JP3206683U - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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JP3206683U
JP3206683U JP2016003465U JP2016003465U JP3206683U JP 3206683 U JP3206683 U JP 3206683U JP 2016003465 U JP2016003465 U JP 2016003465U JP 2016003465 U JP2016003465 U JP 2016003465U JP 3206683 U JP3206683 U JP 3206683U
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plate
chamber
capillary material
heat
storage space
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葉雲宇
曾惓祺
崔明全
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Tai Sol Electronics Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0258—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with means to remove contaminants, e.g. getters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00—Heat exchange conduits
    • F28F2210/02—Heat exchange conduits with particular branching, e.g. fractal conduit arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

【課題】ベイパーチャンバーとヒートパイプの組み合わせによる放熱装置を提供する。【解決手段】ベイパーチャンバー１１、第一毛細管材１２、ヒートパイプ１３、第二毛細管材１４、繊維束１５および作業液体を備える。ベイパーチャンバー１１は第一プレート１１１と、第二プレート１１２と、第一プレート１１１と第二プレート１１２が合わさって形成した格納空間とを有する。第一毛細管材１２は第一プレート１１１および第二プレート１１２または両者のいずれか一つに分布する。ヒートパイプ１３はチャンバー１３１を有し、一端がベイパーチャンバー１１に繋がり、他端が密閉状態に保持され、ベイパーチャンバー１１に露出する。チャンバー１３１は格納空間に繋がる。第二毛細管材１４はヒートパイプ１３の内壁に分布する。繊維束１５は線形を呈し、一部分が格納空間内に配置され、かつ第一毛細管材１２に接触し、別の一部分がチャンバー１３１内まで伸び、第二毛細管材１４に接触する。作業液体は格納空間およびチャンバー１３１に充満する。【選択図】図３A heat dissipating device using a combination of a vapor chamber and a heat pipe is provided. A vapor chamber 11, a first capillary material 12, a heat pipe 13, a second capillary material 14, a fiber bundle 15 and a working liquid are provided. The vapor chamber 11 has a first plate 111, a second plate 112, and a storage space formed by combining the first plate 111 and the second plate 112. The first capillary material 12 is distributed on either the first plate 111 and the second plate 112 or both. The heat pipe 13 has a chamber 131, one end is connected to the vapor chamber 11, the other end is held in a sealed state, and is exposed to the vapor chamber 11. The chamber 131 is connected to the storage space. The second capillary material 14 is distributed on the inner wall of the heat pipe 13. The fiber bundle 15 has a linear shape, and a part thereof is disposed in the storage space and contacts the first capillary 12, and another part extends into the chamber 131 and contacts the second capillary 14. The working liquid fills the storage space and the chamber 131. [Selection] Figure 3

Description

本考案は放熱技術に関し、詳しくはベイパーチャンバーとヒートパイプの組み合わせによる放熱装置に関するものである。   The present invention relates to a heat dissipation technique, and more particularly to a heat dissipation device using a combination of a vapor chamber and a heat pipe.

科学技術が進んでいる現今において、ユーザーのニーズを満足させるために、電子産業界は電子製品の性能を向上させ続け、その一方で製品内部の電子部品に生じた熱エネルギーを増大させるという問題を解決しなければならない。
上述した問題を効果的に解決するために、業界では、熱伝導性が良好なベイパーチャンバーおよびヒートパイプを広範囲に使用する、例えばベイパーチャンバーおよびヒートパイプからなる放熱装置を使用することが一般的である。 In today's advancing science and technology, the electronic industry continues to improve the performance of electronic products in order to satisfy user needs, while increasing the thermal energy generated in electronic components inside the products. Must be resolved.
In order to effectively solve the above-mentioned problems, it is common in the industry to use a vapor chamber and a heat pipe having a good thermal conductivity in a wide range, for example, a heat dissipation device including a vapor chamber and a heat pipe. is there.

特許文献１により開示された温度が均一な放熱器は、ベイパーチャンバー、複数のヒートパイプおよびフィン構造を備える。ベイパーチャンバーは上板および下板を有し、内部が中空チャンバーである。複数のヒートパイプはベイパーチャンバーの上板の表面に固定され、フィン構造に接続され、かつ内部空間を有する。ヒートパイプの内部空間とベイパーチャンバーの中空チャンバーとは相互に繋がることが特徴である。   The radiator having a uniform temperature disclosed in Patent Document 1 includes a vapor chamber, a plurality of heat pipes, and a fin structure. The vapor chamber has an upper plate and a lower plate, and the inside is a hollow chamber. The plurality of heat pipes are fixed to the surface of the upper plate of the vapor chamber, connected to the fin structure, and have an internal space. A feature is that the internal space of the heat pipe and the hollow chamber of the vapor chamber are connected to each other.

ヒートパイプまたはベイパーチャンバーは毛細管構造を介して作業液体を誘導し、循環させることによって放熱効果を果たすことがこの技術領域において常識者によく知られる。毛細管構造は銅粉末焼結によって成形される。上述したベイパーチャンバーの下板は熱源の接触面となる。作業液体は蒸発し、気体状態に転換すると同時にヒートパイプに流れ込み、そののちヒートパイプの管壁を通ってフィン構造によって熱エネルギーを外部へ拡散させる。従って、放熱効率を維持するには、ベイパーチャンバーは循環が良好な作業液体に頼らなければならない。
しかしながら、上述した放熱器はベイパーチャンバーとヒートパイプの内壁に毛細管作用を生じさせることによって作業液体を誘導するため、連なる毛細管構造を配置することが必要である。一方、ベイパーチャンバーの毛細管構造とヒートパイプの湾曲した部位の毛細管構造とを連結するために、別の加工作業を免れず、その結果、製造工程が複雑になる。また、銅粉末焼結によって成形される毛細管構造は作業液体を長距離輸送する効果があまりよくない。 It is well known to those skilled in the art that heat pipes or vapor chambers provide a heat dissipating effect by guiding and circulating a working liquid through a capillary structure. The capillary structure is formed by copper powder sintering. The lower plate of the vapor chamber described above becomes a contact surface of the heat source. The working liquid evaporates and transforms into a gaseous state, and at the same time flows into the heat pipe, and then diffuses the thermal energy to the outside through the pipe wall of the heat pipe by the fin structure. Therefore, to maintain heat dissipation efficiency, the vapor chamber must rely on a working fluid with good circulation.
However, since the above-described heat radiator induces a working liquid by causing a capillary action on the inner wall of the vapor chamber and the heat pipe, it is necessary to arrange a continuous capillary structure. On the other hand, in order to connect the capillary structure of the vapor chamber and the capillary structure of the curved portion of the heat pipe, another processing operation is inevitable, resulting in a complicated manufacturing process. In addition, the capillary structure formed by copper powder sintering is not very effective in transporting the working liquid over a long distance.

従って、上述したとおり、温度が均一な放熱器の熱伝導効果には改善の余地がある。改善すれば上述した問題点を解決できる。   Therefore, as described above, there is room for improvement in the heat conduction effect of the radiator having a uniform temperature. If improved, the above-mentioned problems can be solved.

台湾Ｍ２８６５６４号公報Taiwan M286564 gazette

本考案は、繊維束でベイパーチャンバーとヒートパイプとを連結し、作業液体を長距離輸送し、作業液体の通過質量を増加させることによって放熱効率を増大させる放熱装置を提供することを主な目的とする。   The main object of the present invention is to provide a heat dissipation device that increases the heat dissipation efficiency by connecting a vapor chamber and a heat pipe with a fiber bundle, transporting the working liquid over a long distance, and increasing the passing mass of the working liquid. And

上述した課題を解決するため、放熱装置は、ベイパーチャンバー、第一毛細管材、少なくとも一つのヒートパイプ、第二毛細管材、少なくとも一つの繊維束および作業液体を備える。
ベイパーチャンバーは第一プレート、第二プレート、第一プレートと第二プレートが合わさって形成した格納空間および格納空間に位置する加熱エリアを有する。第一毛細管材は第一プレートおよび第二プレートまたは両者のいずれか一つに分布し、かつ加熱エリアに据えられる。少なくとも一つのヒートパイプはチャンバーを有し、一端がベイパーチャンバーに繋がり、他端が密閉状態に保持され、ベイパーチャンバーに露出する。チャンバーは格納空間に繋がる。第二毛細管材は少なくとも一つのヒートパイプの内壁に分布する。少なくとも一つの繊維束は線形を呈し、一部分が格納空間内かつ第一プレートおよび第二プレートまたは両者のいずれか一つに配置され、かつ第一毛細管材に接触し、別の一部分がチャンバー内まで伸び、ヒートパイプの内壁の第二毛細管材に接触する。作業液体は格納空間およびチャンバーに充満する。 In order to solve the above-described problem, the heat dissipation device includes a vapor chamber, a first capillary material, at least one heat pipe, a second capillary material, at least one fiber bundle, and a working liquid.
The vapor chamber has a first plate, a second plate, a storage space formed by combining the first plate and the second plate, and a heating area located in the storage space. The first capillary material is distributed on the first plate and / or the second plate, and is placed in the heating area. At least one heat pipe has a chamber, one end is connected to the vapor chamber, the other end is kept sealed, and is exposed to the vapor chamber. The chamber is connected to the storage space. The second capillary material is distributed on the inner wall of at least one heat pipe. At least one fiber bundle is linear, a portion is disposed in the containment space and / or in the first plate and / or the second plate, and contacts the first capillary material, and another portion extends into the chamber. Elongates and contacts the second capillary material on the inner wall of the heat pipe. The working liquid fills the storage space and chamber.

先行技術はフィン、ヒートパイプおよびベイパーチャンバーの構造または数を変えることを改善策として採用し、その一方で製品の体積またはコストを増大させ、生産上および使用上の不都合をきたすという問題を抱える。
これに対し、本考案による放熱装置は少なくとも一つの繊維束の一部分が加熱エリアの第一毛細管材に接続され、別の一部分がチャンバー内の第二毛細管材に接続され、繊維束によって作業液体を長距離輸送し、作業液体の通過質量を増加させるため、上述した問題を解決できるだけでなく、熱伝導効率を増大させることができる。 The prior art has the problem of adopting a modification of the structure or number of fins, heat pipes and vapor chambers as an improvement, while increasing the volume or cost of the product and causing production and use disadvantages.
In contrast, in the heat dissipation device according to the present invention, a part of at least one fiber bundle is connected to the first capillary material in the heating area, and another part is connected to the second capillary material in the chamber. In order to increase the passing mass of the working liquid by transporting over a long distance, not only the above-mentioned problems can be solved, but also the heat conduction efficiency can be increased.

比較的好ましい場合、ヒートパイプおよび加熱エリアの配置位置は一致しない。   When relatively preferable, the arrangement positions of the heat pipe and the heating area do not match.

比較的好ましい場合、本考案による放熱装置はユーザーのニーズに応じてベイパーチャンバーおよびヒートパイプの部位を変えることによって生産上および使用上の利便性をはかることができる。   In a relatively preferable case, the heat dissipating device according to the present invention can be produced and used conveniently by changing the location of the vapor chamber and the heat pipe according to the user's needs.

本考案の第１実施形態による放熱装置を示す斜視図である。1 is a perspective view showing a heat dissipation device according to a first embodiment of the present invention. 本考案の第１実施形態による放熱装置の底部を示す斜視図である。It is a perspective view which shows the bottom part of the thermal radiation apparatus by 1st Embodiment of this invention. 図１中の３−３線に沿った断面図である。FIG. 3 is a cross-sectional view taken along line 3-3 in FIG. 1. 本考案の第１実施形態による放熱装置の第一プレートが除去された状態を示す底面図である。It is a bottom view showing a state where the first plate of the heat dissipation device according to the first embodiment of the present invention is removed. 本考案の第２実施形態による放熱装置の第一プレートが除去された状態を示す底面図である。It is a bottom view which shows the state from which the 1st plate of the thermal radiation apparatus by 2nd Embodiment of this invention was removed. 図５中の６−６線に沿った断面図である。FIG. 6 is a cross-sectional view taken along line 6-6 in FIG. 本考案の第３実施形態による放熱装置の第一プレートが除去された底部を示す斜視図である。It is a perspective view which shows the bottom part from which the 1st plate of the thermal radiation apparatus by 3rd Embodiment of this invention was removed. 本考案の第１実施形態による放熱装置の第一プレートが除去された状態を示す底面図である。It is a bottom view showing a state where the first plate of the heat dissipation device according to the first embodiment of the present invention is removed. 図８中の９−９線に沿った断面図である。FIG. 9 is a cross-sectional view taken along line 9-9 in FIG.

以下、本考案による放熱装置を図面に基づいて説明する。   Hereinafter, a heat dissipation device according to the present invention will be described with reference to the drawings.

（第１実施形態）
図１から図４に示すように、本考案の第１実施形態による放熱装置１０は、ベイパーチャンバー１１、第一毛細管材１２、少なくとも一つのヒートパイプ１３、第二毛細管材１４、少なくとも一つの繊維束１５および作業液体（図中未表示）を備える。 (First embodiment)
As shown in FIGS. 1 to 4, the heat dissipation device 10 according to the first embodiment of the present invention includes a vapor chamber 11, a first capillary material 12, at least one heat pipe 13, a second capillary material 14, and at least one fiber. A bundle 15 and a working liquid (not shown in the figure) are provided.

ベイパーチャンバー１１は、第一プレート１１１と、第二プレート１１２と、第一プレート１１１と第二プレート１１２が合わさって形成した格納空間１１３と、格納空間１１３に位置する加熱エリアＨと、気体排出管１６とを有する。
気体排出管１６は一端がベイパーチャンバー１１の格納空間１１３に繋がり、他端が密封状態に保持され、ベイパーチャンバー１１に露出する。第一プレート１１１と第二プレート１１２とは合わさって密封される。 The vapor chamber 11 includes a first plate 111, a second plate 112, a storage space 113 formed by combining the first plate 111 and the second plate 112, a heating area H located in the storage space 113, and a gas exhaust pipe. 16.
One end of the gas discharge pipe 16 is connected to the storage space 113 of the vapor chamber 11, the other end is held in a sealed state, and is exposed to the vapor chamber 11. The first plate 111 and the second plate 112 are sealed together.

第一毛細管材１２は、第一プレート１１１および第二プレート１１２または両者のいずれか一つに分布し、かつ加熱エリアＨに据えられる。本実施形態において、第一毛細管材１２は第二プレート１１２に分布する。第一毛細管材１２は銅粉末焼結によって成形されるが、これに限らず、メッシュから構成されてもよい。   The first capillary material 12 is distributed in any one of the first plate 111 and the second plate 112 or both, and is placed in the heating area H. In the present embodiment, the first capillary material 12 is distributed on the second plate 112. Although the 1st capillary material 12 is shape | molded by copper powder sintering, it may be comprised from not only this but a mesh.

少なくとも一つのヒートパイプ１３は、チャンバー１３１を有し、一端がベイパーチャンバー１１に繋がり、他端が密閉状態に保持され、ベイパーチャンバー１１に露出する。チャンバー１３１は格納空間１１３に繋がる。
本実施形態において、ヒートパイプ１３の数は三つである。ヒートパイプ１３は配置位置が加熱エリアＨに対応しないが、これに限らず、加熱エリアＨに対応してもよい。ヒートパイプ１３はフィン構造１７を貫通する。 At least one heat pipe 13 has a chamber 131, one end connected to the vapor chamber 11, the other end held in a sealed state, and exposed to the vapor chamber 11. The chamber 131 is connected to the storage space 113.
In the present embodiment, the number of heat pipes 13 is three. The arrangement position of the heat pipe 13 does not correspond to the heating area H, but is not limited thereto, and may correspond to the heating area H. The heat pipe 13 passes through the fin structure 17.

第二毛細管材１４は、複数のヒートパイプ１３の内壁に分布し、銅粉末焼結、メッシュまたはスリットによって成形される。本実施形態において、第二毛細管材１４は銅粉末焼結によって成形される。   The second capillary material 14 is distributed on the inner walls of the plurality of heat pipes 13 and is formed by copper powder sintering, mesh or slits. In the present embodiment, the second capillary material 14 is formed by copper powder sintering.

少なくとも一つの繊維束１５は、線形を呈し、一部分が格納空間１１３内かつ第一プレート１１１および第二プレート１１２または両者のいずれか一つに配置され、別の一部分がヒートパイプ１３のチャンバー１３１内まで伸びる。
本実施形態において、繊維束１５の数は三つである。繊維束１５は格納空間１１３内に位置する一部分が第二プレート１１２に据えられ、かつ加熱エリアＨの第一毛細管材１２に接触し、チャンバー１３１内に位置する一部分がヒートパイプ１３の第二毛細管材１４に接触する。 The at least one fiber bundle 15 has a linear shape, a part thereof is disposed in the storage space 113 and the first plate 111 and / or the second plate 112, and another part is in the chamber 131 of the heat pipe 13. It extends to.
In the present embodiment, the number of fiber bundles 15 is three. A portion of the fiber bundle 15 located in the storage space 113 is placed on the second plate 112 and contacts the first capillary 12 in the heating area H, and a portion located in the chamber 131 is the second capillary of the heat pipe 13. Contact material 14.

作業液体は、格納空間１１３およびヒートパイプ１３のチャンバー１３１に充満し、第一毛細管材１２、第二毛細管材１４および複数の繊維束１５に均等に浸透する。作業液体はこの領域において熟知されるため、詳しい説明を省略する。   The working liquid fills the storage space 113 and the chamber 131 of the heat pipe 13 and permeates the first capillary material 12, the second capillary material 14, and the plurality of fiber bundles 15 evenly. Since the working liquid is well known in this area, a detailed description is omitted.

以上は本考案の第１実施形態についての説明である。続いて、第１実施形態の作動状態について説明する。   The above is the description of the first embodiment of the present invention. Next, the operating state of the first embodiment will be described.

図１から図４に示すように、放熱装置１０が作動する際、加熱エリアＨは熱源（図中未表示）に接触し、温度が上昇するとともに、第一毛細管材１２に浸透した作業液体を気体状態に蒸発させ、格納空間１１３内に拡散させる。続いて、気体状態の作業液体は格納空間１１３からヒートパイプ１３のチャンバー１３１へ流動し、複数のヒートパイプ１３の管壁によって熱エネルギーをフィン構造１７に伝導し、そののち外部へ拡散させる。
続いて、気体状態の工作液体は降温し、液体状態に転換すると同時に第二毛細管材１４に浸透する。続いて、液体状態の作業液体は複数の繊維束１５の毛細管作用によって加熱エリアＨの第一毛細管材１２を辿り、第一毛細管材１２に浸透する。上述したとおり、放熱装置１０は作業液体の循環を促すことによって放熱効果を果たす。 As shown in FIGS. 1 to 4, when the heat radiating device 10 operates, the heating area H comes into contact with a heat source (not shown in the drawing), the temperature rises, and the working liquid that has penetrated into the first capillary 12 is removed. It evaporates into a gaseous state and diffuses into the storage space 113. Subsequently, the working liquid in a gas state flows from the storage space 113 to the chamber 131 of the heat pipe 13, and heat energy is conducted to the fin structure 17 through the tube walls of the plurality of heat pipes 13 and then diffused to the outside.
Subsequently, the working fluid in the gaseous state cools down and changes into the liquid state, and at the same time penetrates into the second capillary 14. Subsequently, the working liquid in the liquid state follows the first capillary material 12 in the heating area H by the capillary action of the plurality of fiber bundles 15 and permeates the first capillary material 12. As described above, the heat dissipation device 10 achieves a heat dissipation effect by promoting the circulation of the working liquid.

上述したとおり、本考案による放熱装置１０は、複数の繊維束１５の一部分が加熱エリアＨの第一毛細管材１２に接続され、別の一部分がチャンバー１３１内の第二毛細管材１４に接続され、複数の繊維束１５によって作業液体を長距離輸送し、作業液体の通過質量を増加させるため、従来の技術によって毛細管構造が銅粉末焼結によって成形される温度が均一な放熱器に優れるだけでなく、熱伝導効率を増大させることができる。   As described above, in the heat dissipation device 10 according to the present invention, a part of the plurality of fiber bundles 15 is connected to the first capillary material 12 in the heating area H, and another part is connected to the second capillary material 14 in the chamber 131. Since the working liquid is transported over a long distance by a plurality of fiber bundles 15 and the passing mass of the working liquid is increased, not only is the temperature at which the capillary structure is formed by copper powder sintering by a conventional technique excellent in a uniform radiator. The heat conduction efficiency can be increased.

上述したとおり、本考案による放熱装置１０はユーザーのニーズに応じてベイパーチャンバーとヒートパイプを組み合わせる部位が変わるため、生産上および使用上の利便性を有する。   As described above, the heat radiating device 10 according to the present invention has the convenience in production and use because the part where the vapor chamber and the heat pipe are combined changes according to the user's needs.

（第２実施形態）
図５および図６に示したのは本考案の第２実施形態による放熱装置２０である。第１実施形態との違いは次の通りである。 (Second Embodiment)
5 and 6 show a heat dissipation device 20 according to a second embodiment of the present invention. Differences from the first embodiment are as follows.

複数の繊維束２５は第一プレート２１１および第二プレート２１２に当接するように配置される。第一毛細管材２２は第一プレート２１１に分布する。   The plurality of fiber bundles 25 are arranged so as to contact the first plate 211 and the second plate 212. The first capillary material 22 is distributed on the first plate 211.

熱源（図中未表示）が加熱エリアＨ２上の第一プレート２１１および第二プレート２１２または両者のいずれか一つに接触する際、第２実施形態による放熱装置２０は複数の繊維束２５が第一プレート２１１および第二プレート２１２に当接するため、加熱エリアＨ２の第一毛細管材２２を熱源に対応する位置に据えさえればよい。従って、製作過程において別の構造または外観を変える必要なく、構造を改良することができる。
一方、第２実施形態は第一毛細管材２２によって放熱効率を向上させるが、第一毛細管材２２を配置しなくても基礎放熱を果たすことができる。そのほかの構造および達成できる効果は第一実施形態と同じであるため、詳細な説明を省略する。 When the heat source (not shown in the drawing) contacts either the first plate 211 and the second plate 212 on the heating area H2 or both of them, the heat dissipation device 20 according to the second embodiment has a plurality of fiber bundles 25 as the first. In order to come into contact with the first plate 211 and the second plate 212, it is only necessary to place the first capillary material 22 in the heating area H2 at a position corresponding to the heat source. Thus, the structure can be improved without having to change another structure or appearance during the manufacturing process.
On the other hand, although 2nd Embodiment improves heat dissipation efficiency with the 1st capillary material 22, even if it does not arrange | position the 1st capillary material 22, basic heat dissipation can be achieved. Since other structures and effects that can be achieved are the same as those of the first embodiment, detailed description thereof is omitted.

（第３実施形態）
図７および図９に示したのは本考案の第３実施形態による放熱装置３０である。第１実施形態との違いは次の通りである。 (Third embodiment)
7 and 9 show a heat dissipating device 30 according to a third embodiment of the present invention. Differences from the first embodiment are as follows.

第３実施形態において、ヒートパイプ３３の数は三つであり、繊維束３５の数はひとつである。格納空間３１３は複数のスペーサ３８を有する。複数のスペーサ３８は複数の通路３９を有する。複数のスペーサ３８は第一プレート３１１と第二プレート３１２との間、かつ加熱エリアＨ３、複数の通路３９、チャンバー３３１と格納室３１３との連絡箇所以外の部位に当接する。
加熱エリアＨ３およびチャンバー３３１は複数のスペーサ３８によって隔離され、複数の通路３９によって連絡する。複数の通路３９はヒートパイプ３３に繋がる。繊維束３５は一部分が第一毛細管材３２に接触し、別の部分が任意の二つの通路３９を通り、ヒートパイプ３３の奥まで伸び、両端が第二毛細管材３４に接触する。そのほかの構造および達成できる効果は第一実施形態と同じであるため、詳細な説明を省略する。 In the third embodiment, the number of heat pipes 33 is three, and the number of fiber bundles 35 is one. The storage space 313 has a plurality of spacers 38. The plurality of spacers 38 have a plurality of passages 39. The plurality of spacers 38 abuts between the first plate 311 and the second plate 312, and other portions than the heating area H 3, the plurality of passages 39, and the communication portion between the chamber 331 and the storage chamber 313.
The heating area H3 and the chamber 331 are separated by a plurality of spacers 38 and communicated by a plurality of passages 39. The plurality of passages 39 are connected to the heat pipe 33. A part of the fiber bundle 35 is in contact with the first capillary material 32, another part is passed through any two passages 39, extends to the back of the heat pipe 33, and both ends are in contact with the second capillary material 34. Since other structures and effects that can be achieved are the same as those of the first embodiment, detailed description thereof is omitted.

第３実施形態による放熱装置３０は、複数のスペーサ３８が第一プレート３１１および第二プレート３１２に当接するため、構造上の支持性を向上させることができる。一方、複数の通路３９の一部分には繊維束３５が配置される。作業液体が循環する際、繊維束３５が配置してある通路３９は液体状態の作業液体を誘導する。気体状態の作業液体は繊維束３５が配置されない通路３９を流動する。
上述したとおり、複数のスペーサ３８は放熱装置３０の構造上の支持性を向上させ、液体状態および気体状態の作業液体を異なる通路３９へ効果的に誘導するため、気体状態の作業液体が高速で流動しても気体状態の作業液体の流動に影響を与えることなく、熱伝導効率を増大させることができる。 In the heat dissipation device 30 according to the third embodiment, since the plurality of spacers 38 abut on the first plate 311 and the second plate 312, the structural support can be improved. On the other hand, a fiber bundle 35 is disposed in a part of the plurality of passages 39. When the working liquid circulates, the passage 39 in which the fiber bundle 35 is arranged guides the working liquid in a liquid state. The working liquid in the gas state flows through the passage 39 where the fiber bundle 35 is not disposed.
As described above, the plurality of spacers 38 improve the structural support of the heat dissipation device 30 and effectively guide the working liquid in the liquid state and the gaseous state to different passages 39. Even if it flows, the heat conduction efficiency can be increased without affecting the flow of the working liquid in the gaseous state.

１０ 放熱装置
１１ ベイパーチャンバー
１１１ 第一プレート
１１２ 第二プレート
１１３ 格納空間
１２ 第一毛細管材
１３ ヒートパイプ
１３１ チャンバー
１４ 第二毛細管材
１５ 繊維束
１６ 気体排出管
１７ フィン構造
Ｈ 加熱エリア
２０ 放熱装置
２１１ 第一プレート
２１２ 第二プレート
２２ 第一毛細管材
２５ 繊維束
Ｈ２ 加熱エリア
３０ 放熱装置
３１１ 第一プレート
３１２ 第二プレート
３１３ 格納空間
３２ 第一毛細管材
３３ ヒートパイプ
３３１ チャンバー
３４ 第二毛細管材
３５ 繊維束
３８ スペーサ
３９ 通路
Ｈ３ 加熱エリア 10 Heat dissipation device
11 Vapor chamber
111 First plate
112 Second plate
113 Storage space
12 First capillary material
13 Heat pipe
131 chamber
14 Second capillary material
15 Fiber bundle
16 Gas exhaust pipe
17 Fin structure
H Heating area
20 Heat dissipation device
211 First plate
212 Second plate
22 First capillary material
25 Fiber bundle
H2 heating area
30 Heat dissipation device
311 First plate
312 Second plate
313 Storage space 32 First capillary material
33 Heat pipe
331 chamber
34 Second capillary material
35 Fiber bundle
38 Spacer
39 Passage
H3 heating area

Claims (6)

ベイパーチャンバー、第一毛細管材、少なくとも一つのヒートパイプ、第二毛細管材、少なくとも一つの繊維束および作業液体を備え、
前記ベイパーチャンバーは、第一プレート、第二プレート、前記第一プレートと前記第二プレートが合わさって形成した格納空間および前記格納空間に位置する加熱エリアを有し、
前記第一毛細管材は、前記第一プレートおよび前記第二プレートまたは両者のいずれか一つに分布し、かつ前記加熱エリアに据えられ、
少なくとも一つの前記ヒートパイプは、チャンバーを有し、一端が前記ベイパーチャンバーに繋がり、他端が密閉状態に保持され、前記ベイパーチャンバーに露出し、前記チャンバーは前記格納空間に繋がり、
前記第二毛細管材は、少なくとも一つの前記ヒートパイプの内壁に分布し、
少なくとも一つの前記繊維束は、線形を呈し、一部分が前記格納空間内かつ前記第一プレートおよび前記第二プレートまたは両者のいずれか一つに配置され、かつ前記第一毛細管材に接触し、別の一部分が前記チャンバー内まで伸び、前記ヒートパイプの内壁の前記第二毛細管材に接触し、
前記作業液体は、前記格納空間および前記チャンバーに充満することを特徴とする、
放熱装置。 Comprising a vapor chamber, a first capillary material, at least one heat pipe, a second capillary material, at least one fiber bundle and a working liquid;
The vapor chamber has a first plate, a second plate, a storage space formed by combining the first plate and the second plate, and a heating area located in the storage space,
The first capillary material is distributed on either the first plate and the second plate or both, and is placed in the heating area;
At least one of the heat pipes has a chamber, one end is connected to the vapor chamber, the other end is held in a sealed state, exposed to the vapor chamber, the chamber is connected to the storage space,
The second capillary material is distributed on the inner wall of at least one of the heat pipes;
At least one of the fiber bundles has a linear shape, a part of the fiber bundle is disposed in the storage space and in one of the first plate and the second plate, or both, and is in contact with the first capillary. Extending into the chamber, contacting the second capillary material of the inner wall of the heat pipe,
The working liquid fills the storage space and the chamber.
Heat dissipation device. 少なくとも一つの前記ヒートパイプは、フィン構造を貫通することを特徴とする請求項１に記載の放熱装置。   The heat radiating device according to claim 1, wherein at least one of the heat pipes penetrates the fin structure. 前記第一毛細管材は、銅粉末焼結またはメッシュによって成形されることを特徴とする請求項１に記載の放熱装置。   The heat dissipation device according to claim 1, wherein the first capillary material is formed by copper powder sintering or meshing. 前記第二毛細管材は、銅粉末焼結、メッシュまたはスリットによって成形されることを特徴とする請求項１に記載の放熱装置。   The heat dissipation device according to claim 1, wherein the second capillary material is formed by copper powder sintering, mesh, or slit. 前記格納空間は、スペーサを有し、前記スペーサは複数の通路を有し、前記第一プレートおよび前記第二プレートの一部分に当接することで前記加熱エリアおよび前記チャンバーを隔離し、複数の前記通路は前記加熱エリアおよび前記チャンバーに繋がり、少なくとも一つの前記繊維束は複数の前記通路の一部分に配置されることを特徴とする請求項１に記載の放熱装置。   The storage space has a spacer, the spacer has a plurality of passages, and separates the heating area and the chamber by contacting a part of the first plate and the second plate, and the plurality of the passages 2 is connected to the heating area and the chamber, and at least one of the fiber bundles is disposed in a part of the plurality of passages. 少なくとも一つの前記ヒートパイプおよび前記加熱エリアの配置位置は一致しないことを特徴とする請求項１から請求項５のいずれか一つに記載の放熱装置。   The heat dissipating device according to any one of claims 1 to 5, wherein an arrangement position of at least one of the heat pipe and the heating area does not coincide with each other.
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