CN203788635U - Cooling module - Google Patents

Abstract

The utility model relates to a heat dissipation module, which at least comprises a first heat transfer element and a second heat transfer element; wherein the first heat transfer element is provided with a first chamber filled with working fluid, and the surface of the first chamber or the chamber is provided with at least one first capillary structure; the second heat transfer element is provided with a second cavity filled with working fluid and an embedded part, at least one second capillary structure is arranged on the surface of the second cavity or between the cavities, the embedded part is accommodated in the first cavity, and the working fluid in the first cavity is flooded or soaked higher than or equal to the embedded part, so that the overall heat transfer efficiency of the heat dissipation module is greatly improved.

Description

Cooling module

technical field

The present invention relates to a heat dissipation module, in particular to a heat dissipation module which has both large-area heat transfer and remote heat transfer effects and greatly improves heat transfer efficiency.

Background technique

As the current electronic equipment is gradually advertised as light and thin, the size of each component must be reduced accordingly. However, the heat generated by the reduction in the size of electronic equipment has become a major obstacle to the improvement of the performance of electronic equipment and systems. Despite the ever-shrinking dimensions of the semiconductors forming electronic components, there is a continuing demand for increased performance.

As semiconductors shrink in size, the resulting heat flux increases. The heat flux increase creates challenges in cooling the product beyond just the overall heat increase, because the heat flux increase causes overheating at different times and at different length dimensions, which can lead to electronic failure or damage.

Therefore, in order to solve the above-mentioned problems of the prior art because of the narrow heat dissipation space, personnel in the prior art field set up a VC (Vapor chamber) heat dissipation device (structure) on the top of the chip (chip/body) for heat dissipation, in order to increase the internal heat dissipation of the VC. Capillary limit, use capillary structures such as copper pillars, coating sintering, sintering pillars, foaming pillars, supports with holes (gaps) to support as return channels, and the design of the above supports is mainly due to the micro uniform temperature plate, The lower wall is thinner (applied below 1.5mm). If there is no support to connect the upper and lower walls, it may cause thermal expansion and cause failure.

The existing vapor chamber system is a kind of uniform heat conduction between surfaces. It mainly transfers heat evenly from the heating surface in contact with the heat source on one side to the condensation surface on the other side. It has a large area of heat conduction and heat conduction. It has the advantages of fast speed and uniform temperature effect, but its disadvantage is that it cannot transfer heat to the remote side for heat dissipation. If the heat cannot be dissipated in a timely manner, it is easy to accumulate heat near the heat source. Therefore, this disadvantage is still the biggest disadvantage of the temperature chamber.

And the current conventional technology also has a structure combining heat pipes and vapor chambers, but because the two are externally welded together, the external welding will cause welding thermal resistance. In addition, when conducting heat conduction, the working fluid is in the The vapor-liquid cycle in the vapor chamber is from evaporation in the evaporation area to condensation in the condensation area. The heat is transferred to the heat pipes welded to each other after the heat is carried out before the vapor chamber, so the effect is limited.

Contents of the invention

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat dissipation module that can improve heat dissipation performance.

To achieve the above object, the present invention provides a heat dissipation module, comprising: a first heat fransfer element having a first chamber, the first chamber is provided with a working fluid and a first capillary structure; a second heat fransfer element The element has a second chamber filled with working fluid and an embedding part, the second chamber is provided with a second capillary structure, the embedding part is accommodated in the first chamber, and the embedding part The buried portion is completely covered or soaked by the working fluid in the first chamber.

Preferably, the first heat fransfer element has a heat-absorbing side, and the heat-absorbing side is disposed on the other side of the first heat fransfer element opposite to the first chamber.

Preferably, the first and second capillary structures can be selected as any one of fiber body, sintered powder body, groove, hydrophilic coating, and mesh body.

Preferably, the first heat fransfer element is a vapor chamber.

Preferably, the second heat fransfer element is a heat pipe.

Preferably, there is a heat dissipation element connected to the aforementioned second heat fransfer element, and the heat dissipation element is selected as any one of a heat sink and a heat dissipation fin group.

The heat dissipation module of the present invention not only has the effect of large-area heat transfer, but also has the effect of remote heat dissipation, and because the conduction part is submerged or soaked and covered by the working fluid of the first chamber, the first heat The heat energy of the heat transfer element is quickly absorbed by the second heat transfer element and quickly transferred to the remote end for heat dissipation, so the overall heat transfer efficiency of the heat dissipation module must be greatly improved.

Description of drawings

Fig. 1 is a perspective view of the first embodiment of the heat dissipation module of the present invention;

Fig. 2 is a combined sectional view of the first embodiment of the heat dissipation module of the present invention;

Fig. 2a is a partial enlarged view of the combined cross-sectional view of the first embodiment of the heat dissipation module of the present invention;

3 is a three-dimensional assembled view of the second embodiment of the heat dissipation module of the present invention;

Symbol Description

Cooling module 1

first heat fransfer element 11

first chamber 111

First capillary structure 112

Heat-absorbing side 113

Second heat fransfer element 12

Second chamber 121

Embedding part 122

Second capillary structure 123

working fluid 2

Heat dissipation element 3

Detailed ways

Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

Please refer to Figures 1, 2, and 2a, which are perspective views, combined cross-sectional views, and partial enlarged views of the first embodiment of the heat dissipation module of the present invention. As shown in the figure, the heat dissipation module 1 includes: a first heat transfer element 11. A second heat fransfer element 12;

The first heat fransfer element 11 has a first chamber 111, and a first capillary structure 112 is arranged in the first chamber 111; the second heat fransfer element 12 has a second chamber 121 and an embedded part 122, the second chamber 121 is provided with a second capillary structure 123, the embedding part 122 is accommodated in the first chamber 111, and the embedding part 122 is just inside the first chamber 111 The working fluid 2 completely covers or soaks higher than or equal to the embedding portion 122, and the aforementioned first and second chambers 111, 121 are respectively filled with a working fluid 2.

The first heat fransfer element 11 has a heat-absorbing side 113, the heat-absorbing side 113 is arranged on the opposite side of the first chamber 111 of the first heat fransfer element 11, and the heat-absorbing side 113 can correspond to Attach at least one heat source (not shown in the figure).

The first heat fransfer element 11 is a uniform temperature plate, and the second heat fransfer element 12 is a heat pipe. The embedding part 122 of this embodiment is arranged in the middle section of the second heat fransfer element 12, which is the In the middle part of the two ends of the second heat fransfer element 12, the embedding part 122 of the second heat fransfer element 12 is accommodated in the first chamber 111 of the first heat fransfer element 11, and the first capillary structure 112 can be selected as Any one of fiber body, sintered powder body, groove, hydrophilic coating, and mesh body. This embodiment uses sintered powder as an illustration, but it is not limited thereto. The second capillary structure 123 can also be selected It is any one of fiber body, sintered powder body, groove, hydrophilic coating and grid body.

Please refer to Figure 3, which is a three-dimensional combination diagram of the second embodiment of the heat dissipation module of the present invention. As shown in the figure, part of the structure and connection relationship of this embodiment is the same as that of the first embodiment, so it will not be repeated here. However, the difference between this embodiment and the aforementioned first embodiment is that the second heat fransfer element 12 is additionally connected to at least one heat dissipation element 3, and the heat dissipation element 3 can be selected as either a radiator or a heat dissipation fin group. 1. In this embodiment, a heat sink is used as an illustration but not limited thereto.

Although the present invention is disclosed above in terms of implementation, it is not intended to limit the present invention. Any person familiar with the art may make various modifications and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of protection of the invention should be determined by the claims.

Claims (6)

1. A cooling module, characterized in that, comprising: A first heat fransfer element has a first chamber, and the first chamber is provided with a working fluid and a first capillary structure; A second heat fransfer element has a second chamber filled with working fluid and an embedding part, the second chamber is provided with a second capillary structure, and the embedding part is accommodated in the first chamber, And make the embedding part be completely submerged or soaked by the working fluid in the first chamber. 2. The heat dissipation module according to claim 1, wherein the first heat fransfer element has a heat absorbing side, and the heat absorbing side is arranged on the other side of the first heat fransfer element opposite to the first chamber. side. 3 . The heat dissipation module according to claim 1 , wherein the first and second capillary structures can be any one of fiber body, sintered powder body, groove, hydrophilic coating, and mesh body. 4 . 4. The heat dissipation module according to claim 1, wherein the first heat fransfer element is a vapor chamber. 5. The heat dissipation module according to claim 1, wherein the second heat fransfer element is a heat pipe. 6 . The heat dissipation module according to claim 1 , further comprising a heat dissipation element connected to the second heat transfer element, and the heat dissipation element is selected as any one of a heat sink and a heat dissipation fin set. 7 .