CN106352725A - Heat dissipation device capable of achieving integrated structural thermal control and processing method - Google Patents
Heat dissipation device capable of achieving integrated structural thermal control and processing method Download PDFInfo
- Publication number
- CN106352725A CN106352725A CN201610919770.5A CN201610919770A CN106352725A CN 106352725 A CN106352725 A CN 106352725A CN 201610919770 A CN201610919770 A CN 201610919770A CN 106352725 A CN106352725 A CN 106352725A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- thermal control
- dissipation device
- shell body
- inner housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipation device capable of achieving integrated structural thermal control and a processing method. Through the adoption of the heat dissipation device, the continuous heat transfer in a three-dimensional direction can be achieved; the heat transfer efficiency can be improved; the device is high in structural stability and can achieve a certain support effect.
Description
Technical field
The present invention relates to thermal control technical field is and in particular to a kind of structure thermal control integral heat dissipation device and processing method.
Background technology
With the continuous development of electronic technology, the integrated level of all kinds of chips and module and power consumption are all greatly improved, a side
Face leads to heat flow density to increase, and brings risk for the reliability that it is used safely, on the other hand then can cause difference in functionality chip
Or dense layout in same system for the module, it is to realize effectively radiating in small space to bring bigger difficulty.
For the heater element of high-power high heat flux, particularly the signal-data processing unit of board form, generally
Using soaking plate provide radiating, this is the flat plate heat spreading apparatus that a kind of inwall has capillary structure, when heat by heat source extremely
During evaporating area, the working medium in cavity starts to gasify, and absorbs heat, and the gas-phase working medium relatively low region condensation of temperature internally is put
Heat, the liquid phase working fluid after condensation returns at thermal source in the presence of capillary force or other driving forces, thus realizing the diffusion of heat
And transmission.
The requirement to thermal control for the whole machine improves constantly, in the middle of the higher system of the integrated level not possessing liquid cool condition, as
The cabinet of structural support or framework are it is also desirable to possess heat sinking function.Traditional soaking plate only can expand heat in two dimensional surface direction, needs
Three-dimensional heat transfer just be can achieve by connecting method, but larger interface resistance can be produced in stitching portion, and due to steam
The blocking-up of passage and overheated gas cannot be delivered directly to the relatively low cold end of temperature, therefore heat dissipation capacity is extremely limited.Additionally, for
, not in conplane application scenario, traditional soaking plate then cannot realize break-in spatially or bending for heating face and cooling surface.
To sum up, for adapting to more and more harsh thermal control condition, need a kind of steam cavity configuration of three-dimensional communication, this kind of heat abstractor is realized
Structure thermal control integration, has a biphase heat-transfer capability on three-dimensional, on the basis of ensureing high efficiency and heat radiation level, has
Simplifying further beneficial to system.
Content of the invention
In view of this, the invention provides a kind of structure thermal control integral heat dissipation device, can more efficiently radiate
Simultaneously moreover it is possible to play the effect of structural support.
The present invention is a kind of structure thermal control integral heat dissipation device, and described heat abstractor is cuboid or the cylinder of hollow
For the cavity structure of closing inside body, this cuboid or cylinder, in cavity structure, there are the support column in array distribution, support column
Two ends are contacted with cuboid or cylindrical cavity wall respectively, and the central axis upright supporting in cuboid wall or with
Cylinder is radially consistent；There is capillary structure on the wall of cavity structure and support column surface；There is liquid medium in capillary structure.
Further, described projection is cylinder or cube.
Further, described capillary structure is metal dust, multiple layer metal silk screen or the metal felt of sintering.
The processing method that the present invention also designs described structure thermal control integral heat dissipation device, specifically includes following steps:
Step 1, the respectively bossed inner housing of the outer surface belt (1) of machining molding heat abstractor and corresponding shell
Body (2), in addition to the two contact surface, each face is both needed to leave enough allowance；
Step 2, capillary structure is sintered on shell body (4) and the inner surface of inner housing (1)；
Step 3, by inner housing (1) and shell body (4) cooperation be bolted together, adopt agitating friction in the junction at edge
Weld inner housing (1) and shell body (4) seam；
Step 4, using agitating friction weldering by the support column (2) of (1) on inner housing and shell body (4) joint face seam.
Step 5, on housing arrange filling exit；
Step 6, liquid medium is filled by filling exit and filling aperture is sealed；
Step 7, polish molding.
Beneficial effect:
1st, this heat abstractor reaches without hindrance stealpass heat on three-dimensional, and steam channel all connects on three-dimensional, keeps away
Exempt from the use of interface Heat Conduction Material, heat transfer resistance reduces by more than 80%, heat transfer temperature difference reduces by more than 5 DEG C, and integral heat sink amount carries
High more than 2 times；
2nd, this heat abstractor is three-dimensional integratedization space structure, and plane at an angle to each other is continuous structure in intersection,
There is not the blocking-up being formed because of assembly processes such as splicings, improve structural stability and the bulk strength of heat abstractor.
Brief description
Fig. 1 (a) is inner housing schematic diagram.
Fig. 1 (b) is shell body schematic diagram.
Fig. 1 (c) is the assembling schematic diagram of inner housing and shell body.
Fig. 2 integrated radiating schematic diagram.
Wherein, 1- inner housing, 2- support column, 3- steam channel, 4- shell body.
Specific embodiment
Develop simultaneously embodiment below in conjunction with the accompanying drawings, describes the present invention.
The invention provides a kind of structure thermal control integral heat dissipation device and processing method.
Structure thermal control integral heat dissipation device should include at least 2 soaking plate that are at an angle to each other and having splicing relation, herein
Taking comprise the framework of 4 face soaking versions as a example explanation.
As shown in figure 1, being the processing method of this device, specifically comprise the following steps that
The inner housing with support column 2 as shown in Fig. 1 (a) of step 1, respectively machining molding heat abstractor, and
Corresponding shell body as shown in Fig. 1 (a), in addition to the two contact surface, each face is both needed to leave enough allowance.
Step 2, capillary structure is sintered on the inner surface of shell and the outer surface of inner shell；
Step 3, by inner housing 1 and shell body 4 cooperation be bolted together, edge junction adopt agitating friction weldering will
Inner housing 1 and shell body 4 seam, such as shown in Fig. 1 (c).
Step 4, using agitating friction weldering by inner housing 1 support column 4 and shell body 4 joint face seam.
Step 5, according to practical situation select liquid medium filling exit position carry out punching, fill, seal.
Step 6, polish molding.
The heat abstractor machining is as shown in Fig. 2 be for closing inside the rectangular structure of hollow, rectangular structure
Cavity, has the support column in array distribution in cavity, support two ends contact with the cavity wall of this rectangular structure respectively and
Place along perpendicular to wall direction, cavity wall and support surface and have capillary structure, in capillary structure, have liquid medium.
Double Shell can be copper, copper alloy, aluminum, aluminium alloy, stainless steel and other metal materials, and liquid medium 15 can be
The heat-exchange working mediums such as water, ethanol, fluoride, acetone, ammonia.Support column 2 as supporting construction, can be cylinder table can also be rectangle
Platform is it is therefore an objective to ensure that this heat abstractor is born interior pressure or external pressure all the time within overall tolerance yield strength.Capillary
Structure is attached to the inner surface of metal rectangular structure, and this capillary structure can be sintering metal powder, multiple layer metal silk screen or
Person's metal felt etc..Cavity within rectangular structure is steam channel 3.Liquid medium in capillary structure be subject to thermal evaporation after,
Carry heat and enter steam channel 3, liquefy to the cold in temperature lower region, reenter capillary structure, carried in capillary structure
Return to heat affected zone under the driving of capillary force.This device can not only complete to radiate in the either side of rectangular structure, also
Can be conducted heat on three-dimensional by the no steam channel of blocking-up and capillary structure, enter into adjacent or even phase from a side
Is radiated in side, concrete mode is: liquid medium in a side of rectangular structure be subject to thermal evaporation after, can pass through
Liquefy to the cold in the temperature lower region that steam channel 3 enters into an adjacent side, the capillary structure through connecting the two also may be used
To return to the heat affected zone of this device, realize quick transmission on three dimensions for the heat.
In sum, these are only presently preferred embodiments of the present invention, be not intended to limit protection scope of the present invention.
All any modification, equivalent substitution and improvement within the spirit and principles in the present invention, made etc., should be included in the present invention's
Within protection domain.
Claims (4)
1. a kind of structure thermal control integral heat dissipation device is it is characterised in that described heat abstractor is cuboid or the cylinder of hollow
For the cavity structure of closing inside body, this cuboid or cylinder, in cavity structure, there are the support column in array distribution, support column
Two ends are contacted with cuboid or cylindrical cavity wall respectively, and the central axis upright supporting in cuboid wall or with
Cylinder is radially consistent；There is capillary structure on the wall of cavity structure and support column surface；There is liquid medium in capillary structure.
2. structure thermal control integral heat dissipation device as claimed in claim 1 is it is characterised in that described projection is cylinder or side
Body.
3. structure thermal control integral heat dissipation device as claimed in claim 1 is it is characterised in that described capillary structure is sintering
Metal dust, multiple layer metal silk screen or metal felt.
4. a kind of processing method for the structure thermal control integral heat dissipation device described in claim 1 was it is characterised in that should add
Work method comprises the following steps:
Step 1, the respectively bossed inner housing of the outer surface belt (1) of machining molding heat abstractor and corresponding shell body
(2), in addition to the two contact surface, each face is both needed to leave enough allowance；
Step 2, capillary structure is sintered on shell body (4) and the inner surface of inner housing (1)；
Step 3, by inner housing (1) and shell body (4) cooperation be bolted together, edge junction adopt agitating friction weldering will
Inner housing (1) and shell body (4) seam；
Step 4, using agitating friction weldering by the support column (2) of (1) on inner housing and shell body (4) joint face seam.
Step 5, on housing arrange filling exit；
Step 6, liquid medium is filled by filling exit and filling aperture is sealed；
Step 7, polish molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610919770.5A CN106352725A (en) | 2016-10-21 | 2016-10-21 | Heat dissipation device capable of achieving integrated structural thermal control and processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610919770.5A CN106352725A (en) | 2016-10-21 | 2016-10-21 | Heat dissipation device capable of achieving integrated structural thermal control and processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106352725A true CN106352725A (en) | 2017-01-25 |
Family
ID=57863542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610919770.5A Pending CN106352725A (en) | 2016-10-21 | 2016-10-21 | Heat dissipation device capable of achieving integrated structural thermal control and processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106352725A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107771017A (en) * | 2017-12-05 | 2018-03-06 | 匀加速科技有限公司 | Handset shell |
| CN107846827A (en) * | 2017-12-05 | 2018-03-27 | 匀加速科技有限公司 | capillary radiating mobile phone |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2479467Y (en) * | 2001-04-16 | 2002-02-27 | 李嘉豪 | Cylinder radiator |
| JP2007317876A (en) * | 2006-05-25 | 2007-12-06 | Fujitsu Ltd | Heat sink |
| CN101272674A (en) * | 2008-05-15 | 2008-09-24 | 中山大学 | Three-dimensional uniform temperature heat transfer device |
| CN201812811U (en) * | 2010-10-15 | 2011-04-27 | 游明郎 | Temperature equalizing plate |
| CN102149266A (en) * | 2010-02-04 | 2011-08-10 | 台烨科技股份有限公司 | Temperature equalizing plate |
| CN202354010U (en) * | 2011-11-23 | 2012-07-25 | 燿佳科技股份有限公司 | Heat radiation device |
| CN206310966U (en) * | 2016-10-21 | 2017-07-07 | 北京空间飞行器总体设计部 | A kind of structure thermal control integral heat dissipation device |
-
2016
- 2016-10-21 CN CN201610919770.5A patent/CN106352725A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2479467Y (en) * | 2001-04-16 | 2002-02-27 | 李嘉豪 | Cylinder radiator |
| JP2007317876A (en) * | 2006-05-25 | 2007-12-06 | Fujitsu Ltd | Heat sink |
| CN101272674A (en) * | 2008-05-15 | 2008-09-24 | 中山大学 | Three-dimensional uniform temperature heat transfer device |
| CN102149266A (en) * | 2010-02-04 | 2011-08-10 | 台烨科技股份有限公司 | Temperature equalizing plate |
| CN201812811U (en) * | 2010-10-15 | 2011-04-27 | 游明郎 | Temperature equalizing plate |
| CN202354010U (en) * | 2011-11-23 | 2012-07-25 | 燿佳科技股份有限公司 | Heat radiation device |
| CN206310966U (en) * | 2016-10-21 | 2017-07-07 | 北京空间飞行器总体设计部 | A kind of structure thermal control integral heat dissipation device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107771017A (en) * | 2017-12-05 | 2018-03-06 | 匀加速科技有限公司 | Handset shell |
| CN107846827A (en) * | 2017-12-05 | 2018-03-27 | 匀加速科技有限公司 | capillary radiating mobile phone |
| CN107846827B (en) * | 2017-12-05 | 2019-10-29 | 南通沃特光电科技有限公司 | Capillary heat dissipation mobile phone |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170125 |
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| RJ01 | Rejection of invention patent application after publication |