CN203788635U - Heat-dissipating module - Google Patents
Heat-dissipating module Download PDFInfo
- Publication number
- CN203788635U CN203788635U CN201420215444.2U CN201420215444U CN203788635U CN 203788635 U CN203788635 U CN 203788635U CN 201420215444 U CN201420215444 U CN 201420215444U CN 203788635 U CN203788635 U CN 203788635U
- Authority
- CN
- China
- Prior art keywords
- chamber
- heat
- transmission element
- thermal transmission
- radiating module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012530 fluid Substances 0.000 claims abstract description 15
- 230000005540 biological transmission Effects 0.000 claims description 31
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- 238000006424 Flood reaction Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010011968 Decreased immune responsiveness Diseases 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat-dissipating module composed of a first heat transfer element and a second heat transfer element. The first heat transfer element comprises a first chamber filled with working fluid. At least one first capillary structure is disposed on the surface of the first chamber or in the first chamber. The second heat transfer element comprises a second chamber filled with working fluid and an embedded portion. At least one second capillary structure is disposed on the surface of the second chamber or in the second chamber. The embedded portion is arranged in the first chamber. The embedded portion is immersed in the working fluid in the first chamber covers or the working fluid in the first chamber is higher or equal to embedded portion in order that the overall heat transfer efficiency of the heat-dissipating module is greatly improved.
Description
Technical field
The present invention relates to a kind of radiating module, relate in particular to and a kind ofly have that large area is conducted heat and far-end heat-transfer effect goes forward side by side significantly to promote the radiating module of hot transfer efficiency simultaneously.
Background technology
With existing electronic equipment, using gradually the frivolous hope as bragging about, therefore each item all must dwindle its size thereupon, but the size of electronic equipment is dwindled the major obstacle that the thermal change of following and producing becomes electronic equipment and system enhancement performance.The semiconductor dimensions that no matter forms electronic component is constantly dwindled, and still requires constantly to increase performance.
When semiconductor dimensions is dwindled, result heat flux increases, it is only all increases of heat that heat flux increase cause surpasses the cooling challenge of product, overheated because the increase of heat flux causes at different time and the meeting of different length size, may cause electronic failure Huo Sun Ruined.
Therefore prior art field personnel are for solving above-mentioned prior art because of the narrow and small problem of heat-dissipating space, therefore a kind of VC (Vapor chamber) heat abstractor (structure) of usining is arranged at chip (chip/body) top and uses as heat radiation, in order to increase the capillary limitation in VC, utilize copper post, coating sintering, sintering post, foaming column, the capillary structures such as tool hole (gap) supporter are in order to support as backflow road, and the design of above-mentioned supporter is mainly due on micro-temperature-uniforming plate, lower wall thickness thinner (1.5mm applies below), if in the link without supporter, lower wall may cause thermal expansion, and cause anergy.
Existing temperature-uniforming plate is a kind of and conducts with the even heat of face, it is mainly the cryosurface that the heating surface that contacted with thermal source by a side transfers heat to opposite side uniformly, it has the conduction of larger area heat, the advantages such as heat-transfer rate and even temperature effect are fast, and its shortcoming is heat to be passed to far-end heat radiation, if heat cannot dispel the heat in good time, easy accumulated heat is near pyrotoxin, so a shortcoming is still the disadvantage of temperature-uniforming plate.
And existing known techniques also has the structure that heat pipe is combined with temperature-uniforming plate, but because both are welded to each other combination for outside, and outside weldings will produce the facts generation of welding thermal resistance, in addition, when carrying out when conduction heat again because the steam-condensate circulating of working fluid in temperature-uniforming plate is to be evaporated to condensing zone condensation by evaporating area, after its heat carries out prior to temperature-uniforming plate, begin to be transferred heat to the heat pipe being welded to each other with it, therefore effect is limited.
Summary of the invention
Therefore,, for effectively addressing the above problem, main purpose of the present invention is to provide a kind of radiating module that can heat radiation usefulness.
For reaching above-mentioned purpose, the invention provides a kind of radiating module, comprise: one first thermal transmission element, there is one first chamber, in this first chamber, be provided with working fluid and one first capillary structure; One second thermal transmission element, there is second chamber and that is filled with working fluid and be embedded into portion, this second chamber is provided with one second capillary structure, and this is embedded into portion and is located in aforementioned the first chamber, and makes this be embedded into portion being flooded lid completely or soak by the working fluid in described the first chamber.
Preferably, described the first thermal transmission element has a heat absorbing side, and this heat absorbing side is located at the opposite side of contrary this first chamber of this first thermal transmission element.
Preferably, it is wherein arbitrary that described first and second capillary structure may be selected to be corpus fibrosum and agglomerated powder opisthosoma and groove and hydrophilic coating and grid body.
Preferably, described the first thermal transmission element is a temperature-uniforming plate.
Preferably, described the second thermal transmission element is a heat pipe.
Preferably, have more a heat dissipation element, be connected with aforementioned the second thermal transmission element, described heat dissipation element is chosen as a radiator and a radiating fin group is wherein arbitrary.
By radiating module of the present invention, not only there is large-area heat and pass effect, the effect also with far-end heat radiation simultaneously, and because being flooded lid or soak by the working fluid of the first chamber, this conducting part is coated, also the heat energy that makes this first thermal transmission element is absorbed and conducts to fast far-end by the second thermal transmission element very soon and dispels the heat, therefore significantly promote the hot transfer efficiency of this radiating module integral body.
Accompanying drawing explanation
Fig. 1 is the first embodiment stereogram of radiating module of the present invention;
Fig. 2 is the first embodiment assembled sectional view of radiating module of the present invention;
Fig. 2 a is the partial enlarged drawing of the first embodiment assembled sectional view of radiating module of the present invention;
Fig. 3 is the three-dimensional combination figure of the second embodiment of radiating module of the present invention;
Symbol description
Radiating module 1
The first thermal transmission element 11
The first chamber 111
The first capillary structure 112
Heat absorbing side 113
The second thermal transmission element 12
The second chamber 121
Be embedded into portion 122
The second capillary structure 123
Working fluid 2
Heat dissipation element 3
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail:
Characteristic in above-mentioned purpose of the present invention and structure thereof and function, will be explained according to appended graphic preferred embodiment.
Refer to the 1st, 2,2a figure, for the first embodiment stereogram, the combination of radiating module of the present invention, analyse and observe and partial enlarged drawing, as shown in the figure, described radiating module 1, comprises: one first thermal transmission element 11, one second thermal transmission element 12;
Described the first thermal transmission element 11 has one first chamber 111, is provided with one first capillary structure 112 in this first chamber 111; Described the second thermal transmission element 12 has one second chamber 121 and and is embedded into portion 122, this second chamber 121 is provided with one second capillary structure 123, this is embedded into portion 122 and is located in aforementioned the first chamber 111, and make this be embedded into portion 122 just by the working fluid 2 in described the first chamber 111, being flooded lid completely or soak and be embedded into portion 122 greater than or equal to this, aforementioned first and second chamber 111,121 is filled with respectively a working fluid 2.
Described the first thermal transmission element 11 has a heat absorbing side 113, and this heat absorbing side 113 is located at the opposite side of contrary this first chamber 111 of this first thermal transmission element 11, and this heat absorbing side 113 at least one pyrotoxin (not shown) that can correspondence be sticked.
Described the first thermal transmission element 11 is a temperature-uniforming plate, described the second thermal transmission element 12 is a heat pipe, the present embodiment be embedded into the interlude that portion 122 is located at this second thermal transmission element 12, be the mid portion at these the second thermal transmission element 12 two ends, being embedded in the first chamber 111 that portion 122 is located in this first thermal transmission element 11 of this second thermal transmission element 12, it is wherein arbitrary that this first capillary structure 112 may be selected to be corpus fibrosum and agglomerated powder opisthosoma and groove and hydrophilic coating and grid body, the present embodiment is usingd sintered powder as explanation, but do not regard it as and be limited, it is wherein arbitrary that described the second capillary structure 123 also may be selected to be corpus fibrosum and agglomerated powder opisthosoma and groove and hydrophilic coating and grid body.
Refer to the 3rd figure, three-dimensional combination figure for the second embodiment of radiating module of the present invention, as shown in the figure, the present embodiment part-structure is identical with aforementioned the first embodiment with connection relationship, therefore will repeat no more at this, not existing together for described the second thermal transmission element 12 is connected with at least one heat dissipation element 3 in addition of the present embodiment and aforementioned the first embodiment only, this heat dissipation element 3 may be selected to be a radiator and a radiating fin group is wherein arbitrary, and the present embodiment is usingd radiator as explanation but is not regarded it as and be limited.
Although the present invention discloses as above with execution mode; so it is not in order to limit the present invention, any person skilled in the art person, without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations, so protection scope of the present invention is worked as with standard that claims are decided to be.
Claims (6)
1. a radiating module, is characterized in that, comprising:
One first thermal transmission element, has one first chamber, is provided with working fluid and one first capillary structure in this first chamber;
One second thermal transmission element, there is second chamber and that is filled with working fluid and be embedded into portion, this second chamber is provided with one second capillary structure, and this is embedded into portion and is located in aforementioned the first chamber, and to make this be embedded into portion be that working fluid floods lid completely or soaks in described the first chamber.
2. radiating module as claimed in claim 1, is characterized in that, described the first thermal transmission element has a heat absorbing side, and this heat absorbing side is located at the opposite side of contrary this first chamber of this first thermal transmission element.
3. radiating module as claimed in claim 1, is characterized in that, it is wherein arbitrary that described first and second capillary structure may be selected to be corpus fibrosum and agglomerated powder opisthosoma and groove and hydrophilic coating and grid body.
4. radiating module as claimed in claim 1, is characterized in that, described the first thermal transmission element is a temperature-uniforming plate.
5. radiating module as claimed in claim 1, is characterized in that, described the second thermal transmission element is a heat pipe.
6. radiating module as claimed in claim 1, is characterized in that, has more a heat dissipation element, is connected with aforementioned the second thermal transmission element, and described heat dissipation element is chosen as a radiator and a radiating fin group is wherein arbitrary.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420215444.2U CN203788635U (en) | 2014-04-29 | 2014-04-29 | Heat-dissipating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420215444.2U CN203788635U (en) | 2014-04-29 | 2014-04-29 | Heat-dissipating module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203788635U true CN203788635U (en) | 2014-08-20 |
Family
ID=51324783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420215444.2U Expired - Lifetime CN203788635U (en) | 2014-04-29 | 2014-04-29 | Heat-dissipating module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203788635U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105025682A (en) * | 2014-04-29 | 2015-11-04 | 奇鋐科技股份有限公司 | Heat-dissipating module |
| TWI708038B (en) * | 2019-08-27 | 2020-10-21 | 邁萪科技股份有限公司 | Heat dissipating device using phase changes to transmit heat |
| US11125507B2 (en) | 2019-11-21 | 2021-09-21 | Taiwan Microloops Corp. | Heat dissipating apparatus using phase change heat transfer |
-
2014
- 2014-04-29 CN CN201420215444.2U patent/CN203788635U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105025682A (en) * | 2014-04-29 | 2015-11-04 | 奇鋐科技股份有限公司 | Heat-dissipating module |
| TWI708038B (en) * | 2019-08-27 | 2020-10-21 | 邁萪科技股份有限公司 | Heat dissipating device using phase changes to transmit heat |
| US11125507B2 (en) | 2019-11-21 | 2021-09-21 | Taiwan Microloops Corp. | Heat dissipating apparatus using phase change heat transfer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140820 |