TW201937126A - Heat sink device - Google Patents

Abstract

This case provides a heat dissipation device, which includes a cavity, a plurality of tubes, a heat dissipation fin set disposed on the outer edge of the plurality of tubes, and a vaporization structure. The cavity has a cavity for thermal contact with a heat source, and each tube The body is formed with channels, and the first ends of the channels are in fluid communication with the chamber, and the cavity of the cavity and the channels of the tubes are filled with working medium; wherein, the vaporized structure may use a plurality of skived fins (skived fin), and placed in the chamber of the cavity, which is in thermal contact with the cavity and at least part of the working medium to receive the heat energy from the heat source and transfer it to the working medium, and the working medium is converted into liquid vapor and transferred to the first The direction of the second end of a channel moves. Since the vaporization structure can increase the thermal contact area and enhance the vaporization efficiency of the working medium, it can promote the circulating flow of the working medium of the heat dissipation device and effectively improve the overall heat dissipation efficiency.

Description

Radiator

This case relates to a heat dissipation device, especially a heat dissipation device that dissipates heat through two-phase changes.

With the rapid development of computers and various electronic devices and the convenience they bring, modern people have become accustomed to using time. However, when computers and various electronic devices are operated for a long time, their The disadvantage that the heat cannot be dissipated in time is also accompanied.

In view of this, many methods of heat dissipation, such as heat dissipation by means of airflow (fan), heat dissipation by means of water cooling, and heat dissipation through the principle of thermosiphoning, are widely used, and due to the effect of thermosiphoning, the heat dissipation device can be installed without being The working medium (such as water) can maintain the circulation of the working medium under the premise of pumping. At present, many related researches and technologies have also been proposed, such as disclosed in the US Patent No. US20100315781. In addition, in related application fields, the radiator water radiator (radiator) is At present, one of the most commonly used heat exchangers, combined with a fan, cools the high-temperature liquid or allows the vaporized steam to condense into a liquid. Such continuous circulation does not require any pumps. The vaporization and condensation process of the liquid is sufficient to maintain the liquid Flow. The principle of the above thermosiphon and the existing implementation of the heat dissipation water cooling are known to those skilled in the art, and will not be repeated here.

However, under some usage scenarios, the existing heat sinks using the thermosiphon principle still have a situation where it is too late to de-heat the computer or various electronic devices due to the poor circulation of the internal working medium. After careful investigation by the applicant It is found that the vaporization efficiency or liquefaction efficiency of the working medium in the heat dissipation device is one of the important factors affecting the circulating flow of the working medium. Therefore, how to strengthen the circulating flow of the working medium in the heat dissipation device has become an urgent research topic.

The main object of the present invention is to provide a heat dissipation device with a vaporization structure to increase the thermal contact area and enhance the vaporization efficiency of the working medium, thereby promoting the circulating flow of the working medium of the heat dissipation device and effectively improving the overall heat dissipation efficiency. Preferably, but not limited to this, the vaporized structure is a plurality of skived fins with the advantage of high fin density.

In a preferred embodiment, the present invention provides a heat dissipation device, which includes: a first cavity having a first cavity and used for thermal contact with a heat source; At least one first tube body, each first tube body having a first channel formed therein, and a first end of the first channel is in fluid communication with the first chamber; wherein, the first chamber and the first channel The channel is filled with a working medium; a heat dissipation fin set is provided on the outer edge of the at least one first tube; and a vaporization structure is provided in the first cavity and is in thermal contact with the first cavity and at least Part of the working medium receives heat energy from the heat source and transfers it to the working medium, so that the working medium performs liquid-vapor conversion and moves toward the second end of the first channel.

In a preferred embodiment, the heat dissipation device, wherein the at least one first tube body includes a plurality of first tube bodies, and the heat dissipation fin group includes a plurality of heat dissipation fins; wherein, any one of the first tube systems is located in two Between the heat sink fin groups.

In a preferred embodiment, the vaporization structure includes a plurality of skived fins.

In a preferred embodiment, the first cavity includes a first plate, a second plate, and a plurality of side plates connected between the first plate and the second plate, and the first plate The body, the second plate body and the plurality of side plates collectively define the first chamber.

In a preferred embodiment, the second plate body has a plate body through hole, and the plate body through hole communicates with the first end of the first channel.

In a preferred embodiment, the heat dissipation device further includes a second cavity, and the second cavity has a second cavity, and the second cavity is in fluid communication with the second end of the first channel; Wherein the first chamber, the second chamber and each of the first One channel forms a closed room space.

In a preferred embodiment, the heat dissipation device further includes a heat dissipation element, and the heat dissipation element is disposed on an outer surface of the second cavity.

In a preferred embodiment, the heat dissipation device further includes a liquefaction structure, the liquefaction structure is disposed in the second chamber, and is in thermal contact with the second chamber and at least part of the working medium for the working medium to perform vapor-liquid Convert and move in the direction of the first end of the first channel.

In a preferred embodiment, the liquefied structure includes a plurality of skived fins.

In a preferred embodiment, the second end of the first channel is closed.

In a preferred embodiment, both ends of the at least one first tube are connected to the first cavity.

In a preferred embodiment, the at least one first tube body is provided with a liquefaction structure for the working medium to perform vapor-liquid conversion and move toward the first end of the first channel.

In a preferred embodiment, the liquefaction structure is a capillary structure or a groove formed on an inner surface of the at least one first tube and located in the first channel.

In a preferred embodiment, the heat dissipation device further includes: a third cavity having a third cavity and used for thermal contact with the heat source or another heat source; At least one second tube body, each second tube body has a second channel formed therein, and a first end of the second channel is in fluid communication with the third chamber; wherein, the third chamber and the second channel The channel is filled with another working medium and another heat dissipation fin set, which are arranged at the outer edge of the at least one second tube; and another vaporization structure is arranged in the third chamber and is in thermal contact with the first Three chambers and at least part of the other working medium to receive the heat energy from the heat source or one of the other heat sources and transfer it to the other working medium for the liquid vapor conversion of the other working medium to the first working medium The direction of the second end of one of the two channels moves.

In a preferred embodiment, at least one of the first cavity and the first tubes is directly connected to at least one of the third cavity and the second tubes to be mutually interlockable Or, at least one of the first cavity and the first tubes can be interlocked with at least one of the third cavity and the second tubes through an intermediate connecting structure.

In a preferred embodiment, each of the first pipe systems is a longitudinal pipe body, and each of the second pipe systems is a transverse pipe body.

In a preferred embodiment, the other vaporization structure includes a plurality of skived fins.

1A‧‧‧radiating device

1B‧‧‧radiating device

1C‧‧‧radiating device

1D‧‧‧radiating device

1E‧‧‧radiating device

1F‧‧‧radiating device

1G‧‧‧radiating device

2‧‧‧ working medium

2a‧‧‧Working medium

2b‧‧‧Working medium

4‧‧‧Working medium

31‧‧‧heat source

32‧‧‧heat source

11‧‧‧ First cavity

12‧‧‧The second cavity

13‧‧‧The first tube

13F‧‧‧The first tube

14‧‧‧Cooling Fin Set

15‧‧‧ Vaporization structure

16‧‧‧Liquified structure

17‧‧‧Cooling components

18‧‧‧Liquified structure

111‧‧‧ First chamber

112‧‧‧First board

113‧‧‧Second plate

114‧‧‧Side board

121‧‧‧The second chamber

131‧‧‧ First channel

141‧‧‧fin fins

191‧‧‧The third cavity

192‧‧‧Second tube body

193‧‧‧ Fin set

194‧‧‧ vaporized structure

1131‧‧‧Board through hole

1311‧‧‧The first end of the first channel

1312‧‧‧The second end of the first channel

19211‧‧‧The first end of the second channel

FIG. 1 is a schematic diagram showing the appearance of the heat dissipation device of the present invention in a first preferred embodiment.

Figure 2: It is a three-dimensional exploded view of the partial structure of the heat dissipation device shown in Figure 1 schematic diagram.

FIG. 3 is a schematic cross-sectional conceptual diagram of a part of the structure of the heat dissipation device shown in FIG. 1.

4 is a schematic cross-sectional conceptual diagram of a partial structure of a heat dissipation device of the present invention in a second preferred embodiment.

5 is a schematic cross-sectional conceptual diagram of a partial structure of a heat dissipation device of the present invention in a third preferred embodiment.

6 is a schematic cross-sectional conceptual diagram of a partial structure of a heat dissipation device of the present invention in a fourth preferred embodiment.

7 is a schematic cross-sectional conceptual diagram of a partial structure of a heat dissipation device of the present invention in a fifth preferred embodiment.

8 is a schematic cross-sectional conceptual diagram of a partial structure of a heat dissipation device of the present invention in a sixth preferred embodiment.

9 is a schematic cross-sectional conceptual diagram of a partial structure of a heat dissipation device of the present invention in a seventh preferred embodiment.

The thermal contact mentioned in this article refers to contact with heat conduction, and the actual structure includes at least two embodiments of direct contact and indirect contact. Of course, it is not excluded that the two are very close but in Implementations that are not really touched by the structure. In terms of direct contact between two components, it refers to the direct contact between two components Fitting; as far as the indirect contact of the two components is concerned, a thermally conductive medium, such as thermal paste, may be provided between the two components, but not limited to the above.

Please refer to FIG. 1 to FIG. 3, FIG. 1 is a schematic view of the appearance of the heat dissipation device of the present invention in a first preferred embodiment, FIG. 2 is an exploded perspective view of a partial structure of the heat dissipation device shown in FIG. 1, and FIG. 3 is FIG. 1 A schematic cross-sectional conceptual diagram of a partial structure of the heat dissipation device shown. The heat dissipation device 1A includes a first cavity 11, a second cavity 12, a plurality of first tubes 13, a plurality of heat dissipation fin groups 14, and a vaporization structure 15. The second cavity 12 is located above the first cavity 11, and The first cavity 11 and the second cavity 12 respectively have a first cavity 111 and a second cavity 121, and each first tube 13 is formed with a first channel 131, and each first channel The end 1311 is in fluid communication with the first chamber 111, and the second end 1312 of each first channel 131 is in fluid communication with the second chamber 121 so that the first chamber 111 of the first chamber 11 and the second chamber 12 The second chamber 121 and the first channels 131 of the first tubes 13 form an enclosed space and are filled with the working medium 2; wherein, the heat dissipation fin groups 14 are disposed on the outer edge of the first tube 13 , It is mainly used to receive the heat energy in the first tube body 13 for the air flow in the environment to take away the heat energy, and the vaporization structure 15 is disposed in the first chamber 111 and is in thermal contact with the first chamber 11 and At least part of the working medium 2, such as being immersed in at least part of the working medium 2, is mainly used to strengthen the steam of the working medium 2. Efficiency, this will be detailed later.

In this preferred embodiment, any first tube 13 is located between two adjacent heat dissipation fin groups 14, and each heat dissipation fin group 14 includes a plurality of heat dissipation fins 141, and the heat dissipation fins The 141 lines are arranged along the outer edge of the first tube 13 in such a manner that they are almost parallel to each other. Furthermore, in the preferred embodiment, the first cavity 11 includes A plate body 112, a second plate body 113, and a plurality of side plates 114 connected between the first plate body 112 and the second plate body 113, and the first plate body 112, the second plate body 113, and the plurality of side plates 114 define together The first chamber 111; wherein, the vaporization structure 15 is a plurality of cutting fins (skived fin), and is provided on the first plate 112, and the second plate 113 has a plurality of plate through holes 1131, and these plates The body through holes 1131 communicate with the first ends 1311 of the first channels 131 of the first tubes 13 respectively. In addition, in the present preferred embodiment, the structure of the second cavity 12 is similar to the structure of the first cavity 11, which will not be repeated here.

However, the above are only examples, the composition of the heat dissipation fin group 14 and the arrangement of the heat dissipation fins 141, the structure composition of the first cavity 11 and the second cavity 12 and the first tube 13 The connection relationship, the implementation state of the vaporization structure 15 and the relative positional relationship with the first chamber 111 of the first cavity 11 are not limited to the above. Those skilled in the art can perform any equalization based on actual application requirements Design changes.

Next, the heat dissipation operation of the heat dissipation device 1A will be described. When the first plate 112 of the first cavity 11 is in thermal contact with the heat source 31 below, the heat energy of the heat source 31 is transferred to the first chamber 111 through the first plate 112 and the vaporization structure 15 thereon The liquid working medium 2a is in thermal contact with the first plate 112 and the vaporization structure 15, and the liquid working medium 2a will generate vaporization after absorbing sufficient thermal energy and be converted into a gaseous working medium 2b, that is, liquid vapor Conversion, and then, the gaseous working medium 2b enters the first channel 131 from the first end 1311 of the first channel 131 of the first tubes 13 and moves in the direction of the second end 1312 of the first channel 131; , The thermal energy of the gaseous working medium 2b located in the first channels 131 will be radiated outward to the position The heat dissipation fin groups 14 on the outer edge of a tube body 13, so the gaseous working medium 2b will condense and liquefy due to the release of heat energy, and then be converted into a liquid working medium 2a again. Finally, the liquid working medium 2a The first end 1311 of the first channel 131 of the first tubes 13 flows back to the first chamber 111 of the first cavity 11 and accumulates therein.

Through the above-mentioned two-phase change working cycle, the heat energy generated by the heat source 31 can be quickly discharged by the heat sink 1A. In particular, since the vaporized structure 15 in this preferred embodiment uses skived fins, it has the advantage of high fin density, thereby increasing the thermal contact between the vaporized structure 15 and the liquid working medium 2a The area, that is, the area available for heat energy transfer, increases the vaporization speed of the working medium 2a in the liquid state, thereby promoting the circulating flow of the working medium 2 of the heat sink 1A, and effectively improving the overall heat dissipation performance of the heat sink 1A. In addition, another advantage of the use of skived fins for the vaporization structure 15 is that it can reduce processing costs.

Please refer to FIG. 4, which is a schematic sectional view of a partial structure of a heat dissipation device of the present invention in a second preferred embodiment. The heat dissipation device of this preferred embodiment is roughly similar to that described in the first preferred embodiment of this case, and will not be repeated here. The difference between this preferred embodiment and the aforementioned first preferred embodiment is that the heat dissipation device 1B further includes a liquefaction structure 16, which is disposed in the second chamber 121 and is in thermal contact with the second chamber 12 and At least part of the working medium 2b is mainly used to enhance the liquefaction efficiency of the working medium 2b when performing vapor-liquid conversion. In the preferred embodiment, the liquefied structure 16 is also a plurality of skived fins.

As mentioned in the first preferred embodiment, the gaseous working medium 2b in the first channels 131 of the first tubes 13 will liquefy due to the release of heat energy The liquid working medium 2a flows back into the first chamber 111, however, part of the gaseous working medium 2b (the working medium 2b that has not been liquefied in the first channel 131 of the first tubes 13) will still The second chamber 121 is entered from the second end 1312 of the first channel 131.

Since the second chamber 121 in this preferred embodiment is provided with the liquefaction structure 16 and the liquefaction structure 16 also uses skived fins, as mentioned above, the cutting fins have the advantage of high fin density, Therefore, the thermal contact area between the liquefaction structure 16 and the gaseous working medium 2b is increased, that is, the area available for heat energy transfer is increased, so the liquefaction speed of the gaseous working medium 2b can be increased, so that the liquid working medium 2a Then, it returns to the first chamber 111 of the first cavity 11 through the first channels 131 of the first tube bodies 13 and accumulates therein. Therefore, the arrangement of the liquefaction structure 16 can also promote the circulating flow of the working medium 2 of the heat dissipation device 1B, and effectively improve the overall heat dissipation efficiency of the heat dissipation device 1B. Of course, the above is only an example, and the liquefaction structure 16 can also adopt other structures that can increase the thermal contact area to enhance the liquefaction efficiency of the working medium 2b, and is not limited to skived fins.

Please refer to FIG. 5, which is a schematic sectional view of a partial structure of a heat dissipation device 1A of the present invention in a third preferred embodiment. The heat dissipation device 1A of this preferred embodiment is substantially similar to those described in the first to second preferred embodiments of this case, and will not be repeated here. The difference between this preferred embodiment and the aforementioned first to second preferred embodiments is that the heat dissipation device 1A further includes a heat dissipation element 17 disposed on the outer surface of the second cavity 12, and the heat dissipation element 17 mainly assists in The heat energy of the chamber 121 is dissipated to the outside environment, so that the gaseous working medium 2b in the second chamber 121 can quickly condense and liquefy back to the liquid working medium 2a, and the liquid working medium 2a passes through the first Tube 13 The first channel 131 flows back to the first chamber 111 of the first cavity 11 and accumulates therein. In the preferred embodiment, the heat dissipating element 17 is a plurality of fins, which are used to receive the heat energy in the second cavity 12 for the air flow in the environment to take away the heat energy, but the implementation of the heat dissipating element 17 is not Fins are limited.

Please refer to FIG. 6, which is a schematic sectional view of a partial structure of a heat dissipation device of the present invention in a fourth preferred embodiment. The heat dissipation device 1D of this preferred embodiment is substantially similar to those described in the first to third preferred embodiments of this case, and will not be repeated here. The difference between this preferred embodiment and the aforementioned first to third preferred embodiments is that each first tube body 13 is also provided with another liquefaction structure 18 which is formed in the first tube body 13 The surface is located in the first channel 131 and is mainly used to increase the thermal contact area with the gaseous working medium 2b in the first channel 131, thereby enhancing the liquefaction efficiency of the gaseous working medium 2b in the first channel 131. Preferably, but not limited to this, the liquefied structure 18 may be a capillary structure or a groove.

Please refer to FIG. 7, which is a schematic sectional view of a partial structure of a heat dissipation device of the present invention in a fifth preferred embodiment. The heat dissipation device 1E of this preferred embodiment is substantially similar to that described in the first preferred embodiment of this case, and will not be repeated here. The difference between this preferred embodiment and the aforementioned first preferred embodiment is that the heat dissipation device 1E does not include the second cavity, and the second end 1312 of the first channel 131 of each first tube 13 is closed. That is, the first chamber 111 of the first cavity 11 and the first channels 131 of the first tube bodies 13 form a closed space. Among them, the heat dissipation action of the heat dissipation device 1E of this preferred embodiment is also similar to that described in the first preferred embodiment of this case, and will not be repeated here.

Please refer to FIG. 8, which is a schematic sectional view of a partial structure of a heat dissipation device of the present invention in a sixth preferred embodiment. The heat dissipation device 1F of this preferred embodiment is substantially similar to that described in the fifth preferred embodiment of this case, and will not be repeated here. The difference between this preferred embodiment and the aforementioned fifth preferred embodiment is that both ends of each first tube 13F are connected to the first cavity 11, in other words, each of the first tubes 13F The first end 1311 and the second end 1312 of the first channel 131 communicate with the first chamber 111 of the first cavity 11 respectively. Among them, the heat dissipation action of the heat dissipation device 1F of this preferred embodiment is also similar to that described in the first preferred embodiment of this case, and will not be repeated here.

Please refer to FIG. 9, which is a schematic sectional view of a partial structure of a heat dissipation device of the present invention in a seventh preferred embodiment. In order to clearly illustrate the preferred embodiment, FIG. 9 only shows a part of the structure (the first cavity 11, the second cavity 12, the first tube 13, and the heat dissipation fin group 14 are not shown). The heat dissipation device 1G of this preferred embodiment is substantially similar to those described in the first to sixth preferred embodiments of this case, and will not be repeated here. The difference between this preferred embodiment and the aforementioned first to sixth preferred embodiments is that the heat dissipation device 1G further includes a third cavity 191, a plurality of second tubes 192, a plurality of heat dissipation fin groups 193, and another steam Structure 194, the third cavity 191 is located on the side of the second cavity 12 (such as the left side), or is located between the first cavity 11 and the second cavity 12 and is biased to the side (such as the side), The third cavity 191 has a third cavity 1911, and each second tube 192 has a second channel 1921 formed therein. The first end 19211 of each second channel 1921 is in fluid communication with the third cavity 1911, so that The third chamber 1911 of the third cavity 191 and the second channels 1921 of the second tubes 192 form an enclosed space and are filled with another work Medium 4; wherein, the heat dissipation fin group 193 is disposed on the outer edge of the second tube 192, and is mainly used to receive the thermal energy in the second tube 192, so that the airflow in the environment can take away the thermal energy, and The other vaporization structure 194 is a plurality of skived fins, but not limited to this, it is disposed in the third chamber 1911 and is in thermal contact with the third chamber 191 and at least part of the other work The medium 4 is mainly used to enhance the vaporization efficiency of the other working medium 4.

In the preferred embodiment, the composition of the heat dissipation fin group 193 and the arrangement of the heat dissipation fins are similar to the composition of the heat dissipation fin group 14 and the arrangement of the heat dissipation fins 141, and the structure composition of the third cavity 191 And the connection relationship with the second tubes 192 is similar to the structural composition of the first cavity 11 and the connection relationship with the first tubes 13, the implementation of another vaporization structure 194 and the third cavity The relative positional relationship between the third chamber 1911 of the body 191 is similar to the relative positional relationship between the vaporization structure 15 and the first chamber 111 of the first chamber 11, and the other working medium 4 is in the third position of the third chamber 191 The working cycle of the two-phase change in the chamber 1911 and the second tubes 192 is similar to the working medium 2 in the first chamber 111 of the first cavity 11, the first tubes 13 and the second cavity 12 The two-phase changing duty cycle in the second chamber 121.

Furthermore, in the preferred embodiment, at least one of the first cavity 11, the second cavity 12, the first tubes 13 and the heat dissipation fin sets 14 is directly connected to the third cavity 191, at least one of the second tube bodies 192 and the heat dissipation fin groups 193 can be connected to each other; or the first cavity 11, the second cavity 12, the first tubes 13, the At least one of the heat dissipation fin groups 14 corresponds to an intermediate connecting structure (not shown, such as used to fix the first cavity 11, the second cavity 12, and the third cavity 191 Outer shell) and can be interlocked with at least one of the third cavity 191, the second tubes 192, and the heat dissipation fin groups 193; preferably, but not limited to this, each first The tube body 13 is a longitudinal tube body, and each second tube body 192 is a horizontal tube body. Among them, since the heat dissipation device 1G has a plurality of cavities that can be used for thermal contact with the heat sources 31 and 32 to dissipate the thermal energy (the first preferred embodiment is the first cavity 11 and the third cavity 191), it can be applied according to actual conditions The space conditions are flexible. For example, the third cavity 191 is placed above the other heat source 32 after rotating the heat dissipation device 1G by 90 degrees according to the practically applicable space conditions (even if the second tubes 192 are turned from horizontal to vertical) It is in thermal contact with the other heat source 32, so that the heat energy generated by the other heat source 32 can also be quickly discharged by the heat sink 1G.

The above-mentioned embodiments are merely illustrative for explaining the principle and effect of the present invention, and explaining the technical features of the present invention, rather than limiting the protection scope of the present invention. Anyone who is familiar with this technology can easily complete the changes or equal arrangements without violating the technical principles and spirit of the present invention, which are within the scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be as listed in the scope of patent application mentioned later.

Claims (17)

A heat dissipation device includes: a first cavity having a first cavity and used for thermal contact with a heat source; at least one first tube, each of the first tubes has a first channel formed therein, and the first A first end of a channel is in fluid communication with the first chamber; wherein, the first chamber and the first channel are filled with a working medium; a heat dissipation fin set is disposed on the at least one first tube body Outer edge; and a vaporization structure, disposed in the first chamber, and in thermal contact with the first chamber and at least part of the working medium, to receive heat energy from the heat source and transfer it to the working medium for The working medium performs liquid-vapor conversion and moves in the direction of one second end of the first channel. The heat dissipation device as described in item 1 of the patent application scope, wherein the at least one first tube body includes a plurality of first tube bodies, and the heat dissipation fin group includes a plurality of heat dissipation fins; wherein, any one of the first tube systems is located 2. Between the heat dissipation fin groups. The heat dissipation device as described in item 1 of the patent application scope, wherein the vaporization structure includes a plurality of skived fins. The heat dissipation device as described in item 1 of the patent application scope, wherein the first cavity includes a first plate body, a second plate body and a plurality of side plates connected between the first plate body and the second plate body And the first plate body, the second plate body and the plurality of side plates jointly define the first chamber. The heat dissipation device as described in item 4 of the patent application scope, wherein the second plate body has a plate body through hole, and the plate body through hole communicates with the first end of the first channel. The heat dissipation device as described in item 1 of the patent application further includes a second cavity, and the second cavity has a second cavity, and the second cavity and the second end of the first channel Fluid communication; wherein, the first chamber, the second chamber, and each of the first channels form an enclosed chamber space. The heat dissipation device as described in item 6 of the patent application scope further includes a heat dissipation element, and the heat dissipation element is disposed on an outer surface of the second cavity. The heat dissipation device as described in item 6 of the patent application scope further includes a liquefaction structure disposed in the second chamber and in thermal contact with the second chamber and at least part of the working medium for the working medium Vapor-liquid conversion is performed and moves in the direction of the first end of the first channel. The heat dissipation device as described in item 8 of the patent application scope, wherein the liquefied structure includes a plurality of skived fins. The heat dissipation device as described in item 1 of the patent application scope, wherein the second end of the first channel is closed. The heat dissipation device as described in item 1 of the patent application scope, wherein the at least one first tube Both ends of the body are connected with the first cavity. The heat dissipation device as described in item 1 of the patent application scope, wherein the at least one first tube body is provided with a liquefaction structure for the working medium to perform vapor-liquid conversion and move in the direction of the first end of the first channel. The heat dissipation device as described in item 1 of the patent application scope, wherein the liquefaction structure is a capillary structure or a groove formed on an inner surface of the at least one first tube and located in the first channel. The heat dissipation device as described in item 1 of the scope of the patent application further includes: a third cavity with a third cavity for thermal contact with the heat source or another heat source; at least a second tube, each A second channel is formed in the second tube, and a first end of the second channel is in fluid communication with the third chamber; wherein, the third chamber and the second channel are filled with another working medium A further heat dissipation fin set, disposed at the outer edge of the at least one second tube; and another vaporization structure, disposed in the third cavity, and in thermal contact with the third cavity and at least part of the other A working medium to receive heat energy from the heat source or the other heat source and transfer it to the other working medium for the liquid vapor conversion of the other working medium and to the second end of the second channel Direction of movement. The heat dissipation device as described in item 14 of the patent application scope, wherein at least one of the first cavity and the first tubes is directly connected to the third cavity and the ones At least one of the second tubes can be connected to each other; or at least one of the first cavity and the first tubes can be connected to the third cavity and the ones through an intermediate connecting structure At least one of the second tubes is linked. The heat dissipation device as described in item 14 of the patent application scope, wherein each of the first tube systems is a longitudinal tube body, and each of the second tube systems is a horizontal tube body. The heat dissipation device as described in item 14 of the patent application range, wherein the other vaporization structure includes a plurality of skived fins.