TWM533401U - Heat dissipation apparatus - Google Patents

Heat dissipation apparatus

Info

Publication number
TWM533401U
TWM533401U TW105209273U TW105209273U TWM533401U TW M533401 U TWM533401 U TW M533401U TW 105209273 U TW105209273 U TW 105209273U TW 105209273 U TW105209273 U TW 105209273U TW M533401 U TWM533401 U TW M533401U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation apparatus
heat
dissipation
Prior art date
Application number
TW105209273U
Other languages
Chinese (zh)
Inventor
Yun-Yu Ye
Quan-Qi Zeng
ming-quan Cui
Original Assignee
Tai Sol Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tai Sol Electronics Co Ltd filed Critical Tai Sol Electronics Co Ltd
Priority to TW105209273U priority Critical patent/TWM533401U/en
Priority to JP2016003465U priority patent/JP3206683U/en
Priority to US15/241,678 priority patent/US20170363367A1/en
Publication of TWM533401U publication Critical patent/TWM533401U/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0258—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with means to remove contaminants, e.g. getters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00—Heat exchange conduits
    • F28F2210/02—Heat exchange conduits with particular branching, e.g. fractal conduit arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW105209273U 2016-06-21 2016-06-21 Heat dissipation apparatus TWM533401U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW105209273U TWM533401U (en) 2016-06-21 2016-06-21 Heat dissipation apparatus
JP2016003465U JP3206683U (en) 2016-06-21 2016-07-19 Heat dissipation device
US15/241,678 US20170363367A1 (en) 2016-06-21 2016-08-19 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105209273U TWM533401U (en) 2016-06-21 2016-06-21 Heat dissipation apparatus

Publications (1)

Publication Number Publication Date
TWM533401U true TWM533401U (en) 2016-12-01

Family

ID=56997807

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105209273U TWM533401U (en) 2016-06-21 2016-06-21 Heat dissipation apparatus

Country Status (3)

Country Link
US (1) US20170363367A1 (en)
JP (1) JP3206683U (en)
TW (1) TWM533401U (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018139656A1 (en) * 2017-01-30 2018-08-02 古河電気工業株式会社 Vapor chamber
JP6827117B2 (en) * 2017-12-28 2021-02-10 古河電気工業株式会社 heat pipe
US20200068745A1 (en) * 2018-08-22 2020-02-27 Asia Vital Components Co., Ltd. Heat dissipation structure of electronic device
US10677535B1 (en) * 2018-11-30 2020-06-09 Furukawa Electric Co., Ltd. Heat sink
US10760855B2 (en) * 2018-11-30 2020-09-01 Furukawa Electric Co., Ltd. Heat sink
JP6782326B2 (en) * 2019-04-17 2020-11-11 古河電気工業株式会社 heatsink
FI20195390A1 (en) * 2019-05-10 2020-11-11 Teknologian Tutkimuskeskus Vtt Oy Electric or optical component, coupler, and heat transfer system
JP6697112B1 (en) * 2019-05-10 2020-05-20 古河電気工業株式会社 heatsink
TWI700471B (en) * 2019-05-27 2020-08-01 大陸商深圳興奇宏科技有限公司 Heat dissipation unit with axial capillary structure
CN113766796B (en) * 2020-06-01 2025-03-04 华为技术有限公司 Vapor Chamber and Electronic Devices
US11206746B1 (en) * 2020-06-09 2021-12-21 Chia-Hsing Liu Fluid heat dissipation device
CN213907324U (en) * 2020-07-20 2021-08-06 双鸿电子科技工业(昆山)有限公司 Heat sink with anti-electromagnetic interference
TWM617967U (en) * 2020-07-20 2021-10-01 雙鴻科技股份有限公司 Heat dissipation device
TWI828451B (en) * 2022-11-30 2024-01-01 奇鋐科技股份有限公司 3d vapor chamber

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7293601B2 (en) * 2005-06-15 2007-11-13 Top Way Thermal Management Co., Ltd. Thermoduct
WO2008131587A1 (en) * 2007-04-28 2008-11-06 Jenshyan Chen Heat pipe and manufacturing method thereof
US20110220328A1 (en) * 2010-03-09 2011-09-15 Kunshan Jue-Chung Electronics Co., Ltd. Flexible heat pipe and manufacturing method thereof
TWI498074B (en) * 2010-09-23 2015-08-21 鴻準精密工業股份有限公司 Heat sink for portable consumer electronic device
US20140182819A1 (en) * 2013-01-01 2014-07-03 Asia Vital Components Co., Ltd. Heat dissipating device
CN203177703U (en) * 2013-01-14 2013-09-04 深圳市万景华科技有限公司 Vertical type heat conduction structure
CN203934263U (en) * 2014-07-04 2014-11-05 讯凯国际股份有限公司 Heat sink with capillary members
US20160069616A1 (en) * 2014-09-05 2016-03-10 Asia Vital Components Co., Ltd. Heat pipe with complex capillary structure
US20170122672A1 (en) * 2015-10-28 2017-05-04 Taiwan Microloops Corp. Vapor chamber and manufacturing method thereof
CN205093079U (en) * 2015-11-17 2016-03-16 奇鋐科技股份有限公司 heat sink
US10048017B2 (en) * 2015-12-01 2018-08-14 Asia Vital Components Co., Ltd. Heat dissipation unit
CN107305107B (en) * 2016-04-21 2022-03-18 奇鋐科技股份有限公司 Heat sink device

Also Published As

Publication number Publication date
US20170363367A1 (en) 2017-12-21
JP3206683U (en) 2016-09-29

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees