WO2008131587A1 - Heat pipe and manufacturing method thereof - Google Patents

Heat pipe and manufacturing method thereof Download PDF

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Publication number
WO2008131587A1
WO2008131587A1 PCT/CN2007/001425 CN2007001425W WO2008131587A1 WO 2008131587 A1 WO2008131587 A1 WO 2008131587A1 CN 2007001425 W CN2007001425 W CN 2007001425W WO 2008131587 A1 WO2008131587 A1 WO 2008131587A1
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
heat pipe
metal
layer
wall
Prior art date
Application number
PCT/CN2007/001425
Other languages
French (fr)
Chinese (zh)
Inventor
Jenshyan Chen
Original Assignee
Jenshyan Chen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jenshyan Chen filed Critical Jenshyan Chen
Priority to PCT/CN2007/001425 priority Critical patent/WO2008131587A1/en
Priority to US12/596,490 priority patent/US20100108297A1/en
Publication of WO2008131587A1 publication Critical patent/WO2008131587A1/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/648Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making
    • Y10T29/49353Heat pipe device making

Definitions

  • the present invention relates to a heat pipe and a method of manufacturing the same, and more particularly to a heat pipe for dissipating heat from a light emitting diode and a method of manufacturing the same.
  • a vapor chamber is used directly, the problem of narrowing the installation area can be solved, but additional means are needed to discharge heat from the electronic component, such as a heat sink. Moreover, the space required for the heat sink and the heat sink is still too large for an electronic device having a small idle space.
  • the heat pipe provided by the present invention comprises a tube body, a cavity and a porous capillary flow guiding layer.
  • the tube body has a first opening, and the tube body has a diameter of less than 10 mm.
  • the cavity has a second opening, and the second opening is engaged with the first opening, thereby forming a sealed space between the tube and the cavity.
  • the porous capillary flow guiding layer is formed inside the tubular body and the cavity. Wherein the sealed space accommodates a working fluid, and a cross-sectional area of the cavity is larger than a cross-sectional area of the tubular body.
  • the tubular body is integrally formed with the cavity.
  • the cavity is formed by a recess and an upper cover.
  • the upper cover engages the recess and has the second opening.
  • the groove may be formed by a powder metallurgy process, a stamping process, an injection molding process, a casting process or a machining process.
  • the cavity has a flat end for placement by a general electronic component.
  • the porous capillary flow guiding layer may be sintered by a copper metal powder, a nickel metal powder, a silver metal powder, a metal powder coated with copper, nickel or silver or other similar metal powder. to make.
  • the porous capillary flow guiding layer comprises a layer of metal particles and a metal mesh.
  • the metal particle layer is sintered and formed on an inner wall of the tube body and an inner wall of the cavity, and the metal mesh body is disposed on the metal particle layer.
  • the porous capillary flow guiding layer comprises a corrugated folded metal cloth and a flat metal mesh layer, and the corrugated folded metal cloth is laid on the inner wall of the tubular body and the cavity.
  • the inner wall, and the flat metal mesh layer are disposed on the corrugated metal cloth.
  • the corrugated shape of the corrugated metal cloth may be triangular, rectangular, trapezoidal or wavy.
  • the porous capillary flow guiding layer comprises a plurality of fine scores formed on an inner wall of the tubular body and an inner wall of the cavity.
  • the porous capillary flow guiding layer comprises a plurality of fine nicks and a gold It is a sintered layer, the fine notch is formed on the inner wall of the cavity, and the metal sintered layer is formed on the inner wall of the pipe body and is welded to the fine notch.
  • the heat pipe manufacturing method comprises the following steps: (a) providing a pipe body having a first opening and a third opening; (b) providing a cavity having a second opening; (c) a first opening of the tubular body sealingly engages a second opening of the cavity to form a half finished heat pipe; (d) pumping the semi-finished heat pipe; and (e) sealing the third opening .
  • the inner wall of the semi-finished heat pipe comprises a porous capillary flow guiding layer, the semi-finished heat pipe accommodating a working fluid, and a cross-sectional area of the cavity is larger than a cross-sectional area of the pipe body.
  • the working fluid is injected into the semi-finished heat pipe before or after step (d).
  • the sealing joint in the step (c) is a welding process, a welding process, a mechanical fastening process or a gluing process.
  • the step (b) of the heat pipe manufacturing method provided by the present invention may include: providing a groove; providing an upper cover, the upper cover having the second opening; and engaging the upper cover with the groove to The cavity is formed.
  • the groove may be formed by a powder metallurgy process, a stamping process, an injection molding process, a casting process or a machining process. And forming a first sintered metal layer on the groove, a second sintered metal layer is formed on the upper cover, and the first sintered metal layer is in contact with the second sintered metal layer.
  • the porous capillary flow guiding layer is formed by joining with the tubular body.
  • a sintered metal powder layer is formed on the inner wall of the cavity.
  • the porous capillary flow guiding layer is formed by inserting a center rod from the third opening into the semi-finished heat pipe and substantially abutting the sintered metal powder layer; the center rod and the semi-finished product Filling a first metal powder between the heat pipes; performing a sintering process to fuse the first metal powder with the sintered metal powder layer to form the porous capillary flow guiding layer; and The rod is removed from the semi-finished heat pipe.
  • the cavity has a plurality of fine scores on the inner wall.
  • the porous capillary flow guiding layer is formed by inserting a center rod from the third opening into the semi-finished product heat Inside the conduit and substantially abutting the plurality of fine scores; filling a second metal powder between the center rod and the semi-finished heat pipe; performing a sintering process to make the second metal powder and the A plurality of fine scores are welded to form the porous capillary flow guiding layer; and the center rod is removed from the semi-finished heat pipe.
  • the first metal powder or the second metal powder may be a copper metal powder, a nickel metal powder, a silver metal powder, a metal plated with copper, nickel or silver. Powder or other similar metal powder.
  • the porous capillary flow guiding layer utilizes a machining process to create a plurality of fine scores on the inner wall of the tubular body and the inner wall of the cavity to form the porous capillary guide. Stream layer.
  • the porous capillary flow guiding layer is formed by: sintering a plurality of metal particles on an inner wall of the tubular body and an inner wall of the cavity; and providing a metal mesh body in the On the metal particles to form the porous capillary flow guiding layer.
  • the porous capillary flow guiding layer is formed by: laying a corrugated folded metal cloth on the inner wall of the tubular body and the inner wall of the cavity; and providing a flat metal mesh layer The corrugated folded metal cloth is formed to form the porous capillary flow guiding layer.
  • Another heat pipe manufacturing method comprises the following steps: (A) providing a first pipe body having an opening and a closed end; (B) necking the first pipe body to form a communication a cavity and a second tube, wherein the cavity includes the closed end, the second tube includes the opening; (C) pumping the cavity and the second tube And (D) sealing the opening; wherein the cavity and the inner wall of the second tube body comprise a porous capillary flow guiding layer, the cavity and the second tube body accommodating a working fluid, The cross-sectional area of the cavity is larger than the cross-sectional area of the second pipe body.
  • step (B) is carried out at a temperature in the range of from 400 to 600 °C.
  • the porous capillary flow guiding layer is formed on the inner wall of the first tubular body.
  • the porous capillary flow guiding layer is formed by: placing a first metal powder in the first tube; inserting a center rod from the opening into the first tube body and substantially abutting the first tube a metal powder; filling a second between the center rod and the inner wall of the first tube a metal powder; performing a sintering process to fuse the first metal powder with the second metal powder to form the porous capillary flow guiding layer; and removing the center rod from the first tube.
  • the technical effect of the present invention is to provide a heat pipe having different sectional areas and a manufacturing method thereof, and an electronic component or a clustered electronic component having a large heat generating area can be disposed on a flat end of the heat pipe, and An efficient and rapid cooling mode of the electronic component is provided.
  • Figure 1 is an exploded cross-sectional view of the first preferred embodiment before the heat pipe is completed
  • 2A is a cross-sectional view of the half-finished heat pipe of the first preferred embodiment
  • Figure 2B is a cross-sectional view of the first preferred embodiment of the center rod inserted into the semi-finished heat pipe
  • Figure 2C is the first preferred embodiment between the center bar and the semi-finished heat pipe Filling in a cross-sectional view of a first metal powder
  • Figure 2D is a cross-sectional view of the semi-finished heat pipe of the first preferred embodiment
  • Figure 2E is a cross-sectional view of the heat pipe of the first preferred embodiment
  • FIG. 3A is a partial cross-sectional view of a first opening and a second opening of a heat pipe according to an embodiment
  • FIG. 3B is a first opening of the heat pipe of the embodiment bonded to a second opening
  • FIG. 3C is a partial cross-sectional view showing a first opening and a second opening of the heat pipe of another embodiment
  • FIG. 3D is a first opening of the heat pipe of the embodiment bonded to a second opening
  • Figure 3E is a cross-sectional view of the heat pipe cavity of the above specific embodiment
  • 4A is a cross-sectional view of a half-finished heat pipe of a second preferred embodiment
  • Figure 4B is a cross-sectional view showing the center rod of the second preferred embodiment inserted into the semi-finished heat pipe;
  • Figure 4C is the second preferred embodiment between the center bar and the semi-finished heat pipe Filling in a cross-sectional view of a second metal powder;
  • Figure 4D is a cross-sectional view of the heat pipe of the second preferred embodiment
  • 4E is a cross-sectional view of a specific embodiment before the heat pipe is completed
  • Figure 4F is a cross-sectional view of the heat pipe of the specific embodiment before it is completed;
  • Figure 4G is a cross-sectional view of the heat pipe of the specific embodiment
  • Figure 4H is a cross-sectional view of the cavity of the heat pipe of the above specific embodiment
  • Figure 5 is a cross-sectional view of a heat pipe of a third preferred embodiment
  • Figure 6 is a cross-sectional view of a heat pipe of a fourth preferred embodiment
  • Figure 7 is a cross-sectional view showing a heat pipe of a fifth preferred embodiment
  • Figure 8A is a cross-sectional view showing a first tube body of a heat pipe of a sixth preferred embodiment
  • Figure 8B is a cross-sectional view of the first tube body after necking according to the sixth preferred embodiment
  • Figure 8C is a cross-sectional view of the heat pipe of the sixth preferred embodiment.
  • Figure 8D is a cross-sectional view showing the first tube body of the sixth preferred embodiment in which a first metal powder is placed;
  • Figure 8E is a cross-sectional view of the sixth preferred embodiment in which a center rod is placed on the first tube;
  • Figure 8F is the sixth preferred embodiment of the center rod and the first tube a schematic cross-sectional view of interposing a second metal powder between the bodies;
  • Figure 8G is a cross-sectional view of the first tube body of the sixth preferred embodiment. Summary of the invention
  • FIG. 1 is an exploded cross-sectional view of the heat pipe 1 according to a first preferred embodiment of the present invention before it is completed.
  • the heat pipe 1 comprises a tube body 12 and a cavity 14.
  • the tube body 12 has a first opening 122 and a third opening 124.
  • the cavity 14 has a second opening 142 and a flat end 144.
  • a cross-sectional area of the cavity 14 is greater than a cross-sectional area of the tubular body 12.
  • the cross-sectional area of the cavity 14 refers to the cross-sectional area of the cavity 14 near the flat end 144.
  • the tubular body 12 has a diameter of less than 10 mm. As shown in FIG.
  • the second opening 142 of the cavity 14 is sealingly engaged with the first opening 122 of the tubular body 12 to form a half finished heat pipe 16.
  • the sealing joint may be a welding process, a welding process, a mechanical fastening process or a gluing process.
  • a sintered metal powder layer 182 is formed on the inner wall of the cavity 14, as shown in Fig. 2A.
  • a center rod C1 is inserted from the third opening 124 into the semi-finished heat pipe 16 and substantially abuts the sintered metal powder layer 182, as shown in Fig. 2B.
  • a first metal powder 184 is then filled between the center rod C1 and the semi-finished heat pipe 16, as shown in Figure 2C.
  • the first metal powder 184 may be a copper metal powder, a nickel metal powder, a silver metal powder, a metal powder plated with copper, nickel or silver or the like.
  • a sintering process is then performed to splicing the first metal powder 184 with the sintered metal powder layer 182 to form a porous capillary flow guiding layer 18.
  • the center rod C1 is taken out of the semi-finished heat pipe 16.
  • the semi-finished heat pipe 16 is evacuated and a working fluid L1 is injected before the third opening 124 is sealed.
  • the order in which the working fluid L1 is injected and the pumping is exchanged.
  • the third opening 124 may be shrunk before pumping.
  • the heat pipe 1 is completed after the third opening 124 is sealed.
  • the sealing engagement should avoid excessive damage to the existing porous capillary flow guiding layer.
  • the second opening 142 of the cavity 14 is free of the sintered metal powder layer 182 (please refer to the figure so that the sealing joint can be used without regard to the sintering during the bonding process).
  • the metal powder layer 182 causes damage, for example, using a general welding process or a welding process.
  • the inner wall of the cavity 14 and the inner wall of the pipe body 12 should be as The smooth connection is maintained so that the subsequent first metal powder 184 can be sintered smoothly and fused with the sintered metal powder layer 182 to form the porous capillary flow guiding layer 18.
  • FIG. 3A is a partial cross-sectional view of the first opening 122 and the second opening 142 according to an embodiment.
  • the first opening 122 includes a joint plane 1222 and a weld portion 1224.
  • the second opening 142 includes a joint plane 1422 and a weld portion 1424.
  • the joint planes 1222, 1422 are in close contact with each other.
  • the welded portions 1224, 1424 are all inclined surfaces. When the joining planes are fitted, the welded portions 1224, 1424 form a groove for the filler to be welded. As shown in FIG. 3B, after the sealing joint is completed, only the soldering portions 1224, 1424 are affected, which is filled with a solder P, and the bonding planes 1222, 1224 are unaffected, thereby maintaining the cavity.
  • the inner wall of the body 14 is smoothly connected to the inner wall of the tubular body 12 and does not damage the sintered metal powder layer 182 at the second opening 142 of the cavity 14.
  • FIG. 3C is a partial cross-sectional view of the first opening 122 and the second opening 142 of another embodiment.
  • the first opening 122 includes a joint plane 1222 and a weld portion 1224.
  • the second opening 142 includes a joint plane 1422 and a weld portion 1424.
  • the welded portions 1224, 1424 are each composed of a raised portion 1224a, 1424a and a recess 1224b, 1424b. After the bonding planes are bonded, the bonding planes 1222, 1422 are in close contact with each other, and the protruding portions 1224a, 1424a are fused to each other by heating or other melting means, and fill the grooves 1224b, 1424b.
  • the cavity 14 may include a recess 146 and an upper cover 148.
  • the groove 146 includes the flat end 144, and the upper cover 148 includes the second opening 142.
  • Forming a first sintered metal layer on the groove 146 A second sintered metal layer 1824 is formed on the upper cover 148 of 1822 0 .
  • the cavity 146 is engaged with the upper cover 148 to form the cavity 14, and the first sintered metal layer 1822 and the second sintered metal layer 1824 form the sintered metal powder layer 182.
  • the recess 146 itself may be made by a powder metallurgy process, a stamping process, an injection molding process, a casting process or a machining process.
  • FIG 4A is a cross-sectional view of the heat pipe 2 of a second preferred embodiment before it is completed.
  • the heat pipe 2 is constructed in substantially the same manner as the heat pipe 1 of the first preferred embodiment and will not be described again. Only the manner in which the porous capillary guide layer 28 of the heat pipe 2 is formed will be described in detail.
  • the inner wall of the cavity 24 of the heat pipe 2 has a plurality of fine scores 282 thereon.
  • a center rod C2 is inserted from the third opening 224 of the tubular body 22 of the heat pipe 2 into the half of the finished heat pipe 26 and substantially abuts the plurality of fine scores 282.
  • a second metal powder is further filled between the center rod C2 and the semi-finished heat pipe 26.
  • a sintering process is then performed to fuse the second metal powder 284 with the plurality of fine scores 282 to form the porous capillary flow director layer 28.
  • the center rod C2 is removed from the semi-finished heat pipe 26 as shown in Fig. 4D. And after sealing the third opening 224, the heat pipe 2 is formed.
  • FIG. 4A is a cross-sectional view of the heat pipe 2' of an embodiment before being completed.
  • the plurality of fine scores 282' of the cavity 24' of the heat pipe 2' exhibit an inner diameter which is the same as the inner diameter of the tubular body 22' of the heat pipe 2'. Therefore, a center rod having only a single outer diameter cannot simultaneously satisfy the plurality of fine scores 282' and leave a space between the center rod and the heat pipe .2'-semi-finished heat pipe 26'. The requirement to accommodate the later added metal powder.
  • a center rod C2' needs to have a different outer diameter such that a portion of the center rod C2' can abut the plurality of fine scores 282' and between the center rod C2' and the heat pipe 2' Space is left to accommodate the second metal powder 284' added later, and in the subsequent sintering
  • the second metal powder 284' may be fused with the plurality of fine scores 282' to form a porous capillary guide layer 28', as shown in FIG. 4F.
  • the heat pipe 2' is formed as shown in Fig. 4G.
  • the cavity 24, 24' may include a recess 246 and an upper cover 248.
  • the upper cover 248 includes a second opening 242 of the cavity 24.
  • a first plurality of fine scores 2822 are formed on the groove 246.
  • a second plurality of fine scores 2824 are formed on the upper cover 248. Forming the groove 246 with the upper cover 248 to form the cavity 24, 24', and the first plurality of fine scores 2822 and the second plurality of small scores 2824 are formed A few small fine marks 282 are described.
  • the recess 246 housing itself may be formed by a powder metallurgy process, a stamping process, an injection molding process, a casting process, or a machining process.
  • FIG. 5 is a cross-sectional view of a heat pipe 3 of a third preferred embodiment.
  • the heat pipe 3 is basically made in the same manner as the heat pipe 1 of the first preferred embodiment, and will not be described again. Only the manner in which the porous capillary guide layer 38 of the heat pipe 3 is formed will be described.
  • the porous capillary deflector 38 utilizes a machining process to create a plurality of fine scores 38 on the inner wall of a tubular body 32 of the heat pipe 3 and on the inner wall of a cavity 34 of the heat pipe 3. To form.
  • the plurality of fine scores 38 are scored directly on the inner wall of the semi-finished heat pipe, for example, using a cutter.
  • the cavity of the half of the finished heat pipe has a plurality of small scores originally, so that after the sealing joint, only a few small scores are formed on other parts of the inner wall of the semi-finished heat pipe.
  • a porous capillary flow guiding layer can be formed, but attention should be paid to the connection of the two sets of fine nicks.
  • Such a cavity is more common in a combined cavity, such as a combination of a recess and an upper cover.
  • FIG. 6 is a cross-sectional view of a heat pipe 4 according to a preferred embodiment.
  • the heat pipe 4 is manufactured in substantially the same manner as the heat pipe 1 of the first preferred embodiment, and details are not described herein. Only the manner in which the porous capillary guide layer 48 of the heat pipe 4 is formed will be described.
  • a plurality of metal particles 482 are first sintered on the inner wall of the tube body 42 of the heat pipe 4 and on the inner wall of the cavity 44 of the heat pipe 4.
  • the metal particles 482 are further disposed on a metal mesh 484 to form the porous Capillary baffle 48.
  • the plurality of gold particles 482 may be sintered to the inner wall of the tube body 42 and the inner wall of the cavity 44, respectively.
  • FIG. 7 is a cross-sectional view of a heat pipe 5 of a fifth preferred embodiment.
  • the heat pipe 5 is generally manufactured in the same manner as the heat pipe 1 of the first preferred embodiment, and will not be described herein. Only the manner in which the porous capillary guide layer 58 of the heat pipe 5 is formed will be described.
  • a corrugated metal cloth 582 is first laid on the inner wall of the tube 52 of the heat pipe 5 and on the inner wall of the cavity 54 of the heat pipe 5.
  • the corrugated folded metal cloth 582 is placed on a flat metal mesh layer 584 to form the porous capillary flow guiding layer 58.
  • the corrugated shape of the corrugated folded metal cloth 582 may be triangular, rectangular, trapezoidal or wavy.
  • Fig. 8A is a cross-sectional view showing the first tube body 62 of the heat pipe 6 of a sixth preferred embodiment.
  • the first tubular body 62 has an opening 622 and a closed end 624.
  • the closed end 624 is flat.
  • the first tubular body 62 has a larger inner diameter for subsequent necking.
  • the wall thickness of the end 624 is mostly thicker than the wall thickness before the necking, so that the wall thickness after necking is uniform overall. But should not be limited to this.
  • the first tubular body 62 is then necked to form a cavity 626 and a second tubular body 628 that are in communication, as shown in Figure 8B.
  • the cavity 626 includes the closed end 624
  • the second body 628 includes the opening 622.
  • a cross-sectional area of the cavity 626 is greater than a cross-sectional area of the second tubular body 628.
  • the cross-sectional area of the cavity 626 refers to the cross-sectional area of the closed end.
  • the inner walls of the cavity 626 and the second tubular body 628 include a porous capillary flow guiding layer 64.
  • the cavity 626 and the second tube 628 are again evacuated, and a working fluid L2 is injected into the cavity 626 and the second tube 628. Finally, the opening 622 is sealed. The order in which the working fluid L2 is injected and the pumping is exchanged. After sealing the opening 622, the heat pipe 6 is completed as shown in Fig. 8C.
  • the necking is performed at a temperature of 400 to 600 ° C or at a temperature higher than a recrystallization temperature of the first tube 62 by about 200 ° C.
  • the porous capillary flow guiding layer 64 forms the porous capillary flow guiding layer 64 on the inner wall of the first tubular body 62 before the necking, the steps of which are as follows: in the first tubular body 62 A first metal powder 642 is built in, as shown in FIG. 8D; a center rod C3 is inserted into the first tube body 62 from the opening 622 and substantially abuts the first metal powder 642, as shown in FIG. 8E.
  • the tubular body and the cavity are connected in a symmetrical manner.
  • the tubular body and the cavity may also be connected in an asymmetric manner.
  • the tubular body is attached to the cavity near the edge to accommodate different space constraints.
  • the present invention provides a heat pipe having different cross-sectional areas and a method of manufacturing the same, and an electronic component or a cluster of electronic components having a large heat generating area may be disposed on a flat end of the heat pipe, and An efficient and rapid cooling mode of the electronic component is provided.

Abstract

A heat pipe and the method thereof are provided. The heat pipe (1) comprises a pipe body (12), a cavity (14) and a porous capillary diversion layer (18). The pipe body (12) has a first open (122) and a third open (124), and the cavity (14) has a second open (142). The first open (122) and the second open (142) are bonded together, and the third open (124) is sealed to form the heat pipe (1). The heat pipe comprises working liquid in it. The sectional area of the cavity (14) is larger than that of the pipe body (12). And the cavity (14) has a planar end (144).

Description

一种热导管及其制造方法  Heat pipe and manufacturing method thereof
技术领域 Technical field
本发明涉及一种热导管 (heat pipe)及其制造方法, 特别涉及一种供发光 二极管散热用的热导管及其制造方法。 技术背景  The present invention relates to a heat pipe and a method of manufacturing the same, and more particularly to a heat pipe for dissipating heat from a light emitting diode and a method of manufacturing the same. technical background
随着科技的发展, 许多电子产品的技术, 都因散热的问题而无法突破。 例如,计算机中央处理器在运行时产生大量的热量,这些热量如不能被排出, 将对整个系统的运行产生不良的影响。而热导管在计算机中央处理器的散热 部分起着重要作用。 尤其是在可用空间日益狭小的电子装置中, 能有效散热 同时充分利用空间的散热装置显得更为重要。  With the development of technology, the technology of many electronic products cannot be broken due to the problem of heat dissipation. For example, a computer central processor generates a large amount of heat during operation, and if this heat cannot be discharged, it will adversely affect the operation of the entire system. The heat pipe plays an important role in the heat dissipation portion of the computer's central processing unit. Especially in electronic devices where the available space is increasingly narrow, heat sinks that can effectively dissipate heat while making full use of space are more important.
现有的热导管散热方式大多是通过在一金属介质中穿插数个热导管从 而在所述金属介质上形成一导热面。然而装设在所述导热面上的电子组件所 产生的热量需通过所述金属介质, 才能间接传导至所述热导管, 因此利用这 种散热方式, 其散热效率将受限于所述金属介质的物理性质而不易提高。若 将所述电子组件直接装设在所述热导管上, 则由于一般电子装置中的热导管- 的直径有限, 无法承载直径相对较大的电子组件或是群聚的电子组件。 若直 接使用散热板 (vapor chamber), 虽可解决设置区域狭小的问题, 但是仍需附 加的装置以将热量从所述电子件中排出, 例如散热片。 并且, 上述散热板及 其散热片所需的空间, 对闲置空间较小的电子装置而言, 仍然过大。  Most of the existing heat pipe heat dissipation methods are formed by inserting a plurality of heat pipes in a metal medium to form a heat conducting surface on the metal medium. However, the heat generated by the electronic components mounted on the heat conducting surface needs to pass through the metal medium to be indirectly conducted to the heat pipe. Therefore, the heat dissipation efficiency of the heat dissipation method is limited by the metal medium. The physical properties are not easy to improve. If the electronic component is directly mounted on the heat pipe, the heat pipe in the general electronic device has a limited diameter and cannot carry a relatively large diameter electronic component or a clustered electronic component. If a vapor chamber is used directly, the problem of narrowing the installation area can be solved, but additional means are needed to discharge heat from the electronic component, such as a heat sink. Moreover, the space required for the heat sink and the heat sink is still too large for an electronic device having a small idle space.
因此, 如何能提供一种具有不同截面积的热导管及其制造方法, 可对具 有较大发热面积的电子组件或群聚的电子组件提供有效且迅速的散热方式 以解决上述问题, 成为研究人员亟待解决的问题之一。 发明概要  Therefore, how to provide a heat pipe having different cross-sectional areas and a manufacturing method thereof can provide an effective and rapid heat dissipation method for an electronic component or a clustered electronic component having a large heat-generating area to solve the above problem, and become a researcher One of the problems that need to be solved. Summary of invention
1  1
确 认 本 本发明的目的在于提供一种具有不同截面积且用于发光二极管散热的 热导管及其制造方法。 Confirmation It is an object of the present invention to provide a heat pipe having different cross-sectional areas for heat dissipation of a light-emitting diode and a method of manufacturing the same.
为达上述目的, 本发明提供的热导管包含一管体, 一腔体以及一多孔毛 细导流层。 所述管体具有一第一开口, 所述管体的直径小于 10mm。 所述腔 体具有一第二开口, 所述第二开口与所述第一开口衔接,· 由此所述管体与所 述腔体形成一密封空间。所述多孔毛细导流层形成于所述管体以及所述腔体 的内部。其中所述密封空间容纳一工作流体, 以及所述腔体的一截面积大于 所述管体的一截面积。 '  To achieve the above object, the heat pipe provided by the present invention comprises a tube body, a cavity and a porous capillary flow guiding layer. The tube body has a first opening, and the tube body has a diameter of less than 10 mm. The cavity has a second opening, and the second opening is engaged with the first opening, thereby forming a sealed space between the tube and the cavity. The porous capillary flow guiding layer is formed inside the tubular body and the cavity. Wherein the sealed space accommodates a working fluid, and a cross-sectional area of the cavity is larger than a cross-sectional area of the tubular body. '
在一具体实施例中, 所述管体与所述腔体为一体成型。 在另一具体实施 例中, 所述腔体由一凹槽以及一上盖构成。 所述上盖与所述凹槽衔接并且具 有所述第二开口。 所述凹槽可通过一粉末冶金工艺、 一冲压工艺、 一射出成 型工艺、 一铸造工艺或一机械加工工艺所制成。 在一具体实施例中, 所述腔 体具有一平直端, 可供一般电子组件放置。  In a specific embodiment, the tubular body is integrally formed with the cavity. In another embodiment, the cavity is formed by a recess and an upper cover. The upper cover engages the recess and has the second opening. The groove may be formed by a powder metallurgy process, a stamping process, an injection molding process, a casting process or a machining process. In a specific embodiment, the cavity has a flat end for placement by a general electronic component.
在一具体实施例中, 所述多孔毛细导流层可由一铜金属粉末、一镍金属 粉末、 一银金属粉末、 一表面镀有铜、 镍或银之金属粉末或其它类似的金属 粉末烧结而成。  In a specific embodiment, the porous capillary flow guiding layer may be sintered by a copper metal powder, a nickel metal powder, a silver metal powder, a metal powder coated with copper, nickel or silver or other similar metal powder. to make.
在另一具体实施例中,所述多孔毛细导流层包含一金属颗粒层以及一金 属网体。 所述金属颗粒层烧结成形于所述管体的内壁和所述腔体的内壁上, 以及所述金属网体设置在所述金属颗粒层上。  In another embodiment, the porous capillary flow guiding layer comprises a layer of metal particles and a metal mesh. The metal particle layer is sintered and formed on an inner wall of the tube body and an inner wall of the cavity, and the metal mesh body is disposed on the metal particle layer.
在另一具体实施例中,所述多孔毛细导流层包含一波状绉折金属布以及 一平金属网布层,所述波状绉折金属布铺设在所述管体的内壁和所述腔体的 内壁上, 以及所述平金属网布层设置在所述波状绉折金属布上。 其中所述波 状绉折金属布的波状绉折的形状可为三角形、 长方形、 梯形或波浪形。  In another embodiment, the porous capillary flow guiding layer comprises a corrugated folded metal cloth and a flat metal mesh layer, and the corrugated folded metal cloth is laid on the inner wall of the tubular body and the cavity. The inner wall, and the flat metal mesh layer are disposed on the corrugated metal cloth. The corrugated shape of the corrugated metal cloth may be triangular, rectangular, trapezoidal or wavy.
在另一具体实施例中, 所述多孔毛细导流层包含数个细小刻痕, 形成于 所述管体的内壁以及所述腔体的内壁上。  In another embodiment, the porous capillary flow guiding layer comprises a plurality of fine scores formed on an inner wall of the tubular body and an inner wall of the cavity.
在另一具体实施例中,所述多孔毛细导流层包含数个细小刻痕以及一金 属烧结层, 所述细小刻痕形成于所述腔体的内壁上, 以及所述金属烧结层形 成于所述管体的内壁上并且与所述细小刻痕相熔接。 In another specific embodiment, the porous capillary flow guiding layer comprises a plurality of fine nicks and a gold It is a sintered layer, the fine notch is formed on the inner wall of the cavity, and the metal sintered layer is formed on the inner wall of the pipe body and is welded to the fine notch.
本发明提供的热导管 造方法, 包含下列步骤: (a)提供一管体, 具有一 第一开口以及一第三开口; (b)提供一腔体, 具有一第二开口; (c)将所述管体 的第一开口与所述腔体的第二开口进行密封接合, 以形成一半成品热导管; (d)将所述半成品热导管抽气; 以及 (e)密封所述第三开口。其中所述半成品热 导管的内壁包含一多孔毛细导流层, 所述半成品热导管容纳一工作流体, 所 述腔体的一截面积大于所述管体的一截面积。并且, 所述工作流体在步骤 (d) 之前或之后注入所述半成品热导管内。另外, 步骤 (c)所述密封接合为一焊接 工艺、 一熔接工艺、 一机械扣接工艺或一胶合工艺。  The heat pipe manufacturing method provided by the present invention comprises the following steps: (a) providing a pipe body having a first opening and a third opening; (b) providing a cavity having a second opening; (c) a first opening of the tubular body sealingly engages a second opening of the cavity to form a half finished heat pipe; (d) pumping the semi-finished heat pipe; and (e) sealing the third opening . Wherein the inner wall of the semi-finished heat pipe comprises a porous capillary flow guiding layer, the semi-finished heat pipe accommodating a working fluid, and a cross-sectional area of the cavity is larger than a cross-sectional area of the pipe body. And, the working fluid is injected into the semi-finished heat pipe before or after step (d). In addition, the sealing joint in the step (c) is a welding process, a welding process, a mechanical fastening process or a gluing process.
本发明提供的热导管制造方法的步骤 (b)可包含: 提供 凹槽; 提供一上 盖, 所述上盖具有所述第二开口; 以及将所述上盖与所述凹槽衔接, 以形成 所述腔体。所述凹槽可通过一粉末冶金工艺、一冲压工艺、一射出成型工艺、 一铸造工艺或一机械加工工艺所制成。并且可在所述凹槽上形成有一第一烧 结金属层, 所述上盖上形成有一第二烧结金属层, 所述第一烧结金属层与所 述第二烧结金属层衔接。 或是在所述凹槽上形成有一第一数个细小刻痕, 所 述上盖上形成有一第二数个细小刻痕,所述第一数个细小刻痕与所述第二数 个细小刻痕衔接。 再通过与所述管体接合以形成所述多孔毛细导流层。  The step (b) of the heat pipe manufacturing method provided by the present invention may include: providing a groove; providing an upper cover, the upper cover having the second opening; and engaging the upper cover with the groove to The cavity is formed. The groove may be formed by a powder metallurgy process, a stamping process, an injection molding process, a casting process or a machining process. And forming a first sintered metal layer on the groove, a second sintered metal layer is formed on the upper cover, and the first sintered metal layer is in contact with the second sintered metal layer. Or forming a first plurality of fine nicks on the groove, and forming a second plurality of fine nicks on the upper cover, the first plurality of small nicks and the second plurality of small nicks Scotch convergence. The porous capillary flow guiding layer is formed by joining with the tubular body.
在一具体实施例中, 所述腔体的内壁上形成有一烧结的金属粉层。所述 多孔毛细导流层由下列步骤形成:将一中心棒自所述第三开口插入所述半成 品热导管内并大致紧靠所述烧结的金属粉层; 在所述中心棒与所述半成品热 导管之间填入一第一金属粉末;执行一烧结工艺以使所述第一金属粉末与所 述烧结的金属粉层相熔接, 以形成所述多孔毛细导流层; 以及将所述中心棒 自所述半成品热导管取出。  In a specific embodiment, a sintered metal powder layer is formed on the inner wall of the cavity. The porous capillary flow guiding layer is formed by inserting a center rod from the third opening into the semi-finished heat pipe and substantially abutting the sintered metal powder layer; the center rod and the semi-finished product Filling a first metal powder between the heat pipes; performing a sintering process to fuse the first metal powder with the sintered metal powder layer to form the porous capillary flow guiding layer; and The rod is removed from the semi-finished heat pipe.
在另一具体实施例中, 所述腔体的内壁上具有数个细小刻痕。 所述多孔 毛细导流层由下列步骤形成:将一中心棒自所述第三开口插入所述半成品热 导管内并大致紧靠所述数个细小刻痕;在所述中心棒与所述半成品热导管之 间填入一第二金属粉末;执行一烧结工艺以使所述第二金属粉末与所述数个 细小刻痕相熔接, 以形成所述多孔毛细导流层; 以及将所述中心棒自所述半 成品热导管取出。 在上述两个具体实施例中, 所述第一金属粉末或所述第二 金属粉末可以是一铜金属粉末、一镍金属粉末、 一银金属粉末、 一表面镀有 铜、 镍或银之金属粉末或其它类似的金属粉末。 In another embodiment, the cavity has a plurality of fine scores on the inner wall. The porous capillary flow guiding layer is formed by inserting a center rod from the third opening into the semi-finished product heat Inside the conduit and substantially abutting the plurality of fine scores; filling a second metal powder between the center rod and the semi-finished heat pipe; performing a sintering process to make the second metal powder and the A plurality of fine scores are welded to form the porous capillary flow guiding layer; and the center rod is removed from the semi-finished heat pipe. In the above two specific embodiments, the first metal powder or the second metal powder may be a copper metal powder, a nickel metal powder, a silver metal powder, a metal plated with copper, nickel or silver. Powder or other similar metal powder.
在另一具体实施例中,所述多孔毛细导流层利用一机械加工工艺在所述 管体的内壁及所述腔体的内壁上, 制造数个细小刻痕, 以形成所述多孔毛细 导流层。  In another embodiment, the porous capillary flow guiding layer utilizes a machining process to create a plurality of fine scores on the inner wall of the tubular body and the inner wall of the cavity to form the porous capillary guide. Stream layer.
在另一具体实施例中, 所述多孔毛细导流层由下列步骤形成: 烧结数个 金属颗粒在所述管体的内壁及所述腔体的内壁上; 以及设置一金属网体于所 述金属颗粒上, 以形成所述多孔毛细导流层。  In another embodiment, the porous capillary flow guiding layer is formed by: sintering a plurality of metal particles on an inner wall of the tubular body and an inner wall of the cavity; and providing a metal mesh body in the On the metal particles to form the porous capillary flow guiding layer.
在另一具体实施例中, 所述多孔毛细导流层由下列步骤形成: 铺设一波 状绉折金属布于所述管体的内壁及所述腔体的内壁上; 以及设置一平金属网 布层于所述波状绉折金属布上, 以形成所述多孔毛细导流层。  In another embodiment, the porous capillary flow guiding layer is formed by: laying a corrugated folded metal cloth on the inner wall of the tubular body and the inner wall of the cavity; and providing a flat metal mesh layer The corrugated folded metal cloth is formed to form the porous capillary flow guiding layer.
本发明提供的另一热导管制造方法, 包食下列步骤: (A)提供一第一管 体, 具有一开口以及一封闭端; (B)对所述第一管体缩颈以形成相连通的一 腔体以及一第二管体, 其中所述腔体包含所述封闭端, 所述第二管体包含所 述开口; (C)将所述腔体以及所述第二管体抽气; 以及 (D)密封所述开口; 其 中所述腔体以及所述第二管体的内壁包含一多孔毛细导流层,所述腔体以及 所述第二管体容纳一工作流体,所述腔体的一截面积大于所述第二管体的一 截面积。 其中步骤 (B)在温度 400至 600°C的范围内实施。  Another heat pipe manufacturing method provided by the present invention comprises the following steps: (A) providing a first pipe body having an opening and a closed end; (B) necking the first pipe body to form a communication a cavity and a second tube, wherein the cavity includes the closed end, the second tube includes the opening; (C) pumping the cavity and the second tube And (D) sealing the opening; wherein the cavity and the inner wall of the second tube body comprise a porous capillary flow guiding layer, the cavity and the second tube body accommodating a working fluid, The cross-sectional area of the cavity is larger than the cross-sectional area of the second pipe body. Wherein step (B) is carried out at a temperature in the range of from 400 to 600 °C.
在一具体实施例中, 在步骤 (A)之后, 在所述第一管体的内壁上形成所 述多孔毛细导流层。 所述多孔毛细导流层由下列步骤形成: 置入一第一金属 粉末在所述第一管体内;将一中心.棒自所述开口插入所述第一管体内并大致 紧靠所述第一金属粉末;在所述中心棒与所述第一管体的.内壁间填入一第二 金属粉末; 执行一烧结工艺颐使所述第一金属粉末与第二金属粉末相熔接, 以形成所述多孔毛细导流层; 以及将所述中心棒自所述第一管体取出。 In a specific embodiment, after step (A), the porous capillary flow guiding layer is formed on the inner wall of the first tubular body. The porous capillary flow guiding layer is formed by: placing a first metal powder in the first tube; inserting a center rod from the opening into the first tube body and substantially abutting the first tube a metal powder; filling a second between the center rod and the inner wall of the first tube a metal powder; performing a sintering process to fuse the first metal powder with the second metal powder to form the porous capillary flow guiding layer; and removing the center rod from the first tube.
本发明的技术效果在于,提供一种具有不同截面积的热导管及其制造方 法, 可在所述热导管的平直端上设置具有较大发热面积的电子组件或群聚的 电子组件, 并提供所述电子组件有效且迅速的散热模式。 ' 附图说明  The technical effect of the present invention is to provide a heat pipe having different sectional areas and a manufacturing method thereof, and an electronic component or a clustered electronic component having a large heat generating area can be disposed on a flat end of the heat pipe, and An efficient and rapid cooling mode of the electronic component is provided. ' Description of the drawings
图 1是第一较佳实施例的热导管未完成前的剖面分解图; Figure 1 is an exploded cross-sectional view of the first preferred embodiment before the heat pipe is completed;
图 2A ,是所述第一较佳实施例的一半成品热导管的剖示图; 2A is a cross-sectional view of the half-finished heat pipe of the first preferred embodiment;
图 2B是所述第一较佳实施例的一中心棒插入所述半成品热导管的剖示图; 图 2C是所述第一较佳实施例在所述中心棒与所述半成品热导管之间填入一 第一金属粉末的剖示图; Figure 2B is a cross-sectional view of the first preferred embodiment of the center rod inserted into the semi-finished heat pipe; Figure 2C is the first preferred embodiment between the center bar and the semi-finished heat pipe Filling in a cross-sectional view of a first metal powder;
图 2D是所述第一较佳实施例的所述半成品热导管的剖示图; Figure 2D is a cross-sectional view of the semi-finished heat pipe of the first preferred embodiment;
图 2E是所述第一较佳实施例的所述热导管的剖示图; Figure 2E is a cross-sectional view of the heat pipe of the first preferred embodiment;
图 3A是一具体实施例的热导管的一第一开口与一第二开口的局部剖示图; 图 3B是所述具体实施例的所述热导管的一第一开口与一第二开口接合后的 局部剖示图; 3A is a partial cross-sectional view of a first opening and a second opening of a heat pipe according to an embodiment; FIG. 3B is a first opening of the heat pipe of the embodiment bonded to a second opening; Partial cross-sectional view;
图 3C是另一具体实施例的热导管一第一开口与一第二开口的局部剖示图; 图 3D是所述具体实施例的所述热导管的一第一开口与一第二开口接合后的 局部剖示图; 3C is a partial cross-sectional view showing a first opening and a second opening of the heat pipe of another embodiment; FIG. 3D is a first opening of the heat pipe of the embodiment bonded to a second opening; Partial cross-sectional view;
图 3E是上述具体实施例的所述热导管腔体的剖示图; Figure 3E is a cross-sectional view of the heat pipe cavity of the above specific embodiment;
图 4A是一第二较佳实施例的一半成品热导管的剖示图; 4A is a cross-sectional view of a half-finished heat pipe of a second preferred embodiment;
图 4B是所述第二较佳实施例的一中心棒插入所述半成品热导管的剖示图; 图 4C是所述第二较佳实施例在所述中心棒与所述半成品热导管之间填入一 第二金属粉末的剖示图; ' Figure 4B is a cross-sectional view showing the center rod of the second preferred embodiment inserted into the semi-finished heat pipe; Figure 4C is the second preferred embodiment between the center bar and the semi-finished heat pipe Filling in a cross-sectional view of a second metal powder; '
图 4D是所述第二较佳实施例的所述热导管的剖示图; 图 4E是一具体实施例的热导管未完成前的剖示图; Figure 4D is a cross-sectional view of the heat pipe of the second preferred embodiment; 4E is a cross-sectional view of a specific embodiment before the heat pipe is completed;
图 4F是所述具体实施例的热导管未完成前的剖示图; Figure 4F is a cross-sectional view of the heat pipe of the specific embodiment before it is completed;
图 4G是所述具体实施例的热导管的剖示图; Figure 4G is a cross-sectional view of the heat pipe of the specific embodiment;
图 4H是上述具体实施例的所述热导管的腔体之剖示图; Figure 4H is a cross-sectional view of the cavity of the heat pipe of the above specific embodiment;
图 5是一第三较佳实施例的热导管的剖示图; Figure 5 is a cross-sectional view of a heat pipe of a third preferred embodiment;
图 6是一第四较佳实施例的热导管的剖示图; Figure 6 is a cross-sectional view of a heat pipe of a fourth preferred embodiment;
图 7是一第五较佳实施例的热导管的剖面示图; Figure 7 is a cross-sectional view showing a heat pipe of a fifth preferred embodiment;
图 8A是一第六较佳实施例的热导管之一第一管体的剖示图; Figure 8A is a cross-sectional view showing a first tube body of a heat pipe of a sixth preferred embodiment;
图 8B是所述第六较佳实施例的所述第一管体缩颈后的剖示图; Figure 8B is a cross-sectional view of the first tube body after necking according to the sixth preferred embodiment;
图 8C是所述第六较佳实施例的热导管的剖面示图; Figure 8C is a cross-sectional view of the heat pipe of the sixth preferred embodiment;
图 8D是所述第六较佳实施例的所述第一管体于置入一第一金属粉末的剖示 图; Figure 8D is a cross-sectional view showing the first tube body of the sixth preferred embodiment in which a first metal powder is placed;
图 8E是所述第六较佳实施例置入一中心棒于所述第一管体的剖示图; 图 8F是所述第六较佳实施例于所述中心棒与所述第一管体间置入一第二金 属粉末的剖示意图; 以及 Figure 8E is a cross-sectional view of the sixth preferred embodiment in which a center rod is placed on the first tube; Figure 8F is the sixth preferred embodiment of the center rod and the first tube a schematic cross-sectional view of interposing a second metal powder between the bodies;
图 8G是所述第六较佳实施例的所述第一管体的剖示意图。 发明内容 Figure 8G is a cross-sectional view of the first tube body of the sixth preferred embodiment. Summary of the invention
为了让本发明的上述和其它目的、 特征、 和优点能更明显易懂, 下面将 结合附图对本发明的较佳实施例详细说明。  The above and other objects, features and advantages of the present invention will become more apparent from
请参阅图 1, 图 1是本发明一第一较佳实施例的热导管 1未完成前的剖 面分解图。 所述热导管 1包含一管体 12, 一腔体 14。 所述管体 12具有一第 一开口 122以及一第三开口 124。所述腔体 14具有一第二开口 142以及一平 直端 144。 所述腔体 14的一截面积大于所述管体 12的一截面积。 其中所述 腔体 14的截面积指所述腔体 14靠近所述平直端 144的截面积。所述管体 12 的直径小于 10mm。 如图 2A所示, 将所述腔体 14的第二开口 142与所述管体 12的第一开 口 122密封接合, 以形成一半成品热导管 16。所述密封接合可以是一焊接工 艺、 一熔接工艺、 一机械扣接工艺或一胶合工艺。 Please refer to FIG. 1. FIG. 1 is an exploded cross-sectional view of the heat pipe 1 according to a first preferred embodiment of the present invention before it is completed. The heat pipe 1 comprises a tube body 12 and a cavity 14. The tube body 12 has a first opening 122 and a third opening 124. The cavity 14 has a second opening 142 and a flat end 144. A cross-sectional area of the cavity 14 is greater than a cross-sectional area of the tubular body 12. Wherein the cross-sectional area of the cavity 14 refers to the cross-sectional area of the cavity 14 near the flat end 144. The tubular body 12 has a diameter of less than 10 mm. As shown in FIG. 2A, the second opening 142 of the cavity 14 is sealingly engaged with the first opening 122 of the tubular body 12 to form a half finished heat pipe 16. The sealing joint may be a welding process, a welding process, a mechanical fastening process or a gluing process.
所述第一较佳实施例, 所述腔体 14的内壁上已形成有一烧结的金属粉 层 182, 如图 2A所示。在所述密封接合后, 将一中心棒 C1 自所述第三开口 124插入所述半成品热导管 16内, 并大致紧靠所述烧结的金属粉层 182, 如 图 2B所示。 然后在所述中心棒 C1与所述半成品热导管 16之间填入一第一 金属粉末 184, 如图 2C所示。 所述第一金属粉末 184可以是一铜金属粉末、 一镍金属粉末、 一银金属粉末、 一表面镀有铜、 镍或银的金属粉末或其它类 似的金属粉末。  In the first preferred embodiment, a sintered metal powder layer 182 is formed on the inner wall of the cavity 14, as shown in Fig. 2A. After the sealing engagement, a center rod C1 is inserted from the third opening 124 into the semi-finished heat pipe 16 and substantially abuts the sintered metal powder layer 182, as shown in Fig. 2B. A first metal powder 184 is then filled between the center rod C1 and the semi-finished heat pipe 16, as shown in Figure 2C. The first metal powder 184 may be a copper metal powder, a nickel metal powder, a silver metal powder, a metal powder plated with copper, nickel or silver or the like.
如图 2D所示, 接着执行一烧结工艺, 以使所述第一金属粉末 184与所 述烧结的金属粉层 182相熔接, 以形成一多孔毛细导流层 18。最后在将所述 中心棒 C1 自所述半成品热导管 16中取出。 如图 2E所示, 在将所述第三开 口 124密封之前,需对所述半成品热导管 16抽气, 以及注入一工作流体 Ll。 注入所述工作流体 L1与抽气的顺序可交换。为使后续的密封可以顺利实施, 可以在抽气之前, 先将所述第三开口 124缩口。 最后, 将所述第三开口 124 密封之后所述热导管 1即完成。  As shown in Fig. 2D, a sintering process is then performed to splicing the first metal powder 184 with the sintered metal powder layer 182 to form a porous capillary flow guiding layer 18. Finally, the center rod C1 is taken out of the semi-finished heat pipe 16. As shown in Fig. 2E, the semi-finished heat pipe 16 is evacuated and a working fluid L1 is injected before the third opening 124 is sealed. The order in which the working fluid L1 is injected and the pumping is exchanged. In order for the subsequent sealing to be carried out smoothly, the third opening 124 may be shrunk before pumping. Finally, the heat pipe 1 is completed after the third opening 124 is sealed.
应注意, 所述密封接合应避免过度损害已存在的多孔毛细导流层。 在所 述第一较佳实施例中, 所述腔体 14的第二开口 142无所述烧结的金属粉层 182(请参阅图 因此所述密封接合可不必顾及在接合过程中对所述烧结 的金属粉层 182造成损害, 例如使用一般的焊接工艺或熔接工艺。但仍应注 意的是, 在所述密封接合后, 所述腔体 14的内壁与所述管体 12的内壁应尽 可能保持平滑连接, 以使后续的第一金属粉末 184能顺利烧结, 并与所述烧 结的金属粉层 182相熔接, 以形成所述多孔毛细导流层 18。  It should be noted that the sealing engagement should avoid excessive damage to the existing porous capillary flow guiding layer. In the first preferred embodiment, the second opening 142 of the cavity 14 is free of the sintered metal powder layer 182 (please refer to the figure so that the sealing joint can be used without regard to the sintering during the bonding process). The metal powder layer 182 causes damage, for example, using a general welding process or a welding process. However, it should be noted that after the sealing engagement, the inner wall of the cavity 14 and the inner wall of the pipe body 12 should be as The smooth connection is maintained so that the subsequent first metal powder 184 can be sintered smoothly and fused with the sintered metal powder layer 182 to form the porous capillary flow guiding layer 18.
另外, 若所述腔体 14的第二开口 142处已有所述烧结的金属粉层 182, 使用的接合工艺则有所限制, 或是使用条件有所限制。 例如, 在此实施例中 不宜直接使用熔接工艺或焊接工艺。但是可通过适当的接合设计, 以使用熔 接工艺或焊接工艺。 请参阅图 3A, 图 3A是一具体实施例所述第一开口 122 与所述第二开口 142的局部剖示图。所述第一开口 122包含一接合平面 1222 以及一焊接部位 1224。 所述第二开口 142包含一接合平面 1422以及一焊接 部位 1424。 所述接合平面 1222、 1422相互紧密贴合。 所述焊接部位 1224、 1424均为一斜面。 当所述接合平面贴合 , 所述焊接部位 1224、 1424形成 一凹槽, 以供填料焊接。 如图 3B所示, 所述密封接合完成后, 仅所述焊接 部位 1224、 1424受到影响, 其上充满一焊料 P, 所述接合平面 1222、 1224 则未受到影响, 由此可保持所述腔体 14的内壁与所述管体 12的内壁平滑连 接, 并且不损害所述腔体 14第二开口 142处的所述烧结的金属粉层 182。 In addition, if the sintered metal powder layer 182 is present at the second opening 142 of the cavity 14, the bonding process used is limited, or the use conditions are limited. For example, in this embodiment It is not advisable to use the welding process or the welding process directly. However, a fusion bonding process or a soldering process can be used by a suitable joint design. Referring to FIG. 3A, FIG. 3A is a partial cross-sectional view of the first opening 122 and the second opening 142 according to an embodiment. The first opening 122 includes a joint plane 1222 and a weld portion 1224. The second opening 142 includes a joint plane 1422 and a weld portion 1424. The joint planes 1222, 1422 are in close contact with each other. The welded portions 1224, 1424 are all inclined surfaces. When the joining planes are fitted, the welded portions 1224, 1424 form a groove for the filler to be welded. As shown in FIG. 3B, after the sealing joint is completed, only the soldering portions 1224, 1424 are affected, which is filled with a solder P, and the bonding planes 1222, 1224 are unaffected, thereby maintaining the cavity. The inner wall of the body 14 is smoothly connected to the inner wall of the tubular body 12 and does not damage the sintered metal powder layer 182 at the second opening 142 of the cavity 14.
另夕卜, 请参阅图 3C, 图 3C是另一具体实施例的所述第一开口 122与所 述第二开口 142的局部剖示图。 所述第一开口 122包含一接合平面 1222以 及一焊接部位 1224。 所述第二开口 142包含一接合平面 1422以及一焊接部 位 1424。 所述焊接部位 1224、 1424, 其均由一凸出部位 1224a、 1424a以及 一凹槽 1224b、 1424b组成。 当所述接合平面贴合后, 所述接合平面 1222、 1422相互紧密贴合, 所述凸出部位 1224a、 1424a因加热或其它熔化方式相 互熔合, 并填满所述凹槽 1224b、 1424b。 所述密封接合完成后, 仅所述焊接 部位 1224、 1424受到影响, 所述接合平面 1222、 1224则未受到影响, 由此 可保持所述腔体 14的内壁与所述管体 12的内壁平滑连接, 并且不损害所述 腔体 14的第二开口 142处的所述烧结的金属粉层 182,如图 3D所示。图 3D 中的虚线圈表示所述悍接部位 1224、 1424的熔接区域。 当然, 若所述第一 开口 122与所述第二开口 142以螺栓固定,则上述因热可能产生的影响将不 存在, 但需注意接合的密封性。  In addition, please refer to FIG. 3C, which is a partial cross-sectional view of the first opening 122 and the second opening 142 of another embodiment. The first opening 122 includes a joint plane 1222 and a weld portion 1224. The second opening 142 includes a joint plane 1422 and a weld portion 1424. The welded portions 1224, 1424 are each composed of a raised portion 1224a, 1424a and a recess 1224b, 1424b. After the bonding planes are bonded, the bonding planes 1222, 1422 are in close contact with each other, and the protruding portions 1224a, 1424a are fused to each other by heating or other melting means, and fill the grooves 1224b, 1424b. After the sealing engagement is completed, only the welded portions 1224, 1424 are affected, and the joint planes 1222, 1224 are unaffected, thereby maintaining the inner wall of the cavity 14 and the inner wall of the tubular body 12 smooth. The sintered metal powder layer 182 at the second opening 142 of the cavity 14 is joined and does not damage, as shown in Figure 3D. The dashed circle in Fig. 3D indicates the welded region of the splicing portions 1224, 1424. Of course, if the first opening 122 and the second opening 142 are bolted, the above-mentioned influence due to heat will not exist, but attention should be paid to the sealing property of the joint.
值得注意是, 在上述的具体实施例中, 如图 3E所示, 所述腔体 14可包 含一凹槽 146以及一上盖 148。 所述凹槽 146包含所述平直端 144, 所述上 盖 148包含所述第二开口 142。 所述凹槽 146上形成有一第一烧结金属层 18220所述上盖 148上形成有一第二烧结金属层 1824。将所述凹槽 146与所 述上盖 148衔接, 便形成所述腔体 14, 并且所述第一烧结金属层 1822以及 所述第二烧结金属层 1824即形成所述烧结的金属粉层 182。另外,所述凹槽 146壳体本身可通过一粉末冶金工艺、 一冲压工艺、 一射出成型工艺、 一铸 造工艺或一机械加工工艺所制成。 It should be noted that, in the above specific embodiment, as shown in FIG. 3E, the cavity 14 may include a recess 146 and an upper cover 148. The groove 146 includes the flat end 144, and the upper cover 148 includes the second opening 142. Forming a first sintered metal layer on the groove 146 A second sintered metal layer 1824 is formed on the upper cover 148 of 1822 0 . The cavity 146 is engaged with the upper cover 148 to form the cavity 14, and the first sintered metal layer 1822 and the second sintered metal layer 1824 form the sintered metal powder layer 182. . In addition, the recess 146 itself may be made by a powder metallurgy process, a stamping process, an injection molding process, a casting process or a machining process.
请参阅图 4Α,图 4Α是一第二较佳实施例的热导管 2未完成前的剖示图。 所述热导管 2的制作方式大体上与所述第一较佳实施例的热导管 1相同,在 此不再赘述。 仅就所述热导管 2的多孔毛细导流层 28形成的方式, 进行详 细说明。  Referring to Figure 4, Figure 4A is a cross-sectional view of the heat pipe 2 of a second preferred embodiment before it is completed. The heat pipe 2 is constructed in substantially the same manner as the heat pipe 1 of the first preferred embodiment and will not be described again. Only the manner in which the porous capillary guide layer 28 of the heat pipe 2 is formed will be described in detail.
如图 4Α所示,所述热导管 2的腔体 24的内壁上具有数个细小刻痕 282。 如图 4Β所示, 将一中心棒 C2自所述热导管 2的管体 22的第三开口 224插 入一半成品热导管 26内,并大致紧靠所述数个细小刻痕 282。如图 4C所示, 再于所述中心棒 C2与所述半成品热导管 26之间填入一第二金属粉末。接着 执行一烧结工艺, 以使所述第二金属粉末 284与所述数个细小刻痕 282相熔 接, 以形成所述多孔毛细导流层 28。 如图 4D 所示, 最后再将所述中心棒 C2自所述半成品热导管 26中取出。 并且在密封所述第三开口 224 后, 形 成所述热导管 2。  As shown in Fig. 4A, the inner wall of the cavity 24 of the heat pipe 2 has a plurality of fine scores 282 thereon. As shown in Fig. 4A, a center rod C2 is inserted from the third opening 224 of the tubular body 22 of the heat pipe 2 into the half of the finished heat pipe 26 and substantially abuts the plurality of fine scores 282. As shown in Fig. 4C, a second metal powder is further filled between the center rod C2 and the semi-finished heat pipe 26. A sintering process is then performed to fuse the second metal powder 284 with the plurality of fine scores 282 to form the porous capillary flow director layer 28. Finally, the center rod C2 is removed from the semi-finished heat pipe 26 as shown in Fig. 4D. And after sealing the third opening 224, the heat pipe 2 is formed.
应注意的是, 所述中心棒 C2其外径不一定只有一个, 亦即所述中心棒 C2可能具有不同的外径。 请参阅图 4Ε, 图 4Ε是一具体实施例的热导管 2' 未完成前的剖示图。与所述第二较佳实施例相比较,所述热导管 2'的腔体 24' 的数个细小刻痕 282'呈现一与所述热导管 2'的管体 22'内径相同的内径,因此 一仅具有单一外径的中心棒是无法同时满足紧抵所述数个细小刻痕 282'且 于所述中心棒与所述热导管 .2'—半成品热导管 26'间留有空间以容纳后来加 入的金属粉末的要求。 于此情形, 一中心棒 C2'需具有不同的外径, 使得一 部分中心棒 C2'可紧抵所述数个细小刻痕 282'且在所述中心棒 C2'与所述热导 管 2'间留有空间以容纳后来加入的第二金属粉末 284', 以及在后续的烧结工 艺中, 所述第二金属粉末 284'可以与所述数个细小刻痕 282'相熔接, 以形成 一多孔毛细导流层 28', 如图 4F所示。 并且在密封所述半成品热导管 26'之 后, 形成所述热导管 2', 如图 4G所示。 It should be noted that the center rod C2 does not have to have only one outer diameter, that is, the center rod C2 may have different outer diameters. Referring to FIG. 4A, FIG. 4A is a cross-sectional view of the heat pipe 2' of an embodiment before being completed. Compared with the second preferred embodiment, the plurality of fine scores 282' of the cavity 24' of the heat pipe 2' exhibit an inner diameter which is the same as the inner diameter of the tubular body 22' of the heat pipe 2'. Therefore, a center rod having only a single outer diameter cannot simultaneously satisfy the plurality of fine scores 282' and leave a space between the center rod and the heat pipe .2'-semi-finished heat pipe 26'. The requirement to accommodate the later added metal powder. In this case, a center rod C2' needs to have a different outer diameter such that a portion of the center rod C2' can abut the plurality of fine scores 282' and between the center rod C2' and the heat pipe 2' Space is left to accommodate the second metal powder 284' added later, and in the subsequent sintering In the art, the second metal powder 284' may be fused with the plurality of fine scores 282' to form a porous capillary guide layer 28', as shown in FIG. 4F. And after sealing the semi-finished heat pipe 26', the heat pipe 2' is formed as shown in Fig. 4G.
值得注意的是, 在上述的具体实施例中, 如图 4H所示, 所述腔体 24、 24'可包含一凹槽 246以及一上盖 248。 所述上盖 248包含所述腔体 24的第 二开口 242。所述凹槽 246上形成有一第一数个细小刻痕 2822。所述上盖 248 上形成有一第二数个细小刻痕 2824。 将所述凹槽 246与所述上盖 248衔接, 便形成所述腔体 24、 24', 并且所述第一数个细小刻痕 2822以及所述第二数 个细小刻痕 2824即形成所述数个小细刻痕 282。另外,所述凹槽 246壳体本 身可通过一粉末冶金工艺、 一冲压工艺、 一射出成型工艺、 一铸造工艺或一 机械加工工艺所制成。  It should be noted that in the above specific embodiment, as shown in FIG. 4H, the cavity 24, 24' may include a recess 246 and an upper cover 248. The upper cover 248 includes a second opening 242 of the cavity 24. A first plurality of fine scores 2822 are formed on the groove 246. A second plurality of fine scores 2824 are formed on the upper cover 248. Forming the groove 246 with the upper cover 248 to form the cavity 24, 24', and the first plurality of fine scores 2822 and the second plurality of small scores 2824 are formed A few small fine marks 282 are described. Alternatively, the recess 246 housing itself may be formed by a powder metallurgy process, a stamping process, an injection molding process, a casting process, or a machining process.
请参阅图 5 , 图 5是一第三较佳实施例的热导管 3的剖示图。 所述热导 管 3的制作方式大体上与所述第一较佳实施例热导管 1相同,在此不再赘述。 仅就所述热导管 3的多孔毛细导流层 38形成的方式进行说明。 所述多孔毛 细导流层 38利用一机械加工工艺在所述热导管 3的一管体 32的内壁上以及 '所述热导管 3的一腔体 34的内壁上, 制造数个细小刻痕 38来形成。例如利 用刀具直接在所述半成品热导管的内壁上刻划出所述数个细小刻痕 38。应注 意, 在一具体实施例中, 一半成品热导管的腔体原先已有数个细小刻痕, 因 此在密封接合后,仅需对所述半成品热导管内壁的其它部位进行数个细小刻 痕成形即可形成一多孔毛细导流层, 但需注意这两组细小刻痕的衔接。 此种 腔体多见于组合式的腔体, 例如由一凹槽以及一上盖组合而成。  Referring to Figure 5, Figure 5 is a cross-sectional view of a heat pipe 3 of a third preferred embodiment. The heat pipe 3 is basically made in the same manner as the heat pipe 1 of the first preferred embodiment, and will not be described again. Only the manner in which the porous capillary guide layer 38 of the heat pipe 3 is formed will be described. The porous capillary deflector 38 utilizes a machining process to create a plurality of fine scores 38 on the inner wall of a tubular body 32 of the heat pipe 3 and on the inner wall of a cavity 34 of the heat pipe 3. To form. The plurality of fine scores 38 are scored directly on the inner wall of the semi-finished heat pipe, for example, using a cutter. It should be noted that in one embodiment, the cavity of the half of the finished heat pipe has a plurality of small scores originally, so that after the sealing joint, only a few small scores are formed on other parts of the inner wall of the semi-finished heat pipe. A porous capillary flow guiding layer can be formed, but attention should be paid to the connection of the two sets of fine nicks. Such a cavity is more common in a combined cavity, such as a combination of a recess and an upper cover.
请参阅图 6, 图 6是一 四较佳实施例热导管 4的剖示图。 所述热导管 4的制作方式大体上与所述第一较佳实施例热导管 1相同, 在此不再赘述。 仅就所述热导管 4的多孔毛细导流层 48形成的方式进行说明。 先烧结数个 金属颗粒 482于所述热导管 4的管体 42的内壁上及所述热导管 4的腔体 44 的内壁上。 再在一金属网体 484上设置所述金属颗粒 482, 以形成所述多孔 毛细导流层 48。 应注意, 所述数个金颗粒 482可分别烧结于所述管体 42的 内壁及所述腔体 44的内壁。 Please refer to FIG. 6. FIG. 6 is a cross-sectional view of a heat pipe 4 according to a preferred embodiment. The heat pipe 4 is manufactured in substantially the same manner as the heat pipe 1 of the first preferred embodiment, and details are not described herein. Only the manner in which the porous capillary guide layer 48 of the heat pipe 4 is formed will be described. A plurality of metal particles 482 are first sintered on the inner wall of the tube body 42 of the heat pipe 4 and on the inner wall of the cavity 44 of the heat pipe 4. The metal particles 482 are further disposed on a metal mesh 484 to form the porous Capillary baffle 48. It should be noted that the plurality of gold particles 482 may be sintered to the inner wall of the tube body 42 and the inner wall of the cavity 44, respectively.
请参阅图 7, 图 7是一第五较佳实施例热导管 5的剖示图。 所述热导管 5的制作方式大体上与所述第一较佳实施例热导管 1相同, 在此不再赘述。 仅就所述热导管 5的多孔毛细导流层 58形成的方式进行说明。 先铺设一波 状绉折金属布 582于所述热导管 5的管体 52的内壁上及所述热导管 5的腔 体 54的内壁上。 再置在一平金属网布层 584上设所述波状绉折金属布 582, 以形成所述多孔毛细导流层 58。其中所述波状绉折金属布 582的波状绉折的 形状可以是三角形、 长方形、 梯形或波浪形。  Referring to Figures 7, Figure 7 is a cross-sectional view of a heat pipe 5 of a fifth preferred embodiment. The heat pipe 5 is generally manufactured in the same manner as the heat pipe 1 of the first preferred embodiment, and will not be described herein. Only the manner in which the porous capillary guide layer 58 of the heat pipe 5 is formed will be described. A corrugated metal cloth 582 is first laid on the inner wall of the tube 52 of the heat pipe 5 and on the inner wall of the cavity 54 of the heat pipe 5. The corrugated folded metal cloth 582 is placed on a flat metal mesh layer 584 to form the porous capillary flow guiding layer 58. The corrugated shape of the corrugated folded metal cloth 582 may be triangular, rectangular, trapezoidal or wavy.
请参阅图 8A, 图 8A是一第六较佳实施例的热导管 6的第一管体 62的 剖示图。 所述第一管体 62具有一开口 622以及一封闭端 624。 所述封闭端 624是平整的。所述第一管体 62具有较大的内径, 以供后续的缩颈工艺。并 且, 因为在缩颈工艺中被紧缩的所述第一管体 62的管壁, 在缩颈之后所述 管壁将会增厚, 所以在一般应用中, 所述第一管体 62的封闭端 624的壁厚 大多较缩颈前的管壁厚, 以使缩颈之后的壁厚整体均匀。 但不应以此为限。  Referring to Fig. 8A, Fig. 8A is a cross-sectional view showing the first tube body 62 of the heat pipe 6 of a sixth preferred embodiment. The first tubular body 62 has an opening 622 and a closed end 624. The closed end 624 is flat. The first tubular body 62 has a larger inner diameter for subsequent necking. And, because the wall of the first tubular body 62 that is tightened in the necking process will thicken after the necking, the sealing of the first tubular body 62 in a general application The wall thickness of the end 624 is mostly thicker than the wall thickness before the necking, so that the wall thickness after necking is uniform overall. But should not be limited to this.
接着对所述第一管体 62缩颈以形成相连通的一腔体 626以及一第二管 体 628, 如图 8B所示。其中所述腔体 626包含所述封闭端 624, 所述第二管 体 628包含所述开口 622。 所述腔体 626的一截面积大于所述第二管体 628 的一截面积。 所述腔体 626的截面积是指所述封闭端的截面积。 另外, 所述 腔体 626以及所述第二管体 628的内壁包含一多孔毛细导流层 64。  The first tubular body 62 is then necked to form a cavity 626 and a second tubular body 628 that are in communication, as shown in Figure 8B. Wherein the cavity 626 includes the closed end 624, and the second body 628 includes the opening 622. A cross-sectional area of the cavity 626 is greater than a cross-sectional area of the second tubular body 628. The cross-sectional area of the cavity 626 refers to the cross-sectional area of the closed end. Additionally, the inner walls of the cavity 626 and the second tubular body 628 include a porous capillary flow guiding layer 64.
再对所述腔体 626以及所述第二管体 628抽气, 以及在所述腔体 626以 及所述第二管体 628内注入一工作流体 L2。 最后再将所述开口 622密封。 其中注入所述工作流体 L2与抽气的顺序可交换。将所述开口 622密封之后, 所述热导管 6即完成, 如图 8C所示。  The cavity 626 and the second tube 628 are again evacuated, and a working fluid L2 is injected into the cavity 626 and the second tube 628. Finally, the opening 622 is sealed. The order in which the working fluid L2 is injected and the pumping is exchanged. After sealing the opening 622, the heat pipe 6 is completed as shown in Fig. 8C.
所述第六较佳实施例, 所述缩颈是在温度 400至 600°C的范围内实施热 加工,或是在高于所述第一管体 62的再结晶温度约 200°C以内的范围内实施 热加工。 另外, 所述多孔毛细导流层 64在所述縮颈之前, 在所述第一管体 62的内壁上形成所述多孔毛细导流层 64, 其步骤如下: 在所述第一管体 62 内置入一第一金属粉末 642, 如图 8D所示; 将一中心棒 C3 自所述开口 622 插入所述第一管体 62内并大致紧靠所述第一金属粉末 642, 如图 8E所示; 在所述中心棒 C3与所述第一管体 62的内壁间填入一第二金属粉末 644; 执 行一烧结工艺以使所述第一金属粉末 642与第二金属粉末 644相熔接,从而 形成所述多孔毛细导流层 64; 以及将所述中心棒 C3 自所述第一管体 62取 出, 如图 8G所示。 In the sixth preferred embodiment, the necking is performed at a temperature of 400 to 600 ° C or at a temperature higher than a recrystallization temperature of the first tube 62 by about 200 ° C. Implementation within scope Thermal processing. In addition, the porous capillary flow guiding layer 64 forms the porous capillary flow guiding layer 64 on the inner wall of the first tubular body 62 before the necking, the steps of which are as follows: in the first tubular body 62 A first metal powder 642 is built in, as shown in FIG. 8D; a center rod C3 is inserted into the first tube body 62 from the opening 622 and substantially abuts the first metal powder 642, as shown in FIG. 8E. Inserting a second metal powder 644 between the center rod C3 and the inner wall of the first tube body 62; performing a sintering process to weld the first metal powder 642 with the second metal powder 644, Thereby, the porous capillary flow guiding layer 64 is formed; and the center rod C3 is taken out from the first tubular body 62 as shown in Fig. 8G.
在上述具体实施例中, 所述管体与所述腔体以对称的方式连接, 在实际 运用上, 所述管体与所述腔体也可以不对称的方式连接。 例如, 所述管体连 接至所述腔体接近边缘处, 以适应不同的空间限制。  In the above specific embodiment, the tubular body and the cavity are connected in a symmetrical manner. In practical use, the tubular body and the cavity may also be connected in an asymmetric manner. For example, the tubular body is attached to the cavity near the edge to accommodate different space constraints.
综上所述, 本发明提供一种具有不同截面积的热导管及其制造方法, 可 在所述热导管的平直端上设置具有较大发热面积的电子组件或群聚的电子 组件, 并提供所述电子组件有效且迅速的散热模式。  In summary, the present invention provides a heat pipe having different cross-sectional areas and a method of manufacturing the same, and an electronic component or a cluster of electronic components having a large heat generating area may be disposed on a flat end of the heat pipe, and An efficient and rapid cooling mode of the electronic component is provided.
以上已对本发明的较佳实施例进行了具体说明,但本发明并不限于所述 实施例,熟悉本领域的技术人员在不违背本发明精神的前提下还可作出种种 的等同的变型或替换,这些等同的变型或替换均包含在本申请权利要求所限 定的范围内。  The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the embodiments, and various equivalent modifications or substitutions can be made by those skilled in the art without departing from the spirit of the invention. Such equivalent modifications or alternatives are intended to be included within the scope of the claims.

Claims

权利要求 Rights request
1、 一种热导管, 适用于发光二极管散热, 其特征在于, 所述热导管包含: 一管体, 所述管体具有一第一开口, 所述管体的直径小于 10mm; A heat pipe, suitable for heat dissipation of an LED, characterized in that: the heat pipe comprises: a pipe body, the pipe body has a first opening, the pipe body has a diameter of less than 10 mm;
一腔体, 所述腔体具有一第二开口, 所述第二开口与所述第一开口衔接, 由 此所述管体与所述腔体形成一密封空间; 以及 a cavity, the cavity has a second opening, the second opening is engaged with the first opening, and the tube body forms a sealed space with the cavity;
一多孔毛细导流层, 形成于所述管体以及所述腔体内; a porous capillary flow guiding layer formed in the tubular body and the cavity;
其中所述密封空间容纳一工作流体, 以及所述腔体的一截面积大于所述管体 的一截面积。 Wherein the sealed space accommodates a working fluid, and a cross-sectional area of the cavity is larger than a cross-sectional area of the tubular body.
2、 如权利要求 1所述的热导管, 其特征在于, 所述管体与所述腔体为一体 成型。  2. The heat pipe according to claim 1, wherein the pipe body is integrally formed with the cavity.
3、 如权利要求 1所述的热导管, 其特征在于, 所述腔体包含一凹槽以及一 上盖, 所述上盖与所述凹槽衔接并具有所述第二开口。  3. The heat pipe of claim 1 wherein said cavity includes a recess and an upper cover, said upper cover engaging said recess and having said second opening.
4、 如权利要求 3所述的热导管, 其特征在于, 所述凹槽可通过一粉末冶金 工艺、一冲压工艺、一射出成型工艺、一铸造工艺或一机械加工工艺所制成。 4. The heat pipe according to claim 3, wherein the groove is made by a powder metallurgy process, a stamping process, an injection molding process, a casting process or a machining process.
5、 如权利要求 1所述的热导管, 其特征在于, 所述腔体具有一平直端。5. The heat pipe of claim 1 wherein said cavity has a flat end.
6、 . 如权利要求 1所述的热导管, 其特征在于, 所述多孔毛细导流层可由一 铜金属粉末、 一镍金属粉末、 一银金属粉末、 一表面镀有铜、 镍或银的金属 粉末或其它类似的金属粉末烧结而成。 6. The heat pipe according to claim 1, wherein the porous capillary flow guiding layer is made of a copper metal powder, a nickel metal powder, a silver metal powder, and a surface plated with copper, nickel or silver. Metal powder or other similar metal powder is sintered.
7、 如权利要求 1所述的热导管, 其特征在于, 所述多孔毛细导流层包含一 金属颗粒层以及一金属网体,所述金属颗粒层烧结成形于所述管体的内壁和 所述腔体的内壁上, 以及所述金属网体设置在所述金属颗粒层上。  The heat pipe according to claim 1, wherein the porous capillary flow guiding layer comprises a metal particle layer and a metal mesh body, and the metal particle layer is sintered and formed on an inner wall of the pipe body and The inner wall of the cavity, and the metal mesh body are disposed on the metal particle layer.
8、 如权利要求 1所述的热导管, 其特征在于, 所述多孔毛细导流层包含一 波状绉折金属布以及一平金属网布层,所述波状绉折金属布铺设在所述管体 的内壁和所述腔体的内壁上, 以及所述平金属网布层设置在所述波状绉折金 属布上。 The heat pipe according to claim 1, wherein the porous capillary flow guiding layer comprises a corrugated metal cloth and a flat metal mesh layer, and the corrugated metal cloth is laid on the pipe body. The inner wall and the inner wall of the cavity, and the flat metal mesh layer are disposed on the corrugated folded metal cloth.
9、 如权利要求 8所述的热导管, 其特征在于, 所述波状绉折金属布的波状 绉折的形状可以是三角形、 长方形、 梯形或波浪形。 The heat pipe according to claim 8, wherein the corrugated shape of the corrugated metal cloth is triangular, rectangular, trapezoidal or wavy.
10、 如权利要求 1所述的热导管, 其特征在于, 所述多孔毛细导流层包含数 个细小刻痕, 形成于所述管体的内壁以及所述腔体的内壁上。  The heat pipe according to claim 1, wherein said porous capillary flow guiding layer comprises a plurality of fine scores formed on an inner wall of said tubular body and an inner wall of said cavity.
11、 如权利要求 1所述的热导管, 其特征在于, 所述多孔毛细导流层包含数 个细小刻痕以及一金属烧结层, 所述细小刻痕成形于所述腔体的内壁上, 以 及所述金属烧结层成形于所述管体的内壁上并且与所述细小刻痕相熔接。 The heat pipe according to claim 1, wherein the porous capillary flow guiding layer comprises a plurality of fine scores and a metal sintered layer, and the fine score is formed on an inner wall of the cavity. And the metal sintered layer is formed on an inner wall of the tube body and welded to the fine notch.
12、 一种热导管制造方法, 其特征在于, 包含下列步骤: 12. A method of manufacturing a heat pipe, comprising the steps of:
(a)提供一管体, 具有一第一幵口以及一第三开口;  (a) providing a tubular body having a first opening and a third opening;
(b)提供一腔体, 具有一第二开口;  (b) providing a cavity having a second opening;
(c)将所述管体的第一开口与所述腔体的第二开口进行密封接合, 以形成一 半成品热导管;  (c) sealingly engaging the first opening of the tubular body with the second opening of the cavity to form a semi-finished heat pipe;
(d)将所述半成品热导管抽气; 以及  (d) pumping the semi-finished heat pipe;
(e)密封所述第三开口;  (e) sealing the third opening;
其中所述半成品热导管的内壁包含一多孔毛细导流层,所述半成品热导管容 纳一工作流体, 所述腔体的一截面积大于所述管体的一截面积。 The inner wall of the semi-finished heat pipe comprises a porous capillary flow guiding layer, and the semi-finished heat pipe accommodates a working fluid, and a cross-sectional area of the cavity is larger than a cross-sectional area of the pipe body.
13、 如权利要求 12所述的方法, 其特征在于, 所述腔体具有一平直端。 13. The method of claim 12 wherein said cavity has a flat end.
14、 如权利要求 12所述的方法, 其特征在于, 步骤 (c)所述密封接合可通过 一焊接工艺、 一熔接工艺、 一机械扣接工艺或一胶合工艺。 14. The method of claim 12, wherein the step (c) of the sealing joint is performed by a welding process, a welding process, a mechanical fastening process, or a gluing process.
15、 如权利要求 12所述的方法, 其特征在于, 所述工作流体在步骤 (d)之前 或之后注入所述半成品热导管内。  15. The method of claim 12 wherein said working fluid is injected into said semi-finished heat conduit before or after step (d).
16、 如权利要求 12所述的方法, 其特征在于, 所述腔体的内壁上形成有一 烧结的金属粉层, 以及所述多孔毛细导流层由下列步骤形成:  16. The method according to claim 12, wherein a sintered metal powder layer is formed on an inner wall of the cavity, and the porous capillary flow guiding layer is formed by the following steps:
将一中心棒自所述第三开口插入所述半成品热导管内并大致紧靠所述烧结 的金属粉层; Inserting a center rod from the third opening into the semi-finished heat pipe and substantially abutting the sintered metal powder layer;
在所述中心棒与所述半成品热导管之间填入一第一金属粉末; 执行一烧结工艺以使所述第一金属粉末与所述烧结的金属粉层相熔接, 以形 成所述多孔毛细导流层; 以及 Filling a first metal powder between the center rod and the semi-finished heat pipe; Performing a sintering process to fuse the first metal powder with the sintered metal powder layer to form the porous capillary flow guiding layer;
将所述中心棒自所述半成品热导管取出。 The center rod is removed from the semi-finished heat pipe.
17、 如权利要求 12所述的方法, 其特征在于, 所述腔体的内壁上具有数个 细小刻痕, 以及所述多孔毛细导流层由下列步骤形成:  17. The method of claim 12, wherein the inner wall of the cavity has a plurality of fine scores, and the porous capillary flow guiding layer is formed by the following steps:
将一中心棒自所述第三开口插入所述半成品热导管内并大致紧靠所述数个 细小刻痕; Inserting a center rod from the third opening into the semi-finished heat pipe and substantially abutting the plurality of fine scores;
在所述中心棒与所述半成品热导管之间填入一第二金属粉末; Filling a second metal powder between the center rod and the semi-finished heat pipe;
执行一烧结工艺以使所述第二金属粉末与所述数个细小刻痕相熔接, 以形成 所述多孔毛细导流层; 以及 Performing a sintering process to fuse the second metal powder with the plurality of fine scores to form the porous capillary flow guiding layer;
将所述中心棒自所述半成品热导管取出。 The center rod is removed from the semi-finished heat pipe.
18、 如权利要求 16或 17所述的方法, 其特征在于, 所述第一金属粉末或所 述第二金属粉末可以是一铜金属粉末、 一镍金属粉末、 一银金属粉末、 一表 面镀有铜、 镍或银的金属粉末或其它类似的金属粉末。  The method according to claim 16 or 17, wherein the first metal powder or the second metal powder may be a copper metal powder, a nickel metal powder, a silver metal powder, and a surface plating. There are metal powders of copper, nickel or silver or other similar metal powders.
19、 如权利要求 12所述的方法, 其特征在于, 所述多孔毛细导流层由下列 步骤形成:  19. The method of claim 12 wherein said porous capillary drainage layer is formed by the following steps:
利用一机械加工工艺在所述管体的内壁及所述腔体的内壁上,制造数个细小 刻痕, 以形成所述多孔毛细导流层。 A plurality of fine scores are formed on the inner wall of the tubular body and the inner wall of the cavity by a machining process to form the porous capillary flow guiding layer.
20、 如权利要求 12所述的方法, 其特征在于, 所述多孔毛细导流层由下列 步骤形成:  20. The method of claim 12, wherein the porous capillary flow guiding layer is formed by the following steps:
烧结数个金属颗粒于所述管体的内壁及所述腔体的内壁上; 以及 Sintering a plurality of metal particles on an inner wall of the tube body and an inner wall of the cavity;
设置一金属网体在所述金属颗粒上, 以形成所述多孔毛细导流层。 A metal mesh body is disposed on the metal particles to form the porous capillary flow guiding layer.
21、 如权利要求 12所述的方法, 其特征在于, 所述多孔毛细导流层由下列 步骤形成:  21. The method of claim 12 wherein said porous capillary drainage layer is formed by the following steps:
铺设一波状绉折金属布在所述管体的内壁及所述腔体的内壁上; 以及 设置一平金属网布层在所述波状绉折金属布上, 以形成所述多孔毛细导流 层。 Laying a corrugated metal cloth on the inner wall of the tube body and the inner wall of the cavity; and providing a flat metal mesh layer on the corrugated metal cloth to form the porous capillary flow Floor.
22、 如权利要求 12所述的方法, 其特征在于, 步骤 (b)包含- 提供一凹槽;  22. The method of claim 12, wherein step (b) comprises providing a recess;
提供一上盖, 所述上盖具有所述第二幵口,· 以及 Providing an upper cover, the upper cover having the second opening, and
将所述上盖与所述凹槽衔接, 以形成所述腔体。 The upper cover is engaged with the recess to form the cavity.
23、 如权利要求 22所述的方法, 其特征在于, 所述凹槽上形成有一第一烧 结金属层, 所述上盖上形成有一第二烧结金属层, 所述第一烧结金属层与所 述第二烧结金属层衔接。  The method according to claim 22, wherein a first sintered metal layer is formed on the groove, and a second sintered metal layer is formed on the upper cover, the first sintered metal layer and the The second sintered metal layer is joined.
24、 如权利要求 22所述的方法, 其特征在于, 所述凹槽上形成有一第一数 个细小刻痕, 所述上盖上形成有一第二数个细小刻痕, 所述第一数个细小刻 痕与所述第二数个细小刻痕衔接。  The method according to claim 22, wherein a first plurality of fine nicks are formed on the groove, and a second plurality of fine nicks are formed on the upper cover, the first number A small score is joined to the second plurality of fine scores.
25、 如权利要求 22所述的方法, 其特征在于, 所述凹槽可通过一粉末冶金 工艺、一冲压工艺、一射出成型工艺、一铸造工艺或一机械加工工艺所制成。 25. The method of claim 22, wherein the recess is formed by a powder metallurgy process, a stamping process, an injection molding process, a casting process, or a machining process.
26、 一种热导管制造方法, 其特征在于, 包含下列步骤: 26. A method of manufacturing a heat pipe, comprising the steps of:
(A)提供一第一管体, 具有一开口以及一封闭端;  (A) providing a first tube body having an opening and a closed end;
(B)对所述第一管体缩颈以形成相连通的一腔体以及一第二管体, 其中所述 腔体包含所述封闭端, 所述第二管体包含所述开口;  (B) necking the first tubular body to form a cavity and a second tubular body, wherein the cavity comprises the closed end, and the second tubular body comprises the opening;
(C)将所述腔体以及所述第二管体抽气; 以及  (C) pumping the cavity and the second tube; and
(D)密封所述开口;  (D) sealing the opening;
其中所述腔体以及所述第二管体的内壁包含一多孔毛细导流层,所述腔体以 及所述第二管体容纳一工作流体, 所述腔体的一截面积大于所述第二管体的 一截面积。 Wherein the cavity and the inner wall of the second tube body comprise a porous capillary flow guiding layer, the cavity body and the second tube body accommodating a working fluid, and a cross-sectional area of the cavity body is larger than the The cross-sectional area of the second tube.
27、 如权利要求 26所述的方法, 其特征在于, 所述封闭端是平整的。  27. The method of claim 26 wherein said closed end is flat.
28、 如权利要求 26所述的方法, 其特征在于, 步骤 (B)在温度 400至 600°C的 范围内实施。  The method according to claim 26, wherein the step (B) is carried out at a temperature of from 400 to 600 °C.
29、 如权利要求 26所述的方法, 其特征在于, 还包含: 在步骤 (A)之后, 在所述第一管体之内壁上形成所述多孔毛细导流层。 The method according to claim 26, further comprising: After the step (A), the porous capillary flow guiding layer is formed on the inner wall of the first tube.
30、 如权利要求 29所述的方法, 其特征在于, 所述多孔毛细导流层由下列 步骤形成:  30. The method of claim 29, wherein the porous capillary drainage layer is formed by the following steps:
置入一第一金属粉末于所述第一管体内; Inserting a first metal powder into the first tube;
将一中心棒自所述幵口插入所述第一管体内并大致紧靠所述第一金属粉末; 在所述中心棒与所述第一管体的内壁间填入一第二金属粉末; Inserting a central rod from the mouth into the first tube and substantially abutting the first metal powder; filling a second metal powder between the center rod and the inner wall of the first tube;
执行一烧结工艺以使所述第一金属粉末与第二金属粉末相熔接, 以形成所述 多孔毛细导流层; 以及 Performing a sintering process to fuse the first metal powder with the second metal powder to form the porous capillary flow guiding layer;
将所述中心棒自所述第一管体取出。 The center rod is taken out of the first tube.
PCT/CN2007/001425 2007-04-28 2007-04-28 Heat pipe and manufacturing method thereof WO2008131587A1 (en)

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