WO2023078397A1

WO2023078397A1 - Liquid cooling server

Info

Publication number: WO2023078397A1
Application number: PCT/CN2022/129901
Authority: WO
Inventors: 舒建军
Original assignee: 北京比特大陆科技有限公司
Priority date: 2021-11-05
Filing date: 2022-11-04
Publication date: 2023-05-11
Also published as: CN216486343U

Abstract

A liquid cooling server (100), comprising a server body (110), a power supply (120), a water distributor (130), and a pipeline assembly (140). The server body (110) comprises at least two computing power units (111). Each computing power unit (111) comprises a computing power piece (1111) and a first liquid cooling radiator (1112) for dissipating heat of the computing power piece (1111). The first liquid cooling radiator (1112) comprises first liquid inlets (1103) and first liquid outlets (1104). The power supply (120) comprises an electric control board (121) and a second liquid cooling radiator (122) for dissipating heat of the electric control board (121). The water distributor (130) is mounted on the server body (110). The at least two first liquid inlets (1103) or the at least two first liquid outlets (1104) are connected to the water distributor (130) by means of the pipeline assembly (140). Heat of both the server body and the power supply is dissipated by means of water cooling, and energy consumption is reduced. After a fan is removed, the liquid cooling server has good sealing performance so as to improve the overall reliability of the liquid cooling server. Moreover, the water distributor is arranged to reduce the number of water pipes connected to an external water path system, so that the field deployment efficiency can be improved.

Description

liquid cooling server

technical field

The present application relates to the field of servers, in particular to a liquid-cooled server.

Background technique

At present, there are three cooling methods for servers. The first is to use fans to cool the server body and power supply; the second is to use water cooling for the server body and air cooling for the power supply; the third is to use water cooling for both the server body and power supply. Heat dissipation. However, as far as the first and second heat dissipation methods are concerned, the fan needs power to drive, which is not conducive to environmental protection and energy saving. Moreover, the fan is a high-speed operating component and is easily damaged. The use of the fan reduces the overall reliability of the server. The third way to dissipate heat is to directly connect the server body and power supply to the external waterway system. The number of water pipes connected to the external waterway system is large, resulting in low deployment efficiency on site. Therefore, it is necessary to design a server body and power supply that use A server that is water-cooled to dissipate heat and reduce the number of water pipes connected to the external water system.

Contents of the invention

The purpose of this application is to provide a liquid-cooled server, which aims to solve the technical problem that both the server body and the power supply use water cooling for heat dissipation and can reduce the number of water pipes connected to the external water system.

In order to achieve the above purpose, the solution provided by this application is: a liquid-cooled server, including:

The server body, the server body includes at least two computing power units, each of the computing power units includes a computing power chip and a first liquid cooling radiator for dissipating heat from the computing power chip, the first The liquid cooling includes a first liquid inlet and a first liquid outlet;

A power supply, the power supply is installed on one side of the server body, the power supply includes an electric control board and a second liquid cooling radiator for dissipating heat from the electric control board, and the second liquid cooling radiator includes The second liquid inlet and the second liquid outlet;

A water distributor, the water distributor is installed on the server body;

In the pipe assembly, at least two of the first liquid inlets or at least two of the first liquid outlets are connected to the water separator through the pipe assembly.

Optionally, the water separator includes a first water separator, the pipeline assembly includes first connecting pipes having the same number as the number of the first liquid inlets, and the first water separator includes a first inner cavity and one more first transfer port than the number of the first liquid inlets, one of the first transfer ports is used to connect to an external water supply pipeline, and the remaining first transfer ports pass through one of the first transfer ports respectively. The first connecting pipe is connected to one of the first liquid inlets.

Optionally, the water separator includes a second water separator, the pipeline assembly includes a second connecting pipe and a third connecting pipe having the same number as the number of the first liquid outlets, and the second water separator It includes a second inner cavity and a second adapter whose number is one more than that of the first liquid outlet, one of the second adapters is connected to the second liquid inlet through the second connecting pipe, and the rest Each of the second transfer ports is respectively connected to one of the first liquid outlets through one of the third connecting pipes; the second liquid outlet is used to connect with an external water outlet pipeline.

Optionally, the water separator includes a third water separator, the pipeline assembly includes a fourth connecting pipe and fifth connecting pipes whose number is the same as that of the first liquid outlet, and the third water separator It includes a third inner cavity and a third transfer port whose number is one more than that of the first liquid outlet, one of the third transfer ports is connected to the second liquid outlet through the fourth connecting tube, and the rest Each of the third transfer ports is respectively connected to one of the first liquid outlets through one of the fifth connecting pipes.

Optionally, the water separator includes a fourth water separator, the pipeline assembly includes sixth connecting pipes having the same number as the first liquid inlet, and the fourth water separator includes a fourth inner cavity and The number of fourth transfer ports is one more than the number of the first liquid inlet, one of the fourth transfer ports is connected to the external water outlet pipeline, and the remaining fourth transfer ports are respectively connected through one of the sixth transfer ports The tube is connected to one of the first liquid inlets; the second liquid inlet is used for connecting with an external water supply pipeline.

Optionally, the first liquid inlet and the first liquid outlet are arranged on the same side of the first liquid cooling radiator.

Optionally, the second liquid inlet and the second liquid outlet are disposed on the same side of the second liquid cooling radiator.

Optionally, the first liquid inlet, the first liquid outlet, the second liquid inlet and the second liquid outlet are arranged on the same side of the liquid-cooled server.

Optionally, the computing power unit further includes a tray and a spring screw; the first liquid cooling radiator, the computing power sheet, and the tray are stacked in sequence and fixed by the spring screw; the computing power unit It is installed on the server body through the tray.

Optionally, the power supply further includes a thermally conductive layer, and the electric control board, the thermally conductive layer, and the second liquid-cooled radiator are sequentially stacked.

Optionally, the server body further includes a chassis, the power supply and the computing power unit are installed in the chassis, and the water divider is installed on the outer side of the chassis.

Compared with the prior art, the beneficial effects of the present application are:

Both the server body and the power supply are cooled by water to save energy consumption. After removing the fan, the liquid-cooled server has good sealing performance to improve the overall reliability of the liquid-cooled server. And by setting the water divider to reduce the number of water pipes connected to the external waterway system, it is beneficial to improve the efficiency of on-site deployment.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present application. Those skilled in the art can also obtain other drawings according to the structures shown in these drawings without creative effort.

FIG. 1 is a three-dimensional schematic diagram 1 of a liquid-cooled server provided in Embodiment 1 of the present application;

Fig. 2 is a schematic perspective view of the liquid-cooled server provided in Embodiment 1 of the present application without the pipeline assembly;

FIG. 3 is a perspective view II of the liquid-cooled server provided in Embodiment 1 of the present application;

Fig. 4 is a three-dimensional schematic diagram of a computing power unit provided in an embodiment of the present application;

FIG. 5 is a three-dimensional schematic diagram of the liquid-cooled server provided in Embodiment 1 of the present application;

FIG. 6 is a schematic plan view of the power supply provided by Embodiment 1 of the present application;

FIG. 7 is a schematic plan view of a liquid-cooled server provided in Embodiment 2 of the present application.

Explanation of reference numbers:

100. Liquid-cooled server; 110. Server body; 111. Computing unit; 1111. Computing chip; 1101. First signal input interface; 1102. Second power input interface; 1112. First liquid-cooled radiator; 1103. 1104, first liquid outlet; 1113, tray; 1114, spring screw; 112, chassis; 1121, shell; 1122, front panel; 1123, rear panel; 113, main control board; 1131, Signal output interface; 1132, first power input interface; 120, power supply; 121, electric control board; 1211, second signal input interface; 1212, power output interface; 1201, first power output interface; 1202, second power output Interface; 122, the second liquid cooling radiator; 1221, the second liquid inlet; 1222, the second liquid outlet; 123, the heat conduction layer; 130, the water separator; 131, the first water separator; 1311, the first water separator 1 transfer interface; 132, second water distributor; 1321, second transfer interface; 133, third water distributor; 1331, third transfer interface; 134, fourth water distributor; 1341, fourth transfer interface; 140 1. Pipe assembly; 141. First connecting pipe; 142. Second connecting pipe; 143. Third connecting pipe; 144. Fourth connecting pipe; 145. Fifth connecting pipe; 146. Sixth connecting pipe.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between the various components in a certain posture , if the specific posture changes, the directional indication also changes accordingly.

It should also be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element through intervening elements.

In addition, the descriptions involving "first", "second" and so on in the present application are only for the purpose of description, and should not be understood as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In addition, the technical solutions of the various embodiments can be combined with each other, but it must be based on the realization of those skilled in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist , nor within the scope of protection required by the present application.

Embodiment one:

As shown in Figures 1-6, the liquid-cooled server 100 provided by the embodiment of the present application includes a server body 110, a power supply 120, a water distributor 130, and a pipe assembly 140; the server body 110 includes at least two computing power units 111, each The computing power unit 111 includes a computing power chip 1111 and a first liquid cooling radiator 1112 for dissipating heat from the computing power chip 1111. The first liquid cooling heat dissipation includes a first liquid inlet 1103 and a first liquid outlet 1104; a power supply 120 is installed on one side of the server body 110. The power supply 120 includes an electric control board 121 and a second liquid cooling radiator 122 for dissipating heat from the electric control board 121. The second liquid cooling radiator 122 includes a second liquid inlet 1221 and the second liquid outlet 1222 ; the water distributor 130 is installed on the server body 110 ; at least two first liquid inlets 1103 or at least two first liquid outlets 1104 are connected to the water distributor 130 through the pipe assembly 140 . The server body 110 provided in this embodiment includes four computing power units 111, and each computing power unit 111 includes a first liquid inlet 1103 and a first liquid outlet 1104. Of course, in a specific application, the computing power unit 111 The number is not limited to four, for example, it may be two or three as an alternative. Both the server body 110 and the power supply 120 provided in this embodiment use water cooling to dissipate heat, which saves energy consumption. After removing the fan, the liquid-cooled server 100 has good sealing performance to improve the overall reliability of the liquid-cooled server 100 . And by setting the water separator 130 to reduce the number of water pipes connected to the external waterway system, it is beneficial to improve the efficiency of on-site deployment.

As shown in Figures 1 and 2, as an implementation, the water separator 130 includes a first water separator 131, and the pipe assembly 140 includes first connecting pipes 141 having the same number as the first liquid inlet 1103, and the first The water distributor 131 includes a first inner cavity (not shown in the figure) and a first transfer port 1311 whose number is one more than that of the first liquid inlet 1103, and one of the first transfer ports 1311 is used to connect with an external water supply pipeline , the remaining first transfer ports 1311 are respectively connected to a first liquid inlet 1103 through a first connecting pipe 141 . It should be noted that water is used as the heat dissipation medium of the liquid-cooled server 100 in this embodiment. Of course, in specific applications, the heat dissipation medium is not limited to water. For example, as an alternative, it may also be cooling liquid or silicon oil. The first inner cavity communicates with the first transfer port 1311, and the first inner cavity serves as a space medium for temporarily storing water. The first water distributor 131 provided in this embodiment is provided with five first transfer ports 1311 , and the pipe assembly 140 includes four first connecting pipes 141 . One of the first transfer ports 1311 connected to the external water supply pipeline serves as a water inlet, and the water in the external water supply pipeline enters the first inner cavity through the first transfer port 1311 .

As shown in FIGS. 1 and 2 , as an implementation, the water separator 130 includes a second water separator 132 , and the pipeline assembly 140 includes a second connecting pipe 142 and a third pipe with the same number as the first liquid outlet 1104 . The connecting pipe 143, the second water distributor 132 includes a second inner cavity (not shown in the figure) and a second transfer port 1321 whose number is one more than that of the first liquid outlet 1104, wherein one second transfer port 1321 passes through the second transfer port 1321 The second connecting pipe 142 is connected to the second liquid inlet 1221, and the remaining second transfer ports 1321 are respectively connected to a first liquid outlet 1104 through a third connecting pipe 143; the second liquid outlet 1222 is used for connecting with the external outlet. Water line connection. The second inner chamber communicates with the second transfer port 1321, and the second inner chamber serves as a space medium for temporarily storing water. The second water separator 132 provided in this embodiment is provided with five second transfer ports 1321 , and the pipe assembly 140 includes four third connecting pipes 143 . The liquid-cooled server 100 provided in this embodiment receives water through one of the first transfer ports 1311 connected to the external water supply pipeline; finally, the water is discharged out of the liquid-cooled server 100 through the water outlet pipe connected to the second liquid outlet 1222 . The liquid-cooled server 100 provided in this embodiment includes both the first water distributor 131 and the second water distributor 132, which can minimize the number of water pipes connected to the external water system. Of course, this is only an optimal solution for this application , in specific applications, for example, as an alternative, it may also include only the first water separator 131, and the remaining first liquid outlets 1104 are directly connected to the external water system; or only include the second water separator 132, The other first liquid inlets 1103 are directly connected to the external waterway system. It should be noted that the external water system first enters the server body 110 through the first transfer port 1311 connected to the external water supply pipeline to perform water cooling and heat dissipation on the server body 110, and then the water in the server body 110 is transported to the server body 110 through the second connecting pipe 142. The power supply 120 is used to cool the power supply 120 with water, and finally discharge it through the second liquid outlet 1222 .

As shown in FIGS. 1 and 2 , as an implementation, the first liquid inlet 1103 , the first liquid outlet 1104 , the second liquid inlet 1221 and the second liquid outlet 1222 are located on the same side of the liquid-cooled server 100 . side. The first liquid inlet 1103, the first liquid outlet 1104, the second liquid inlet 1221, and the second liquid outlet 1222 are all set on one side of the liquid-cooled server 100 to facilitate the connection of pipelines and improve field deployment. efficiency. Of course, in specific applications, it is not limited thereto. For example, as an alternative, the first liquid inlet 1103 and the first liquid outlet 1104 may also be arranged on the same side of the first liquid cooling radiator 1112 or on the second The liquid inlet 1221 and the second liquid outlet 1222 are arranged on the same side of the second liquid cooling radiator 122, which can also improve the efficiency of on-site deployment and facilitate the connection of pipelines.

As shown in Figure 3 and Figure 4, as an implementation, the computing power unit 111 also includes a tray 1113 and a spring screw 1114; the first liquid cooling radiator 1112, the computing power chip 1111 and the tray 1113 are stacked in sequence and are connected by the spring screw 1114 is fixed; the computing power unit 111 is installed on the server body 110 through the tray 1113 . In this application, the computing chip 1111 is clamped between the first liquid cooling radiator 1112 and the tray 1113 through the spring screw 1114, which can prevent the spring screw 1114 from directly contacting the surface of the computing chip 1111 and causing damage to the computing chip 1111. . In addition, because the spring screw 1114 is elastic, it can ensure that the computing power chip 1111 and the first liquid cooling radiator 1112 are in closer contact without damaging the computing power chip 1111; further improving the heat dissipation of the first liquid cooling The cooling effect of the device 1112.

As shown in FIG. 6 , as an implementation, the power supply 120 further includes a heat conduction layer 123 , and the electric control board 121 , the heat conduction layer 123 and the second liquid cooling radiator 122 are stacked in sequence. The heat generated by the electronic control board 121 is conducted to the second liquid cooling radiator 122 through the heat conducting layer 123 for liquid cooling and heat dissipation. It should be noted that the power supply 120 also includes a casing; the electric control board 121 , the heat conduction layer 123 and the second liquid cooling radiator 122 are fixed on the casing by ordinary screws.

As shown in Figures 1-3, as an implementation, the server body 110 also includes a chassis 112, the power supply 120 and the computing power unit 111 are installed in the chassis 112, and the water divider 130 is installed on the outside of the chassis 112. It should be noted that the power supply 120 and computing power unit 111 are installed inside the chassis 112 , and the water separator 130 is installed outside the chassis 112 .

As shown in Figure 1 and Figure 5, as an implementation, the chassis 112 includes a housing 1121, a front panel 1122 and a rear panel 1123, the front panel 1122 and the rear panel 1123 are respectively installed on opposite sides of the housing 1121, the housing 1121, the front panel 1122 and the rear panel 1123 jointly enclose a cavity (not shown in the figure); the power supply 120 and the computing power unit 111 are installed in the cavity, and the water separator 130 is installed on the front panel 1122 away from the cavity side. When the computing power unit 111 needs to be inspected, maintained or repaired, the front panel 1122 and the rear panel 1123 can be detached to remove the computing power unit 111, which is convenient for disassembly and subsequent maintenance. In addition, the power supply housing is made of aluminum alloy with strong thermal conductivity, and the power supply housing is in contact with the casing 1121 . Part of the waste heat inside the power supply 120 is dissipated to the outside through the power supply aluminum casing and the casing 1121 .

As shown in Figure 1 and Figures 4-6, as an implementation, the first liquid cooling radiator 1112 and the second liquid cooling radiator 122 are arranged along the direction of the rear panel 1123 toward the front panel 1122, and the first liquid cooling The side of the radiator 1112 with the first liquid inlet 1103 and the first liquid outlet 1104 is close to the front panel 1122; the second liquid cooling radiator 122 is provided with the second liquid inlet 1221 and the second liquid outlet 1222 One side is close to the front panel 1122.

As shown in Figures 4-6, as an implementation, the server body 110 also includes a main control board 113, the main control board 113 is provided with a signal output interface 1131 and a first power input interface 1132, and the computing power chip 1111 is provided with a first Signal input interface 1101 and second power input interface 1102, electric control board 121 is provided with second signal input interface 1211 and power output interface 1212; The signal input interface 1211 is electrically connected for the main control board 113 to transmit electrical signals to the computing power chip 1111 and the electric control board 121; the electric control board 121 is respectively connected to the first power input interface 1132 and the second power input through the power output interface 1212 The interface 1102 is electrically connected for the power supply 120 to provide the power supply 120 to the computing power chip 1111 and the main control board 113 .

As shown in Figure 3 and Figure 5, as an implementation, the power output interface 1212 includes a first power output interface 1201 and a second power output interface 1202, and the signal output interface 1131 is respectively connected to the first signal input interface 1101 and the first signal input interface 1101 through a cable. The second signal input interface 1211 is electrically connected; the first power output interface 1201 is electrically connected to the first power input interface 1132 through a cable, and the second power output interface 1202 is electrically connected to the second power input interface 1102 through a copper bar. It should be noted that the computing power unit 111 needs to consume a large amount of power supply 120 during operation, which consumes a lot of power, so the power supply 120 and the computing power unit 111 are connected through copper bars, while the rest of the communication connections or low-power power Connection is just a matter of using a cable.

The working principle of the liquid-cooled server 100 provided in this embodiment is described below with reference to FIG. 1:

When the liquid-cooled server 100 is working, the heat generated by the computing chip 1111 in the computing power unit 111 is conducted to the first liquid-cooled radiator 1112, and the heat generated by the electric control board 121 in the power supply 120 is conducted to the second liquid-cooled radiator through the heat-conducting layer 123. In the cooling radiator 122; at this time, the external cold water enters the first inner cavity of the first water separator 131 through the external water supply pipeline, and the cold water in the first inner cavity enters the first liquid cooling heat dissipation through the first connecting pipe 141 The heat generated by the computing power chip 1111 is water-cooled and dissipated in the device 1112, and then the water in the first liquid-cooled radiator 1112 enters the second inner cavity of the second water separator 132 through the third connecting pipe 143, and the second inner cavity The water in the water enters the second liquid cooling radiator 122 through the second connecting pipe 142 to cool and dissipate the heat generated by the electric control board 121, and finally the water after absorbing the heat is discharged through the water outlet pipe connected to the second liquid outlet 1222. Cold server 100 outside.

Embodiment two:

As shown in FIG. 7 , the difference between this embodiment and the first embodiment is that the water in this embodiment is supplied from the power source 120 and the water is supplied from the server body 110 . Specifically reflected in:

As shown in Fig. 7, as an embodiment, the water separator 130 includes a third water separator 133, and the pipeline assembly 140 includes a fourth connecting pipe 144 and a fifth connecting pipe 145 having the same number as the first liquid outlet 1104 , the third water separator 133 includes a third inner cavity and a third transfer port 1331 whose number is one more than that of the first liquid outlet 1104, wherein a third transfer port 1331 is connected to the second liquid outlet through the fourth connecting pipe 144 1222, and the remaining third transfer ports 1331 are respectively connected to a first liquid outlet 1104 through a fifth connecting pipe 145. The third inner chamber communicates with the third transfer port 1331, and the third inner chamber serves as a space medium for temporarily storing water. The first water separator 131 provided in this embodiment is provided with five third transfer ports 1331 , and the pipe assembly 140 includes four fourth connecting pipes 144 . Wherein the third transfer port 1331 is used for draining the water in the liquid-cooled server 100 .

As shown in Figure 7, as an embodiment, the water separator 130 includes a fourth water separator 134, the pipeline assembly 140 includes the sixth connecting pipe 146 having the same number as the first liquid inlet 1103, and the fourth water separator 134 It includes a fourth inner cavity and a fourth transfer port 1341 that is one more than the number of the first liquid inlet 1103, one of the fourth transfer ports 1341 is connected to the external water outlet pipeline, and the remaining fourth transfer ports 1341 are respectively passed through a first The six connecting pipes 146 are connected to a first liquid inlet 1103; the second liquid inlet 1221 is used to connect with an external water supply pipeline. The fourth inner cavity communicates with the fourth transfer port 1341, and the fourth inner cavity serves as a space medium for temporarily storing water. The fourth water separator 134 provided in this embodiment is provided with five fourth transfer ports 1341 , and the pipe assembly 140 includes four sixth connecting pipes 146 . It should be noted that the external water system first enters the power supply 120 through the second liquid inlet 1221 to cool and dissipate the power supply 120, and then the water in the power supply 120 is transported to the server body 110 through the fourth connecting pipe 144 to cool the server body 110. The water is cooled and dissipated, and finally discharged through the fourth adapter 1341 connected to the external water outlet pipeline.

The working principle of the liquid-cooled server 100 provided in this embodiment is described below with reference to FIG. 7 :

When the liquid-cooled server 100 is working, the heat generated by the computing chip 1111 in the computing power unit 111 is conducted to the first liquid-cooled radiator 1112, and the heat generated by the electric control board 121 in the power supply 120 is conducted to the second liquid-cooled radiator through the heat-conducting layer 123. In the cooling radiator 122; at this time, the external cold water enters the second liquid cooling radiator 122 through the external water supply pipeline to carry out water cooling and heat dissipation of the heat generated by the electric control board 121, and then the water in the second liquid cooling radiator 122 passes through The fourth connecting pipe 144 enters the third inner chamber of the third water distributor 133, and the water in the third inner chamber enters the first liquid cooling radiator 1112 through the fifth connecting pipe 145 to cool the heat generated by the computing chip 1111. Water cooling and heat dissipation, then the water absorbed in the first liquid cooling radiator 1112 enters the fourth inner cavity of the fourth water distributor 134 through the sixth connecting pipe 146, and finally passes through the outlet connected to one of the fourth transfer ports 1341 The water pipe drains out of the liquid-cooled server 100 .

Except for the above differences, the structures of the liquid-cooled server 100 and its components provided in this embodiment can be optimally designed with reference to Embodiment 1, and will not be described in detail here.

The above is only the preferred embodiment of the application, and does not limit the patent scope of the application. Under the conception of the application, the equivalent structural transformation made by using the specification and drawings of the application, or directly/indirectly used in Other relevant technical fields are included in the scope of patent protection of this application.

Claims

The liquid-cooled server is characterized in that it includes:

The server body, the server body includes at least two computing power units, each of the computing power units includes a computing power chip and a first liquid cooling radiator for dissipating heat from the computing power chip, the first The liquid cooling includes a first liquid inlet and a first liquid outlet;

A power supply, the power supply is installed on one side of the server body, the power supply includes an electric control board and a second liquid cooling radiator for dissipating heat from the electric control board, and the second liquid cooling radiator includes The second liquid inlet and the second liquid outlet;

A water distributor, the water distributor is installed on the server body;

In the pipe assembly, at least two of the first liquid inlets or at least two of the first liquid outlets are connected to the water separator through the pipe assembly.
The liquid-cooled server according to claim 1, wherein the water separator includes a first water separator, and the pipe assembly includes first connecting pipes having the same number as the number of the first liquid inlets, so The first water separator includes a first inner chamber and one more first transfer ports than the number of the first liquid inlets, one of the first transfer ports is used to connect with an external water supply pipeline, and the rest are each The first transfer ports are respectively connected to one of the first liquid inlets through one of the first connecting pipes.
The liquid-cooled server according to claim 1 or 2, wherein the water distributor includes a second water distributor, and the pipeline assembly includes a second connecting pipe and the number of which is the same as that of the first liquid outlets The third connecting pipe, the second water separator includes a second inner cavity and a second transfer port whose number is one more than the number of the first liquid outlets, wherein one of the second transfer ports passes through the second The connecting pipe is connected to the second liquid inlet, and the remaining second adapters are respectively connected to one of the first liquid outlets through one of the third connecting pipes; the second liquid outlet is used for Connect with external water outlet pipe.
The liquid-cooled server according to claim 1, wherein the water separator includes a third water separator, and the pipe assembly includes a fourth connecting pipe and a fourth connecting pipe having the same number as the number of the first liquid outlets. Five connecting pipes, the third water separator includes a third inner cavity and a third transfer port whose number is one more than the number of the first liquid outlets, wherein one of the third transfer ports passes through the fourth connecting pipe connected to the second liquid outlet, and each of the remaining third adapters is respectively connected to one of the first liquid outlets through one of the fifth connecting pipes.
The liquid-cooled server according to claim 1 or 4, wherein the water separator includes a fourth water separator, and the pipe assembly includes sixth connecting pipes having the same number as the first liquid inlet, The fourth water separator includes a fourth inner cavity and a fourth transfer port that is one more than the number of the first liquid inlet, one of the fourth transfer ports is connected to the external water outlet pipeline, and the rest are connected to the external water outlet pipeline. The fourth transfer port is respectively connected to one of the first liquid inlets through one of the sixth connecting pipes; the second liquid inlet is used for connecting with an external water supply pipeline.
The liquid-cooled server according to claim 1, wherein the first liquid inlet and the first liquid outlet are arranged on the same side of the first liquid-cooled radiator.
The liquid-cooled server according to claim 1 or 2 or 4 or 6, wherein the second liquid inlet and the second liquid outlet are arranged on the same side of the second liquid-cooled radiator.
The liquid-cooled server according to claim 1 or 2 or 4 or 6, wherein the first liquid inlet, the first liquid outlet, the second liquid inlet and the second outlet The liquid ports are arranged on the same side of the liquid-cooled server.
The liquid-cooled server according to claim 1 or 2 or 4 or 6, wherein the computing power unit further comprises a tray and a spring screw; the first liquid-cooled radiator, the computing power chip and the The trays are stacked in sequence and fixed by the spring screws; the computing power unit is installed on the server body through the trays.
The liquid-cooled server according to claim 1, 2, 4, or 6, wherein the power supply further includes a thermally conductive layer, the electric control board, the thermally conductive layer, and the second liquid-cooled radiator Cascade settings one by one.
The liquid-cooled server according to claim 1 or 2 or 4 or 6, wherein the server body further includes a chassis, the power supply and the computing power unit are installed in the chassis, and the water divider The device is mounted on the outer side of the chassis.