CN208271118U - One kind being used for heat-transfer device built in computer server mainframe box - Google Patents
One kind being used for heat-transfer device built in computer server mainframe box Download PDFInfo
- Publication number
- CN208271118U CN208271118U CN201820753928.0U CN201820753928U CN208271118U CN 208271118 U CN208271118 U CN 208271118U CN 201820753928 U CN201820753928 U CN 201820753928U CN 208271118 U CN208271118 U CN 208271118U
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- China
- Prior art keywords
- thermally conductive
- heat
- fan
- mainboard
- coolant
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- Expired - Fee Related
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Abstract
The utility model discloses a kind of for heat-transfer device built in computer server mainframe box, including thermally conductive mainboard, cooling fin, first fan and the second fan, the positive middle position of thermally conductive mainboard is equipped with groove, and cooling fin is equipped in groove, top inside the thermally conductive mainboard is equipped with the first fan of two groups of thermally conductive mainboards of perforation, bottom end inside the thermally conductive mainboard is equipped with the second fan of two groups of thermally conductive mainboards of perforation, the middle position at the thermally conductive mainboard back side is inlaid with heat conduction copper sheet, and S-shaped coolant pipe is equipped between adjacent heat conduction copper sheet, the bottom at the thermally conductive mainboard back side is equipped with tank for coolant.The utility model carries out the thermally conductive of an entirety to mainframe box inside by thermally conductive mainboard and cooling fin, cooperate back side heat conduction copper sheet, optimize heat exchanger effectiveness, and it is equipped with coolant pipe, water cooling heat conduction and heat radiation is carried out to mainframe box inside by the coolant liquid that circulates in coolant pipe, function more comprehensively, can be with effective temperature-reducing.
Description
Technical field
The utility model relates to thermally conductive equipment technical fields, more particularly to one kind is for built in computer server mainframe box
Heat-transfer device.
Background technique
Computer server is the core in automatic control system, be nobody directly participate under can make production process or its
The control hinge that his process is carried out by expectation rule or preset program, in order to guarantee computer server in long-time use process
In stability, heat-transfer device is particularly important, and heat-transfer device structure is simple in traditional computer server mainframe box, function list
One, general only by heat emission fan and thermally conductive sheet progress, simply heat conduction and heat radiation, wind-cooling heat dissipating limited efficacy encounter external environment temperature
, can not be effectively to internal thermally conductive cooling when spending higher, and heat-transfer device heat dissipation position is fixed built in existing mainframe box, it can not
Concentration quick conductive is carried out at the position of components concentrated to internal heat, will affect the normal operation of ambient electron component, because
This, it is existing in the prior art to solve for heat-transfer device built in computer server mainframe box that the utility model proposes one kind
Problem.
Utility model content
In view of the above-mentioned problems, the utility model proposes one kind to be used for heat-transfer device built in computer server mainframe box, it should
It is whole to mainframe box inside progress one by thermally conductive mainboard and cooling fin for heat-transfer device built in computer server mainframe box
Body it is thermally conductive, cooperate back side heat conduction copper sheet and water cooling heat exchange, function more comprehensively, can with effective temperature-reducing, meanwhile, this is used to calculate
Heat-transfer device built in machine server host case is suitble to range thermal conductivity heat-insulating, and is suitble to the thermally conductive cooling of unit piece.
To solve the above-mentioned problems, the utility model proposes one kind to be used for thermally conductive dress built in computer server mainframe box
It sets, including thermally conductive mainboard, cooling fin, the first fan and the second fan, the thermally conductive positive middle position of mainboard is equipped with recessed
Slot, and cooling fin is equipped in groove, the top inside the thermally conductive mainboard is equipped with the first fan of two groups of thermally conductive mainboards of perforation, institute
State the second fan that the bottom end inside thermally conductive mainboard is equipped with two groups of thermally conductive mainboards of perforation, the middle position at the thermally conductive mainboard back side
Place is inlaid with heat conduction copper sheet, and S-shaped coolant pipe is equipped between adjacent heat conduction copper sheet, and the bottom at the thermally conductive mainboard back side is equipped with
Tank for coolant, the tank for coolant is interior to be equipped with coolant liquid, and the outlet of tank for coolant is equipped with water pump, the water pump and coolant pipe
Inlet communication, and the outlet of coolant pipe is connected to tank for coolant, and the back side of second fan is equipped with hollow heat-conducting block,
And the inside of hollow heat-conducting block is equipped with copper pipe, the bottom of the copper pipe is equipped with flexible heat conducting pipe, and the bottom of flexible heat conducting pipe is set
Have heat absorbing sheet, the back side of first fan is communicated with thermally conductive hose, and on thermally conductive hose side wall far from the first fan one
End is equipped with cylinder heat radiating fin, and the thermally conductive hose is equipped with collector mat far from one end of the first fan.
Further improvement lies in that: the thermally conductive positive two sides of mainboard are equipped with two groups of mounting holes.
Further improvement lies in that: the middle position of the thermally conductive mainboard back side two sides is equipped with thermally conductive storehouse, and thermally conductive storehouse
It is equipped with fin, the inside in the thermally conductive storehouse is equipped with soundproof plate.
Further improvement lies in that: the heat conduction copper sheet is at least provided with five groups, and ipsilateral first fan and the second wind
It is connected by heat conduction copper sheet between fan.
Further improvement lies in that: the top of the heat absorbing sheet is equipped with arc heat radiating fin, and the bottom of heat absorbing sheet is equipped with spiral
Slot.
The utility model has the following beneficial effects: the utility model carries out mainframe box inside by thermally conductive mainboard and cooling fin
Thermally conductive, the cooperation back side heat conduction copper sheet of one entirety, optimizes heat exchanger effectiveness, and outfit coolant pipe, by coolant pipe
The coolant liquid that circulates carries out water cooling heat conduction and heat radiation to mainframe box inside, function more comprehensively, can with effective temperature-reducing, meanwhile, this is practical new
Type is additionally provided with the first fan and the second fan, effectively carries out air-cooled thermally conductive, and the first fan can pass through thermally conductive hose and thermal-arrest
It covers the position for concentrating cabinet inside heat to be isolated, then quick heat extraction, protection surrounding component operates normally, and is suitble to model
It encloses thermal conductivity heat-insulating, and the second fan can connect finer element by heat absorbing sheet, then cooperates hollow heat-conducting block and soft
Property heat conducting pipe cool down to the element, be suitble to the thermally conductive cooling of unit piece, in addition, the utility model using flexible heat conducting pipe, lead
Hot hose is connect with mainframe box internal element, and fan is avoided to cause to resonate, and protects internal element, then cooperate the effect of soundproof plate,
Decrease noise.
Detailed description of the invention
Fig. 1 is the utility model structure schematic diagram.
Fig. 2 is the utility model front schematic view.
Fig. 3 is the utility model partial structural diagram.
Fig. 4 is the utility model heat absorbing sheet bottom schematic view.
Wherein: the thermally conductive mainboard of 1-, 2- cooling fin, the first fan of 3-, the second fan of 4-, 5- heat conduction copper sheet, 6- coolant pipe,
7- tank for coolant, 8- water pump, the hollow heat-conducting block of 9-, 10- copper pipe, 11- flexibility heat conducting pipe, 12- heat absorbing sheet, the thermally conductive hose of 13-,
14- cylinder heat radiating fin, 15- collector mat, 16- mounting hole, the thermally conductive storehouse 17-, 18- soundproof plate, 19- arc heat radiating fin, 20- spiral
Slot.
Specific embodiment
In order to deepen the understanding to the utility model, the utility model is further described below in conjunction with embodiment,
The present embodiment is only used for explaining the utility model, does not constitute the restriction to scope of protection of the utility model.
According to Fig. 1,2,3,4, present embodiments provide a kind of for thermally conductive dress built in computer server mainframe box
It sets, including thermally conductive mainboard 1, cooling fin 2, the first fan 3 and the second fan 4, the positive middle position of the thermally conductive mainboard 1 is set
It is fluted, and cooling fin 2 is equipped in groove, the top inside the thermally conductive mainboard 1 is equipped with the first of the thermally conductive mainboard 1 of two groups of perforations
Fan 3, the bottom end inside the thermally conductive mainboard 1 are equipped with the second fan 4 of the thermally conductive mainboard 1 of two groups of perforations, and the thermally conductive mainboard 1 is carried on the back
The middle position in face is inlaid with heat conduction copper sheet 5, and S-shaped coolant pipe 6, the thermally conductive master are equipped between adjacent heat conduction copper sheet 5
The bottom at 1 back side of plate is equipped with tank for coolant 7, coolant liquid is equipped in the tank for coolant 7, and the outlet of tank for coolant 7 is equipped with water
Pump 8, the inlet communication of the water pump 8 and coolant pipe 6, and the outlet of coolant pipe 6 is connected to tank for coolant 7, described second
The back side of fan 4 is equipped with hollow heat-conducting block 9, and the inside of hollow heat-conducting block 9 is equipped with copper pipe 10, and the bottom of the copper pipe 10 is set
Flexible heat conducting pipe 11, and the bottom of flexible heat conducting pipe 11 is equipped with heat absorbing sheet 12, the back side of first fan 3, which is communicated with, leads
Hot hose 13, and one end on 13 side wall of thermally conductive hose far from the first fan 3 is equipped with cylinder heat radiating fin 14, the thermally conductive hose
13 one end far from the first fan 3 are equipped with collector mat 15, and the positive two sides of the thermally conductive mainboard 1 are equipped with two groups of mounting holes 16,
The middle position of 1 back side two sides of thermally conductive mainboard is equipped with thermally conductive storehouse 17, and thermally conductive storehouse 17 is equipped with fin, described thermally conductive
The inside in storehouse 17 is equipped with soundproof plate 18, and the heat conduction copper sheet 5 is equipped with 11 groups, and ipsilateral first fan 3 and second
It being connected by heat conduction copper sheet 5 between fan 4, the top of the heat absorbing sheet 12 is equipped with arc heat radiating fin 19, and heat absorbing sheet 12
Bottom is equipped with helicla flute 20.
This is used for heat-transfer device built in computer server mainframe box by thermally conductive mainboard 1 and cooling fin 2 in mainframe box
Portion carries out the thermally conductive of an entirety, cooperates back side heat conduction copper sheet 5, optimizes heat exchanger effectiveness, and be equipped with coolant pipe 6, by cold
But circulation coolant liquid carries out water cooling heat conduction and heat radiation to mainframe box inside in liquid pipe 6, function more comprehensively, can with effective temperature-reducing, meanwhile,
This be used for computer server mainframe box built in heat-transfer device be additionally provided with the first fan 3 and the second fan 4, effectively carry out air-cooled lead
Heat, and the first fan 3 can be isolated by the position that thermally conductive hose 13 and collector mat 15 concentrate cabinet inside heat, then
Quick heat extraction, protection surrounding component operate normally, and are suitble to range thermal conductivity heat-insulating, and the second fan 4 can pass through heat absorbing sheet
Then the finer element of 12 connections cooperates hollow heat-conducting block 9 and flexible heat conducting pipe 11 to cool down the element, is suitble to single
The thermally conductive cooling of element, in addition, this is used for built in computer server mainframe box heat-transfer device using flexible heat conducting pipe 11, thermally conductive soft
Pipe 13 is connect with mainframe box internal element, and fan is avoided to cause to resonate, and protects internal element, then cooperate the effect of soundproof plate 18,
Decrease noise.
Before use, being mounted a device on the side wall inside computer server mainframe box by mounting hole 16, by thermal-arrest
Cover 15 is fixed at the position that cabinet inside heat is concentrated, and heat absorbing sheet 12 is fixed to internal some biggish precision elements of fever
Connecting plate on, in use, starting the first fan 3 and the second fan 4, the first fan 3 carries out the heat at heat concentration fast
Speed detaches, and the heat that the second fan 4 dissipates precision element is quickly dredged, meanwhile, start water pump 8, it will be in tank for coolant 7
The coolant liquid in portion is pumped into coolant pipe 6, enters back into tank for coolant 7, carries out the circulation of a water cooling, the free heat of cabinet inside
A part, which is water cooled, dredges, and a part is dredged by heat conduction copper sheet 5, is transmitted on thermally conductive mainboard 1, then passes through cooling fin 2 and outside
Air heat exchange carries out thermally conductive cooling, and in the process, the resonance of fan is prevented by flexible heat conducting pipe 11 and thermally conductive hose 13,
Extra noise is isolated by soundproof plate 18.
The basic principles and main features and advantage of the utility model have been shown and described above.The technical staff of the industry
It should be appreciated that the present utility model is not limited to the above embodiments, the above embodiments and description only describe this
The principle of utility model, on the premise of not departing from the spirit and scope of the utility model, the utility model also has various change
And improvement, these various changes and improvements fall within the scope of the claimed invention.The utility model requires protection scope
It is defined by appending claims and equivalents.
Claims (5)
1. one kind is used for heat-transfer device built in computer server mainframe box, it is characterised in that: including thermally conductive mainboard (1), heat dissipation
Piece (2), the first fan (3) and the second fan (4), the positive middle position of the thermally conductive mainboard (1) are equipped with groove, and groove
Interior to be equipped with cooling fin (2), the internal top of the thermally conductive mainboard (1) is equipped with the first fan of two groups of thermally conductive mainboards of perforation (1)
(3), the internal bottom end of the thermally conductive mainboard (1) is equipped with the second fan (4) of two groups of thermally conductive mainboards of perforation (1), the thermally conductive master
The middle position at plate (1) back side is inlaid with heat conduction copper sheet (5), and S-shaped coolant pipe is equipped between adjacent heat conduction copper sheet (5)
(6), the bottom at thermally conductive mainboard (1) back side is equipped with tank for coolant (7), coolant liquid is equipped in the tank for coolant (7), and cold
But the outlet of liquid case (7) is equipped with water pump (8), the inlet communication of the water pump (8) and coolant pipe (6), and coolant pipe (6)
Outlet is connected to tank for coolant (7), and the back side of second fan (4) is equipped with hollow heat-conducting block (9), and hollow heat-conducting block
(9) inside is equipped with copper pipe (10), and the bottom of the copper pipe (10) is equipped with flexible heat conducting pipe (11), and flexible heat conducting pipe (11)
Bottom is equipped with heat absorbing sheet (12), and the back side of first fan (3) is communicated with thermally conductive hose (13), and thermally conductive hose (13) side
One end on wall far from the first fan (3) is equipped with cylinder heat radiating fin (14), and the thermally conductive hose (13) is far from the first fan (3)
One end be equipped with collector mat (15).
2. according to claim 1 a kind of for heat-transfer device built in computer server mainframe box, it is characterised in that: institute
It states thermally conductive mainboard (1) positive two sides and is equipped with two groups of mounting holes (16).
3. according to claim 1 a kind of for heat-transfer device built in computer server mainframe box, it is characterised in that: institute
The middle position for stating thermally conductive mainboard (1) back side two sides is equipped with thermally conductive storehouse (17), and thermally conductive storehouse (17) are equipped with fin, described
The inside of thermally conductive storehouse (17) is equipped with soundproof plate (18).
4. according to claim 1 a kind of for heat-transfer device built in computer server mainframe box, it is characterised in that: institute
Heat conduction copper sheet (5) is stated at least provided with five groups, and by thermally conductive between ipsilateral first fan (3) and the second fan (4)
Copper sheet (5) connection.
5. according to claim 1 a kind of for heat-transfer device built in computer server mainframe box, it is characterised in that: institute
The top for stating heat absorbing sheet (12) is equipped with arc heat radiating fin (19), and the bottom of heat absorbing sheet (12) is equipped with helicla flute (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820753928.0U CN208271118U (en) | 2018-05-21 | 2018-05-21 | One kind being used for heat-transfer device built in computer server mainframe box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820753928.0U CN208271118U (en) | 2018-05-21 | 2018-05-21 | One kind being used for heat-transfer device built in computer server mainframe box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208271118U true CN208271118U (en) | 2018-12-21 |
Family
ID=64684920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820753928.0U Expired - Fee Related CN208271118U (en) | 2018-05-21 | 2018-05-21 | One kind being used for heat-transfer device built in computer server mainframe box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208271118U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112445307A (en) * | 2020-12-04 | 2021-03-05 | 金陵科技学院 | Protective device for computer protection |
| CN113175640A (en) * | 2021-05-11 | 2021-07-27 | 罗金辉 | Improve radiating dull and stereotyped lamp of self-cleaning LED |
| CN116931687A (en) * | 2023-09-15 | 2023-10-24 | 四川华鲲振宇智能科技有限责任公司 | Server architecture and chassis structural design thereof |
-
2018
- 2018-05-21 CN CN201820753928.0U patent/CN208271118U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112445307A (en) * | 2020-12-04 | 2021-03-05 | 金陵科技学院 | Protective device for computer protection |
| CN113175640A (en) * | 2021-05-11 | 2021-07-27 | 罗金辉 | Improve radiating dull and stereotyped lamp of self-cleaning LED |
| CN116931687A (en) * | 2023-09-15 | 2023-10-24 | 四川华鲲振宇智能科技有限责任公司 | Server architecture and chassis structural design thereof |
| CN116931687B (en) * | 2023-09-15 | 2023-11-28 | 四川华鲲振宇智能科技有限责任公司 | Server architecture and chassis structural design thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181221 Termination date: 20190521 |