled, time and energy are wasted, the heat dissipation effect of a CPU and a display card is poor although the structure of the device is complex, and the use experience of a user is influenced is solved.

In order to achieve the above object, the utility model provides a following technical scheme: a computer water cooling device comprises a mainframe box, wherein a CPU and a display card are installed on the inner wall of the mainframe box, a magnet plate is installed on the top of the mainframe box, a water tank is installed on the top of the magnet plate, a first water inlet connector is arranged on one side of the water tank, a first water inlet pipe is arranged on one side of the first water inlet pipe, a first booster pump is installed on one side of the first water inlet pipe, a sealing cover is connected with the output end of the first water inlet pipe, a thin copper plate is arranged on one side of the sealing cover, a heat conduction silicon glue layer is arranged on one side of the thin copper plate, a heat dissipation coil pipe is installed on the inner wall of the thin copper plate, a heat insulation layer is installed on the inner wall of the sealing cover, a first water outlet pipe is connected to one side of the sealing cover, a first refrigerating head is connected to one end of the first water outlet pipe, a first water outlet connector is connected to, one side of second water supply connector is connected with the second inlet tube, the second booster pump is installed to the outer wall of second inlet tube, the loose joint of second is connected to the output of second inlet tube, one side fixedly connected with second outlet pipe that the second loosed the joint, the one end of second outlet pipe is connected with the second refrigeration head, the output of second outlet pipe is connected with second water connectors.

Preferably, two limiting blocks and four bolts are installed on the outer wall of the sealing cover and are installed on two sides of the sealing cover.

Preferably, the heat dissipation coil pipe is connected in a multi-pipe mode and is evenly distributed and attached to the outer wall of the thin copper plate.

Preferably, the limiting block is detachably connected with the CPU through a bolt.

Preferably, two ends of the heat dissipation coil are respectively connected with two ends of the first water inlet pipe and two ends of the first water outlet pipe.

Preferably, the first refrigeration head and the first booster pump are respectively electrically connected with an externally arranged controller.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a setting of water tank, magnet board, first water swivel, stopper and bolt, first water swivel is connected with the water tank through first water swivel, and the magnet board adsorbs at the top of computer, stopper and bolt with CPU fixed can, the effectual complicated installation procedure of having solved has solved a large amount of time of user.

2. The utility model discloses a setting of first booster pump, first heat radiation structure, first refrigeration head and the scattered joint of second, water pours into the seal cover into from first inlet tube into, flows into the heat dissipation coil pipe that sets up in the seal cover, flows out from first outlet pipe again and reaches radiating effect, the effectual not good problem that influences user experience of heat dissipation of having solved.

Drawings

FIG. 1 is a side cross-sectional view of the present invention;

fig. 2 is a front view of the present invention;

fig. 3 is a top view of the present invention;

fig. 4 is a view of the heat dissipation coil of the present invention.

In the figure: 1. a main chassis; 2. a water tank; 3. a magnet plate; 4. a CPU; 5. a display card; 6. a first heat dissipation structure; 7. a second loose joint; 8. a first water outlet joint; 9. a first refrigeration head; 10. a first water inlet joint; 11. a first booster pump; 12. a first water inlet pipe; 13. a first water outlet pipe; 14. a second water inlet pipe; 15. a second water outlet pipe; 16. a heat conductive silica gel layer; 17. a thin copper plate; 18. a heat-dissipating coil pipe; 19. a limiting block; 20. a bolt; 21. a sealing cover; 22. a heat-insulating layer; 23. a second refrigeration head; 24. a second booster pump; 25. a second water outlet joint; 26. and a second water inlet joint.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "connected" and "disposed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. The following describes an embodiment of the present invention according to its overall structure.

Referring to fig. 1-4, a computer water cooling device includes a main cabinet 1, a CPU4 and a display card 5 are installed on an inner wall of the main cabinet 1, a magnet plate 3 is installed on a top of the main cabinet 1, a water tank 2 is installed on a top of the magnet plate 3, a first water inlet connector 10 is installed on one side of the water tank 2, a first water inlet pipe is installed on one side of the first water inlet connector 10, a first booster pump 11 is installed on one side of a first water inlet pipe 12, an output end of the first water inlet pipe 12 is connected with a sealing cover 21, a thin copper plate 17 is installed on one side of the sealing cover 21, a heat conductive silicone layer 16 is installed on one side of the thin copper plate 17, a heat dissipation coil 18 is installed on an inner wall of the thin copper plate 17, a heat insulation layer 22 is installed on an inner wall of the sealing cover 21, a first water outlet pipe 13 is connected to one end of the first water outlet pipe 13, a first cooling, a second water inlet connector 26 is installed on one side of the water tank 2, a second water inlet pipe 14 is connected to one side of the second water inlet connector 26, a second booster pump 24 is installed on the outer wall of the second water inlet pipe 14, the output end of the second water inlet pipe 14 is connected with a second loose connector 7, a second water outlet pipe 15 is fixedly connected to one side of the second loose connector 7, one end of the second water outlet pipe 15 is connected with a second refrigerating head 23, and the output end of the second water outlet pipe 15 is connected with a second water outlet connector 25.

Please refer to fig. 1 and fig. 2, two limiting blocks 19 and four bolts 20 are installed on the outer wall of the sealing cover 21 and are installed on two sides of the sealing cover 21 for fixing and preventing falling off.

Please refer to fig. 1, the heat dissipation coil 18 is connected with multiple pipes and is uniformly distributed and attached to the outer wall of the thin copper plate 17, so that the water can flow circularly and absorb heat more quickly.

Referring to fig. 1, the stopper 19 is detachably connected to the CPU4 through a bolt 20, so as to facilitate the detachment and fixation of the first thermal connector 6.

Referring to fig. 1, two ends of the heat dissipation coil 18 are respectively connected to two ends of the first water inlet pipe 12 and the first water outlet pipe 13, so as to facilitate the circulation of water.

Please refer to fig. 1, the first cooling head 9 and the first booster pump 11 are electrically connected to an external controller respectively, so that the switch is convenient when the refrigerator is used.

The working principle is as follows: when the water cooling device is used, the water tank 2 is adsorbed at the top of the mainframe box 1 through the magnet plate 3, the first water inlet pipe is connected with the water tank 2 through the first water inlet connector 10, the first water outlet pipe 13 is connected with the water tank 2 through the first water outlet connector 8, the sealing cover 21 is fixed on the CPU4 through the limiting block 19 and the bolt 20, the first water inlet connector 10 and the first refrigerating head 9 are opened, water is pressed into the first water inlet pipe through the first water inlet connector 10 and then flows into the output end sealing cover 21 of the first water inlet pipe, the heat dissipation coil 18 is connected with the inner wall of the sealing cover 21, water enters the heat dissipation coil 18, the water takes away heat after entering the heat dissipation coil 18, the first water outlet pipe 13 is connected with one end of the heat dissipation coil 18, the water reaches the first refrigerating head 9 through the first water outlet pipe 13 under the action of the pressure, the first refrigerating head 9 cools the water flowing into the water tank 2 due to the refrigerating action, the circulation effect achieves the effect of heat dissipation, and the heat dissipation mode of the display card 5 is the same as that of the CPU 4.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a computer water cooling plant, includes mainframe box (1), its characterized in that: CPU (4) and display card (5) are installed to the inner wall of mainframe box (1), magnet board (3) are installed at the top of mainframe box (1), water tank (2) are installed at the top of magnet board (3), one side of water tank (2) is provided with first water supply connector (10), one side of first water supply connector (10) is provided with first inlet tube (12), first booster pump (11) is installed to one side of first inlet tube (12), the output of first inlet tube is connected with seal cover (21), one side of seal cover (21) is provided with thin copper plate (17), one side of thin copper plate (17) is provided with heat conduction silica gel layer (16), heat dissipation coil pipe (18) are installed to the inner wall of thin copper plate (17), heat preservation (22) are installed to the inner wall of seal cover (21), one side of seal cover (21) is connected with first outlet pipe (13), the one end of first outlet pipe (13) is connected with first refrigeration head (9), the one end of first refrigeration head (9) is connected with first water connectors (8), second water connectors (26) are installed to one side of water tank (2), one side of second water connectors (26) is connected with second inlet tube (14), second booster pump (24) are installed to the outer wall of second inlet tube (14), second water connectors (7) are scattered to the output of second inlet tube (14) connection, one side fixedly connected with second outlet pipe (15) of second water connectors (7) are scattered to the second, the one end of second outlet pipe (15) is connected with second refrigeration head (23), the output of second outlet pipe (15) is connected with second water connectors (25).

2. The computer water cooling device according to claim 1, wherein: two limiting blocks (19) and four bolts (20) are installed on the outer wall of the sealing cover (21), and are installed on two sides of the sealing cover (21).

3. The computer water cooling device according to claim 1, wherein: the heat dissipation coil pipes (18) are connected in a multi-pipe mode and are evenly distributed and attached to the outer wall of the thin copper plate (17).

4. The computer water cooling device according to claim 2, characterized in that: the limiting block (19) is detachably connected with the CPU (4) through a bolt (20).

5. The computer water cooling device according to claim 1, wherein: and two ends of the heat dissipation coil (18) are respectively connected with two ends of the first water inlet pipe (12) and two ends of the first water outlet pipe (13).

6. The computer water cooling device according to claim 1, wherein: the first refrigerating head (9) and the first booster pump (11) are respectively electrically connected with a controller arranged outside.