TW201104201A - Heat dissipation device and manufacturing method thereof - Google Patents

Heat dissipation device and manufacturing method thereof Download PDF

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Publication number
TW201104201A
TW201104201A TW98125051A TW98125051A TW201104201A TW 201104201 A TW201104201 A TW 201104201A TW 98125051 A TW98125051 A TW 98125051A TW 98125051 A TW98125051 A TW 98125051A TW 201104201 A TW201104201 A TW 201104201A
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TW
Taiwan
Prior art keywords
heat
base
pipe
tube
heat pipe
Prior art date
Application number
TW98125051A
Other languages
Chinese (zh)
Inventor
Ye-Fei Yu
Xin-Xiang Zha
Xian-Min Jin
Jer-Haur Kuo
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW98125051A priority Critical patent/TW201104201A/en
Publication of TW201104201A publication Critical patent/TW201104201A/en

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Abstract

A heat dissipation device includes a substrate and at least one heat pipe embedded in the substrate with at least one end of the heat pipe protruding laterally out of the substrate. The heat pipe is integrally connected with the substrate by insert molding technique. The heat pipe includes a hollow tube, a wick structure attached to an inner surface of the tube and a working fluid filled in the tube. A method for manufacturing the heat dissipation device includes following steps: providing a hollow tube with a wick structure attached to an inner surface of the tube, one end of the tube being open; providing a mold and placing the tube into the mold, injecting a melted metal into the mold to form a substrate wherein the tube is integrally embedded in the substrate with the open end of the tube protruding laterally out of the substrate; filling a working fluid into the tube via the open end and sealing the open end of the tube.

Description

201104201 VI. Description of the Invention: [Technical Field] The present invention relates to a heat sink device suitable for heat dissipation of a heat-generating electronic component and a method of manufacturing the same. * [Prior Art] With the rapid development of the computer industry, the CPU is pursuing high speed, and the heat dissipation problem caused by multi-function and miniaturization is becoming more and more serious. Therefore, heat must be dissipated in a timely and effective manner, otherwise it will greatly Affect the performance of electronic components, while also reducing the life of electronic components. The heat sink is usually used in the industry to dissipate heat from electronic components. 1 The heat dissipating device mostly adopts a combination of an endothermic bottom plate and a round heat pipe. The heat absorbing bottom plate is provided with a groove for accommodating the heat pipe, and the heat pipe is valleyd in the groove and connected to the heat absorbing base plate by solder paste. The heat dissipating device of the structure has the following problems: when the heat dissipating device is formed, the groove is formed on the heat absorbing substrate, and the heat pipe and the heat absorbing substrate are combined, and the manufacturing process and the assembly process are cumbersome and time consuming. The cost is increased. Second, due to the problem of process tolerance, the heat pipe and the heat absorption base plate are not tightly combined, and it is easy to generate a large contact thermal resistance, which seriously affects the heat transfer efficiency. Third, the process of tin-poor welding is difficult to control and the product is caused. The quality of the difference is large. SUMMARY OF THE INVENTION 201104201 In view of this, it is necessary to provide a heat sink having a simple process and high heat dissipation efficiency and a method of manufacturing the same. A heat dissipating device includes a base and at least a heat pipe coupled to the base. The heat pipe includes a pipe body, a capillary structure disposed in the pipe body, and a working liquid accommodated in the pipe body. The body is embedded in the base by insert molding to be integrated with the base, and at least one end of the heat pipe is exposed outside the seat. The method for manufacturing a political thermal device includes the steps of: providing a metal pipe body having a capillary structure therein, the metal pipe body having opposite first ends and second ends, the first end opening; The human mold is combined with the (4) metal to form a pedestal covering the tube body while the first end of the tube body is exposed to the outside of the pedestal; the working fluid is injected into the tube body from the first end of the tube body And evacuating; sealing the first end of the tube. Compared with the conventional heat dissipating device, the above-mentioned heat dissipating device eliminates the process of forming a groove on the pedestal and assembling and welding the heat pipe and the pedestal, and the dragon is simple and money, and is returned to the base shop (four) to form a type-body molding' The heat pipe and the susceptor are tightly combined without gaps, and the large:::, the contact thermal resistance between the heat pipe and the pedestal, and the heat dissipation vibration = thermal performance. At the same time improve the stability of product quality. L Besch Mode The following is a further description of the present invention with reference to the accompanying drawings. Referring to FIG. 1 and FIG. 2, the heat dissipation device 1 includes a base 12 and a plurality of heat pipes 16 embedded in the base 12. The susceptor 12 has a substantially square rectangular shape and is made of a metal material such as aluminum which is excellent in thermal conductivity. The susceptor 12 includes a bottom surface 122 for contacting a heat generating electronic component (not shown) and a top surface 124 opposite the bottom surface 122. The heat pipes 16 have the same shape and structure, and each heat pipe 16 extends linearly, and includes a hollow pipe body 162, a capillary structure 164 attached to the inner wall of the pipe body 16 and a working liquid accommodated in the pipe body 162 (not shown). Show). The tube body 162 is made of a metal material such as copper which is excellent in heat conduction. The working fluid is a low boiling liquid such as water, alcohol, or the like. The working liquid is easily vaporized and vaporized when heated, and liquefied and condensed when it is cold. The capillary structure 164 can be a fine tantalum powder, a mesh or a composite of any two of them. In the present embodiment, the capillary structure 164 is a sintered powder. The capillary structure 164 has a plurality of fine pores therein to provide recirculation power for the liquefied coagulated working fluid. These heat pipes 16 are parallel to each other and are evenly spaced. These heat pipes extend from the side of the base 12 to the opposite side. Both ends of the mother-heat pipe 16 protrude from the two sides of the base 12 to be exposed to the outside. These heat pipes 16 are flat, so that each heat pipe 16 has a flat heat absorbing surface 161. The 201104201 heat absorbing surface 161 of the heat pipe 16 exposes the susceptor 12 and is flush with the bottom surface 122 of the susceptor 12. Therefore, the heat absorbing surface 161 of the heat pipe 16 can directly absorb heat from the heat generating electronic component. Referring to FIG. 3 and FIG. 4, when the heat dissipating device 100 is molded, firstly, a flat metal pipe body 162a having a capillary structure 164a therein is provided, and one end of the pipe body 162a is open and the other end is sealed; the pipe body 162a is placed in a The casting mold 18 of the susceptor 12 is molded, and molten metal is injected into the mold 18, and the tube body 162a is bonded to the molten metal to form a susceptor 12 covering the tube body 162a, while the tube body 162a is formed. The two ends are exposed to the outside of the base; the working fluid is injected into the tubular body 162a from the open end of the tubular body 162a and evacuated; and the open end of the tubular body 162a is sealed to obtain the heat sink 100. The heat pipe 16 is embedded in the base 12 and integrated with the base 12 by means of insert molding, and the pipe body 162a is dust-flated before the pipe body 162a is placed in the mold 18. It has a flat heat absorbing surface 161. When the tube body 162a is placed in the mold 18, at least one end, that is, the open end of the tube body 162a is exposed to the outside of the base 12, so as to inject, vacuum and seal the tube body 162a after the molding is completed. operating. Compared with the conventional heat dissipating device, the heat dissipating device 100 eliminates the process of forming a groove in the susceptor 12, and does not need to assemble the heat pipe 16 and the susceptor 12, thereby eliminating the welding process and making the process simple and convenient. In addition, 201104201, the heat pipe 16 and the susceptor 12 realize a tight joint without gaps, which greatly reduces the thermal resistance between the heat pipe 16 and the susceptor 12, and improves the product quality. In this embodiment, the base 12 is made of aluminum, and the tube body 162 of the heat official 16 is made of copper. In order to avoid electrochemical corrosion of the aluminum base 12 and the copper heat pipe 16, it may be preheated. The outer surface of the body 162 of the officer 16 is sprayed or plated with a layer of interface material such as a layer of gold.底面 When the heat sink is in operation, the bottom surface 122 of the susceptor 12 and the heat absorbing surface 161 of the heat pipe 16 are attached to the heat-generating electronic component, and the bottom surface 122 of the susceptor 12 and the heat absorbing surface 161 of the heat pipe 16 absorb heat from the heat-generating electronic component simultaneously. . The susceptor 12 directly conducts the absorbed heat to the top surface 124 thereof; after the heat pipe 16 absorbs the heat, the working liquid therein evaporates & the heat is quickly transmitted to the entire interior of the heat officer 16, and then rapidly transmitted to The susceptor 12 on the periphery of the heat pipe 16 allows the portions of the susceptor 12 to be uniformly heated. Because the heat pipe 16 and the base 12 are integrally formed, the thermal resistance between the heat pipe 16 and the base ^ is minimized', so heat can be quickly transferred from the heat pipe 16 to the base 12, thereby lifting the heat sink 1 Thermal performance. FIG. 5 is a second embodiment of a heat sink according to the present invention. The heat sink 200 is similar to the heat sink of the above embodiment, and includes a rectangular base 22 and is embedded in the base by casting. 22 heat pipes 26, 27 at the bottom. The heat dissipating device is different from the heat dissipating device 100 of the above embodiment in that the dispersing 201104201, the set 200 includes a first heat pipe 26 in a straight line shape and two first heat members 27 which are bent. The first heat pipe 26 is located in the middle, extending from the center of one side of the base Y2 to the center of the opposite other side, and both ends of the first heat pipe 26 protrude from both sides of the base 22, respectively. The two second heat pipes 27 are respectively located on the two heat pipes 26, and the two second heat pipes 27 include a straight pipe portion 272 located in the middle and two folded pipe portions 271, 273 located at opposite ends of the straight pipe portion 272. • The straight tube portion 272 of the two second heat pipes 27 is parallel to the first heat pipe 26, and the tube portions 27丄, 273 extend radially toward the four corners of the base 22 and protrude outside the base 22, because of the second The folded portions 271 and 273 of the heat pipe π extend toward the corners of the susceptor 22, so that the susceptor 22 can be more uniformly heated, thereby improving the utilization of the susceptor 22. The method of forming the heat sink 2GG is the same as the method of forming the heat sink 100 in the above embodiment, and will not be described herein. φ Figure 6 shows a third embodiment of the heat sink of the present invention. The U-set 300 is similar to the heat sink of the above-described first embodiment, and includes a base 32 and a heat pipe 36 disposed in the base. The susceptor 32 has a bottom surface that is in contact with the heat-generating electronic component and a top surface that faces the bottom surface 322. The heat dissipating device is different from the heat dissipating device 100 in the first embodiment in that: when the pedestal 32 is formed, a plurality of heat dissipating fins 34 ′ are integrally formed on the top surface 324 of the susceptor %. The heat pipe 16 is different from the shape of the heat pipe 16 in the above embodiment. The heat pipe % is 201104201 U-shaped. The heat pipe 16 includes an evaporation section 362 and a condensation section 364. The evaporation section 362 of the heat pipe 36 is embedded in the base 32. The condensation section 364 is disposed in the heat dissipation fins 34. The heat pipe 36 is also flattened so that its evaporation section 362 also has a flat contact surface for contact with the heat generating electronic components. The heat pipe 36 is integrated with the base 32 and the heat dissipation fins 34 by insert molding, so that the heat pipe 36 and the base 32 and the heat dissipation fins 34 can be tightly coupled without gaps, so that the heat pipe The contact thermal resistance between the base 36 and the heat sink fins 34 is minimized, thereby improving the heat dissipation efficiency of the heat sink 3. The method of molding the heat sink 300 is similar to the method of forming the heat sink of the first embodiment. Firstly, a metal pipe body having a capillary structure is provided, the pipe body is open at one end, and the other pipe is sealed, and the pipe body is flat and bent into a U shape; the pipe body is placed into the base plate. 32 and the mold of the heat sink fin 34, ♦ the portion of the tube body used to form the evaporation section 362 is combined with the metal of the county to form a susceptor 32 covering the evaporation section, the tube body being used to form the condensation section 364. The portion is combined with the molten metal to form a heat dissipating fin 34 covering a periphery of the condensation portion, and both ends of the tube are exposed to the outside of the base 32 or the heat dissipating fin 34; The open end injects a working liquid into the tube body and evacuates the liquid; and the open end of the tube body is sealed to obtain the heat sink 3〇〇. "The above description, the invention meets the requirements of the invention patent, according to 201104201 = special shot please. However, the above mentioned only for the transfer of 2 cases, those who are familiar with the skill of the case, in the conversion of the invention, arsenic Equivalent modifications or variations are intended to be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a first embodiment of a heat sink according to the present invention. Fig. 2 is a line along the line II-II of the heat sink shown in Fig. 1. Figure 3 is a flow chart of a manufacturing method of the heat dissipating device shown in Figure 1. Figure 4 is a schematic view showing a molding process of the heat dissipating device shown in Figure 3 by using the manufacturing method shown in Figure 3. Figure 5 is a heat dissipating device of the present invention. Fig. 6 is a perspective view of a third embodiment of a heat sink according to the present invention. [Description of main components] Heat sink 100' 200, 300 Base 12, 22, 32 Base 122' 322 Top surface 124 &gt 324 敎管*,,, 9 16、36 Heat absorbing surface 161 ' 361 Tube 162 ' 162a Capillary structure 164, 164a Mold 18 First heat pipe 26 Second heat pipe 27 Folding pipe portion 271, 273 Straight pipe portion 272 Heat sink fin 34 evaporation Section 362 Condensation section 364 11

Claims (1)

  1. 201104201 VII. Patent application scope: 1. A heat dissipating device comprising at least a heat pipe combined with a base, the heat pipe comprising a pipe body, a capillary knot disposed in the pipe body, and a housing and a tube. The working fluid in the body is improved in that the tube body of the tube is embedded in the base by insert molding to be coupled to the body, and at least one end of the heat tube is exposed outside the base. . 2. The heat dissipation device according to claim 1, wherein the heat 10 has a flat shape, the heat pipe has a flat heat absorbing surface, and the base has a bottom surface for contacting the heat source, and the heat absorbing surface of the heat pipe It is exposed to the outside and flush with the bottom surface of the pedestal to be in direct contact with the heat source. 3. The heat sink of claim 2, wherein the base includes a top surface opposite the bottom surface, the top surface of the base extending upwardly to form a plurality of heat sink fins. 4. The heat dissipating device according to the third aspect of the invention, wherein the hot moss is U-shaped, comprising an evaporation section and a condensation section, the evaporation section being embedded in the base, the condensation section being disposed in the base The heat sink fins. The heat dissipating device according to claim 1, wherein the base has a rectangular shape, and the heat pipe has a plurality of heat pipes, and the first heat pipe and the second heat pipe are linear, from the base The central portion of one side extends to the center of the opposite other side, and the second heat pipe includes a straight pipe portion parallel to the first heat official and a two-fold official portion at the two ends of the straight pipe portion The tube portion extends toward the corner of the base and is larger than the outside of the base. 12 201104201 6--The manufacturing method of the heat dissipating device' comprises the following steps: • providing a metal pipe body having a capillary structure inside, the metal pipe body having opposite first ends and second ends, the first end opening Inserting the official body into the mold and combining with the molten metal to form a base covering the body, while leaving the first end of the tube exposed outside the base; • from the first end of the tube The tube body is injected with a working liquid and evacuated; after that, the first end of the tube body is sealed. The method of manufacturing a heat sink according to claim 6, wherein the base has a bottom surface for contacting the heat source and a top surface opposite to the bottom surface, the base being formed when the base is molded The top surface - the body forms a plurality of heat sink fins. • 8· According to the manufacturer of the heat sink described in item 7 of the patent application, the 6H heat pipe is U-shaped, including an evaporation section and a condensation section, and 5 Hailuo section is disposed in the base, the condensation The segment is disposed on the heat dissipation fin. According to the manufacturing method of the heat dissipating device described in claim 6, wherein the outer surface of the pipe body is coated with a layer of interface material before the pipe body is placed in the mold. The method for manufacturing a spatter, according to any one of claims 6 to 9, wherein the base has a bottom surface for contacting the heat source 13 201104201, and the tube body is placed Before the mold, the tube body is flattened to have a flat heat absorbing surface. After the tube body and the molten metal are formed, the heat absorbing surface of the tube body is flush with the bottom surface of the pedestal to be exposed to the outside.
    14
TW98125051A 2009-07-24 2009-07-24 Heat dissipation device and manufacturing method thereof TW201104201A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98125051A TW201104201A (en) 2009-07-24 2009-07-24 Heat dissipation device and manufacturing method thereof

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Application Number Priority Date Filing Date Title
TW98125051A TW201104201A (en) 2009-07-24 2009-07-24 Heat dissipation device and manufacturing method thereof

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TW201104201A true TW201104201A (en) 2011-02-01

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103128258A (en) * 2011-11-30 2013-06-05 讯凯国际股份有限公司 Heat guide module and manufacturing method thereof
CN103128259A (en) * 2011-11-30 2013-06-05 讯凯国际股份有限公司 Heat dissipation module and manufacturing method of heat dissipation module
TWI451922B (en) * 2011-12-02 2014-09-11 Cooler Master Dev Corp Thermal dissipation module and method of manufacturing the same
TWI588646B (en) * 2016-03-30 2017-06-21 Cooling seat
CN109874268A (en) * 2018-11-27 2019-06-11 奇鋐科技股份有限公司 Heat-sink unit manufacturing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103128258A (en) * 2011-11-30 2013-06-05 讯凯国际股份有限公司 Heat guide module and manufacturing method thereof
CN103128259A (en) * 2011-11-30 2013-06-05 讯凯国际股份有限公司 Heat dissipation module and manufacturing method of heat dissipation module
TWI451922B (en) * 2011-12-02 2014-09-11 Cooler Master Dev Corp Thermal dissipation module and method of manufacturing the same
TWI588646B (en) * 2016-03-30 2017-06-21 Cooling seat
CN109874268A (en) * 2018-11-27 2019-06-11 奇鋐科技股份有限公司 Heat-sink unit manufacturing method

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