CN113766801B - Immersed liquid cooling server and cooling device thereof - Google Patents
Immersed liquid cooling server and cooling device thereof Download PDFInfo
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- CN113766801B CN113766801B CN202011184345.9A CN202011184345A CN113766801B CN 113766801 B CN113766801 B CN 113766801B CN 202011184345 A CN202011184345 A CN 202011184345A CN 113766801 B CN113766801 B CN 113766801B
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- 238000001816 cooling Methods 0.000 title claims abstract description 110
- 239000007788 liquid Substances 0.000 title claims abstract description 59
- 238000007654 immersion Methods 0.000 claims abstract description 41
- 238000005192 partition Methods 0.000 claims abstract description 30
- 239000002826 coolant Substances 0.000 claims description 43
- 239000000110 cooling liquid Substances 0.000 claims description 43
- 239000012809 cooling fluid Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004334 fluoridation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
An immersion liquid cooling server comprising: a housing comprising opposing first and second server panels, the housing having disposed therein: the system comprises a strong electric partition, a first server panel and a second server panel, wherein the strong electric partition is provided with a hard disk, and is close to the first server panel; the weak current partition comprises a main board circuit and an interface circuit, the weak current partition is close to the second server panel, and the interface circuit and an external interface are both arranged on the second server panel.
Description
Technical Field
The present disclosure relates to the field of computer technology, and more particularly, to an immersion liquid cooling server and a cooling device thereof.
Background
Currently, main stream servers in the market mostly adopt an air cooling heat dissipation device, a hard disk is placed right in front of a system, a fan module is placed in the middle of the system, a main board is placed in the middle of the system, a power supply is placed at the left rear, and an I/O port and an external card are placed at the right rear.
In implementing the concepts of the present disclosure, the inventors found that at least the following problems exist in the prior art: for CPUs with more than 300 watts, the air cooling device cannot meet the heat removal requirement; the air cooling server has high heat rejection cost, the high-rotation speed fan has extremely high material cost, and the power consumption of the single fan is extremely high, so that the purchasing cost of the server is increased, and the requirements of the PUE (Power Usage Effectiveness, power use efficiency) specified by the state and the place cannot be met; furthermore, the high-rotation speed fan causes the performance of the mechanical hard disk on the system to be reduced, and the requirement of a user on the performance of the hard disk cannot be met.
Disclosure of Invention
One aspect of the present disclosure provides an immersion liquid cooling server comprising:
a housing comprising opposing first and second server panels, the housing having disposed therein:
the system comprises a strong electric partition, a first server panel and a second server panel, wherein the strong electric partition is provided with a hard disk, and is close to the first server panel;
the weak current partition comprises a main board circuit and an interface circuit, the weak current partition is close to the second server panel, and the interface circuit and an external interface are both arranged on the second server panel.
According to the embodiment of the disclosure, the main board circuit comprises at least one Central Processing Unit (CPU), and a flow control pump and an outlet of a cooling liquid pipeline controlled by the flow control pump are arranged at the CPU and used for controlling the flow of cooling liquid at the CPU.
According to an embodiment of the disclosure, the coolant tube is a straight tube.
According to an embodiment of the disclosure, the inlet of the coolant pipe is disposed outside the strong electric partition throughout the strong electric partition and the first panel.
According to the embodiment of the disclosure, the strong electric connection component is a node power-on clamp.
According to an embodiment of the disclosure, the interface circuit includes a network card interface circuit and an IO interface circuit.
According to an embodiment of the disclosure, the housing has a slide rail for enabling movement of the immersion liquid cooling server towards the first panel or the second panel.
According to another aspect of the present disclosure, there is provided a cooling apparatus of an immersion liquid cooling server, comprising:
the cooling box is internally provided with cooling liquid, and the immersed liquid cooling server is arranged in the cooling liquid;
and the strong electric power interface is arranged in the cooling box and is used for being connected with a strong electric connection part of the immersed liquid cooling server.
According to an embodiment of the present disclosure, the cooling device further includes:
and the convection device is arranged in the cooling box and is used for realizing convection of the cooling liquid in the cooling box.
According to an embodiment of the disclosure, the cooling liquid is a fluorinated liquid.
According to the embodiment of the disclosure, the problems that the air cooling cannot meet the heat dissipation requirement of the high-power CPU and the cost is high can be at least partially solved, and the technical effects of improving the heat dissipation efficiency and reducing the cost of the heat dissipation device are achieved.
Drawings
The above and other objects, features and advantages of the present disclosure will become more apparent from the following description of embodiments thereof with reference to the accompanying drawings in which:
FIG. 1 is a schematic diagram of a server structure of a conventional air cooling device;
fig. 2 is a schematic structural diagram of an immersion liquid cooling server according to an embodiment of the present disclosure at a first view angle;
FIG. 3 is a schematic diagram of an immersion liquid cooling server according to an embodiment of the present disclosure;
FIG. 4 is a front view of an immersion liquid cooled server according to an embodiment of the present disclosure;
fig. 5 is a schematic flow diagram of coolant in a coolant line of an immersion liquid cooling server according to an embodiment of the disclosure.
Description of the reference numerals
100-immersing a liquid cooling server; 110-a housing; 111-a front panel; 1111-mounting ears; 112-a rear panel; 113-side panels; 1131-a slide rail; 114-a bottom plate; 120-strong current partition; 1201-hard disk; 1202-node power-on clamps; 130-weak current partition; 1310-a motherboard circuit; 1311-CPU; 1320-interface circuitry; 1321-network card interface circuitry; 1322-PCIe add-on card; 140-a flow control pump; 150-coolant pipes.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is only exemplary and is not intended to limit the scope of the present disclosure. In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the present disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. In addition, in the following description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the concepts of the present disclosure.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The terms "comprises," "comprising," and/or the like, as used herein, specify the presence of stated features, steps, operations, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, or components.
All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art unless otherwise defined. It should be noted that the terms used herein should be construed to have meanings consistent with the context of the present specification and should not be construed in an idealized or overly formal manner.
Where expressions like at least one of "A, B and C, etc. are used, the expressions should generally be interpreted in accordance with the meaning as commonly understood by those skilled in the art (e.g.," a system having at least one of A, B and C "shall include, but not be limited to, a system having a alone, B alone, C alone, a and B together, a and C together, B and C together, and/or A, B, C together, etc.). Where a formulation similar to at least one of "A, B or C, etc." is used, in general such a formulation should be interpreted in accordance with the ordinary understanding of one skilled in the art (e.g. "a system with at least one of A, B or C" would include but not be limited to systems with a alone, B alone, C alone, a and B together, a and C together, B and C together, and/or A, B, C together, etc.).
Fig. 1 is a schematic diagram of a server structure of a conventional air cooling device. As shown in fig. 1, the main stream air-cooled server mostly has a hard disk placed right in front of the system, a fan module placed in the middle of the system, a main board placed in the middle of the system, a power supply placed at the left rear, and an I/O port and an external card placed at the right rear. However, the adoption of the air cooling device for heat dissipation cannot solve the problems of heat dissipation, PUE and the like of the existing high-power-consumption CPU server.
Embodiments of the present disclosure provide an immersion liquid cooling server and a cooling device thereof. The immersion liquid cooling server includes: a housing comprising opposing first and second server panels, the housing having disposed therein: the system comprises a strong electric partition, a first server panel and a second server panel, wherein the strong electric partition is provided with a hard disk, and is close to the first server panel; the weak current partition comprises a main board circuit and an interface circuit, the weak current partition is close to the second server panel, and the interface circuit and an external interface are both arranged on the second server panel.
A first illustrative embodiment of the present disclosure provides an immersion liquid cooled server. The immersed liquid cooling server is arranged in the box body filled with cooling liquid, so that the design of the fan module can be canceled.
Fig. 2 is a schematic structural diagram of an immersion liquid cooling server according to an embodiment of the disclosure at a first view angle. Fig. 3 is a schematic structural diagram of an immersion liquid cooling server according to an embodiment of the disclosure under a second view angle. As shown in fig. 2-3, the immersion liquid cooled server 100 includes a housing 110, the housing 110 including front and rear panels 111, 112, side panels 113, a bottom panel 114, and a top panel (not shown). In order to realize the separation of strong current and weak current, a strong current partition 120 and a weak current partition 130 are arranged on the bottom 114 in the shell 110.
Further, in order to facilitate the wire management and operation, the strong current partition 120 is disposed near the rear panel 112, and the weak current partition 130 is disposed near the front panel 111. Specifically, the strong electric partition is provided with a hard disk 1201, and the rear panel 112 is provided with a node power clamp 1202 for connecting to a power strip at the bottom of the tank filled with cooling liquid. The weak current partition 130 includes a main board circuit 1310 and an interface circuit 1320, where the interface circuit 1320 and an external interface are both disposed on the front panel 111.
Illustratively, the node power clamp 1202 is disposed perpendicular to the rear panel 112, and when the immersion liquid cooling server 100 is placed, the rear panel 112 of the immersion liquid cooling server 100 faces the bottom of the tank filled with cooling liquid, so that the node power clamp 1202 is vertically inserted into the power strip at the bottom of the tank. The node power-on clamp 1202 has a clamping portion that can maintain a stable connection of the immersion liquid cooling server 100 to the tank.
The front panel 111 of the immersion liquid cooling server 100 is maintained near the level of the cooling liquid. Fig. 4 is a front view of an immersion liquid cooling server 100 according to an embodiment of the present disclosure. As shown in fig. 4, the interfaces of the interface circuit 1320 are disposed on the front panel 111, for example, the network card interface circuit 1321 and the PCIe external card 1322 of the interface circuit 1320 are disposed on the front panel 111, so as to facilitate interconnection with each switch and realize separation between strong and weak electricity. Thus, when the operation is performed, the whole system can be pulled out for the operation by pulling out the weak cable of the front panel 111.
As shown in fig. 2 to 3, mounting lugs 1111 are further provided on both sides of the front panel 111, and the mounting lugs 1111 have a grip portion and a fixing portion. The fixing part is provided with screw holes for being matched with bolts to realize the installation and the fixation of the immersed liquid cooling server 100 and the cooling box. The gripping portion is perpendicular to the front panel 111, so that a user can conveniently operate the immersion liquid cooling server 100, for example, pull the immersion liquid cooling server 100 out of the box during operation and maintenance.
Preferably, the side panel 113 of the housing 110 has a sliding rail 1131 for facilitating the movement of the immersion liquid cooling server 100 towards the front panel 111 or the rear panel 112.
In this embodiment, the main board circuit 1310 of the weak current partition 130 is disposed between the hard disk 1201 and the interface circuit 1320. The motherboard circuit 1310 includes at least one central processing unit CPU1311. Since the component of the server system that generates the greatest heat is a CPU, one flow control pump 140 and the outlet of the coolant pipe 150 controlled by the flow control pump 140 are provided at each CPU1311. Illustratively, a temperature sensor is provided at the CPU1311 for monitoring the temperature of the CPU1311, and the flow control pump 140 intelligently controls the flow of the fluorinated liquid according to the temperature of the monitoring CPU1131, thereby precisely controlling the temperature of the CPU 1131.
The inlet of the coolant pipe 150 is provided at the heat exchanger of the coolant. In this embodiment, the heat exchanger of the cooling liquid is disposed at the bottom of the tank filled with the cooling liquid, and the cooling liquid pipe 150 penetrates through the rear panel 112 and the strong electric partition 120 to convey the cooling liquid with a lower temperature at the heat exchanger of the cooling liquid to the surface of the CPU1131, thereby reducing the temperature of the CPU1131 and realizing accurate control of the temperature of the CPU 1131. In addition, the coolant pipe 150 is also beneficial to convection of the coolant in the cooling tank, so that the temperature of the coolant is uniform.
Fig. 5 is a schematic flow diagram of coolant within a coolant line of the immersion liquid cooling server 100 according to an embodiment of the present disclosure.
As shown in FIG. 5, the low-temperature fluoridation solution directly reaches the surface of the CPU along the arrow direction, so that the heat-relieving efficiency is higher and the energy is saved. As can be seen in fig. 2-3 and fig. 5, in this embodiment, the coolant pipe 150 is disposed between the lower portion of the hard disk 1201 and the bottom plate 114.
It will be appreciated that in other embodiments, the heat exchanger of the coolant may be disposed at other positions of the tank filled with the coolant, and the coolant pipe 150 may be adjusted according to the position of the heat exchanger of the coolant, so as to ensure that the low-temperature coolant at the heat exchanger of the coolant is delivered to the CPU.
The immersion liquid cooling server 100 of the present disclosure achieves strong and weak electricity separation, and facilitates cable arrangement and operation and maintenance operations. Meanwhile, by arranging the flow control pump and the cooling liquid pipeline, the fluorinated liquid can accurately reach the surface of the CPU, so that the technical effects of higher heat dissipation efficiency and more energy conservation are achieved.
In yet another exemplary embodiment of the present disclosure, a cooling apparatus of an immersion liquid cooling server 100 is provided. The cooling device of the immersion liquid cooling server 100 comprises a cooling box, a strong electric power interface and a cooling liquid heat exchanger.
Wherein, cooling liquid is arranged in the cooling box, and the immersed liquid cooling server 100 is arranged in the cooling liquid. Illustratively, the cooling fluid is a fluorinated fluid.
The strong electric power interface is disposed in the cooling box and is used for being connected with a strong electric connection component of the immersion liquid cooling server 100. Preferably, the strong electric power interface is a power supply socket and is arranged at the bottom of the cooling box.
Specifically, the power strip may include a plurality of power supply sockets for plugging with the node power clips 1202 of the rear panel of the immersion liquid cooling server 100. The plurality of immersion liquid cooling servers 100 are vertically inserted into a cooling tank filled with a cooling liquid, and an interface of the front panel 111 is disposed near the liquid level of the cooling liquid, thereby saving space and facilitating wire arrangement.
The cooling liquid heat exchanger is arranged in the cooling box and used for carrying out heat exchange cooling on the cooling liquid heated by the server. In this embodiment, the coolant heat exchanger is disposed at the bottom of the cooling tank, and the inlet of the coolant pipe 150 is disposed at the heat exchanger of the coolant, so that the coolant with a low temperature at the heat exchanger of the coolant is delivered to the surface of the CPU1131, and the flow rate of the coolant in the coolant pipe 150 is controlled by the flow control pump according to the temperature of the CPU, so as to realize accurate control of the temperature of the CPU 1131. In addition, the coolant pipe 150 is also beneficial to convection of the coolant in the cooling tank, so that the temperature of the coolant is uniform.
In order to make the temperature of the cooling liquid more uniform, the cooling device may further include a convection device disposed in the cooling tank for achieving convection of the cooling liquid in the cooling tank.
In this embodiment, since the heat exchanger of the cooling liquid is disposed at the bottom of the cooling tank, the convection device is configured to achieve up-down convection of the cooling liquid, so that the temperature of the cooling liquid is more uniform.
In yet another exemplary embodiment of the present disclosure, a cooling apparatus for an immersion liquid cooled server 100 is provided. The cooling device of the immersion liquid cooling server 100 comprises a cooling box, a strong electric power interface and a cooling liquid heat exchanger.
Wherein, cooling liquid is arranged in the cooling box, and the immersed liquid cooling server 100 is arranged in the cooling liquid. Illustratively, the cooling fluid is a fluorinated fluid. The strong electric power interface is disposed in the cooling box and is used for being connected with a strong electric connection component of the immersion liquid cooling server 100. Preferably, the strong electric power interface is arranged at the bottom of the cooling box. The immersion liquid cooling server 100 is vertically inserted into a cooling tank filled with a cooling liquid, and an interface of the front panel 111 is disposed near the liquid level of the cooling liquid, thereby saving space and facilitating wire arrangement.
The cooling liquid heat exchanger is arranged in the cooling box and used for carrying out heat exchange cooling on the cooling liquid heated by the server.
In this embodiment, the coolant heat exchanger is disposed at a position on the side of the cooling tank, where the position is close to the CPU1131 after the cooling tank is installed, and the inlet of the coolant pipeline 150 is disposed at a position on the side of the cooling tank, where the position is close to the coolant heat exchanger, where the coolant pipeline 150 conveys the coolant with a low temperature at the coolant heat exchanger to the surface of the CPU1131, and the flow rate of the coolant in the coolant pipeline 150 is controlled by the flow control pump according to the temperature of the CPU, so as to realize accurate control of the temperature of the CPU.
In order to make the coolant temperature more even, cooling device can also include convection device, convection device set up in the cooling tank for realize the lower coolant liquid of cooling tank middle part temperature to cooling tank bottom or top water conservancy diversion, thereby make the temperature of coolant liquid more even.
Those skilled in the art will appreciate that the features recited in the various embodiments of the disclosure and/or in the claims may be provided in a variety of combinations and/or combinations, even if such combinations or combinations are not explicitly recited in the disclosure. In particular, the features recited in the various embodiments of the present disclosure and/or the claims may be variously combined and/or combined without departing from the spirit and teachings of the present disclosure. All such combinations and/or combinations fall within the scope of the present disclosure.
The embodiments of the present disclosure are described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. Although the embodiments are described above separately, this does not mean that the measures in the embodiments cannot be used advantageously in combination. The scope of the disclosure is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be made by those skilled in the art without departing from the scope of the disclosure, and such alternatives and modifications are intended to fall within the scope of the disclosure.
Those skilled in the art will appreciate that the features recited in the various embodiments of the disclosure and/or in the claims may be combined in various combinations and/or combinations, even if such combinations or combinations are not explicitly recited in the disclosure. In particular, the features recited in the various embodiments of the present disclosure and/or the claims may be variously combined and/or combined without departing from the spirit and teachings of the present disclosure. All such combinations and/or combinations fall within the scope of the present disclosure.
The embodiments of the present disclosure are described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. Although the embodiments are described above separately, this does not mean that the measures in the embodiments cannot be used advantageously in combination. The scope of the disclosure is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be made by those skilled in the art without departing from the scope of the disclosure, and such alternatives and modifications are intended to fall within the scope of the disclosure.
Claims (9)
1. An immersion liquid cooling server comprising:
a housing (110), the housing (110) comprising opposing first and second server panels, the housing (110) having disposed therein:
a strong electric partition (120), wherein the strong electric partition (120) is provided with a hard disk (1201), the strong electric partition (120) is close to a first server panel, and the first panel is provided with a strong electric connection part which is used for connecting a strong electric power interface; and
the weak current partition (120), the weak current partition (120) comprises a main board circuit (1310) and an interface circuit (1320), the weak current partition (120) is close to a second server panel, and the interface circuit (1320) and an external interface are both arranged on the second server panel;
the main board circuit (1310) comprises at least one Central Processing Unit (CPU) (1311), a flow control pump (140) and an outlet of a cooling liquid pipeline (150) controlled by the flow control pump (140) are arranged at the CPU (1311), and the flow control pump (140) is used for controlling the flow of cooling liquid at the CPU (1311) in response to the temperature of the CPU (1311).
2. The immersion liquid cooling server according to claim 1, wherein the inlet of the coolant pipe (150) is provided at a heat exchanger of the coolant.
3. The immersion liquid cooling server of claim 1, wherein the strong electrical connection member has a clamping portion.
4. The immersion liquid cooling server of claim 1, wherein the interface circuitry (1320) comprises network card interface circuitry (1321) and IO interface circuitry.
5. The immersion liquid cooling server according to claim 1, wherein the housing (110) has a sliding rail (1131) for enabling movement of the immersion liquid cooling server towards the first or second panel.
6. A cooling arrangement for an immersion liquid cooled server according to any of claims 1 to 5, comprising:
the cooling box is internally provided with cooling liquid, and the immersed liquid cooling server is arranged in the cooling liquid;
the strong electric power interface is arranged in the cooling box and is used for being connected with a strong electric connecting component of the immersed liquid cooling server; and
and the cooling liquid heat exchanger is arranged in the cooling box and is used for carrying out heat exchange cooling on cooling liquid.
7. The cooling device of claim 6, wherein the cooling device further comprises:
and the convection device is arranged in the cooling box and is used for realizing convection of the cooling liquid in the cooling box.
8. The cooling device of claim 6, wherein the cooling fluid is a fluorinated fluid.
9. The cooling device of claim 6, wherein the high-power interface is disposed at a bottom of the cooling tank; and/or
The cooling liquid heat exchanger is arranged at the bottom of the cooling box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011184345.9A CN113766801B (en) | 2020-10-29 | 2020-10-29 | Immersed liquid cooling server and cooling device thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011184345.9A CN113766801B (en) | 2020-10-29 | 2020-10-29 | Immersed liquid cooling server and cooling device thereof |
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| Publication Number | Publication Date |
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| CN113766801A CN113766801A (en) | 2021-12-07 |
| CN113766801B true CN113766801B (en) | 2024-04-05 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20230026424A1 (en) * | 2021-07-20 | 2023-01-26 | Dell Products, L.P. | Immersion cooling of information handling systems with on-node boost pumps |
| CN116301265B (en) * | 2023-05-23 | 2023-08-04 | 苏州浪潮智能科技有限公司 | Immersion liquid cooling system, control method thereof and server |
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| CN107577319A (en) * | 2017-10-24 | 2018-01-12 | 北京中热能源科技有限公司 | A kind of liquid immersion type server |
| CN108811472A (en) * | 2018-08-15 | 2018-11-13 | 北京百度网讯科技有限公司 | Liquid cooling server apparatus, server and liquid cooling apparatus |
| CN209149242U (en) * | 2019-01-18 | 2019-07-23 | 湖南航天捷诚电子装备有限责任公司 | The hermetically sealed reinforcement type module liquid cooled server of cabinet in a kind of 1U standard |
| CN110109524A (en) * | 2019-06-13 | 2019-08-09 | 北京丰联奥睿科技有限公司 | A kind of funneling liquid cooled server |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107577319A (en) * | 2017-10-24 | 2018-01-12 | 北京中热能源科技有限公司 | A kind of liquid immersion type server |
| CN108811472A (en) * | 2018-08-15 | 2018-11-13 | 北京百度网讯科技有限公司 | Liquid cooling server apparatus, server and liquid cooling apparatus |
| CN209149242U (en) * | 2019-01-18 | 2019-07-23 | 湖南航天捷诚电子装备有限责任公司 | The hermetically sealed reinforcement type module liquid cooled server of cabinet in a kind of 1U standard |
| CN110109524A (en) * | 2019-06-13 | 2019-08-09 | 北京丰联奥睿科技有限公司 | A kind of funneling liquid cooled server |
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