CN206310966U - A kind of structure thermal control integral heat dissipation device - Google Patents

A kind of structure thermal control integral heat dissipation device Download PDF

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Publication number
CN206310966U
CN206310966U CN201621143969.5U CN201621143969U CN206310966U CN 206310966 U CN206310966 U CN 206310966U CN 201621143969 U CN201621143969 U CN 201621143969U CN 206310966 U CN206310966 U CN 206310966U
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China
Prior art keywords
thermal control
heat dissipation
support column
dissipation device
heat
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CN201621143969.5U
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Chinese (zh)
Inventor
励精图治
李磊
黄金印
满广龙
张红星
孙萌
杨沪宁
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Beijing Institute of Spacecraft System Engineering
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Beijing Institute of Spacecraft System Engineering
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Abstract

The utility model discloses a kind of structure thermal control integral heat dissipation device.Uninterrupted heat transfer can be reached on three-dimensional using the utility model, improve heat transfer efficiency.And the structural stability of the present apparatus is high, certain supporting role can be played.

Description

A kind of structure thermal control integral heat dissipation device
Technical field
The utility model is related to thermal control technical field, and in particular to a kind of structure thermal control integral heat dissipation device.
Background technology
With continuing to develop for electronic technology, integrated level and the power consumption of all kinds of chips and module are greatly improved, a side Face causes heat flow density to increase, and is that the reliability of its safe handling brings risk, on the other hand can then cause difference in functionality chip Or dense layout of the module in same system, it is to realize that effective heat-radiation belt carrys out bigger difficulty in small space.
For the signal-data processing unit of the heater element of high-power high heat flux, particularly board form, generally Using soaking plate provide radiating, this is the flat plate heat spreading apparatus that a kind of inwall has capillary structure, when heat by heat source extremely During evaporating area, the working medium in cavity starts gasification, and absorbs heat, and the gas-phase working medium relatively low region condensation of temperature internally is put Heat, the liquid phase working fluid after condensation is returned at thermal source in the presence of capillary force or other driving forces, so as to realize the diffusion of heat And transmission.
Requirement of the whole machine to thermal control is improved constantly, in the middle of the integrated level for not possessing liquid cool condition system higher, as The cabinet or framework of structural support, it is also desirable to possess heat sinking function.Traditional soaking plate only can expand heat in two dimensional surface direction, need Three-dimensional is just capable of achieving by connecting method to conduct heat, but can produce larger interface resistance in stitching portion, and due to steam The blocking of passage and overheated gas cannot be delivered directly to the relatively low cold end of temperature, therefore heat dissipation capacity is extremely limited.Additionally, for Heating face and cooling surface application scenario not on the same plane, traditional soaking plate cannot then realize deflecting or bending spatially. To sum up, for the more and more harsh thermal control condition of adaptation, it is necessary to a kind of steam cavity configuration of three-dimensional communication, this kind of heat abstractor realization Structure thermal control integration, possesses the two-phase heat-transfer capability on three-dimensional, on the basis of high efficiency and heat radiation level is ensured, has Beneficial to further simplifying for system.
Utility model content
In view of this, the utility model provides a kind of structure thermal control integral heat dissipation device, can more efficiently dissipate While hot, moreover it is possible to play a part of structural support.
The utility model is a kind of structure thermal control integral heat dissipation device, and the heat abstractor is hollow cuboid or circle Cylinder, the cuboid or cylinder inside are the cavity structure of closing, are had in cavity structure in the support column of array distribution, support Cavity wall of the post two ends respectively with cuboid or cylinder is contacted, and support column central axis upright in cuboid wall or It is radially consistent with cylinder;There is capillary structure on the wall of cavity structure and support column surface;There is liquid medium in capillary structure.
Further, the support column is cylinder or cube.
Further, the capillary structure is the metal dust of sintering, multiple layer metal silk screen or metal felt.
Beneficial effect:
1st, the heat abstractor reaches uninterrupted heat transfer on three-dimensional, and steam channel is connected on three-dimensional, is kept away The use of interface Heat Conduction Material is exempted from, heat transfer resistance reduces by more than 80%, and heat transfer temperature difference reduces by more than 5 DEG C, and integral heat sink amount is carried It is high more than 2 times;
2nd, the heat abstractor is three-dimensional integratedization space structure, and plane at an angle to each other is continuous structure in intersection, In the absence of the blocking formed by assembly processes such as splicings, the structural stability and bulk strength of heat abstractor are improve.
Brief description of the drawings
Fig. 1 (a) is inner housing schematic diagram.
Fig. 1 (b) is shell body schematic diagram.
Fig. 1 (c) is the assembling schematic diagram of inner housing and shell body.
The integrated radiating schematic diagrames of Fig. 2.
Wherein, 1- inner housings, 2- support columns, 3- steam channels, 4- shell bodies.
Specific embodiment
Developed simultaneously embodiment below in conjunction with the accompanying drawings, and the utility model is described in detail.
The utility model provides a kind of structure thermal control integral heat dissipation device.
Structure thermal control integral heat dissipation device should comprise at least 2 soaking plates that are at an angle to each other and having splicing relation, herein The explanation as a example by comprising 4 frameworks of face soaking version.
As shown in figure 1, being the processing method of the device, comprise the following steps that:
The inner housing with support column 2 as shown in Fig. 1 (a) of step 1, respectively machining shaping heat abstractor, and The corresponding shell body as shown in Fig. 1 (a), in addition to the two contact surface, each face is both needed to leave enough allowance.
On the outer surface of step 2, the inner surface that capillary structure is sintered to shell and inner casing;
Step 3, inner housing 1 and shell body 4 are coordinated it is bolted together, will using agitating friction weldering in the junction at edge Inner housing 1 and the soldering of shell body 4, shown in such as Fig. 1 (c).
Step 4, using agitating friction weldering by inner housing 1 support column 4 and the joint face soldering of shell body 4.
Step 5, liquid medium filling exit position is selected to be punched, filled, sealed according to actual conditions.
Step 6, finishing shaping.
The heat abstractor for machining is as shown in Fig. 2 be hollow rectangular structure, rectangular structure inside is closing Cavity, has in the support column of array distribution in cavity, support column two ends contacted with the cavity wall of the rectangular structure respectively and Placed along perpendicular to wall direction, there is capillary structure on cavity wall and support column surface, there is liquid medium in capillary structure.
Double Shell can be copper, copper alloy, aluminium, aluminium alloy, stainless steel and other metal materials, and liquid medium 15 can be The heat-exchange working mediums such as water, ethanol, fluoride, acetone, ammonia.Support column 2, as supporting construction, can be that cylinder table can also be square Shape platform, it is therefore an objective to ensure that the heat abstractor bears pressure or external pressure in next and integrally tolerating within yield strength all the time.Hair Fine texture is attached to the inner surface of metal rectangular structure, and the capillary structure can be sintering metal powder, multiple layer metal silk screen Or metal felt etc..Cavity inside rectangular structure is steam channel 3.Liquid medium is in capillary structure by thermal evaporation Afterwards, carry heat and enter steam channel 3, liquefied to the cold in temperature lower region, capillary structure is reentered, in capillary structure institute Heat affected zone is returned under the driving that capillary force is provided.The device can not only complete radiating in the either side of rectangular structure, Can also be conducted heat on three-dimensional by uninterrupted steam channel and capillary structure, i.e., from side enter into it is adjacent even Opposite flank is radiated, and concrete mode is:Liquid medium in the side of rectangular structure by after thermal evaporation, Ke Yitong Cross steam channel 3 and enter into the temperature lower region of an adjacent side and liquefy to the cold, by connecting the capillary structure of the two also The heat affected zone of the device is may return to, quick transmission of the heat on three dimensions is realized.
In sum, preferred embodiment of the present utility model is these are only, is not intended to limit of the present utility model Protection domain.It is all it is of the present utility model spirit and principle within, any modification, equivalent substitution and improvements made etc. all should be wrapped It is contained within protection domain of the present utility model.

Claims (3)

1. a kind of structure thermal control integral heat dissipation device, it is characterised in that the heat abstractor is hollow cuboid or cylinder Body, the cuboid or cylinder inside are the cavity structure of closing, are had in cavity structure in the support column of array distribution, support column Cavity wall of the two ends respectively with cuboid or cylinder is contacted, and support column central axis upright in cuboid wall or with Cylinder is radially consistent;There is capillary structure on the wall of cavity structure and support column surface;There is liquid medium in capillary structure.
2. structure thermal control integral heat dissipation device as claimed in claim 1, it is characterised in that the support column is cylinder or side Body.
3. structure thermal control integral heat dissipation device as claimed in claim 1, it is characterised in that the capillary structure is sintering Metal dust, multiple layer metal silk screen or metal felt.
CN201621143969.5U 2016-10-21 2016-10-21 A kind of structure thermal control integral heat dissipation device Active CN206310966U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621143969.5U CN206310966U (en) 2016-10-21 2016-10-21 A kind of structure thermal control integral heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621143969.5U CN206310966U (en) 2016-10-21 2016-10-21 A kind of structure thermal control integral heat dissipation device

Publications (1)

Publication Number Publication Date
CN206310966U true CN206310966U (en) 2017-07-07

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106352725A (en) * 2016-10-21 2017-01-25 北京空间飞行器总体设计部 Heat dissipation device capable of achieving integrated structural thermal control and processing method
CN110645815A (en) * 2019-09-29 2020-01-03 联想(北京)有限公司 Vapor chamber and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106352725A (en) * 2016-10-21 2017-01-25 北京空间飞行器总体设计部 Heat dissipation device capable of achieving integrated structural thermal control and processing method
CN110645815A (en) * 2019-09-29 2020-01-03 联想(北京)有限公司 Vapor chamber and preparation method thereof

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